TWI542951B - 用於光阻淋洗溶液之全氟烷基磺醯胺界面活性劑 - Google Patents

用於光阻淋洗溶液之全氟烷基磺醯胺界面活性劑 Download PDF

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Publication number
TWI542951B
TWI542951B TW101128804A TW101128804A TWI542951B TW I542951 B TWI542951 B TW I542951B TW 101128804 A TW101128804 A TW 101128804A TW 101128804 A TW101128804 A TW 101128804A TW I542951 B TWI542951 B TW I542951B
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TW
Taiwan
Prior art keywords
solution
photoresist
perfluoroalkylsulfonamide
photoresist material
aqueous
Prior art date
Application number
TW101128804A
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English (en)
Chinese (zh)
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TW201314373A (zh
Inventor
傑森 麥克 奇瑞恩
派翠西亞 瑪莉 沙維
馬修 詹姆士 皮諾
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3M新設資產公司
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Publication of TW201314373A publication Critical patent/TW201314373A/zh
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Publication of TWI542951B publication Critical patent/TWI542951B/zh

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/40Treatment after imagewise removal, e.g. baking
    • H10P76/204
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/40Treatment after imagewise removal, e.g. baking
    • G03F7/405Treatment with inorganic or organometallic reagents after imagewise removal
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Detergent Compositions (AREA)
  • Emulsifying, Dispersing, Foam-Producing Or Wetting Agents (AREA)
TW101128804A 2011-08-10 2012-08-09 用於光阻淋洗溶液之全氟烷基磺醯胺界面活性劑 TWI542951B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161522057P 2011-08-10 2011-08-10

Publications (2)

Publication Number Publication Date
TW201314373A TW201314373A (zh) 2013-04-01
TWI542951B true TWI542951B (zh) 2016-07-21

Family

ID=47669161

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101128804A TWI542951B (zh) 2011-08-10 2012-08-09 用於光阻淋洗溶液之全氟烷基磺醯胺界面活性劑

Country Status (7)

Country Link
US (1) US9551936B2 (enExample)
EP (1) EP2742523B1 (enExample)
JP (1) JP6101693B2 (enExample)
KR (1) KR102000800B1 (enExample)
CN (1) CN103717706B (enExample)
TW (1) TWI542951B (enExample)
WO (1) WO2013022673A2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9454082B2 (en) * 2013-01-29 2016-09-27 3M Innovative Properties Company Surfactants and methods of making and using same
KR101530606B1 (ko) * 2014-03-18 2015-07-01 주식회사 스노젠 인산 및 황산계 과불소화알킬 에스테르 계면 활성제와 이를 함유하는 크롬 식각액 및 저온 공정용 소핑제
WO2016040551A1 (en) * 2014-09-11 2016-03-17 3M Innovative Properties Company Fluorinated surfactant containing compositions
JP7039865B2 (ja) * 2017-05-26 2022-03-23 大日本印刷株式会社 パターン形成方法、凹凸構造体の製造方法、レプリカモールドの製造方法、レジストパターン改質装置及びパターン形成システム
WO2019105889A1 (en) 2017-11-28 2019-06-06 Basf Se Composition comprising a primary and a secondary surfactant, for cleaning or rinsing a product
US11762297B2 (en) * 2019-04-09 2023-09-19 Tokyo Electron Limited Point-of-use blending of rinse solutions to mitigate pattern collapse
CN114788527B (zh) * 2022-05-10 2024-03-01 广西产研院生物制造技术研究所有限公司 一种碘酸混合溶液消毒剂、制备方法及其在生猪圈舍消毒中的应用

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2567011A (en) 1949-01-10 1951-09-04 Minnesota Mining & Mfg Fluorocarbon acids and derivatives
DE2024909B2 (de) 1970-05-22 1977-09-29 Bayer Ag, 5090 Leverkusen Verfahren zur herstellung von n-hydroxyalkyl-perfluoralkansulfonamiden und einige n,n-bis-(hydroxyalkyl)-perfluor-alkansulfonamide
US4089804A (en) 1976-12-30 1978-05-16 Ciba-Geigy Corporation Method of improving fluorinated surfactants
DE2921142A1 (de) 1979-05-25 1980-12-11 Bayer Ag Verwendung von perfluoralkansulfonamid- salzen als tenside
JP3217116B2 (ja) * 1992-03-06 2001-10-09 日産化学工業株式会社 低表面張力洗浄用組成物
JP4075275B2 (ja) 1999-03-25 2008-04-16 大日本インキ化学工業株式会社 感光性組成物、印刷版原版及び画像形成方法
EP1038667B1 (en) * 1999-03-25 2005-07-27 Dainippon Ink And Chemicals, Inc. Lithographic printing plate and image forming method
US20040029395A1 (en) 2002-08-12 2004-02-12 Peng Zhang Process solutions containing acetylenic diol surfactants
EP2082995B1 (en) 1999-10-27 2012-08-08 3M Innovative Properties Company Method of reducing the surface tension, of forming a stable foam and to increase the wetting of a coating
US6890452B2 (en) 2002-11-08 2005-05-10 3M Innovative Properties Company Fluorinated surfactants for aqueous acid etch solutions
US7169323B2 (en) * 2002-11-08 2007-01-30 3M Innovative Properties Company Fluorinated surfactants for buffered acid etch solutions
JP4493393B2 (ja) 2004-04-23 2010-06-30 東京応化工業株式会社 リソグラフィー用リンス液
JP4767829B2 (ja) 2006-01-11 2011-09-07 東京応化工業株式会社 リソグラフィー用洗浄剤及びそれを用いたレジストパターン形成方法
JP2007219009A (ja) * 2006-02-14 2007-08-30 Az Electronic Materials Kk レジスト基板用処理液とそれを用いたレジスト基板の処理方法
US20080299487A1 (en) 2007-05-31 2008-12-04 Taiwan Semiconductor Manufacturing Company, Ltd. Lithography material and lithography process
US20080280230A1 (en) * 2007-05-10 2008-11-13 Taiwan Semiconductor Manufacturing Company, Ltd. Photolithography process including a chemical rinse
JP5089422B2 (ja) * 2008-02-15 2012-12-05 岡本化学工業株式会社 感光性組成物およびそれを用いた平版印刷版用原版
WO2010074877A1 (en) 2008-12-23 2010-07-01 3M Innovative Properties Company Method of making a composition and aqueous composition preparable thereby
US20100155657A1 (en) 2008-12-23 2010-06-24 3M Innovative Properties Company Aqueous composition containing fluorinated sulfonamide and sulfonamidate compounds
JP5624753B2 (ja) * 2009-03-31 2014-11-12 東京応化工業株式会社 リソグラフィー用洗浄液及びこれを用いたレジストパターンの形成方法

Also Published As

Publication number Publication date
TW201314373A (zh) 2013-04-01
EP2742523B1 (en) 2020-09-23
JP6101693B2 (ja) 2017-03-22
CN103717706B (zh) 2015-09-23
JP2014527200A (ja) 2014-10-09
EP2742523A4 (en) 2015-01-21
US20140154632A1 (en) 2014-06-05
CN103717706A (zh) 2014-04-09
KR102000800B1 (ko) 2019-07-16
KR20140052010A (ko) 2014-05-02
WO2013022673A3 (en) 2013-06-06
EP2742523A2 (en) 2014-06-18
US9551936B2 (en) 2017-01-24
WO2013022673A2 (en) 2013-02-14

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