TWI521652B - Resin sealing device and resin sealing method - Google Patents

Description

Resin sealing device and resin sealing method

The present invention relates to the technical field of a resin sealing device and a resin sealing method.

Conventionally, as disclosed in Patent Document 1, there is proposed a resin sealing device having an upper mold and a mold which can be relatively close to or separated from the upper mold, and the lower mold has a frame mold having a through hole and The structure of the molding die that is fitted in the through hole is configured to seal the resin placed on the substrate formed between the upper mold and the lower mold.

(previous technical literature) (Patent Literature)

Patent Document 1: Japanese Laid-Open Patent Publication No. 2011-230423

In the resin sealing device shown in Patent Document 1, a portion (clamping surface) of the mold is placed under contact with the substrate for performing mold closing The groove (exhaust groove) of the gas in the cavity is discharged when the substrate is clamped. By the venting groove, when the resin is sealed, air such as air or volatile components generated by melting of the resin is discharged together with the air in the cavity, and voids or resin are generated in the substrate (molded article) sealed by the resin. Not filled, etc.

However, on the surface of the substrate clamped to the lower mold, irregularities such as holes for the pilot pin (for substrate positioning) exist in a different manner for each substrate. If such unevenness interferes with the exhaust groove provided in the lower mold, there is a possibility that the resin leaks from the gap generated there. Therefore, in the past, it has been necessary to design a mold to align the vent groove on the basis of the unevenness of the substrate, and it takes a corresponding time to design or manufacture the mold.

Therefore, the present invention has been made in order to solve the above problems, and an object of the present invention is to provide a resin sealing device and a resin seal which can prevent voids or unfilled in a molded article without considering the unevenness of each molded article. method.

The present invention is directed to a resin sealing apparatus comprising: a first mold; and a second mold which is capable of being relatively close to or separated from the first mold and having a through hole a frame mold and a molding die that are fitted to the through hole, and a resin seal that is placed on a molded article formed between the first mold and the second film. And a movement control mechanism for controlling a position of the frame mold in a direction in which the frame mold can be approached or separated, wherein the frame mold is borrowed from a position of the first mold while the molding die is adjacent to the first mold The movement control mechanism locks, and a gap is provided between the frame mold and the molded article to perform the resin sealing.

Conventionally, an exhaust groove that communicates inside and outside the cavity even when the mold is closed has been used. However, the present invention is not limited to the concept of the conventional closed mold, but the frame mold is locked by the mold while being close to the first mold. A gap is provided between the frame-shaped mold and the molded article with respect to the position of the first mold.

Further, the present invention can also be understood as a resin sealing method using a first mold and a second mold which can be relatively close to or separated from the first mold, and has a through hole. a frame mold and a structure of a molding die that is fitted to the through hole; and a resin seal that is disposed on a molded article formed in a cavity formed between the first mold and the second film, and is characterized in that The method of controlling the movement of the frame mold relative to the first mold by controlling a position of the frame mold in a direction in which the frame mold can be approached or separated is provided when the molding die is adjacent to the first mold. And a process of providing a gap between the frame mold and the molded article; and providing the gap to perform the resin sealing process.

According to the present invention, it is not necessary to consider the unevenness of each molded article, and it is also possible to prevent voids or unfilling in the molded article.

100, 300, 400, 500‧‧‧ resin sealing device

102, 202, 302, 402, 502‧‧‧ substrates

104, 304, 404, 504‧‧‧ semiconductor wafer

106, 406, 506‧‧‧ resin

107, 207‧‧‧ molded products

108, 208, 308, 408, 508‧‧‧ release film

110, 310‧‧‧ fixed platen

112, 312‧‧‧ movable platen

114, 314‧‧‧ mould

116‧‧‧Decompression flow path

118‧‧‧Substrate adsorption flow path

120, 320‧‧‧上模

122, 222, 422, 522‧‧‧ upper compression mould

124, 224, 424, 524‧‧‧ upper frame

126, 136‧ ‧ spring

128‧‧ ‧ sales

130, 330‧‧‧

132, 232, 332, 432, 532‧‧‧ compression mold

134, 234, 334, 434, 534‧‧‧ lower frame mode

135‧‧‧film adsorption flow path

138, 338, 438, 538‧‧‧ mobile control agencies

Fig. 1 is a schematic view showing an example of a resin sealing device according to a first embodiment of the present invention.

Fig. 2 is a view showing an example of the first half of the resin sealing based on the same resin sealing device.

Fig. 3 is a view showing an example of the second half of the resin sealing of Fig. 2;

(A) and (B) are schematic diagrams showing a state between a substrate and a lower frame mold in the first embodiment, and (C) is a relationship between the substrate and the lower frame mold in the second embodiment. The pattern of the pattern.

Fig. 5 is a schematic view showing an example of a resin sealing device according to a third embodiment of the present invention.

Fig. 6 is a schematic view showing an example of a resin sealing device according to a fourth embodiment of the present invention.

Fig. 7 is a schematic view showing an example of a resin sealing device according to a fifth embodiment of the present invention.

Hereinafter, an example of the first embodiment of the present invention will be described in detail with reference to the drawings.

First, a schematic configuration of a resin sealing device according to an embodiment of the present invention will be described with reference to Fig. 1 .

The resin sealing device 100 is a compression molding type in which the resin 106 is directly disposed in a cavity. As shown in Fig. 1, it has an upper die 120 (first die) and can be relatively close to or separated from the upper die 120 (first) 2 mold) (In addition, the mold 114 is composed of the upper mold 120 and the lower mold 130). The lower mold 130 has a structure in which a frame mold 134 (frame mold) having a through hole 134B and a compression mold 132 (forming mold) disposed to be fitted to the through hole 134B. Further, the resin sealing device 100 performs resin sealing of the substrate 102 (formed product) disposed in the cavity formed between the upper mold 120 and the lower mold 130. Here, the resin sealing device 100 is provided with a movement control mechanism 138 that controls the position of the lower frame mold 134 in the Z direction (a direction in which it can approach or separate). Further, during the approach of the lower compression mold 132 and the upper mold 120, the position of the lower frame mold 134 with respect to the upper mold 120 is locked by the movement control mechanism 138, and a gap Gp is provided between the lower frame mold 134 and the substrate 102 to perform resin sealing. Further, strictly speaking, the gap Gp can be formed between the upper surface of the release film 108 and the lower surface of the substrate 102. However, in the present embodiment, the thickness of the release film 108 is regarded as zero.

Further, the substrate 102 is represented as a representative example of a semiconductor wafer such as a support PCB substrate or a lead frame. In the present embodiment, the substrate 102 is shown as a molded article, but a bonding wire or the like of the semiconductor wafer 104 or the connection substrate 102 and the semiconductor wafer 104 is also included in the molded article. Also, the resin 106 represents a thermosetting tree In the present embodiment, the fat is a flat plate shape (solid) formed in advance, but may be in the form of powder, granules, or liquid. Further, the release film 108 is stretchable and contractible, and the peeling property from the lower mold 130 and the resin-sealed substrate 102 (molded article 107) is good even when heated. Further, the release film is in a form of continuous supply, but may be in the form of a strip or a release film.

Hereinafter, the constituent elements will be specifically described.

As shown in Fig. 1, the upper mold 120 in the mold 114 is provided with an upper compression mold 122 and an upper frame mold 124. The upper compression mold 122 is attached to the fixed platen 110 and fixed. A pressure reducing flow path 116 is provided inside the upper compression mold 122, and communicates with a pressure reducing port 116A provided on the lower mold side surface of the upper compression mold 122. A pressure reducing mechanism (not shown) is connected to the pressure reducing flow path 116. Therefore, the inside of the cavity can be depressurized to be in a vacuum state. Further, a substrate adsorption flow path 118 is provided inside the upper compression mold 122, and communicates with the substrate adsorption port 118A provided on the lower mold side surface of the upper compression mold 122. A suction mechanism (not shown) is connected to the substrate adsorption flow path 118. Therefore, the substrate 102 can be adsorbed or held on the lower mold side surface of the upper compression mold 122.

As shown in FIG. 1, the upper frame mold 124 is provided with a through hole 124B, and the upper compression mold 122 is fitted to the through hole 124B. That is, the upper frame mold 124 is in a frame shape surrounding the outer circumference of the upper compression mold 122, and is attached to the upper compression mold 122 via the spring 126. Further, the spring 126 urges the upper frame mold 124 toward the lower side in the Z direction. Therefore, the upper frame mold 124 can be moved relative to the upper compression mold 122 in the Z direction. move. A sealing member 124A (O-ring or the like) is provided on a surface of the upper frame mold 124 opposite to the lower mold 130. Further, a sealing member (not shown) is also provided on the sliding surface of the upper compression mold 122 and the upper frame mold 124. Further, a plurality of pins 128 that are movable toward the lower side in the Z direction are provided between the substrate suction port 118A and the pressure reducing port 116A, that is, at positions outside the region where the substrate 102 is held. The pin 128 is biased toward the lower side in the Z direction by a spring (not shown).

Further, in the present embodiment, the upper mold 120 includes the upper compression mold 122 and the upper frame mold 124. However, these are not essential structures and may be integrated. And there is no sales 128. Further, there is no sealing member 124A, pressure reducing flow path 116, or the like.

As shown in FIG. 1, the lower mold 130 is provided with a lower compression mold 132 and a lower frame mold 134. The lower compression mold 132 is attached to a movable platen 112 that is moved up and down by a drive mechanism (not shown). Therefore, the lower mold 130 can be relatively close to or separated from the upper mold 120 in the Z direction (in addition, the lower mold can be attached to the fixed pressure plate, and the upper mold can be attached to the movable pressure plate). A film adsorption flow path 135 is provided inside the lower frame mold 134 to communicate with a gap provided between the lower compression mold 132 and the lower frame mold 134. A film suction mechanism (not shown) is connected to the film adsorption flow path 135. Therefore, the release film 108 can be adsorbed or held on the surface of the lower mold 130 (in addition, the release film can be removed, or the substrate can be adsorbed to the lower mold and the release film can be adsorbed to the upper mold).

As shown in Fig. 1, a concave portion 134A is provided on the upper mold side surface of the lower frame mold 134 corresponding to the position of the pin 128. By placing pin 128 The position corresponding to the lower frame mold 134 is inserted into the concave portion 134A of the lower frame mold 134 to fix the release film 108, and the amount of expansion and contraction of the release film 108 is minimized. The lower frame mold 134 includes a through hole 134B, and the lower compression mold 132 is fitted to the through hole 134B. That is, the lower frame mold 134 is in a frame shape surrounding the outer circumference of the lower compression mold 132, and is attached to the lower compression mold 132 via the spring 136. In addition, the spring 136 urges the lower frame mold 134 toward the upper side in the Z direction (the spring 136 is set to be stronger than the spring 126 or the spring for the pin 128). Therefore, the lower frame mold 134 can relatively move in the Z direction with respect to the lower compression mold 132. When the upper mold 120 approaches the lower mold 130, the lower frame mold 134 can abut against the upper frame mold 124 via the release film 108.

As shown in FIG. 1, the movement control mechanism 138 is placed in contact with the end portion 134B integrally provided on the outer circumference of the lower mold 130. The movement control mechanism 138 includes a hook portion 138A for restraining the frame mold 134 to be moved toward the upper side in the Z direction by the force of the spring 136, and a support portion 138B which is connected to the hook portion 138A and capable of being attached from above. The position of the hook portion 138A in the Z direction is freely controlled with respect to the movable platen 112. That is, the movement control mechanism 138 moves up and down together with the movable platen 112, but the position of the lower frame mold 134 can be freely controlled by the hook portion 138A.

Further, although not shown in the first drawing, a plurality of heaters are embedded in the upper mold 120 and the lower mold 130. With the heater, the mold 114 is heated to a predetermined temperature (for example, 175 degrees) for resin sealing.

The series of operations of the resin sealing device 100 are defined by a processing device (control means) not shown, and the operations of the mold 114, the movement control mechanism 138, and the like are automatically controlled.

Next, the operation of the resin sealing device 100 will be described with reference to FIGS. 2 to 3 . Further, the position WP indicated by a one-dot chain line indicates the initial position (standby position) which is the reference of the moving lower mold 130.

First, in a state in which the upper mold 120 and the lower mold 130 are separated, the substrate 102 is transported to the vicinity of the upper compression mold 122 by a transport mechanism (not shown). At this time, the suction mechanism (not shown) operates (open arrow), and the substrate 102 is adsorbed or fixed to the upper compression mold 122 by the negative pressure generated in the substrate adsorption port 118A via the substrate adsorption flow path 118. Further, the release film 108 is disposed on the lower mold 130. Further, the film suction mechanism (not shown) operates (open arrow), and the release film 108 is adsorbed or fixed to the lower mold 130 by the negative pressure generated by the film adsorption flow path 135 (Fig. 2(A)). At this time, the upper surface of the lower frame mold 134 and the upper surface of the lower compression mold 132 are the same by the movement control mechanism 138. In addition, the mold 114 is heated to a constant temperature (for example, 175 degrees) at the time of resin sealing.

Next, the resin 106 is placed on a predetermined position on the release film 108 by a resin transfer mechanism (not shown) (Fig. 2(B)).

Next, the movable platen 112 is moved upward to bring the lower mold 130 closer to the upper mold 120. Thereby, the pin 128 protruding from the upper compression mold 122 is inserted into the concave portion provided in the lower frame mold 134 together with the release film 108. The portion 134A, the release film 108 is clamped. Next, the sealing member 124A of the upper frame mold 124 abuts against the release film 108 on the lower frame mold 134, and the upper mold 120 and the lower mold 130 constitute a sealed state. At this stage, the rise of the movable platen 112 is temporarily stopped, and the pressure reducing mechanism (not shown) is operated with respect to the mold 114 (black arrow), and the pressure reducing operation is started from the pressure reducing port 116A via the pressure reducing flow path 116 (Fig. 2 (Fig. 2 ( C)). Further, at this time, the resin 106 on the lower mold 130 is not in contact with the substrate 102 adsorbed to the upper mold 120.

Next, the movable platen 112 is moved upward again to bring the resin 106 into contact with the bonding wire or the resin 106 and the semiconductor wafer 104 (Fig. 2(D)). The rise of the movable platen 112 is stopped again in this stage. Up to this point, the upper surface of the lower frame mold 134 and the upper surface of the lower compression mold 132 are the same by the movement control mechanism 138.

Next, the rise of the lower frame mold 134 with respect to the lower compression mold 132 is started by the movement control mechanism 138. Then, the lower frame mold 134 is moved until the position between the lower frame mold 134 and the substrate 102 becomes the gap Gp, and the position of the lower frame mold 134 is stopped by the movement control unit 138 (Fig. 3(A)) and 4 Figure (A)). In the present embodiment, the gap Gp is a thickness to which the gas can be leaked, and is a thickness (width) which does not cause leakage of the resin, specifically, a shape or a volume of the cavity or application to the resin. The pressure or the like completes the optimization of the gap Gp.

Next, the movable platen 112 is moved upward again. and, The lower compression mold 132 is raised to compress the resin 106. At this time, the substrate 102 which is adsorbed or held by the upper mold 120 by the movement of the lower frame mold 134 maintains a constant gap Gp. That is, the movement control mechanism 138 moves the lower frame mold 134 in the opposite direction to the movement of the movable platen 112, and lowers the lower frame mold 134 with respect to the lower compression mold 132. That is, during the approach of the lower compression mold 132 and the upper mold 120, the position of the lower frame mold 134 relative to the upper mold 120 is locked (resultably) by the movement control mechanism 138, and is set between the lower frame mold 134 and the substrate 102 (constant). Clearance Gp. Further, even after the compression pressure (based on the pressure of the resin) rises, the gap Gp is maintained by the movement of the movement control mechanism 138. In the stage where the compression pressure becomes a predetermined pressure (pressure for forming a good molded article 107), the movement of the movable platen 112 is stopped, and the compression pressure is maintained (Fig. 1, Fig. 3(B), Fig. 4(B). ) the pressure holding state). The compression pressure in the pressure-retaining state is defined so that the molded article 107 does not cause "shrink marks (formation abnormality due to curing shrinkage of the resin) or voids or unfilled" during the aging (curing). And, until the pressure holding state ends, the constant gap Gp is maintained. That is, the resin sealing is completed in a state where the gap Gp is set based on the locking of the position of the frame mold 134 below the movement control mechanism 138.

Next, after the aging time is passed, the movable platen 112 is moved downward to separate the upper mold 120 from the lower mold 130 (Fig. 3(C)). At this time, in order to leak the pressure reducing flow path 116 and smoothly detach the substrate 102 from the upper mold 120, the substrate adsorption flow path is adopted. The negative pressure of 118 is changed to positive pressure, that is, blast (open arrow). Further, the molded article 107 is left on the lower mold side.

Next, the movable platen 112 is further moved downward, and the upper mold 120 and the lower mold 130 are completely separated, and the upper position of the lower frame mold 134 is returned to the standby position WP (Fig. 3(D)). Thereafter, the movable platen 112 and the movement control mechanism 138 are operated such that the surface of the lower frame mold 134 and the surface of the lower compression mold 132 are formed in the same manner as the standby position WP, and are removed from the release film 108 by a conveying device (not shown). Molded product 107.

As described above, the present embodiment is not limited to the so-called closed mold concept, but the lower frame mold 134 is locked by locking the position of the lower frame mold 134 with respect to the upper mold 120 while the lower compression mold 132 is close to the upper mold 120. A gap Gp is provided between the substrate 102 and the substrate 102. Therefore, it is possible to ensure the gap Gp for discharging the gas in the cavity without changing the thickness (width) while locking the position of the lower frame mold 134 with respect to the upper mold 120, and it is possible to eliminate the need to provide a conventional exhaust gas. Slot (of course, a venting groove can also be provided). Further, since the gap Gp in which the thickness (width) does not change during the predetermined period is provided over the outer circumference of the substrate 102, the air in the cavity can be discharged from the entire circumference without partially discharging the air as in the exhaust groove. Therefore, the void or unfilling of the molded article 107 can be further reduced as compared with the conventional exhaust groove. At the same time, the thickness of the gap Gp can be made thinner than the thickness of the conventional exhaust groove, so that the possibility of resin leakage can be further reduced as compared with the conventional exhaust groove.

Further, in the present embodiment, the resin sealing is completed in a state where the gap Gp is provided by the locking of the position of the frame mold 134 below the movement control mechanism 138. Therefore, the void or unfilled of the molded article 107 can be further reduced.

That is, according to the present embodiment, it is not necessary to consider the unevenness of each of the substrates 102, and it is also possible to avoid occurrence of voids or unfilling in the molded article 107.

Further, as in the second embodiment shown in Fig. 4(C), the resin sealing can be completed in a state where the gap Gp is provided as in the first embodiment. In the second embodiment, the resin sealing is completed in a state where the lock of the frame type 234 under the movement control means is released and the gap Gp is eliminated. At this time, for example, at the time when the compression pressure rises, the lower frame mold 234 is moved to eliminate the gap Gp. At this point in time, the compression pressure can be monitored and used as a trigger, and the position of the movable platen can be monitored and used as a trigger. Therefore, compared with the first embodiment, the possibility of resin leakage can be further reduced. In addition, since the configuration and function of the resin sealing device of the second embodiment are the same as those of the first embodiment, the latter two digits of the reference numerals are the same, and the descriptions other than the above are omitted.

Further, the second embodiment is a one-tone elimination gap Gp, but may be reduced in a stepwise manner (including continuously or discontinuously) to eliminate the gap Gp, or may only narrow the gap Gp. Further, the gap Gp is set to a thickness that is likely to cause leakage of the resin, and when the compression pressure is increased, it may be set to a thickness that does not cause leakage of the resin. degree.

Further, as in the third embodiment shown in Fig. 5, the lower frame mold can be directly and freely controlled by the movement control means as in the above embodiment. In the third embodiment, the movement control mechanism 338 has a braking portion 338A and a supporting portion 338B. The braking portion 338A is a member that can move in the X direction, and can be inserted between the upper mold 320 and the lower frame mold 334 of the lower mold 330. When the brake portion 338A is inserted between the upper mold 320 and the lower frame mold 334, the thickness of the gap Gp can be formed between the substrate 302 and the lower frame mold 334 adsorbed to the upper mold 320 (the brake portion can also be used). The thickness is the same as the thickness of the gap Gp, and the braking portion can be inserted between the substrate and the lower frame mold). The support portion 338B is attached to the fixed platen 310, and the brake portion 338A can be driven in the X direction. Further, the support portion 338B can adjust the position of the braking portion 338A in the Z direction. Further, the upper mold 320 has an integral structure, but may have the same configuration as that of the first and second embodiments. Further, although the lower mold 330 is schematically shown, it may have the same configuration as that of the first and second embodiments.

When the resin sealing is performed, the braking portion 338A is placed in contact with the lower surface of the upper mold 320. Further, when the lower compression mold 332 approaches the upper mold 320 with the rise of the movable platen 312, the rising of the lower frame mold 334 is restricted by the braking portion 338A, and the position of the lower frame mold 334 with respect to the upper mold 320 is locked and the lower frame mold 334 is locked. A gap Gp is provided between the substrate 302 and the substrate 302. When the compression pressure rises, the braking portion 338A is pulled out from between the upper mold 320 and the lower frame mold 334, and the gap Gp is eliminated. The substrate 302 is clamped by the lower frame mold 334 (the resin sealing can also be completed in a state where the gap Gp is set). Further, in order to obtain the time point at which the compression pressure rises, the pressure or the position can be triggered in the same manner as in the second embodiment. Further, the substrate 302 is resin-sealed. Further, the movement control mechanism may have a structure in which the support portion is located at a position opposed to the lower frame mold and the position of the lower frame mold is directly controlled without the brake portion. That is, the support portion may also have the function of a braking portion. In this case, the gap may be fixed from the time when the gap Gp is provided, or the gap Gp may be changed by the movement of the support portion in the Z direction (the movement control mechanism 438 according to the fourth embodiment of Fig. 6 corresponds to the support portion). ). Alternatively, as in the fifth embodiment of Fig. 7, the movement control mechanism 538 may be disposed between the upper compression mold 522 and the lower frame mold 534, and the gap Gp may be fixedly provided.

Although the above embodiment has been described in the present invention, the present invention is not limited to the above embodiment. That is, modifications and design changes may be made without departing from the spirit and scope of the invention.

[Industrial Availability]

The resin sealing device of the present invention can be widely applied to a compression molding die in which a resin is directly disposed in a cavity.

100‧‧‧Resin sealing device

116‧‧‧Decompression flow path

118‧‧‧Substrate adsorption flow path

124B‧‧‧through hole

126‧‧ ‧ spring

128‧‧ ‧ sales

104‧‧‧Semiconductor wafer

Gp‧‧‧ gap

124A‧‧‧ Sealing member

116A‧‧‧Decompression port

118A‧‧‧Substrate adsorption port

134A‧‧‧ recess

135‧‧‧film adsorption flow path

136‧‧ ‧ spring

134B‧‧‧through hole

138B‧‧‧Support

110‧‧‧Fixed platen

114‧‧‧Mold

108‧‧‧ release film

122‧‧‧Upper compression mould

102‧‧‧Substrate

120‧‧‧上模

124‧‧‧Upper frame

138‧‧‧Mobile Control Agency

132‧‧‧ Lower compression mould

134‧‧‧Bottom mode

130‧‧‧下模

112‧‧‧ movable platen

138A‧‧‧ hook

Claims (2)

A resin sealing device comprising: a first mold; and a second mold that is capable of being relatively close to or separated from the first mold, and having a frame-shaped mold having a through hole and being fitted into the through hole a structure of the molding die disposed; and a resin sealing of the molded article disposed in a cavity formed between the first die and the second die, wherein the frame mold is controlled to be close to or a movement control mechanism at a position in the direction of separation, wherein the position of the frame mold relative to the first mold is locked by the movement control mechanism while the molding die is adjacent to the first mold, and the frame mold is A gap is provided between the molded article and the resin is sealed by releasing the lock based on the position of the frame mold of the movement control mechanism and eliminating the gap. A resin sealing method using: a first mold; and a second mold that is capable of being relatively close to or separated from the first mold, and having a frame-shaped mold having a through hole and being fitted into the through hole And a resin seal of the molded article disposed in a cavity formed between the first die and the second die, and comprising: the molding die and the first die During the approach, the position of the frame mold relative to the first mold is controlled by the frame mold a process of locking with a movement control mechanism at a position in the direction that can be approached or separated, and providing a gap between the frame mold and the molded article; and releasing the frame mold based on the movement control mechanism The process of sealing the foregoing resin is completed in a state where the position is locked and the gap is eliminated.