CN111050492B - Electric golden finger method for reducing liquid medicine residue - Google Patents
Electric golden finger method for reducing liquid medicine residue Download PDFInfo
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- CN111050492B CN111050492B CN201911424515.3A CN201911424515A CN111050492B CN 111050492 B CN111050492 B CN 111050492B CN 201911424515 A CN201911424515 A CN 201911424515A CN 111050492 B CN111050492 B CN 111050492B
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- gold
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- finger
- windowing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to the technical field of printed circuit boards, in particular to an electric golden finger method for reducing liquid medicine residue. According to the method, the design of the local electric gold pattern is adjusted and optimized, and the communicated golden finger windowing and base material windowing are arranged on the local electric gold pattern, so that gullies formed by the height difference between the base material surface and two sides of the base material surface are in a windowing state, the gullies are not covered by a dry film, developing liquid medicine at the gullies can be cleaned through plate washing post-treatment in the conventional outer layer pattern manufacturing, particularly, the positions of the golden finger windowing and the base material windowing are pressed by water absorption sponges after the plate washing, then the multilayer production plate is heated, the developing liquid medicine is almost free of residues, and the problem that the golden surface of the golden finger is white or the gold cannot be plated due to the residual developing liquid medicine is solved. The gold plating layer is added on the gold finger by the method, the problem that the gold surface of the gold finger is whitish or not plated with gold is solved, and the production rejection rate and the rework rate are obviously reduced.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to an electric golden finger method for reducing liquid medicine residue.
Background
The gold finger used for the interface on the circuit board can cause friction loss to the gold surface of the gold finger when plugging, in order to increase the plugging times, in the production and manufacturing of the circuit board, after an outer layer circuit and a solder mask layer are manufactured, the gold finger is continuously subjected to electric thick gold processing on the basis of nickel-gold surface processing, so that the gold layer thickness of the gold finger is increased. The main production flow of the circuit board designed with the golden fingers is as follows: manufacturing an inner layer circuit and an inner layer AOI on the inner layer core board → pressing → outer layer drilling → copper deposition and full-board electroplating → an outer layer circuit and an outer layer AOI → silk screen solder resist → nickel electroplating → local gold electroplating pattern → gold finger local gold electroplating → film removal → molding. The local electrogilding graphic process for thickening the gold layer thickness of the gold finger after nickel-gold electroplating is to cover a layer of dry film on a multilayer production board, expose the gold finger position needing gold plating through exposure and development, cover other metal surfaces, the covered film surface covered with the solder resist ink and the substrate surface not covered with the solder resist ink by the dry film, and form the local electrogilding graphic to form the gold finger windowing at the gold finger position. The preparation process has the following defects: when the edge of the golden finger window passes through the surface of the substrate (as shown in fig. 1), gaps covered by the dry film are formed because the two sides of the surface of the substrate are metal surfaces and/or plate surfaces already covered with solder resist ink (the copper surface is covered with solder resist ink). As shown in fig. 2a, 2b and 2c, for example, in fig. 2a, the thickness of the copper layer is 45 μm, the thickness of the solder resist layer is 20 μm, the height difference between the two sides of the substrate surface and the substrate surface is 65 μm, and the dry film at the boundary is difficult to completely adhere to the plate surface, thereby forming a gap. Therefore, the developing solution in the process of manufacturing the local gold plating pattern remains in the gullies under the dry film, and the developing solution is difficult to completely clean even through plate washing and drying treatment, so that the gold surface of the processed gold finger is whitened due to the fact that the surface of the gold finger is polluted by the developing solution when the local gold plating is performed on the gold finger position, and even the problem that the gold cannot be plated occurs, and the gold plating is scrapped or reworked.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a method for reducing the residual liquid medicine of the golden finger, which comprises the following steps:
s1, manufacturing a local electrogilding pattern on the multilayer production board;
the multilayer production board is a production board which is manufactured with an outer layer circuit and a solder mask layer and is subjected to nickel-gold surface treatment, and the multilayer production board is provided with a gold finger, a base material surface exposed from the base material, a film covering surface covered with solder mask ink and a metal surface exposed from a metal layer;
the local electric golden pattern comprises a golden finger windowing part for exposing the golden finger and a base material windowing part for exposing the base material surface, wherein the edge of the golden finger windowing part passes through the base material surface, the edge passing through the base material surface is called an overlapping edge, and the golden finger windowing part is communicated with the base material windowing part at the overlapping edge;
further, the shortest distance between the overlapped edge and the gold finger is greater than or equal to 0.5 mm.
Further, the copper thickness of the outer layer wiring was 45 μm.
Further, the thickness of the solder resist layer is 20 μm.
Further, the thickness of the nickel layer formed by the electro-nickel-gold surface treatment is 3-5 μm.
Further, the thickness of the gold layer formed by the electro-nickel gold surface treatment is 0.025-0.05 μm.
Furthermore, after a local electrogilding graph is manufactured on the multilayer production board, before electrogilding treatment is carried out on the multilayer production board, the positions of the golden finger windowing and the base material windowing are pressed by a water-absorbing sponge, and then the multilayer production board is placed at 70-80 ℃ to be dried for 30-60 min.
S2, performing electrogilding treatment on the multilayer production board, and plating gold on the gold finger until the thickness of the gold layer meets the design requirement;
and S3, removing the film of the multilayer production board, and then carrying out molding processing to obtain the circuit board.
Compared with the prior art, the invention has the beneficial effects that:
according to the method, the design of the local electric gold pattern is adjusted and optimized, and the communicated gold finger windowing and substrate windowing are arranged on the local electric gold pattern, so that gullies formed by the height difference between the substrate surface and two sides of the substrate surface are in a windowing state, gullies are not covered by dry films, developing liquid medicine at the gullies can be cleaned through plate washing post-treatment in the conventional outer layer pattern manufacturing, particularly, the positions of the gold finger windowing and the substrate windowing are pressed by water absorption sponges after the plate washing, then the multilayer production plate is heated and dried, the developing liquid medicine is almost free of residues, and the problem that the gold surface of the gold finger is whitened or cannot be plated with gold due to the residual developing liquid medicine is solved. The gold plating layer is added on the gold finger by the method, the problem that the gold surface of the gold finger is whitish or not plated with gold is solved, and the production rejection rate and the rework rate are obviously reduced.
Drawings
FIG. 1 is a schematic view of a multi-layer production panel having gold fingers on the panel surface, an exposed substrate surface, a cover surface covered with solder resist ink, and an exposed metal surface of a metal layer;
FIG. 2a is one of the schematic cross-sectional views of a portion of a ply at and near the face of a substrate on a multi-ply production panel;
FIG. 2b is a second schematic cross-sectional view of a portion of the plies at and near the substrate side of the multi-ply production panel;
FIG. 2c is a third schematic cross-sectional view of a portion of the plies at and near the substrate side of the multi-ply production panel.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to the following specific embodiments.
Examples
The embodiment provides a manufacturing method of a circuit board, in particular to a manufacturing method of a gold finger on the circuit board, and provides an electric gold finger method for reducing liquid medicine residue when a gold layer is plated after nickel gold is plated on the gold finger. The production board of the embodiment is designed with a gold finger, a substrate surface with exposed substrate, a film covering surface covered with solder resist ink and a metal surface with exposed metal layer.
The specific preparation method of the circuit board comprises the following steps:
1. cutting: the core board is cut according to the size of the jointed board, and the thickness of the core board is 0.15mm and 0.5OZ/0.5 OZ.
2. Inner layer: coating wet films on two surfaces of the core plate, and controlling the film thickness to be 8 mu m; the exposure of the inner layer circuit is completed by using a full-automatic exposure machine and 5-6 exposure rulers (21 exposure rulers); and etching a circuit pattern after development, wherein the minimum line width/line gap of the inner layer is 0.09mm/0.09 mm.
3. Inner layer AOI: and (4) detecting defects of open short circuit, circuit notch, pin hole and the like of the inner layer, scrapping the defective inner layer core plate, and enabling the non-defective inner layer core plate to enter the next flow.
4. And (3) laminating: and performing brown oxidation treatment on the core plate of the inner layer, selecting copper foil and no-flow glue PP, stacking the plates according to the product design sequence, then selecting proper lamination conditions according to the Tg of the plate material to perform lamination, and laminating to form the multilayer production plate.
5. Drilling an outer layer: and drilling holes on the multilayer production board according to the drilling tape information.
6. Copper deposition and full-plate electroplating: metallizing the hole drilled in the previous step, and chemically removing the glue residue once before copper deposition.
7. Outer layer circuit: and manufacturing an outer layer circuit on the multilayer production board in a positive process mode, and carrying out outer layer pattern transfer, pattern electroplating, film stripping, alkaline etching and tin stripping processes. The copper thickness of the outer layer of the wiring was 45 μm.
8. Outer layer AOI: and using an automatic optical detection system to detect whether the outer layer circuit has defects such as open circuit, gap, incomplete etching, short circuit and the like by comparing with CAM data.
9. Solder resist and silk screen printing of characters: the green oil layer (solder mask layer) is manufactured on the outer layer of the multilayer production board and characters are printed in a silk screen mode, and the thickness of the solder mask layer is 20 mu m, so that the influence of environmental change on the multilayer production board in the subsequent use process can be reduced.
10. Surface treatment (electroless nickel gold): uniformly electroplating nickel layers and gold layers with certain required thickness on copper surfaces such as pads at the windowing positions of the solder mask layer on the multilayer production board, wherein the thickness of the nickel layers is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.025-0.05 μm.
The multilayer production board is provided with a gold finger, a substrate surface with exposed substrate, a film covering surface covered with solder resist ink and a metal surface with exposed metal layer.
11. Local electric thick gold: the gold plating layer is added on the gold finger to thicken the thickness of the gold layer on the gold finger, and the method specifically comprises the following steps:
and S1, covering the dry film on the multilayer production board, and transferring the pattern on the film to the multilayer production board through exposure and development to form a local electrogilding pattern. The partial electric golden pattern comprises a golden finger windowing part exposing golden fingers and a base material windowing part exposing a base material surface, wherein the partial edge of the golden finger windowing part passes through the base material surface, the edge passing through the base material surface is called an overlapping edge, and the golden finger windowing part is communicated with the base material windowing part at the overlapping edge.
The shortest distance between the overlapping edge and the gold finger is 0.5 mm.
S2, washing the multilayer production board with water, after the board is primarily dried, pressing the windowing position of the golden finger and the windowing position of the base material with water-absorbing sponge, and then placing the multilayer production board at 70-80 ℃ for drying for 30-60 min.
S3, carrying out gold electroplating treatment on the multilayer production board, and plating gold on the gold finger until the thickness of the gold layer meets the design requirement, wherein the plating thickness is controlled to be 0.05-1.5 μm.
And S4, performing film stripping treatment on the multilayer production board.
12. Molding: according to the prior art and according to the design requirement, routing the shape, and manufacturing the PCB with the tolerance of +/-0.05 mm.
13. Electrical testing: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and (5) flying probe testing.
14. FQC: and checking whether the appearance, the hole wall copper thickness, the medium layer thickness, the green oil thickness, the inner layer copper thickness and the like of the finished board meet the requirements of customers.
15. Packaging: and hermetically packaging the finished boards according to the packaging mode and the packaging quantity required by the customer, putting a drying agent and a humidity card, and then delivering.
By adopting the method for preparing the circuit board, the problem that the gold surface of the gold finger is whitish or not plated with gold does not occur after the gold-plated layer is added on the gold finger, and therefore scrapping or reworking is not caused.
The technical contents of the present invention are further illustrated by the examples, so as to facilitate the understanding of the reader, but the embodiments of the present invention are not limited thereto, and any technical extension or re-creation based on the present invention is protected by the present invention.
Claims (6)
1. The method for reducing the residual liquid medicine of the electric golden finger is characterized by comprising the following steps:
s1, manufacturing a local electrogilding pattern on the multilayer production board;
the multilayer production board is a production board which is manufactured with an outer layer circuit and a solder mask layer and is subjected to nickel-gold surface treatment, and the multilayer production board is provided with a gold finger, a base material surface exposed from the base material, a film covering surface covered with solder mask ink and a metal surface exposed from a metal layer;
the local electric gold pattern comprises a gold finger window for exposing a gold finger and a base material window for exposing a base material surface, wherein part of the edge of the gold finger window passes through the base material surface, the edge passing through the base material surface is called an overlapped edge, the gold finger window is communicated with the base material window at the overlapped edge, and a gully formed by the height difference between the base material surface and two sides of the base material surface is in a windowing state and is not covered by a dry film;
after a local electrogilding graph is manufactured on the multilayer production board, before electrogilding treatment is carried out on the multilayer production board, a water-absorbing sponge is used for pressing a gold finger windowing part and a base material windowing part, and then the multilayer production board is placed at 70-80 ℃ to be dried for 30-60 min;
s2, performing electrogilding treatment on the multilayer production board, and plating gold on the gold finger until the thickness of the gold layer meets the design requirement;
and S3, removing the film of the multilayer production board, and then carrying out molding processing to obtain the circuit board.
2. The method of claim 1, wherein the shortest distance between the overlapping edge and the golden finger in step S1 is greater than or equal to 0.5 mm.
3. The method of claim 1, wherein the copper thickness of the outer layer of the circuit in step S1 is 45 μm.
4. The method for reducing the residue of chemical solution in an electrical golden finger of claim 1, wherein the thickness of the solder mask layer in step S1 is 20 μm.
5. The method of claim 1, wherein the thickness of the nickel layer formed by the surface treatment of electroless nickel and gold in step S1 is 3-5 μm.
6. The method of claim 5, wherein the thickness of the gold layer formed by the surface treatment of electroless nickel gold in step S1 is 0.025-0.05 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911424515.3A CN111050492B (en) | 2019-12-31 | 2019-12-31 | Electric golden finger method for reducing liquid medicine residue |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911424515.3A CN111050492B (en) | 2019-12-31 | 2019-12-31 | Electric golden finger method for reducing liquid medicine residue |
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| CN111050492A CN111050492A (en) | 2020-04-21 |
| CN111050492B true CN111050492B (en) | 2022-07-08 |
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| CN108419377B (en) * | 2018-05-10 | 2019-09-13 | 生益电子股份有限公司 | One kind having lead partially plating gold method |
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- 2019-12-31 CN CN201911424515.3A patent/CN111050492B/en active Active
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