TWI532997B - 膜式探針卡 - Google Patents

膜式探針卡 Download PDF

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Publication number
TWI532997B
TWI532997B TW103124089A TW103124089A TWI532997B TW I532997 B TWI532997 B TW I532997B TW 103124089 A TW103124089 A TW 103124089A TW 103124089 A TW103124089 A TW 103124089A TW I532997 B TWI532997 B TW I532997B
Authority
TW
Taiwan
Prior art keywords
film
coupled
probe card
printed circuit
circuit board
Prior art date
Application number
TW103124089A
Other languages
English (en)
Chinese (zh)
Other versions
TW201520561A (zh
Inventor
趙濬秀
朴鍾鉉
李鎔寬
Original Assignee
普歐２０００有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 普歐２０００有限公司 filed Critical 普歐２０００有限公司
Publication of TW201520561A publication Critical patent/TW201520561A/zh
Application granted granted Critical
Publication of TWI532997B publication Critical patent/TWI532997B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
TW103124089A 2013-07-17 2014-07-14 膜式探針卡 TWI532997B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130084095A KR101380162B1 (ko) 2013-07-17 2013-07-17 필름타입 프로브카드

Publications (2)

Publication Number Publication Date
TW201520561A TW201520561A (zh) 2015-06-01
TWI532997B true TWI532997B (zh) 2016-05-11

Family

ID=50656231

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103124089A TWI532997B (zh) 2013-07-17 2014-07-14 膜式探針卡

Country Status (2)

Country Link
KR (1) KR101380162B1 (ko)
TW (1) TWI532997B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108427021B (zh) 2017-02-13 2020-08-21 华邦电子股份有限公司 探针头、探针模块及其制作方法
TWI619948B (zh) * 2017-02-13 2018-04-01 華邦電子股份有限公司 探針頭、探針模組及其製作方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000321303A (ja) * 1999-05-14 2000-11-24 Tokyo Electron Ltd プローブカード及びコンタクタ
US6657448B2 (en) * 2000-02-21 2003-12-02 Kabushiki Kaisha Nihon Micronics Electrical connection apparatus
JP2003035725A (ja) * 2001-07-25 2003-02-07 Micronics Japan Co Ltd 電気的接続装置

Also Published As

Publication number Publication date
TW201520561A (zh) 2015-06-01
KR101380162B1 (ko) 2014-04-03

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees