TWI518009B - 具有經塑形輪廓之定位環 - Google Patents

具有經塑形輪廓之定位環 Download PDF

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Publication number
TWI518009B
TWI518009B TW097127195A TW97127195A TWI518009B TW I518009 B TWI518009 B TW I518009B TW 097127195 A TW097127195 A TW 097127195A TW 97127195 A TW97127195 A TW 97127195A TW I518009 B TWI518009 B TW I518009B
Authority
TW
Taiwan
Prior art keywords
positioning ring
ring
bending radius
radius
outer diameter
Prior art date
Application number
TW097127195A
Other languages
English (en)
Chinese (zh)
Other versions
TW200920661A (en
Inventor
卜拉布戈帕拉克里納Ｂ
原茵
吳正勳
敏克葛利格瑞Ｅ
Original Assignee
應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 應用材料股份有限公司 filed Critical 應用材料股份有限公司
Publication of TW200920661A publication Critical patent/TW200920661A/zh
Application granted granted Critical
Publication of TWI518009B publication Critical patent/TWI518009B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T292/00—Closure fasteners
    • Y10T292/20—Clamps
    • Y10T292/205—Ring

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW097127195A 2007-07-19 2008-07-17 具有經塑形輪廓之定位環 TWI518009B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/780,335 US8033895B2 (en) 2007-07-19 2007-07-19 Retaining ring with shaped profile

Publications (2)

Publication Number Publication Date
TW200920661A TW200920661A (en) 2009-05-16
TWI518009B true TWI518009B (zh) 2016-01-21

Family

ID=39832643

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097127195A TWI518009B (zh) 2007-07-19 2008-07-17 具有經塑形輪廓之定位環

Country Status (7)

Country Link
US (2) US8033895B2 (https=)
EP (1) EP2180977B1 (https=)
JP (1) JP5355563B2 (https=)
KR (1) KR101485410B1 (https=)
CN (1) CN101778697B (https=)
TW (1) TWI518009B (https=)
WO (1) WO2009012444A1 (https=)

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US9074686B2 (en) * 2010-12-06 2015-07-07 Microflex Technologies Llc Ring seal retainer assembly and methods
US20130225050A1 (en) * 2012-02-24 2013-08-29 Apple Inc. Localized spot lapping on a larger work surface area
JP5957277B2 (ja) * 2012-04-28 2016-07-27 光洋機械工業株式会社 工作物の外周ｒ面研削用治具および外周ｒ面研削装置
US9193027B2 (en) * 2012-05-24 2015-11-24 Infineon Technologies Ag Retainer ring
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US9487386B2 (en) 2013-01-16 2016-11-08 Infineon Technologies Ag Comb MEMS device and method of making a comb MEMS device
USD733560S1 (en) * 2013-06-25 2015-07-07 Lincoln Global, Inc. Packing bead ring for a wire coil
CN103419125B (zh) * 2013-08-14 2015-12-23 上海华力微电子有限公司 固定环
CN103394996B (zh) * 2013-08-14 2015-12-23 上海华力微电子有限公司 固定环
JP6403981B2 (ja) * 2013-11-13 2018-10-10 株式会社荏原製作所 基板保持装置、研磨装置、研磨方法、およびリテーナリング
KR102323430B1 (ko) * 2014-03-31 2021-11-09 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
US9368371B2 (en) 2014-04-22 2016-06-14 Applied Materials, Inc. Retaining ring having inner surfaces with facets
KR102173323B1 (ko) 2014-06-23 2020-11-04 삼성전자주식회사 캐리어 헤드, 화학적 기계식 연마 장치 및 웨이퍼 연마 방법
US10252397B2 (en) 2014-10-30 2019-04-09 Applied Materials, Inc. Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes
US10500695B2 (en) * 2015-05-29 2019-12-10 Applied Materials, Inc. Retaining ring having inner surfaces with features
JP6392193B2 (ja) * 2015-10-14 2018-09-19 株式会社荏原製作所 基板保持装置および基板研磨装置ならびに基板保持装置の製造方法
KR102420066B1 (ko) * 2016-07-25 2022-07-11 어플라이드 머티어리얼스, 인코포레이티드 Cmp를 위한 리테이닝 링
CN109420969B (zh) * 2017-08-29 2020-12-01 中芯国际集成电路制造(上海)有限公司 一种研磨头和化学机械研磨装置
US11400560B2 (en) * 2017-10-04 2022-08-02 Applied Materials, Inc. Retaining ring design
CN109693174A (zh) * 2017-10-23 2019-04-30 中芯国际集成电路制造(上海)有限公司 一种研磨头和化学机械研磨装置
KR102485810B1 (ko) * 2018-03-02 2023-01-09 주식회사 윌비에스엔티 화학적 기계적 연마 장치의 리테이너 링
KR102702996B1 (ko) 2018-12-10 2024-09-04 삼성전자주식회사 연마 균일도를 제어할 수 있는 화학 기계적 연마 장치
US11691244B2 (en) 2020-07-08 2023-07-04 Applied Materials, Inc. Multi-toothed, magnetically controlled retaining ring
KR102500158B1 (ko) * 2021-03-09 2023-02-15 (주)아이에스티 리테이너 링
US20230356354A1 (en) * 2022-05-03 2023-11-09 Applied Materials, Inc. Compliant inner ring for a chemical mechanical polishing system
WO2024049890A1 (en) * 2022-09-01 2024-03-07 Applied Materials, Inc. Retainer for chemical mechanical polishing carrier head
USD1086087S1 (en) * 2023-03-30 2025-07-29 Samsung Electronics Co., Ltd. CMP (chemical mechanical planarization) retaining ring
US20250114898A1 (en) * 2023-10-06 2025-04-10 Applied Materials, Inc. Retaining ring for edge compensation by slurry flow control

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US20020173242A1 (en) * 1999-04-19 2002-11-21 Mitsubishi Materials Corporation Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
US6224472B1 (en) * 1999-06-24 2001-05-01 Samsung Austin Semiconductor, L.P. Retaining ring for chemical mechanical polishing
US6506105B1 (en) * 2000-05-12 2003-01-14 Multi-Planar Technologies, Inc. System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control
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US6869335B2 (en) * 2002-07-08 2005-03-22 Micron Technology, Inc. Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces
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US20050113002A1 (en) * 2003-11-24 2005-05-26 Feng Chen CMP polishing heads retaining ring groove design for microscratch reduction
US20050126708A1 (en) * 2003-12-10 2005-06-16 Applied Materials, Inc. Retaining ring with slurry transport grooves
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Also Published As

Publication number Publication date
US8388412B2 (en) 2013-03-05
JP5355563B2 (ja) 2013-11-27
CN101778697A (zh) 2010-07-14
TW200920661A (en) 2009-05-16
EP2180977B1 (en) 2012-11-21
KR20100057815A (ko) 2010-06-01
JP2010533604A (ja) 2010-10-28
CN101778697B (zh) 2012-10-31
KR101485410B1 (ko) 2015-01-23
WO2009012444A1 (en) 2009-01-22
US8033895B2 (en) 2011-10-11
US20120028548A1 (en) 2012-02-02
US20090021024A1 (en) 2009-01-22
EP2180977A1 (en) 2010-05-05

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