TWI513769B - 可加工之無機及有機聚合物調配物、其製造方法及用途 - Google Patents

可加工之無機及有機聚合物調配物、其製造方法及用途 Download PDF

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Publication number
TWI513769B
TWI513769B TW103122550A TW103122550A TWI513769B TW I513769 B TWI513769 B TW I513769B TW 103122550 A TW103122550 A TW 103122550A TW 103122550 A TW103122550 A TW 103122550A TW I513769 B TWI513769 B TW I513769B
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TW
Taiwan
Prior art keywords
acid
polymer
polymer composition
film
formulation
Prior art date
Application number
TW103122550A
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English (en)
Chinese (zh)
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TW201506088A (zh
Inventor
Edward Rutter Jr
Ahila Krishnamoorthy
Joseph Kennedy
Original Assignee
Honeywell Int Inc
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Publication of TW201506088A publication Critical patent/TW201506088A/zh
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Publication of TWI513769B publication Critical patent/TWI513769B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2361/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
    • C08J2361/04—Condensation polymers of aldehydes or ketones with phenols only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Materials For Photolithography (AREA)
  • Formation Of Insulating Films (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW103122550A 2008-02-25 2009-02-24 可加工之無機及有機聚合物調配物、其製造方法及用途 TWI513769B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US3132808P 2008-02-25 2008-02-25

Publications (2)

Publication Number Publication Date
TW201506088A TW201506088A (zh) 2015-02-16
TWI513769B true TWI513769B (zh) 2015-12-21

Family

ID=41016679

Family Applications (2)

Application Number Title Priority Date Filing Date
TW103122550A TWI513769B (zh) 2008-02-25 2009-02-24 可加工之無機及有機聚合物調配物、其製造方法及用途
TW098105833A TWI454508B (zh) 2008-02-25 2009-02-24 可加工之無機及有機聚合物調配物、其製造方法及用途

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW098105833A TWI454508B (zh) 2008-02-25 2009-02-24 可加工之無機及有機聚合物調配物、其製造方法及用途

Country Status (6)

Country Link
US (1) US8859673B2 (https=)
EP (1) EP2247665A2 (https=)
JP (2) JP5378420B2 (https=)
KR (1) KR101546222B1 (https=)
TW (2) TWI513769B (https=)
WO (1) WO2009108574A2 (https=)

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US8623447B2 (en) * 2010-12-01 2014-01-07 Xerox Corporation Method for coating dielectric composition for fabricating thin-film transistors
GB201105364D0 (en) 2011-03-30 2011-05-11 Cambridge Display Tech Ltd Surface planarisation
KR101550092B1 (ko) * 2012-05-21 2015-09-03 (주)엘지하우시스 하이브리드 언더코팅층을 갖는 투명 도전성 필름 및 이의 제조방법, 이를 이용한 터치패널
JP6279878B2 (ja) * 2013-10-31 2018-02-14 東京応化工業株式会社 太陽電池の製造方法
JP6803842B2 (ja) 2015-04-13 2020-12-23 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． オプトエレクトロニクス用途のためのポリシロキサン製剤及びコーティング
US10381481B1 (en) 2018-04-27 2019-08-13 Taiwan Semiconductor Manufacturing Co., Ltd. Multi-layer photoresist

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Also Published As

Publication number Publication date
US8859673B2 (en) 2014-10-14
EP2247665A2 (en) 2010-11-10
TW200940610A (en) 2009-10-01
JP5378420B2 (ja) 2013-12-25
KR101546222B1 (ko) 2015-08-20
JP2011513514A (ja) 2011-04-28
KR20100126764A (ko) 2010-12-02
US20110054119A1 (en) 2011-03-03
JP2013241617A (ja) 2013-12-05
WO2009108574A3 (en) 2009-12-10
TWI454508B (zh) 2014-10-01
JP5702837B2 (ja) 2015-04-15
TW201506088A (zh) 2015-02-16
WO2009108574A2 (en) 2009-09-03

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