JP2013526777A - 化学機械平坦化用の界面活性剤を含む固定研磨パッド - Google Patents
化学機械平坦化用の界面活性剤を含む固定研磨パッド Download PDFInfo
- Publication number
- JP2013526777A JP2013526777A JP2013510126A JP2013510126A JP2013526777A JP 2013526777 A JP2013526777 A JP 2013526777A JP 2013510126 A JP2013510126 A JP 2013510126A JP 2013510126 A JP2013510126 A JP 2013510126A JP 2013526777 A JP2013526777 A JP 2013526777A
- Authority
- JP
- Japan
- Prior art keywords
- structured
- abrasive article
- abrasive
- polishing
- structured abrasive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
- B24B37/245—Pads with fixed abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
- B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
- B24D3/344—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent the bonding agent being organic
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US33335110P | 2010-05-11 | 2010-05-11 | |
| US61/333,351 | 2010-05-11 | ||
| PCT/US2011/034439 WO2011142986A1 (en) | 2010-05-11 | 2011-04-29 | Fixed abrasive pad with surfactant for chemical mechanical planarization |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013526777A true JP2013526777A (ja) | 2013-06-24 |
| JP2013526777A5 JP2013526777A5 (enExample) | 2014-06-19 |
Family
ID=44383031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013510126A Pending JP2013526777A (ja) | 2010-05-11 | 2011-04-29 | 化学機械平坦化用の界面活性剤を含む固定研磨パッド |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20130059506A1 (enExample) |
| JP (1) | JP2013526777A (enExample) |
| KR (1) | KR20130081229A (enExample) |
| CN (1) | CN102892553B (enExample) |
| SG (1) | SG185523A1 (enExample) |
| TW (1) | TWI532597B (enExample) |
| WO (1) | WO2011142986A1 (enExample) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104822495A (zh) * | 2012-09-21 | 2015-08-05 | 3M创新有限公司 | 向固定磨料幅材中引入添加剂以改善cmp性能 |
| WO2014189086A1 (ja) * | 2013-05-24 | 2014-11-27 | Jsr株式会社 | 化学機械研磨パッドおよびそれを用いた化学機械研磨方法 |
| US20150104940A1 (en) * | 2013-10-11 | 2015-04-16 | Air Products And Chemicals Inc. | Barrier chemical mechanical planarization composition and method thereof |
| US9873180B2 (en) * | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
| CN107078048B (zh) | 2014-10-17 | 2021-08-13 | 应用材料公司 | 使用加成制造工艺的具复合材料特性的cmp衬垫建构 |
| US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| BR112017011164B1 (pt) * | 2014-11-26 | 2021-10-05 | 3M Innovative Properties Company | Artigo abrasivo, conjunto abrasivo e método para sua utilização |
| US9914864B2 (en) | 2014-12-23 | 2018-03-13 | Saint-Gobain Ceramics & Plastics, Inc. | Shaped abrasive particles and method of forming same |
| SI3237147T1 (sl) * | 2014-12-23 | 2021-01-29 | Saint-Gobain Ceramics&Plastics, Inc. | Oblikovani abrazivni deli in metoda oblikovanja istih |
| WO2016172450A1 (en) | 2015-04-23 | 2016-10-27 | The University Of Florida Research Foundation, Inc. | Hybrid tool with both fixed-abrasive and loose-abrasive phases |
| KR20230169424A (ko) | 2015-10-30 | 2023-12-15 | 어플라이드 머티어리얼스, 인코포레이티드 | 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법 |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| USD850041S1 (en) * | 2017-07-31 | 2019-05-28 | 3M Innovative Properties Company | Scouring pad |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
| JP7186770B2 (ja) | 2017-10-04 | 2022-12-09 | サンーゴバン アブレイシブズ,インコーポレイティド | 研磨用物品およびその形成方法 |
| CN112654655A (zh) | 2018-09-04 | 2021-04-13 | 应用材料公司 | 先进抛光垫配方 |
| US11331767B2 (en) | 2019-02-01 | 2022-05-17 | Micron Technology, Inc. | Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods |
| US20200306927A1 (en) | 2019-03-29 | 2020-10-01 | Saint Gobain Abrasives, Inc. | Performance Grinding Solutions |
| US12226876B2 (en) | 2019-04-03 | 2025-02-18 | Saint-Gobain Abrasives, Inc. | Abrasive article, abrasive system and method for using and forming same |
| US11851570B2 (en) * | 2019-04-12 | 2023-12-26 | Applied Materials, Inc. | Anionic polishing pads formed by printing processes |
| USD934573S1 (en) * | 2019-12-19 | 2021-11-02 | 3M Innovative Properties Company | Sponge with surface pattern |
| US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
| US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
| US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
| CN117327450A (zh) * | 2023-09-21 | 2024-01-02 | 浙江芯秦微电子科技有限公司 | 一种抛光液的制备方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09201773A (ja) * | 1996-01-29 | 1997-08-05 | Dainippon Printing Co Ltd | 研磨テープ及びその製造方法 |
| JPH11512874A (ja) * | 1995-09-22 | 1999-11-02 | ミネソタ・マイニング・アンド・マニュファクチャリング・カンパニー | 半導体ウェーハの露出面を改質する方法 |
| JP2008537911A (ja) * | 2005-04-14 | 2008-10-02 | サンーゴバン アブレイシブズ,インコーポレイティド | ストラクチャード研磨物品を作る方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5152917B1 (en) | 1991-02-06 | 1998-01-13 | Minnesota Mining & Mfg | Structured abrasive article |
| US5435816A (en) | 1993-01-14 | 1995-07-25 | Minnesota Mining And Manufacturing Company | Method of making an abrasive article |
| BR9407536A (pt) | 1993-09-13 | 1997-08-26 | Minnesota Mining & Mfg | Artigo abrasivo processos de fabricação e de refino de peça em trabalho corn o mesmo ferramenta de produção para fabricação do mesmo e processo de produção de matriz mestra para formação da mesma |
| US5454844A (en) | 1993-10-29 | 1995-10-03 | Minnesota Mining And Manufacturing Company | Abrasive article, a process of making same, and a method of using same to finish a workpiece surface |
| AU686335B2 (en) | 1994-02-22 | 1998-02-05 | Minnesota Mining And Manufacturing Company | Abrasive article, a method of making same, and a method of using same for finishing |
| US5692950A (en) | 1996-08-08 | 1997-12-02 | Minnesota Mining And Manufacturing Company | Abrasive construction for semiconductor wafer modification |
| US6475253B2 (en) * | 1996-09-11 | 2002-11-05 | 3M Innovative Properties Company | Abrasive article and method of making |
| US5876268A (en) * | 1997-01-03 | 1999-03-02 | Minnesota Mining And Manufacturing Company | Method and article for the production of optical quality surfaces on glass |
| US5833724A (en) * | 1997-01-07 | 1998-11-10 | Norton Company | Structured abrasives with adhered functional powders |
| US5851247A (en) | 1997-02-24 | 1998-12-22 | Minnesota Mining & Manufacturing Company | Structured abrasive article adapted to abrade a mild steel workpiece |
| FR2766106B1 (fr) * | 1997-07-18 | 2001-09-07 | Coatex Sa | Utilisation d'un copolymere a structure tensio-active comme agent dispersant et/ou d'aide au broyage |
| US6139594A (en) | 1998-04-13 | 2000-10-31 | 3M Innovative Properties Company | Abrasive article with tie coat and method |
| US6458018B1 (en) * | 1999-04-23 | 2002-10-01 | 3M Innovative Properties Company | Abrasive article suitable for abrading glass and glass ceramic workpieces |
| US20030017797A1 (en) * | 2001-03-28 | 2003-01-23 | Kendall Philip E. | Dual cured abrasive articles |
| US7150771B2 (en) * | 2004-06-18 | 2006-12-19 | 3M Innovative Properties Company | Coated abrasive article with composite tie layer, and method of making and using the same |
| US7497885B2 (en) | 2006-12-22 | 2009-03-03 | 3M Innovative Properties Company | Abrasive articles with nanoparticulate fillers and method for making and using them |
| US8083820B2 (en) * | 2006-12-22 | 2011-12-27 | 3M Innovative Properties Company | Structured fixed abrasive articles including surface treated nano-ceria filler, and method for making and using the same |
| US8348723B2 (en) * | 2009-09-16 | 2013-01-08 | 3M Innovative Properties Company | Structured abrasive article and method of using the same |
-
2011
- 2011-04-29 CN CN201180023624.XA patent/CN102892553B/zh not_active Expired - Fee Related
- 2011-04-29 US US13/696,908 patent/US20130059506A1/en not_active Abandoned
- 2011-04-29 JP JP2013510126A patent/JP2013526777A/ja active Pending
- 2011-04-29 WO PCT/US2011/034439 patent/WO2011142986A1/en not_active Ceased
- 2011-04-29 KR KR1020127031934A patent/KR20130081229A/ko not_active Withdrawn
- 2011-04-29 SG SG2012083150A patent/SG185523A1/en unknown
- 2011-05-10 TW TW100116384A patent/TWI532597B/zh not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11512874A (ja) * | 1995-09-22 | 1999-11-02 | ミネソタ・マイニング・アンド・マニュファクチャリング・カンパニー | 半導体ウェーハの露出面を改質する方法 |
| JPH09201773A (ja) * | 1996-01-29 | 1997-08-05 | Dainippon Printing Co Ltd | 研磨テープ及びその製造方法 |
| JP2008537911A (ja) * | 2005-04-14 | 2008-10-02 | サンーゴバン アブレイシブズ,インコーポレイティド | ストラクチャード研磨物品を作る方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI532597B (zh) | 2016-05-11 |
| SG185523A1 (en) | 2012-12-28 |
| KR20130081229A (ko) | 2013-07-16 |
| CN102892553A (zh) | 2013-01-23 |
| US20130059506A1 (en) | 2013-03-07 |
| WO2011142986A1 (en) | 2011-11-17 |
| CN102892553B (zh) | 2016-04-27 |
| TW201213121A (en) | 2012-04-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140428 |
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| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20140428 |
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| A977 | Report on retrieval |
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| A601 | Written request for extension of time |
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| A02 | Decision of refusal |
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