TWI532597B - 具有用於化學機械平坦化之界面活性劑的固定式研磨墊 - Google Patents
具有用於化學機械平坦化之界面活性劑的固定式研磨墊 Download PDFInfo
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- TWI532597B TWI532597B TW100116384A TW100116384A TWI532597B TW I532597 B TWI532597 B TW I532597B TW 100116384 A TW100116384 A TW 100116384A TW 100116384 A TW100116384 A TW 100116384A TW I532597 B TWI532597 B TW I532597B
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- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
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- RGBXDEHYFWDBKD-UHFFFAOYSA-N propan-2-yl propan-2-yloxy carbonate Chemical compound CC(C)OOC(=O)OC(C)C RGBXDEHYFWDBKD-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
- B24B37/245—Pads with fixed abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
- B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
- B24D3/344—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent the bonding agent being organic
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US33335110P | 2010-05-11 | 2010-05-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201213121A TW201213121A (en) | 2012-04-01 |
| TWI532597B true TWI532597B (zh) | 2016-05-11 |
Family
ID=44383031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100116384A TWI532597B (zh) | 2010-05-11 | 2011-05-10 | 具有用於化學機械平坦化之界面活性劑的固定式研磨墊 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20130059506A1 (enExample) |
| JP (1) | JP2013526777A (enExample) |
| KR (1) | KR20130081229A (enExample) |
| CN (1) | CN102892553B (enExample) |
| SG (1) | SG185523A1 (enExample) |
| TW (1) | TWI532597B (enExample) |
| WO (1) | WO2011142986A1 (enExample) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2897767A4 (en) * | 2012-09-21 | 2016-07-27 | 3M Innovative Properties Co | INTEGRATION OF ADDITIONS IN FIXED SLOPES FOR IMPROVED CMP PERFORMANCE |
| WO2014189086A1 (ja) * | 2013-05-24 | 2014-11-27 | Jsr株式会社 | 化学機械研磨パッドおよびそれを用いた化学機械研磨方法 |
| US20150104940A1 (en) * | 2013-10-11 | 2015-04-16 | Air Products And Chemicals Inc. | Barrier chemical mechanical planarization composition and method thereof |
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
| US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| KR102295988B1 (ko) | 2014-10-17 | 2021-09-01 | 어플라이드 머티어리얼스, 인코포레이티드 | 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성 |
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-
2011
- 2011-04-29 KR KR1020127031934A patent/KR20130081229A/ko not_active Withdrawn
- 2011-04-29 SG SG2012083150A patent/SG185523A1/en unknown
- 2011-04-29 WO PCT/US2011/034439 patent/WO2011142986A1/en not_active Ceased
- 2011-04-29 CN CN201180023624.XA patent/CN102892553B/zh not_active Expired - Fee Related
- 2011-04-29 US US13/696,908 patent/US20130059506A1/en not_active Abandoned
- 2011-04-29 JP JP2013510126A patent/JP2013526777A/ja active Pending
- 2011-05-10 TW TW100116384A patent/TWI532597B/zh not_active IP Right Cessation
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| JP2013526777A (ja) | 2013-06-24 |
| CN102892553A (zh) | 2013-01-23 |
| SG185523A1 (en) | 2012-12-28 |
| TW201213121A (en) | 2012-04-01 |
| CN102892553B (zh) | 2016-04-27 |
| WO2011142986A1 (en) | 2011-11-17 |
| US20130059506A1 (en) | 2013-03-07 |
| KR20130081229A (ko) | 2013-07-16 |
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