TWI519777B - Processing device, processing system and coordinate correction method - Google Patents
Processing device, processing system and coordinate correction method Download PDFInfo
- Publication number
- TWI519777B TWI519777B TW100113161A TW100113161A TWI519777B TW I519777 B TWI519777 B TW I519777B TW 100113161 A TW100113161 A TW 100113161A TW 100113161 A TW100113161 A TW 100113161A TW I519777 B TWI519777 B TW I519777B
- Authority
- TW
- Taiwan
- Prior art keywords
- inspection
- measurement
- substrate
- coordinates
- sample
- Prior art date
Links
- 238000012545 processing Methods 0.000 title claims description 87
- 238000012937 correction Methods 0.000 title claims description 28
- 238000000034 method Methods 0.000 title claims description 28
- 239000000758 substrate Substances 0.000 claims description 159
- 238000007689 inspection Methods 0.000 claims description 154
- 238000005259 measurement Methods 0.000 claims description 148
- 230000007246 mechanism Effects 0.000 claims description 38
- 230000008569 process Effects 0.000 claims description 19
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 238000004891 communication Methods 0.000 claims description 6
- 238000009472 formulation Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 238000003384 imaging method Methods 0.000 claims 6
- 238000012546 transfer Methods 0.000 description 27
- 238000013461 design Methods 0.000 description 15
- 238000012360 testing method Methods 0.000 description 7
- 230000009471 action Effects 0.000 description 2
- 238000003556 assay Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/004—Measuring arrangements characterised by the use of mechanical techniques for measuring coordinates of points
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0015—Orientation; Alignment; Positioning
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010105475A JP5663192B2 (ja) | 2010-04-30 | 2010-04-30 | 処理装置、座標補正方法および座標補正プログラム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201207382A TW201207382A (en) | 2012-02-16 |
| TWI519777B true TWI519777B (zh) | 2016-02-01 |
Family
ID=44887797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100113161A TWI519777B (zh) | 2010-04-30 | 2011-04-15 | Processing device, processing system and coordinate correction method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5663192B2 (enrdf_load_stackoverflow) |
| KR (1) | KR20110121571A (enrdf_load_stackoverflow) |
| CN (1) | CN102237262A (enrdf_load_stackoverflow) |
| TW (1) | TWI519777B (enrdf_load_stackoverflow) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103075970B (zh) * | 2012-12-27 | 2015-07-01 | 深圳市华星光电技术有限公司 | 测长装置直交度补偿方法及使用该方法的测长装置 |
| US9080865B2 (en) | 2012-12-27 | 2015-07-14 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Orthogonality compensation method for length measurement device and length measurement device using same |
| CN103292709B (zh) * | 2013-05-24 | 2015-09-09 | 深圳市华星光电技术有限公司 | 测长机日常检测与自动补正方法 |
| JP5808454B1 (ja) | 2014-04-25 | 2015-11-10 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法、プログラムおよび記録媒体 |
| CN105047581A (zh) * | 2014-04-25 | 2015-11-11 | 株式会社日立国际电气 | 衬底处理装置及半导体器件的制造方法 |
| CN106814307B (zh) * | 2017-01-10 | 2020-05-12 | 深圳鼎缘电子科技有限公司 | 一种腔体滤波器自动调试方法及系统 |
| CN108226179B (zh) * | 2018-01-10 | 2021-01-22 | 京东方科技集团股份有限公司 | 自动光学检测设备的校准方法及自动修复系统 |
| CN110111383B (zh) * | 2018-05-08 | 2022-03-18 | 广东聚华印刷显示技术有限公司 | 玻璃基板的偏移校正方法、装置和系统 |
| CN112666164B (zh) * | 2020-11-23 | 2023-06-16 | 上海新时达机器人有限公司 | 针对多品类混线生产控制柜的机器人视觉检测方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002107137A (ja) * | 2000-09-29 | 2002-04-10 | Toshiba Corp | 検査ステージの制御方法 |
| US7127098B2 (en) * | 2001-09-13 | 2006-10-24 | Hitachi, Ltd. | Image detection method and its apparatus and defect detection method and its apparatus |
| JP3903889B2 (ja) * | 2001-09-13 | 2007-04-11 | 株式会社日立製作所 | 欠陥検査方法及びその装置並びに撮像方法及びその装置 |
| JP4207689B2 (ja) * | 2003-07-15 | 2009-01-14 | 株式会社ニコン | 位置ずれ測定装置 |
| JP2005310833A (ja) * | 2004-04-16 | 2005-11-04 | Olympus Corp | 基板検査装置および方法 |
| CN100547757C (zh) * | 2006-11-07 | 2009-10-07 | 中芯国际集成电路制造(上海)有限公司 | 一种新型晶圆定位偏移纠正方法 |
| JP2009300230A (ja) * | 2008-06-12 | 2009-12-24 | Olympus Corp | 位置合わせを行う装置、方法、およびプログラム、ならびに基準モデルを作成する装置、方法、およびプログラム |
-
2010
- 2010-04-30 JP JP2010105475A patent/JP5663192B2/ja not_active Expired - Fee Related
-
2011
- 2011-04-15 TW TW100113161A patent/TWI519777B/zh not_active IP Right Cessation
- 2011-04-29 KR KR1020110040487A patent/KR20110121571A/ko not_active Withdrawn
- 2011-04-29 CN CN2011101134762A patent/CN102237262A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW201207382A (en) | 2012-02-16 |
| CN102237262A (zh) | 2011-11-09 |
| KR20110121571A (ko) | 2011-11-07 |
| JP5663192B2 (ja) | 2015-02-04 |
| JP2011232298A (ja) | 2011-11-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |