TWI547224B - Circuit board with electroplated type and manufacturing method thereof - Google Patents

Description

Electroplated circuit board structure and manufacturing method thereof

The present invention relates to a circuit board structure and a method of fabricating the same, and more particularly to a plated circuit board structure and a method of fabricating the same.

Generally, the substrate of the circuit board is a laminate which is laminated with a semi-cured resin (prepreg) using insulating paper, glass fiber cloth, or other fibrous material. The substrate can be coated with a copper film on one or both sides under high temperature and high pressure, and then the copper film is formed into a desired circuit layout.

The circuit layout of today's circuit boards has been able to fabricate circuits of different thicknesses on one side of the substrate by etching. Further, a thick copper foil is required on the surface of the substrate, and the thick copper foil is etched into the surface. The thick circuit then etches the rest of the thick copper foil to reduce its thickness, thereby forming the thin circuit required.

However, the above-mentioned circuit fabrication method is a commonly known subtraction technology in the industry. In the process of fabricating circuits of different thicknesses, a large amount of high-priced metal is consumed, and the etching process to be repeatedly performed requires a lot of resources, and a large amount of pollution is generated. . More importantly, the circuit of different thickness formed by the above circuit manufacturing method will exhibit a significant difference in the surface of the circuit board, thereby affecting the subsequent surface treatment and processing, and even affecting the assembly of components.

Therefore, the present inventors have felt that the above-mentioned deficiencies can be improved, and they have devoted themselves to research and cooperated with the application of the theory, and finally proposed a present invention which is reasonable in design and effective in improving the above-mentioned defects.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a plated circuit board structure and a method of fabricating the same, which can form at least two circuits of different thicknesses under the premise that the outer surface of the first conductive layer is in the same plane via an additive technique.

The present invention provides a method of fabricating a plated circuit board structure, the method comprising: providing a board, wherein the board comprises a substrate and a first conductive layer, the substrate having a first surface and a second on opposite sides a surface, the first conductive layer is located on the first surface, and the first conductive layer has a thickness smaller than a distance between the first surface and the second surface; and processed in a non-chemically etched manner on the substrate Forming a through hole through the first surface and the second surface, and the portion of the through hole corresponding to the first surface of the substrate is shielded by the first conductive layer; Forming a conductor at the through hole, and the thickness of the conductor is greater than a thickness of the first conductive layer; and etching the first conductive layer to form a first line and a second line separated from each other, and the first A line is integrally connected to the conductor. Furthermore, the present invention also provides a plated circuit board structure manufactured by the above-described method for manufacturing a plated circuit board structure.

The present invention further provides a method for fabricating a plated circuit board structure, the method comprising: providing a substrate, wherein the substrate has a first surface and a second surface on opposite sides; the non-chemical etching process is performed on the substrate a substrate, the substrate is formed with a through hole penetrating the first surface and the second surface; a first conductive layer is disposed on the first surface of the substrate, wherein the first conductive layer has a thickness smaller than the first a distance between the surface and the second surface, and the portion of the through hole corresponding to the first surface of the substrate is shielded by the first conductive layer; a conductive body is filled at the through hole of the substrate by electroplating, and The conductor has a thickness greater than a thickness of the first conductive layer; and the first conductive layer is etched to form a first line and a second line separated from each other, and the first line is integrally connected to the conductor. Furthermore, the present invention also provides a plated circuit board structure manufactured by the above-described method for manufacturing a plated circuit board structure.

In summary, the electroplated circuit board structure and the manufacturing method thereof provided by the present invention enable the electroplated circuit board structure to form at least two different conditions on the premise that the outer surface of the first conductive layer is in the same plane by the addition technique. Thickness of the circuit, in order to effectively save material costs, avoid wasting high-priced metals, and reduce pollution sources.

The detailed description of the present invention and the accompanying drawings are to be understood by the claims The scope is subject to any restrictions.

100‧‧‧Electroplated circuit board structure

1‧‧‧ plates

11‧‧‧Substrate

111‧‧‧ first surface

112‧‧‧ second surface

1121‧‧‧ Reserved area

113‧‧‧through holes

114‧‧‧ hole wall

12‧‧‧First conductive layer

121‧‧‧First line

122‧‧‧second line

13‧‧‧Second conductive layer

131‧‧‧ openings

14‧‧‧Adhesive layer

2‧‧‧ Conductor

3‧‧‧First mask layer

4‧‧‧Second mask layer

FIG. 1 is a schematic diagram of step S101 in the first embodiment of the present invention.

FIG. 2 is a schematic diagram (1) of step S103 in the first embodiment of the present invention.

FIG. 3 is a schematic diagram (2) of step S103 in the first embodiment of the present invention.

4A is a schematic view (1) of step S105 in the first embodiment of the present invention.

FIG. 4B is a schematic diagram (1) of step S107 in the first embodiment of the present invention.

FIG. 5A is a schematic diagram (2) of step S105 in the first embodiment of the present invention.

FIG. 5B is a schematic diagram (2) of step S107 in the first embodiment of the present invention.

FIG. 6 is a schematic diagram of steps S201 to S205 in the second embodiment of the present invention.

FIG. 7 is a schematic diagram of step S301 in the third embodiment of the present invention.

FIG. 8 is a schematic diagram of step S303 in the third embodiment of the present invention.

Figure 9 is a schematic diagram of step S305 in the third embodiment of the present invention.

Figure 10 is a schematic diagram of step S307 in the third embodiment of the present invention.

Figure 11 is a schematic view (1) of step S309 in the third embodiment of the present invention.

Figure 12 is a schematic view (2) of step S309 in the third embodiment of the present invention.

[First Embodiment]

Please refer to FIG. 1 to FIG. 5B , which are the first embodiment of the present invention. It should be noted that the related quantity mentioned in the embodiment corresponds to the embodiment, and only the embodiment is specifically described to facilitate understanding thereof. The content is not intended to limit the scope of the invention. Furthermore, the correlation diagram in this embodiment is a partial block as a schematic description. This embodiment provides a method of manufacturing a plated circuit board structure, the steps of which are substantially as follows.

Step S101: Referring to FIG. 1, a board 1 is provided, wherein the board 1 comprises a substrate 11 and a first conductive layer 12. The substrate 11 has a first surface 111 and a second surface 112 on opposite sides, and the first conductive layer 12 is located on the first surface 111 of the substrate 11, and the first conductive layer 12 has a smaller thickness than the first surface 111 and The distance between the second surfaces 112 (that is, the thickness of the first conductive layer 12 is less than the thickness of the substrate 11).

In more detail, the substrate 11 is usually formed of a preimpregnated material, and the prepreg layer may be a glass fiber prepreg or a carbon fiber prepreg according to different reinforcing materials. (Carbon fiber prepreg), epoxy resin (Epoxy resin) and other materials. However, the substrate 11 may also be formed of a soft board material, that is, the substrate 11 is mostly composed of a polyester material (Polyester, PET) or a polyimide (PI) without glass. Fiber, carbon fiber, etc. However, the present invention does not limit the material of the substrate 11.

Furthermore, the first conductive layer 12 is formed of a metal foil, and the metal foil is, for example, a copper foil. The selection of the first conductive layer 12 is preferably 2 ounces or less, that is, the thickness of the first conductive layer 12 is preferably 70 μm or less. The thickness of the sheet 1 is preferably greater than 140 μm and less than 700 μm. However, the above description of the sheet material 1 selected for the present embodiment is not limited to the conditions of the present embodiment in practical use.

Step S103: Referring to FIG. 2, the second surface 112 of the substrate 11 is processed by a non-chemical etching method, and the substrate 11 is formed with a long through hole 113 penetrating through the first surface 111 and the second surface 112. The portion of the through hole 113 corresponding to the first surface 111 of the substrate 11 is shielded by the first conductive layer 12. That is, the first conductive layer 12 must be exposed from the through hole 113 during the formation of the through hole 113.

Further, after being processed on the second surface 112 of the substrate 11 by the non-chemical etching method, a hole wall 114 defining the through hole 113 is formed. Wherein, the hole wall 114 is entirely perpendicular to the first conductive layer 12, that is, the opposite end edges of the hole wall 114 (such as the bottom end edge and the top edge of the hole wall 114 in FIG. 2) are perpendicular to the substrate 11 respectively. The first surface 111 and the second surface 112.

Moreover, in the process of forming the through hole 113, the aspect ratio and the shape of the through hole 113 can be controlled and adjusted according to the needs of the designer. For example, when the through hole 113 is formed, as shown in FIG. 3, the depth of the through hole 113 can be made larger than the width of the through hole 113, and the through hole 113 can be formed into an elongated strip shape.

It should be noted that the non-chemical etching method for forming the through holes 113 may include laser drilling, plasma etching, or milling. In more detail, the substrate 11 is ablated downward from the second surface 112 by laser drilling to form a through hole 113. Alternatively, it may be processed from the second surface 112 by means of a milling machine to form a through hole 113. In addition, the through hole 113 may also remove a portion of the substrate 11 downward by a milling machine, and then continue to remove the substrate 11 by laser drilling, thereby forming a through hole 113. Then, the substrate 11 remaining in the surface of the first conductive layer 12 in the through hole 113 can be removed by a chemical method.

Step S105: Referring to FIG. 4A and FIG. 5A, a conductor 2 is formed by filling in the through hole 113 of the substrate 11 by a plating method, and the thickness of the conductor 2 is greater than the thickness of the first conductive layer 12. . The plating method refers to plating metal ions (eg, copper ions) into the through holes 113 to form a solid conductor 2 . It should be noted that before the electroplating, a mask layer (not shown) is formed on the first conductive layer 12 to prevent metal ions from adhering to the first conductive layer 12; and after the electroplating is completed, the mask is removed. Cover layer.

In more detail, during the plating process at the through hole 113 of the substrate 11, it is possible until the outer surface of the conductor 2 is flush with the second surface 112 of the substrate 11 (as shown in FIG. 4A), or until the outside of the conductor 2 The surface protrudes from the second surface 112 of the substrate 11 (as in Figure 5A). Or, in other ways, the conductor 2 is brought to a predetermined height, however, The height at which the conductor 2 is formed is not limited to this. It should be noted that the conductor 2 shown in FIG. 5A can also be subjected to a rubbing treatment according to the designer's requirements, so that the conductor 2 forms a conductor 2 having a flat surface as shown in FIG. 4A.

Step S107: Referring to FIG. 4B and FIG. 5B, the first conductive layer 12 is etched to form a first line 121 and a second line 122 which are separated from each other, and the first line 121 is integrally connected to the conductor 2 .

It should be noted that, in the respective steps described in this embodiment, the order of the steps can be adjusted under reasonable circumstances. In other words, the present embodiment is not limited to the above-described sequence of steps.

In summary, the embodiment provides a plated circuit board structure 100 formed through the above steps. It should be noted that, by the adding technique of steps S101 to S107 of the embodiment, the plated circuit board structure 100 can be formed into at least two different conditions on the premise that the outer surface of the first conductive layer 12 is on the same plane. A circuit of thickness (eg, a first line 121 connecting the conductor 2, a second line 122). Thereby, the method of the embodiment can effectively achieve the effects of saving material cost, avoiding waste of high-priced metals, and reducing pollution sources.

When the electroplated circuit board structure 100 is applied, the first line 121 (ie, the thicker circuit) connecting the conductor 2 can be used to transmit a high-power driving current, thereby reducing the impedance of the driving current, thereby avoiding the circuit burning. Or reduce operating efficiency due to overheating. Furthermore, the first line 121 connecting the conductors 2 can also be used as a heat energy discharge channel, so that the plated circuit board structure 100 can be used to maintain the desired working efficiency for a long time. In addition, the second line 122 (ie, the thinner circuit) can be used for control signal transmission.

In addition, the plated circuit board structure 100 of the embodiment can also be subjected to a lay-up process with various circuit board structures, and the stack process is a conventional technique. Therefore, the embodiment is not for the stack. The board process is described in detail.

[Second embodiment]

Please refer to FIG. 6 , which is a second embodiment of the present invention. This embodiment is similar to the first embodiment, and the same points are not repeated. The difference between the two is mainly because the sheet 1 is processed by a build-up process. Forming, in particular, the manufacturing method of the electroplated circuit board structure provided by the embodiment includes the following steps: Step S201: providing a substrate 11 having a first surface 111 and a first surface on opposite sides Two surfaces 112.

Step S203: processing the substrate 11 in a non-chemical etching manner, so that the substrate 11 is formed with a through hole 113 penetrating the first surface 111 and the second surface 112.

Step S205: A first conductive layer 12 is disposed on the first surface 111 of the substrate 11 (eg, high temperature bonding) through an adhesive layer 14 (eg, a semi-cured resin), wherein the thickness of the first conductive layer 12 It is smaller than the distance between the first surface 111 and the second surface 112, and the portion of the through hole 113 corresponding to the first surface 111 of the substrate 11 is shielded by the first conductive layer 12. Furthermore, the contour of the adhesive layer 14 is substantially aligned with the contour of the substrate 11.

After the step S205, the step S105 and the step S107 of the first embodiment are continued. Therefore, the related steps after the step S205 in this embodiment are not repeated herein. It should be noted that, in the respective steps described in this embodiment, the order of the steps can be adjusted under reasonable circumstances. In other words, the present embodiment is not limited to the above-described sequence of steps.

In summary, the embodiment provides a plated circuit board structure formed through the above steps.

[Third embodiment]

Referring to FIG. 7 to FIG. 12, which is a third embodiment of the present invention, the present embodiment is similar to the first embodiment, and the same portions are not described again. For convenience of description, the drawings of the present embodiment are presented in a plan sectional view. . Specifically, the manufacturing method of the electroplated circuit board structure provided by this embodiment generally includes the following steps.

Step S301: Referring to FIG. 7, a board 110 is provided, wherein the board 1 includes a substrate 11, a first conductive layer 12, and a second conductive layer 13. on The substrate 11 has a first surface 111 and a second surface 112 on opposite sides, the first conductive layer 12 is located on the first surface 111 of the substrate 11, and the second conductive layer 13 is located on the second surface of the substrate 11. 112 on. Moreover, the thickness of the first conductive layer 12 is smaller than the distance between the first surface 111 and the second surface 112 (that is, the thickness of the first conductive layer 12 is smaller than the thickness of the substrate 11). Furthermore, the first conductive layer 12 and the second conductive layer 13 are formed of a metal foil, and the metal foil is, for example, a copper foil, but is not limited thereto.

Step S303: Referring to FIG. 8, the second conductive layer 13 is processed to form an opening 131. Further, a portion of the second conductive layer 13 may be removed by photolithography to form the opening 131. Accordingly, the opening 131 is exposed to a portion of the second surface 112 of the substrate 11.

Step S305: Referring to FIG. 9, the second surface 112 of the substrate 11 is exposed from the opening 131 by a non-chemical etching method so that the formed through hole 113 has a hole diameter not larger than the opening 131. In other words, at the position of the opening 131, the through hole 113 is formed downward in the direction of the substrate 11, and the through hole 113 is exposed to the first conductive layer 12, and the aperture of the through hole 113 is smaller than the aperture of the opening 131.

Furthermore, the second surface 112 of the substrate 11 defines a reserved area 1121, and the reserved area 1121 is located between the side wall of the opening 131 and the side wall of the through hole 113. In other words, the second conductive layer 13 does not completely cover the second surface 112 of the substrate 11, and the reserved region 1121 is defined as a region between the sidewall of the opening 131 and the sidewall of the through hole 113.

Further, this embodiment can also adopt a method similar to that of the second embodiment, that is, the sheet material 1 is formed by a build-up process (not shown). In detail, the substrate 11 is provided first. Next, a through hole 113 is formed on the substrate 11. Thereafter, the first surface 111 and the second surface 112 of the substrate 11 are respectively superposed on the first conductive layer 12 and the second conductive layer 13 through the adhesive layer 14, wherein the second conductive layer 13 has been previously formed with the opening 131. That is, the second conductive layer 13 does not cover the reserved area 1121. Then, high temperature pressing is performed to form the sheet material 1.

Then, the first mask layer 3 is formed to cover the first conductive layer 12, and a second mask layer 4 is formed to cover the second conductive layer 13 and the reserved area 1121, and the through hole H2 is exposed. Specifically, the first mask layer 3 and the second mask layer 4 may be an anti-etching dry film, a photo resist or other insulating material. The first mask layer 3 and the second mask layer 4 do not cover the first conductive layer 12 exposed by the through hole 113.

Step S307: Referring to FIG. 10, the second mask layer 4 is used as a mask, and the conductor 2 is formed in the through hole 113 by electroplating. In detail, copper metal is plated through the through holes 113 by electroplating to form a solid conductor 2. In general, when a conductor is prepared by a conventional electroplating method, metal ions (for example, copper ions) are easily deposited on the edge of the metal layer, such as the edge of the line or the edge of the opening of the metal layer, so that the edge of the metal layer is easily formed redundantly. Metal tumors, such as copper nodules, reduce product yield.

However, in the present embodiment, since the second mask layer 4 covers the second conductive layer 13 and the reserved region 1121, the through hole 113 is formed during electroplating to prepare the conductor 2, compared to the conventional plating technique. The edges are not easily formed into metal tumors due to the accumulation of metal ions. According to this, it is possible to cause the conductor 2 to be completely formed by electroplating. In addition, the first mask layer 3 covers the outer surface of the first conductive layer 12, and is mainly used to prevent metal ions from adhering to the first conductive layer 12.

Step S309: Referring to FIG. 11, the first mask layer 3 and the second mask layer 4 are removed. Since the first mask layer 3 and the second mask layer 4 may be an anti-etching dry film or a photo resist, they may be removed through an aqueous solution containing sodium hydroxide. Next, a subsequent etch line process can be performed to etch the first conductive layer 12 to form the first line 121 and the second line 122, and the second conductive layer 13 can also be etched to form a desired line pattern. However, the present invention does not limit the etching circuit process.

In addition, according to different needs of the user, the manufacturing method of the electroplated circuit board structure of the embodiment further includes performing a brushing process on the conductor 2. Specifically, you can The tip of the conductor 2 is ground by a belt grinder to form a top planar conductor 2 (Fig. 12). The conductors 2 may have different heights, that is, the tips of the conductors 2 may be flush with the surface of the second conductive layer 13, or may be higher than the surface of the second conductive layer 13. In the present embodiment, the tip end of the conductor 2 is ground to a level substantially flush with the surface of the second conductive layer 13 by a belt grinder.

It should be noted that, in the respective steps described in this embodiment, the order of the steps can be adjusted under reasonable circumstances. In other words, the present embodiment is not limited to the above-described sequence of steps.

In summary, the embodiment provides a plated circuit board structure 100 formed through the above steps.

[Possible effects of the embodiments of the present invention]

In summary, the manufacturing method of the electroplated circuit board structure provided by the embodiment of the present invention enables the electroplated circuit board structure to be located on the outer surface of the first conductive layer through the adding technique carried out in the steps of the above embodiments. On the premise of the same plane, at least two circuits of different thicknesses (for example, the first line connecting the conductor and the second line) are formed. Thereby, the method of the embodiment can effectively achieve the effects of saving material cost, avoiding waste of high-priced metals, and reducing pollution sources.

In the application of the electroplated circuit board structure, the first line connecting the conductors (ie, the thicker circuit) can be used to transmit a high-power driving current, thereby reducing the impedance of the driving current, thereby preventing the circuit from being burned or being lowered due to overheating. Operational efficiency. Furthermore, the first line connecting the conductors can also be used as a heat energy discharge channel, so that the electroplated circuit board structure can maintain the desired working efficiency for a long time. In addition, the second line (ie, the thinner circuit) can be used as a control signal transmission.

Moreover, since the through hole is formed by a non-chemical etching method, the aspect ratio and the shape of the through hole can be controlled and adjusted according to the designer's needs. That is, the depth of the through hole can be larger than the width of the through hole, and the through hole can be formed into a long strip shape, thereby making the plated circuit board structure have a wide application range.

The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the invention, and the equivalent variations and modifications of the scope of the invention are intended to be within the scope of the invention.

100‧‧‧Electroplated circuit board structure

1‧‧‧ plates

11‧‧‧Substrate

111‧‧‧ first surface

112‧‧‧ second surface

12‧‧‧First conductive layer

121‧‧‧First line

122‧‧‧second line

2‧‧‧ Conductor

Claims (5)

A method of manufacturing a plated circuit board structure, the method comprising: providing a board, wherein the board comprises a substrate, a first conductive layer, and a second conductive layer, the substrate having a first surface on the opposite side And a second surface, the first conductive layer is located on the first surface, the second conductive layer is located on the second surface, and the thickness of the first conductive layer is less than between the first surface and the second surface The second conductive layer is processed to form an opening; and is processed in a non-chemically etched manner on the second surface of the substrate from the exposed portion, so that the substrate is formed through the first surface and the a through hole of the second surface, and the formed aperture of the through hole is smaller than the aperture of the aperture, and the portion of the through hole corresponding to the first surface of the substrate is shielded by the first conductive layer, and the sidewall of the opening An area between the sidewalls of the through hole is defined as a reserved area; a first mask layer is formed to cover the first conductive layer; and a second mask layer is formed to cover the second conductive layer and the pre- Leave the area and expose it Forming a conductor at a through hole of the substrate by electroplating, and the thickness of the conductor is greater than a thickness of the first conductive layer; removing the first mask layer and the second mask layer; and etching the The first conductive layer is formed into a first line and a second line separated from each other, and the first line is integrally connected to the conductor. The method of manufacturing a plated circuit board structure according to claim 1, wherein, when the conductor is formed, plating is performed at the through hole of the substrate, and an outer surface of the conductor protrudes from a second surface of the substrate . The method of manufacturing a plated circuit board structure according to claim 1, wherein when the through hole is formed in the substrate, the second surface of the substrate is processed by the non-chemical etching, and the through hole defines the through hole. a hole wall, and the hole wall is entirely perpendicular to the first conductive layer. The method of manufacturing a plated circuit board structure according to claim 1, wherein when the through hole is formed in the substrate, the aspect ratio of the through hole is controlled such that the depth of the through hole is larger than the width of the through hole. A plated circuit board structure produced by the method of manufacturing a plated circuit board structure according to claim 1.