CN101115358A - Flexible circuit board pattern plating method and pattern plating negative plate - Google Patents
Flexible circuit board pattern plating method and pattern plating negative plate Download PDFInfo
- Publication number
- CN101115358A CN101115358A CNA2006100619125A CN200610061912A CN101115358A CN 101115358 A CN101115358 A CN 101115358A CN A2006100619125 A CNA2006100619125 A CN A2006100619125A CN 200610061912 A CN200610061912 A CN 200610061912A CN 101115358 A CN101115358 A CN 101115358A
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- plating
- lead wire
- electroplate lead
- pattern plating
- negative plate
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Abstract
The invention discloses a graphics plating film applied to a flexible circuit board graphics plating method, in the position of drawing the plating lead, compared with the design position of the plating lead edge, the outer edge of the graphics plating area that is corresponding to the position of the plating lead edge and covers the plating lead is extended forth along the plating lead. On the basis of the prior art, the invention dislocates the graphics plating film and the outer layer circuitry film, the accumulation of bubbles are avoided in the gilded lead when dry film lamination, and the potential fracture danger of the gilded lead can be solved.
Description
[technical field]
The present invention relates to the making of two-sided or multi-layer flexible circuit board, particularly the pattern plating negative plate that uses in the method for figure plating wherein and this method.
[background technology]
Existing FPC (being flexible circuit board) as shown in Figure 1, can make structures such as single face, two-sided, multilayer.Conducting between double sided board and the multi-layer sheet different layers is by with after its lamination boring, realizes at hole wall built-in last layer hole copper.Existing copper-plating technique is divided into the plate plating and figure plates two kinds, because increasing, copper facing rear surface copper thickness can influence its bending performance, thereby in order to keep the distinctive good bending performance of FPC product, must adopt the figure coating technology to come copper facing, the figure plating is an important procedure realizing high bending property multi-layer FPC product.
The making flow process of multi-layer sheet skin or double sided board is generally:
Boring: be generally NC boring, the FPC drilling bore hole come by numerical control drilling machine;
Black hole;
Laminating film: dry film is pressed in FPC product two sides by double roll press;
Exposure: by covering of UV-irradiation and egative film, make the dry film generation chemical reaction of specific region, thereby make it when developing, have selectivity;
Develop: with the dry film flush away of unexposed area; Exposure, the purpose of developing are dry film to be covered do not need copper-plated position;
Copper facing:, thereby make the circuit between the different layers realize conducting with copper on the pore lining of NC boring formation;
Membrane removal: remove the dry film that the FPC product surface adheres to.
And then through operations such as laminating film, exposure, development, etching making profile circuit, fit and the hot pressing coverlay, carry out surface treatment.Surface treatment generally has gold-plated, and is zinc-plated, turmeric, heavy tin etc.
Wherein, in the copper facing operation in order to keep the distinctive good bending performance of FPC product, usually utilize the figure coating technology to finish copper facing to hole wall, the figure plating is exactly to utilize the dry film after developing to cover copper foil surface, form certain pattern, as shown in Figure 2, realize optionally copper facing, promptly the part that is covered by dry film (shadow region) is can plated with copper, and exposed portions can plated with copper.Just because of some areas have plated copper, and some areas do not have, so behind the flush away dry film, originally the place at dry film edge just has difference in height, its difference is a copper facing thickness, and this has just formed step.
Existing multiple-plate figure coating technology is as follows: after the operation of finishing NC boring (for example secondary NC boring), need carry out the figure plating to finish hole copper conducting function, general multi-layer sheet figure coverage rate is for except that all the other product entire areas of (being referred to as porose disc) the fraction very around the hole, this is for the follow-up turmeric that carries out, the product of heavy tin does not have any problem, but it is gold-plated for needs, the zinc-plated surface-treated product that waits, because the figure plating causes product edge to have step, as shown in Figure 3, can the laminating film operation when follow-up making profile circuit cause gold plated lead 1 place to exist bubble to cause broken string, when gold-plated, there is open circuit, thereby cause the product can not plated with gold, form defective products.
[summary of the invention]
Main purpose of the present invention is exactly that difference in height at figure plating edge in the prior art causes the gold plated lead place to have the problem of broken string that bubble causes, the pattern plating negative plate that uses in a kind of FPC pattern plating method and this method is provided, bubble is carried out harmless transfer, fundamentally solved the potential hazard of gold plated lead fracture.
For achieving the above object, the present invention proposes a kind of flexible circuit board pattern plating method, pull out the position of electroplate lead wire at needs, the outward flange that will be used to cover the figure plating zone of electroplate lead wire stretches out along electroplate lead wire with respect to the design attitude at electroplate lead wire edge.
The outward extending distance of outward flange in described figure plating zone is preferred 0.5mm～2mm.
The outward extending distance of outward flange in described figure plating zone is 2mm.
For achieving the above object, the present invention also proposes a kind of pattern plating negative plate, be used for comprising the figure plating operation of the flexible circuit board of electroplate lead wire, described pattern plating negative plate comprises shielded area and copper plated area, described shielded area is used to cover the electroplate lead wire of setting, and the outward flange of described shielded area is compared to have along electroplate lead wire with the design attitude at this electroplate lead wire edge and moved towards outward extending interval.
The width at described interval is preferably 0.5mm～2mm, can be designed as 2mm.
The present invention also proposes a kind of flexible circuit board that is formed by said method and pattern plating negative plate, this flexible circuit board comprises figure plating zone and is arranged in the electroplate lead wire in figure plating zone, has at interval between the outward flange in described electroplate lead wire edge and figure plating zone.
Described interval is preferably 0.5mm～2mm, can be designed as 2mm.
The invention has the beneficial effects as follows: the present invention is on the existing processes basis, by to pattern plating negative plate with make the outer-layer circuit egative film and carry out certain dislocation, thereby bubble is deposited in the gold plated lead place when having avoided laminating film, thereby has solved the potential hazard of gold plated lead fracture.
Feature of the present invention and advantage will be elaborated in conjunction with the accompanying drawings by embodiment.
[description of drawings]
Fig. 1 is the schematic diagram of FPC;
Fig. 2 be FPC the pattern plating negative plate schematic diagram;
Fig. 3 is the comparison diagram of the circuit egative film of the pattern plating negative plate of FPC in the prior art and electroplate lead wire;
Fig. 4 is for using the schematic diagram of the FPC gold plated lead broken string that causes in the prior art;
Fig. 5 improves the comparison diagram of the circuit egative film of back pattern plating negative plate and electroplate lead wire for the present invention;
Fig. 6 finishes lead-in wire plating back bubble distribution schematic diagram for using the present invention;
Fig. 7 is for using the schematic diagram of the preceding flexible circuit board FPC of an embodiment of the present invention figure plating;
Fig. 8 is the composing schematic diagram of the flexible circuit board FPC of application an embodiment of the present invention;
Fig. 9 is the defective products datagram of a kind of embodiment of application prior art;
Figure 10 is for using the defective products datagram of an embodiment of the present invention.
[embodiment]
For the FPC of needs making electroplate lead wire, the electroplate lead wire proper alignment is used for by welding or pegs graft being connected with another piece wiring board in the end of FPC.The end of electroplate lead wire forms electroplate lead wire edge 1, straight line normally, as shown in Figure 3.Figure plating zone is similar substantially to the shape of electroplate lead wire position by the shape that each edge surrounds, the outward flange 2 in figure plating zone refers to the edge with 1 corresponding figure plating zone, electroplate lead wire edge, usually also be straight line, the outward flange 2 and the electroplate lead wire edge 1 in the zone of figure plating in the prior art are positioned on the straight line in design substantially.In making the figure plating operation of flexible circuit board FPC, when carrying out the design of hole plating negative plate, conventional all areas for the covering product surface, and in the present invention, need are pulled out the position of electroplate lead wire, and the outward flange 2 that will be used to cover the figure plating zone of electroplate lead wire is done certain opening up and is prolonged.Being the present invention stretches out the outward flange 2 in the figure plating zone design attitude with respect to electroplate lead wire edge 1 along electroplate lead wire, outward extending distance is preferred 0.5mm～2mm.In actual operation, the outward flange 2 in figure plating zone can be extended to into copper scrap zone, simultaneously with profile electroplate lead wire edge 1 relative pattern plating negative plate retraction 0.5～2mm, thereby form pattern plating negative plate and cover position and the dislocation of electroplate lead wire marginal position, the dry film lamination bubble that has caused owing to the copper facing step that exists when having avoided laminating film has solved the problem of the fracture of gold plated lead.In the practical application, as shown in Figure 2, pattern plating negative plate comprises shielded area 10 and copper plated area 20, shielded area 10 is used to cover the electroplate lead wire of setting, after figure plating operation, form the figure plating zone on the FPC, so the outward flange in figure plating zone is equal to the outward flange of shielded area 10, all the other zones of pattern plating negative plate are copper plated area 20.As shown in Figure 5, the outward flange 2 of shielded area 10 is compared to have along electroplate lead wire with the design attitude at this electroplate lead wire edge 1 and is moved towards outward extending interval, be the outward flange of pattern plating negative plate shielded area 10 than former technological requirement along the electroplate lead wire certain distance that stretches out, 0.5mm～2mm for example, be preferably 2mm, the circuit egative film of electroplate lead wire is not done extension simultaneously, promptly as shown in Figure 5, the outward flange 2 of pattern plating negative plate shielded area 10 has extended a width L than the 1 outside integral body of the electroplate lead wire edge on the circuit egative film of electroplate lead wire, thereby electroplate lead wire and figure coating are pressed dry between the step that forms behind the film certain distance is arranged, bubble can not be deposited on the electroplate lead wire, thereby has avoided forming on electroplate lead wire the cavity.As shown in Figure 6, by the present invention the copper scrap district has been transferred in the cavity, though there is the cavity in the copper scrap district, do not influenced gold plated lead, lead-in wire does not cut off.The preferred value of extended L is 0.5mm～2mm, and too minute bubbles can not be dodged out fully, and is too big and can waste material.
Utilize above-mentioned pattern plating negative plate and pattern plating method, can be made into the higher FPC of a kind of yields, figure on this FPC plating zone and the edge that is arranged in the electroplate lead wire in figure plating zone are compared, between have the interval, this is 0.5mm～2mm for example at interval, is preferably 2mm.
As shown in Figure 7, in a kind of specific embodiment, multilayer circuit board one end has golden finger to draw, and need take electrogilding technology to make.If the application prior art is not pulled out the limit to electroplating lead and opened up and prolong processing, promptly the circuit egative film of this product is consistent with the outward flange holding position, shielded area of pattern plating negative plate.Because it is bigger that this plate is set type, as shown in Figure 8, can only carry out lamination according to assigned direction (arrow direction among Fig. 8) during laminating film, this moment step and dry film to be pressed into direction vertical, cause part gold plated lead place bubble to pile up, have 35% product to take place to cause gold-plated bad phenomenon approximately because of causing to break.
The improvement of figure plating process being carried out according to the present invention, with the outward flange in figure plating zone along the electroplate lead wire trend outwards open up prolong 2mm after, with circuit egative film and graphs coincide, the step bubble is deposited in outside the electroplate lead wire, the hole that this bubble causes in follow-up operation with etched, but gold plated lead can't be affected, and has guaranteed gold-plated reliability.
By Fig. 9 and Figure 10 as seen, on the existing processes basis, by to pattern plating negative plate with make the outer-layer circuit egative film and carry out certain dislocation, thereby bubble is deposited in the gold plated lead place when having avoided laminating film, thereby solved the potential hazard of gold plated lead fracture, effectively reduce gold-plated bad generation, improved the product yields.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to the scope of patent protection that the present invention is determined by claims of being submitted to.
Claims (9)
1. flexible circuit board pattern plating method is characterized in that: pull out the position of electroplate lead wire at needs, the outward flange that will be used to cover the figure plating zone of electroplate lead wire stretches out along electroplate lead wire with respect to the design attitude at electroplate lead wire edge.
2. flexible circuit board pattern plating method as claimed in claim 1 is characterized in that: the outward extending distance of outward flange in described figure plating zone is 0.5mm～2mm.
3. as flexible circuit board pattern plating method as described in the claim 2, it is characterized in that: the outward extending distance of outward flange in described figure plating zone is 2mm.
4. pattern plating negative plate, be used for comprising the figure plating operation of the flexible circuit board of electroplate lead wire, described pattern plating negative plate comprises shielded area and copper plated area, described shielded area is used to cover the electroplate lead wire of setting, it is characterized in that: the outward flange of described shielded area is compared to have along electroplate lead wire with the design attitude at this electroplate lead wire edge and is moved towards outward extending interval.
5. pattern plating negative plate as claimed in claim 4 is characterized in that: the width at described interval is 0.5mm～2mm.
6. pattern plating negative plate as claimed in claim 5 is characterized in that: the width at described interval is 2mm.
7. a flexible circuit board comprises figure plating zone and is arranged in the electroplate lead wire that figure plates the zone, it is characterized in that: have at interval between the outward flange in described electroplate lead wire edge and figure plating zone.
8. pattern plating negative plate as claimed in claim 5 is characterized in that: the described 0.5mm of being spaced apart～2mm.
9. pattern plating negative plate as claimed in claim 5 is characterized in that: the described 2mm of being spaced apart.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100619125A CN100558221C (en) | 2006-07-28 | 2006-07-28 | Flexible circuit board pattern plating method, pattern plating negative plate and flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100619125A CN100558221C (en) | 2006-07-28 | 2006-07-28 | Flexible circuit board pattern plating method, pattern plating negative plate and flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101115358A true CN101115358A (en) | 2008-01-30 |
| CN100558221C CN100558221C (en) | 2009-11-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2006100619125A Expired - Fee Related CN100558221C (en) | 2006-07-28 | 2006-07-28 | Flexible circuit board pattern plating method, pattern plating negative plate and flexible circuit board |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101686600A (en) * | 2008-09-26 | 2010-03-31 | 住友电工印刷电路株式会社 | Flexible printing wiring board, method for manufacturing the same, and flexible printing wiring board for hard disc device |
| CN102316677A (en) * | 2010-06-30 | 2012-01-11 | 比亚迪股份有限公司 | Electroplating method for double-side and multilayer flexible printed circuit board |
| CN103247853A (en) * | 2012-02-10 | 2013-08-14 | 比亚迪股份有限公司 | NFC antenna, mobile terminal as well as manufacturing method of NFC antenna |
| CN111050492A (en) * | 2019-12-31 | 2020-04-21 | 深圳崇达多层线路板有限公司 | Electric golden finger method for reducing liquid medicine residue |
| CN111246669A (en) * | 2020-01-17 | 2020-06-05 | 深圳市德名利电子有限公司 | Design method of LPDDR substrate, LPDDR substrate and electronic equipment |
| CN112888177A (en) * | 2020-12-30 | 2021-06-01 | 信丰迅捷兴电路科技有限公司 | Manufacturing method of optical module board for 5G |
| CN113056094A (en) * | 2019-12-27 | 2021-06-29 | 深南电路股份有限公司 | Prefabricated substrate and printed circuit board |
-
2006
- 2006-07-28 CN CNB2006100619125A patent/CN100558221C/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101686600A (en) * | 2008-09-26 | 2010-03-31 | 住友电工印刷电路株式会社 | Flexible printing wiring board, method for manufacturing the same, and flexible printing wiring board for hard disc device |
| CN101686600B (en) * | 2008-09-26 | 2013-10-16 | 住友电工印刷电路株式会社 | Flexible printing wiring board, method for manufacturing the same, and flexible printing wiring board for hard disc device |
| CN102316677A (en) * | 2010-06-30 | 2012-01-11 | 比亚迪股份有限公司 | Electroplating method for double-side and multilayer flexible printed circuit board |
| CN102316677B (en) * | 2010-06-30 | 2013-05-08 | 比亚迪股份有限公司 | Electroplating method for double-side and multilayer flexible printed circuit board |
| CN103247853A (en) * | 2012-02-10 | 2013-08-14 | 比亚迪股份有限公司 | NFC antenna, mobile terminal as well as manufacturing method of NFC antenna |
| CN113056094A (en) * | 2019-12-27 | 2021-06-29 | 深南电路股份有限公司 | Prefabricated substrate and printed circuit board |
| CN111050492A (en) * | 2019-12-31 | 2020-04-21 | 深圳崇达多层线路板有限公司 | Electric golden finger method for reducing liquid medicine residue |
| CN111050492B (en) * | 2019-12-31 | 2022-07-08 | 深圳崇达多层线路板有限公司 | Electric golden finger method for reducing liquid medicine residue |
| CN111246669A (en) * | 2020-01-17 | 2020-06-05 | 深圳市德名利电子有限公司 | Design method of LPDDR substrate, LPDDR substrate and electronic equipment |
| CN111246669B (en) * | 2020-01-17 | 2021-07-30 | 深圳市德明利技术股份有限公司 | Design method of LPDDR substrate, LPDDR substrate and electronic equipment |
| CN112888177A (en) * | 2020-12-30 | 2021-06-01 | 信丰迅捷兴电路科技有限公司 | Manufacturing method of optical module board for 5G |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100558221C (en) | 2009-11-04 |
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Legal Events
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| C06 | Publication | ||
| PB01 | Publication | ||
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| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: SHENZHEN BYD ELECTRONIC COMPONENT Co.,Ltd. Assignor: BYD Co.,Ltd. Contract fulfillment period: 2008.4.25 to 2015.11.14 Contract record no.: 2008440000067 Denomination of invention: Flexible circuit board pattern plating method and pattern plating negative plate License type: Exclusive license Record date: 20080504 |
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| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENCE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.4.25 TO 2015.11.14 Name of requester: BIYADI ELECTRON MEMBER CO., LTD., SHENZHEN CITY Effective date: 20080504 |
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| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
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| TR01 | Transfer of patent right |
Effective date of registration: 20201211 Address after: No.415 Jiangping Road, Jingjiang City, Taizhou City, Jiangsu Province Patentee after: Jiangsu Jiuyuan Electric Power Construction Engineering Co.,Ltd. Address before: 518119 BYD Industrial Park, Yanan Road, Kwai Chung Town, Longgang District, Guangdong, Shenzhen Patentee before: BYD Co.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091104 Termination date: 20210728 |