TWI527278B - A molded article production apparatus, a molded article production method, and a molded article - Google Patents
A molded article production apparatus, a molded article production method, and a molded article Download PDFInfo
- Publication number
- TWI527278B TWI527278B TW103104186A TW103104186A TWI527278B TW I527278 B TWI527278 B TW I527278B TW 103104186 A TW103104186 A TW 103104186A TW 103104186 A TW103104186 A TW 103104186A TW I527278 B TWI527278 B TW I527278B
- Authority
- TW
- Taiwan
- Prior art keywords
- resin
- opening
- molded article
- flow path
- cavity
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 78
- 239000011347 resin Substances 0.000 claims description 390
- 229920005989 resin Polymers 0.000 claims description 390
- 239000007788 liquid Substances 0.000 claims description 148
- 238000002347 injection Methods 0.000 claims description 93
- 239000007924 injection Substances 0.000 claims description 93
- 230000007246 mechanism Effects 0.000 claims description 55
- 238000000465 moulding Methods 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 23
- 230000003287 optical effect Effects 0.000 claims description 15
- 229920001187 thermosetting polymer Polymers 0.000 claims description 12
- 238000004891 communication Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 9
- 239000012467 final product Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000003507 refrigerant Substances 0.000 description 29
- 238000005538 encapsulation Methods 0.000 description 17
- 239000000047 product Substances 0.000 description 14
- 238000001721 transfer moulding Methods 0.000 description 14
- 239000003795 chemical substances by application Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 9
- 238000002156 mixing Methods 0.000 description 7
- 230000007723 transport mechanism Effects 0.000 description 5
- 239000004848 polyfunctional curative Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 240000004282 Grewia occidentalis Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/03—Injection moulding apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1742—Mounting of moulds; Mould supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013066872A JP6144085B2 (ja) | 2013-03-27 | 2013-03-27 | 成形品生産装置、及び成形品生産方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201442297A TW201442297A (zh) | 2014-11-01 |
| TWI527278B true TWI527278B (zh) | 2016-03-21 |
Family
ID=51592444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103104186A TWI527278B (zh) | 2013-03-27 | 2014-02-10 | A molded article production apparatus, a molded article production method, and a molded article |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6144085B2 (ja) |
| KR (1) | KR101559231B1 (ja) |
| CN (1) | CN104070634B (ja) |
| MY (1) | MY172097A (ja) |
| TW (1) | TWI527278B (ja) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6440599B2 (ja) * | 2015-08-28 | 2018-12-19 | Ｔｏｗａ株式会社 | 樹脂成形装置及び樹脂成形方法 |
| CN107526996A (zh) * | 2016-06-21 | 2017-12-29 | 旭景科技股份有限公司 | 指纹感测芯片封装方法及利用其制成的指纹感测模块 |
| TWI643310B (zh) * | 2017-02-18 | 2018-12-01 | 林立宸 | 一種無基板之封裝體的製備方法及其應用 |
| CN107399041B (zh) * | 2017-06-05 | 2019-04-16 | 湖北久祥电子科技有限公司 | 一种铆合式封胶的led封装工艺 |
| JP2019034444A (ja) * | 2017-08-10 | 2019-03-07 | Ｔｏｗａ株式会社 | 樹脂成形品の搬送機構、樹脂成形装置及び樹脂成形品の製造方法 |
| JP6891836B2 (ja) * | 2018-03-07 | 2021-06-18 | 住友電装株式会社 | コネクタ及びその製造方法 |
| CN111791446A (zh) * | 2020-07-10 | 2020-10-20 | 陈勇成 | 一种大型塑胶制品的注塑机 |
| JP7399056B2 (ja) | 2020-09-25 | 2023-12-15 | 本田技研工業株式会社 | 車両 |
| TWI817277B (zh) * | 2021-12-03 | 2023-10-01 | 日商山田尖端科技股份有限公司 | 樹脂供給機構及具備其的樹脂封裝裝置 |
| CN115284553B (zh) * | 2022-07-28 | 2023-04-11 | 嘉兴精科科技有限公司 | 一种高精密可折叠手机转轴组件成型装置及工艺 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04111768U (ja) * | 1991-03-14 | 1992-09-29 | 株式会社小糸製作所 | モジユールタイプｌｅｄのモールド構造 |
| JP3434924B2 (ja) * | 1994-12-29 | 2003-08-11 | テイ・エス テック株式会社 | 表皮一体成形装置 |
| DE69942479D1 (de) * | 1998-07-10 | 2010-07-22 | Apic Yamada Corp | Verfahren zur Herstellung einer Halbleitervorrichtung und Harzformmaschine zu diesem Zweck |
| JP2004207290A (ja) | 2002-12-24 | 2004-07-22 | Seiko Epson Corp | 半導体装置の製造方法及び製造装置 |
| JP2006175771A (ja) * | 2004-12-24 | 2006-07-06 | Prc:Kk | 射出成形方法及び射出成形装置 |
| JP4954171B2 (ja) * | 2008-09-30 | 2012-06-13 | Ｔｏｗａ株式会社 | 電子部品の圧縮樹脂封止成形方法及び装置 |
| US20110233821A1 (en) * | 2008-09-30 | 2011-09-29 | Towa Corporation | Compression resin sealing and molding method for electronic component and apparatus therefor |
-
2013
- 2013-03-27 JP JP2013066872A patent/JP6144085B2/ja active Active
-
2014
- 2014-01-24 KR KR1020140008958A patent/KR101559231B1/ko active IP Right Grant
- 2014-01-27 CN CN201410039169.8A patent/CN104070634B/zh active Active
- 2014-02-10 TW TW103104186A patent/TWI527278B/zh active
- 2014-03-25 MY MYPI2014000881A patent/MY172097A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP6144085B2 (ja) | 2017-06-07 |
| MY172097A (en) | 2019-11-13 |
| KR101559231B1 (ko) | 2015-10-12 |
| JP2014192362A (ja) | 2014-10-06 |
| CN104070634B (zh) | 2017-06-09 |
| KR20140118708A (ko) | 2014-10-08 |
| TW201442297A (zh) | 2014-11-01 |
| CN104070634A (zh) | 2014-10-01 |
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