TWI509731B - 晶片焊接裝置 - Google Patents

晶片焊接裝置 Download PDF

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TWI509731B
TWI509731B TW101107592A TW101107592A TWI509731B TW I509731 B TWI509731 B TW I509731B TW 101107592 A TW101107592 A TW 101107592A TW 101107592 A TW101107592 A TW 101107592A TW I509731 B TWI509731 B TW I509731B
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wafer
suction
dividing
prompting
suction device
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TW101107592A
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TW201338088A (zh
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Chih Chen Lai
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Hon Hai Prec Ind Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part

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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

晶片焊接裝置
本發明涉及一種晶片焊接裝置。
先前之晶片焊接裝置一般包括一個載台以及一個吸取裝置。所述載台用於承載、定位待焊接產品，所述吸取裝置用於吸取晶片並將所述晶片壓緊於所述待焊接產品之焊接位置處。
在進行晶片焊接時，如果所述晶片與待焊接產品表面之間平行度誤差較大，則所述晶片與待焊接產品表面之間接觸不充分，同時產生所述晶片與待焊接產品表面焊接不良而導致晶片與待焊接產品之間結合力不足，或者所述晶片內應力過大而損壞等問題。故此，在晶片焊接前，首先要調整所述吸取裝置與所述載台之間之平行度。然，先前技術中，該調整動作均藉由人工目視完成，如此費時且不精確。
有鑒於此，有必要提供一種能夠提高晶片貼裝效率之晶片焊接裝置以及具有該晶片焊接裝置之晶片焊接裝置。
一種晶片焊接裝置，包括一個載台、一個吸取裝置以及一個提示裝置。所述載台用於承載、定位待焊接產品。所述吸取裝置採用導電材料製成，用於吸取晶片並將所述晶片置放於所述待焊接產品之焊接位置處。所述載台包括一個底部以及複數設置於所述底 部上且相互間隔之分割部。所述分割部由導電材料製成。所述每一分割部相對於所述底部之高度可調整。所述提示裝置包括一個電源以及一個提示元件。所述電源之兩極分別連接所述吸取裝置以及所述分割部。所述提示元件用於提示所述吸取裝置與所述分割部之間之接觸狀態。所述分割部分別具有不同的電阻值，且任意分割部之間並連後的電阻值不同於其餘分割部的電阻值或者其餘分割部任意並聯後的電阻值。
相較先前技術，所述晶片焊接裝置將所述載台分割為複數分割部、並將所述分割部、所述吸取裝置與所述提示裝置電連結，利用所述分割部連接電阻的變化判斷所述吸取裝置是否與所述分割部接觸完好，因此可以直觀、快速地判斷出所述吸取裝置的吸取端與所述分割部的頂面之間的平行度狀況。
100‧‧‧晶片焊接裝置
10‧‧‧載台
11‧‧‧底部
111‧‧‧轉軸
12‧‧‧分割部
13‧‧‧調整螺絲
121‧‧‧頂面
20‧‧‧吸取裝置
21‧‧‧吸取端
22‧‧‧挾持端
23‧‧‧抽氣通道
30‧‧‧提示裝置
31‧‧‧電源
32‧‧‧提示元件
33‧‧‧開關單元
圖1係本發明晶片焊接裝置之示意圖。
圖2係利用本發明晶片焊接裝置之電路示意圖。
下面將結合附圖對本發明作一具體介紹。
請參閱圖1及圖2，本發明之晶片焊接裝置100包括一個載台10、一個吸取裝置20以及一個提示裝置30。
所述載台10用於承載、定位待焊接產品(圖未示)。所述載台10包括一個底部11以及複數分割部12。所述底部11用於支撐所述分割部12，所述底部11包括一個轉軸111，所述轉軸111可在驅動馬達(圖未示)的驅動下帶動所述底部11旋轉。所述分割部12設置 於所述底部11表面，並且所述分割部12均可相對於所述底部11表面調整其高度，本實施方式中，所述分割部12分別通過調整螺絲13調整其相對於所述底部11表面的高度。所述相鄰的分割部12之間相互絕緣間隔。所述每一個分割部12具有一個背離所述底部11之頂面121。本實施方式中，所述每一個分割部12為扇形柱，所述分割部12圍成的整體為圓柱形，因此所述頂面121為扇形，所述頂面121圍成的整體為圓形。所述分割部12的數量可以依據實際的需求而變化，較佳地，所述分割部12的數量不少於三個，本實施方式中，所述分割部12的數量為四個。所述分割部12由導電材料製成，且所述分割部12分別具有不同的電阻值，且任意分割部12之間並連後的電阻值不同於其餘分割部12的電阻值或者其餘分割部12任意並聯後的電阻值。
所述吸取裝置20為一真空式吸嘴，所述吸取裝置20包括一個吸取端21、一個與所述吸取端21相背的挾持端22以及一個貫穿所述吸取端21以及所述挾持端22的抽氣通道23。所述吸取端21用於吸取晶片。所述挾持端22可被機械臂(圖未示)或者類似的挾持裝置挾持而將所吸取之晶片移至待焊接位置。所述吸取裝置20由導電材料製成，本實施方式中，所述吸取裝置20的材料為鎢鋼。
所述提示裝置30包括一個電源31以及一個與所述電源31相電連之提示元件32。所述電源31的正負極分別連接所述吸取裝置20和所述分割部12，所述吸取裝置20與所述複數分割部12以及所述提示元件32相串聯，所述複數分割部12之間為並聯關係。所述提示元件32用於提示所述吸取裝置20與所述分割部12之間的接觸狀態，具體地，所述提示元件32依據流經電流之不同而發出相應之提示 。本實施方式中，所述提示元件32為蜂鳴器，其能夠依流經電流之不同而產生不同強度之蜂鳴聲。當然，所述提示元件32也可以為其他能夠依據流經電流不同而產生不同提示的設備，例如LED燈。所述提示裝置30還包括一個開關單元33，所述開關單元33用於控制是否開啟所述提示裝置30之提示功能。本實施方式中，所述開關單元33設置於連接所述電源31電極以及所述吸取裝置20之電路上，當然，所述開關單元33的位置不限於此。
所述晶片焊接裝置100在進行晶片焊接前，首先調整所述吸取裝置20與所述分割部12的頂面121之間的平行度。調整時，首先將所述提示裝置30的開關單元33閉合，調整所述吸取裝置20向所述分割部12靠近直至所述吸取端21接觸至少一個分割部12之頂面121，此時所述提示元件32會產生蜂鳴聲，依據所述蜂鳴聲的大小，能夠判斷出所述吸取裝置20的吸取端21與所述分割部12的頂面121的接觸狀況。如果所有分割部12的頂面121均與所述吸取裝置20之吸取端21接觸，則該提示裝置30與所述吸取裝置20以及所述分割部12構成的電路的電阻最小，因此，所述提示元件32的蜂鳴聲最大；如果部分分割部12的頂面121與所述吸取裝置20之吸取端21接觸，則該提示裝置30與所述吸取裝置20以及所述分割部12構成的電路的電阻變大，因此，所述提示元件32的蜂鳴聲減小。本實施方式中，由於所述分割部12分別具有不同的電阻值，且任意分割部12之間並連後的電阻值不同於其餘分割部12的電阻值或者其餘分割部12任意並聯後的電阻值，因此不僅可以由所述提示元件32的蜂鳴聲的大小判斷出是否所有分割部12的頂面均與所述吸取裝置20之吸取端21接觸，還可以根據所述提示元件32的蜂鳴聲的大小的差異判斷出哪一個或者哪幾個分割部12的頂面均未 與所述吸取裝置20之吸取端21接觸。根據所述提示元件32的蜂鳴聲調整未與所述吸取裝置20之吸取端21接觸之分割部12，直至所述提示元件32的蜂鳴聲最大。另外，在調整過程中，可以旋轉所述分割部12，如果所述分割部12旋轉一周所述提示元件32之蜂鳴聲均最大，則所述吸取裝置20之吸取端21與所述分割部12頂面121之間之平行度誤差被控制在較理想的範圍內。
所述晶片焊接裝置將所述載台分割為複數分割部、並將所述分割部、所述吸取裝置與所述提示裝置電連結，利用所述分割部連接電阻的變化判斷所述吸取裝置是否與所述分割部接觸完好，因此可以直觀、快速地判斷出所述吸取裝置的吸取端與所述分割部的頂面之間的平行度狀況。
綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。
100‧‧‧晶片焊接裝置
10‧‧‧載台
11‧‧‧底部
111‧‧‧轉軸
12‧‧‧分割部
13‧‧‧調整螺絲
121‧‧‧頂面
20‧‧‧吸取裝置
21‧‧‧吸取端
22‧‧‧挾持端
23‧‧‧抽氣通道
30‧‧‧提示裝置
31‧‧‧電源
32‧‧‧提示元件
33‧‧‧開關單元

Claims (8)

  1. 一種晶片焊接裝置，包括一個載台以及一個吸取裝置，所述載台用於承載、定位待焊接產品，所述吸取裝置用於吸取晶片並將所述晶片置放於所述待焊接產品之焊接位置處，其改進在於：所述載台包括一個底部以及複數設置於所述底部上且相互間隔之分割部，所述分割部由導電材料製成，所述每一分割部相對於所述底部之高度可調整，所述吸取裝置採用導電材料製成，所述晶片焊接裝置還包括一個提示裝置，所述提示裝置包括一個電源以及一個提示元件，所述電源之兩極分別連接所述吸取裝置以及所述分割部，所述提示元件用於依據所述吸取裝置與所述分割部之間之接觸狀態發出相應提示，所述分割部分別具有不同的電阻值，且任意分割部之間並連後的電阻值不同於其餘分割部的電阻值或者其餘分割部任意並聯後的電阻值。
  2. 如申請專利範圍第1項所述之晶片焊接裝置，其中，所述底部包括一個轉軸，所述轉軸用於帶動所述底部旋轉。
  3. 如申請專利範圍第1項所述之晶片焊接裝置，其中，所述每一個分割部為扇形柱，所述分割部圍成的整體為圓柱形。
  4. 如申請專利範圍第1項所述之晶片焊接裝置，其中，所述分割部的數量為四個。
  5. 如申請專利範圍第1項所述之晶片焊接裝置，其中，所述吸取裝置包括一個吸取端、一個與所述吸取端相背的挾持端以及一個貫穿所述吸取端以及所述挾持端的抽氣通道，所述吸取端用於吸取晶片，所述挾持端用於將所吸取之晶片移至所述焊接位置處。
  6. 如申請專利範圍第1項所述之晶片焊接裝置，其中，所述吸取裝置的材料 為鎢鋼。
  7. 如申請專利範圍第1項所述之晶片焊接裝置，其中，所述提示元件為蜂鳴器。
  8. 如申請專利範圍第1項所述之晶片焊接裝置，其中所述提示裝置還包括一個開關單元，所述開關單元與所述吸取裝置、所述分割部以及所述提示元件串聯，所述開關單元用於控制是否開啟所述提示裝置之提示功能。
TW101107592A 2012-03-07 2012-03-07 晶片焊接裝置 TWI509731B (zh)

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US6076912A (en) * 1998-06-03 2000-06-20 Lexmark International, Inc. Thermally conductive, corrosion resistant printhead structure
TW200415734A (en) * 2002-11-08 2004-08-16 Umc Japan Bump ball crimping apparatus
US6898848B2 (en) * 1997-01-07 2005-05-31 Renesas Technology Corp. Method of bonding inner leads to chip pads
US7246430B2 (en) * 2003-06-03 2007-07-24 Matsushita Electric Industrial Co., Ltd. Electronic component mounting apparatus and electronic component mounting method
US7587814B2 (en) * 2004-04-30 2009-09-15 Fuji Machine Mfg. Co., Ltd. Printed-board supporting apparatus
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Publication number Priority date Publication date Assignee Title
US6898848B2 (en) * 1997-01-07 2005-05-31 Renesas Technology Corp. Method of bonding inner leads to chip pads
US6076912A (en) * 1998-06-03 2000-06-20 Lexmark International, Inc. Thermally conductive, corrosion resistant printhead structure
TW200415734A (en) * 2002-11-08 2004-08-16 Umc Japan Bump ball crimping apparatus
US7246430B2 (en) * 2003-06-03 2007-07-24 Matsushita Electric Industrial Co., Ltd. Electronic component mounting apparatus and electronic component mounting method
US7587814B2 (en) * 2004-04-30 2009-09-15 Fuji Machine Mfg. Co., Ltd. Printed-board supporting apparatus
CN102053092A (zh) * 2009-10-27 2011-05-11 日东电工株式会社 布线电路基板的检查方法、制造方法和检查装置

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