TWI506011B - 在光聚合物調配物中作為添加劑之氟胺基甲酸酯 - Google Patents
在光聚合物調配物中作為添加劑之氟胺基甲酸酯 Download PDFInfo
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- TWI506011B TWI506011B TW099137563A TW99137563A TWI506011B TW I506011 B TWI506011 B TW I506011B TW 099137563 A TW099137563 A TW 099137563A TW 99137563 A TW99137563 A TW 99137563A TW I506011 B TWI506011 B TW I506011B
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Classifications
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- C08G18/288—Compounds containing at least one heteroatom other than oxygen or nitrogen
- C08G18/2885—Compounds containing at least one heteroatom other than oxygen or nitrogen containing halogen atoms
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- C—CHEMISTRY; METALLURGY
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G18/4269—Lactones
- C08G18/4277—Caprolactone and/or substituted caprolactone
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G18/71—Monoisocyanates or monoisothiocyanates
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G18/71—Monoisocyanates or monoisothiocyanates
- C08G18/715—Monoisocyanates or monoisothiocyanates containing sulfur in addition to isothiocyanate sulfur
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/73—Polyisocyanates or polyisothiocyanates acyclic
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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Description
本發明係關於含有基質聚合物、寫入單體及光起始劑之光聚合物調配物,該光聚合物調配物用於製造光學元件,特別係製造全像元件及影像之用途、一種使含有光聚合物調配物及特殊氟胺基甲酸酯之全像媒體曝光之方法。
WO 2008/125229 A1描述開始時所提類型之光聚合物調配物。此等物包含以聚胺基甲酸酯為主之基質聚合物、以丙烯酸酯為主之寫入單體和光起始劑。在硬化狀態下,寫入單體和光起始劑係以空間分佈嵌入聚胺基甲酸酯基質中。由WO文件亦得知可將酞酸二丁酯(工業塑料之慣用塑化劑)加入該光聚合物調配物中
對於光聚合物調配物在下述用途領域中之使用,光聚合物中因全像曝光所造成之折射率調整Δn扮演決定性角色。在全像曝光期間,信號光束與參考光束之干涉場(在最簡單的情況下,兩平面波之干涉場)係藉由該干涉場中高強度位置處(例如)高折射率丙烯酸酯之局部光聚合而映射成一折射率光柵。該光聚合物(全像圖)中之折射率光柵包含所有信號光束之資訊。藉僅以參考光束進行全像圖之照明,然後可重建該信號。因此重建得到與入射參考光之強度相關之信號強度係於下稱為繞射效率,DE。在由兩平面波重疊形成之全像圖之最簡單的情況下,DE係獲自重建時所繞射光之強度與入射參考光及繞射光之強度總和的商。DE愈高,全像圖在以固定亮度使信號可見所需參考光之所需量方面的效率愈高。高度折射的丙烯酸酯係可在光聚合物調配物中產生折射率光柵並因此可使全像圖具有高DE及高Δn,其中該等折射率光柵在最低折射率之區域與最高折射率之區域間具有高振幅。應注意:DE係視Δn與光聚合物層厚度d之乘積而定。乘積愈大,可能DE(對於反射全像圖)愈大。(例如)單色照明時全像圖為可見的(經重建)之角度範圍寬度僅視該層厚度d而定。(例如)以白光照明全像圖時,有助於重建全像圖之光譜範圍的寬度同樣僅視該層厚度d而定。在此情況下,d愈小,個別可接受寬度愈大。因此,若希望產生明亮且隨時可見之全像圖,需要高Δn‧d及小厚度d,特別係以致DE係儘可能地大。此意味Δn愈高,可獲得較大寬容度以藉由修改d產生明亮全像圖而無損失DE。因此,Δn之最適化對光聚合物調配物之最適化是特別重要的(P. Hariharan,Optical Holography,第2版,Cambridge University Press,1996)
本發明目的係提供一種可製造相較於已知調配物具有較高亮度之全像圖的光聚合物調配物。
此目的在根據本發明光聚合物調配物情況下係憑藉其包含氟胺基甲酸酯作為塑化劑之事實達到。因此,吾人發現將氟胺基甲酸酯添加至已知光聚合物調配物中係使由其產生之全像圖具有高Δn值。因此,此意味由根據本發明調配物產生之全像圖相較於已知全像圖具有較高亮度。
該等氟胺基甲酸酯較佳係具有通式(I)之結構件並經至少一個氟原子取代之化合物。
更佳係該等氟胺基甲酸酯具有通式(II)
其中n係1且n係8,R1
、R2
、R3
皆為氫及/或彼此獨立地為未經取代或視情況亦經雜原子取代之線性、經分支、環狀或雜環狀有機基團,基團R1
、R2
、R3
中至少一者係經至少一個氟原子取代。在此特佳係R1
為具有至少一個氟原子之有機基團。
根據另一具體實施例,R1
可包含1-20 CF2
基及/或一或多個CF3
基,特佳係1-15 CF2
基及/或一或多個CF3
基,特佳係1-10 CF2
基及/或一或多個CF3
基,極特佳係1-8 CF2
基及/或一或多個CF3
基,R2
可包含C1-C20烷基,較佳係C1-C15烷基,特佳係C1-C10烷基或氫及/或R3
可包含C1-C20烷基,較佳係C1-C15烷基,特佳係C1-C10烷基或氫。
特佳係該等氟胺基甲酸酯具有脲二酮、異三聚氰酸酯、縮二脲、脲基甲酸酯、聚脲、氧雜二氮雜二酮及/或亞胺氧雜二二酮結構件及/或此等結構件之混合物。
該等氟胺基甲酸可特別具有1.4600,較佳係1.4500,特佳係1.4400且尤其佳係1.4300之折射率n20
;D
。
該等氟胺基甲酸可具有10-80重量%之氟,較佳係12.5-75重量%之氟,特佳係15-70重量%之氟,且尤其特佳係17.5-65重量%之氟之氟含量。
式(III)之氟胺基甲酸酯可藉由式R[NCO]n
之異氰酸酯與氟化醇以化學計量比例彼此反應並形成胺基甲酸酯的方式獲得。
較佳式R[NCO]n
之異氰酸酯係異氰酸甲酯、異氰酸乙酯、異氰酸丙酯異構物、異氰酸丁酯異構物、異氰酸戊酯異構物、異氰酸己酯異構物、異氰酸庚酯異構物、異氰酸辛酯異構物、異氰酸壬酯異構物、異氰酸癸酯異構物、硬脂醯基異氰酸酯、異氰酸環丙酯、異氰酸環丁酯、異氰酸環戊酯、異氰酸環己酯、異氰酸環庚酯、2-甲基戊烷1,5-二異氰酸酯(MPDI)、十二亞甲基二異氰酸酯、1,8-二異氰酸基-4-(異氰酸基甲基)辛烷(TIN)、6-二異氰酸基己烷(HDI,Desmodur H)、1-異氰酸基-3,3,5-三甲基-5-異氰酸基甲基環己烷(IPDI,Desmodur I)、2,4,4-三甲基己烷1,6-二異氰酸酯(TMDI)、二環己基甲烷二異氰酸酯(Desmodur W)、六氫甲伸苯基二異氰酸酯(H6TDI)、雙(4-異氰酸基環己基)甲烷(H12-MDI)、1,3-雙(異氰酸基甲基)環己烷、Desmodur LD、Desmodur N 100、Desmodur N3200、Desmodur N3300、Desmodur N3350、Desmodur N3368、Desmodur N3375、Desmodur N3390、Desmodur N3400、Desmodur N3600、Desmodur N3790、Desmodur N3800、Desmodur N3900、Desmodur N50、Desmodur N75、Desmodur NZ1、Desmodur PL340、Desmodur PL350、Desmodur PM76、Desmodur BL3175、Desmodur BL3272、Desmodur BL3370、Desmodur BL3475、Desmodur BL4265、Desmodur BL5375、Desmodur BLXP2677、Desmodur DA-L、Desmodur DN、Desmodur E 305、Desmodur E3265、Desmodur E3370、Baymicron OXA、Desmodur VP LS 2078/2、Desmodur VP LS 2114/1、Desmodur VP LS 2257、Desmodur VP LS 2352/1、Desmodur VP LS 2371、Desmodur VP LS 2376/1、Desmodur XP 2406、Desmodur XP 2489、Desmodur XP 2565、Desmodur XP 2580、Desmodur XP 2599、Desmodur XP 2617、Desmodur XP 2626、Desmodur XP 2675、Desmodur XP 2679、Desmodur XP 2714、Desmodur XP 2730、Desmodur XP 2731、Desmodur XP 2742、Desmodur XP 2748、Desmodur Z 4470或其混合物。
特佳式R[NCO]n
之異氰酸酯係異氰酸丙酯異構物、異氰酸丁酯異構物、異氰酸戊酯異構物、異氰酸己酯異構物、異氰酸庚酯異構物、異氰酸辛酯異構物、異氰酸壬酯異構物、異氰酸癸酯異構物、硬脂醯基異氰酸酯、1,8-二異氰酸基-4-(異氰酸基甲基)辛烷(TIN)、6-二異氰酸基己烷(HDI,Desmodur H)、1-異氰酸基-3,3,5-三甲基-5-異氰酸基甲基環己烷(IPDI,Desmodur I)、2,4,4-三甲基己烷1,6-二異氰酸酯(TMDI)、二環己基甲烷二異氰酸酯(Desmodur W)、六氫甲伸苯基二異氰酸酯(H6TDI)、1,3-雙(異氰酸基甲基)環己烷、Desmodur LD、Desmodur N3400、Desmodur N3600、Baymicron OXA或其混合物。
極特佳式R[NCO]n
之異氰酸酯係異氰酸異丙酯、異氰酸正丁酯、異氰酸正己酯、異氰酸正辛酯、異氰酸正癸酯、異氰酸環己酯、硬脂醯基異氰酸酯、1,8-二異氰酸基-4-(異氰酸基甲基)辛烷(TIN)、6-二異氰酸基己烷(HDI,Desmodur H)、1-異氰酸基-3,3,5-三甲基-5-異氰酸基甲基環己烷(IPDI,Desmodur I)、2,4,4-三甲基己烷1,6-二異氰酸酯(TMDI)、二環己基甲烷二異氰酸酯(Desmodur W)、六氫甲伸苯基二異氰酸酯(H6TDI)、1,3-雙(異氰酸基甲基)環己烷、Desmodur LD、Desmodur N3400、Desmodur N3600、Desmodur N3900、Baymicron OXA或其混合物。
氟化醇之可選擇範圍寬廣且較佳係使用氟含量為30%至82%之氟,特佳係氟含量為40%至80%之氟,特佳係氟含量為49%至75%之氟之一級或二級、單-、二-或三官能基醇。
在各情況下用於製備氟胺基甲酸酯之上述類型異氰酸酯與醇的反應係胺基甲酸酯化。該反應可借助於已知用於加速異氰酸酯加成反應之觸媒,如(例如)三級胺、錫、鋅、鐵或鉍化合物,特別係三乙基胺、1,4-二氮雜雙環[2.2.2]辛烷、辛酸鉍、辛酸鋅或二月桂酸二丁基錫進行,該等物可在初始時導入或後來計量送入。
該等氟胺基甲酸酯可具有低於0.5重量%,較佳係低於0.2重量%,特佳係低於0.1重量%之異氰酸酯基(M=42克/莫耳)或游離異氰酸酯基單體之含量。
此外,該等氟胺基甲酸酯可具有低於1重量%,較佳係低於0.5重量%,特佳係低於0.2重量%之未反應羥基官能基化合物的含量。
該等氟胺基甲酸可具有10-80重量%之氟,較佳係12.5-75重量%之氟,特佳係15-70重量%之氟,且尤其佳係17.5-65重量%之氟之氟含量。
該等氟胺基甲酸具有1.4600,較佳係1.4500,特佳係1.4400且尤其佳係1.4300之折射率n20
;D
。
製備該等氟胺基甲酸酯時,異氰酸酯與醇各可溶於非反應性溶劑,例如芳族或脂族烴或芳族或脂族鹵化烴或塗料溶劑中,如(例如)乙酸乙酯或乙酸丁酯或丙酮或丁酮或醚,如四氫呋喃或第三丁基甲基醚,或偶極非質子溶劑,如二甲基亞碸或N-甲基吡咯啶酮或N-乙基吡咯啶酮並可以熟諳此技者所熟知的方式在初始時導入或計量送入。
反應結束後,可在大氣壓力或較低壓力下自混合物移除未反應溶劑並藉由測定固體含量測定終點。該等固體含量以氟胺基甲酸酯計一般係在99.999至95.0重量%,較佳係99.998至98.0重量%之範圍內。
該等基質聚合物特別可為聚胺基甲酸酯。該等聚胺基甲酸酯較佳係可藉由異氰酸酯組分a)與異氰酸酯反應性組分b)反應而獲得。
該異氰酸酯組分a)較佳包含聚異氰酸酯。可使用之聚異氰酸酯係所有熟諳此技者本身所熟知之化合物或其混合物,其每分子平均具有兩個或多個NCO官能基。此等物可具有芳族、芳脂族、脂族或環脂族基。亦可同時使用少量含有不飽和基之單異氰酸酯及/或聚異氰酸酯。
例如,伸丁基二異氰酸酯、六亞甲基二異氰酸酯(HDI)、異佛酮二異氰酸酯(IPDI)、1,8-二異氰酸基-4-(異氰酸基甲基)辛烷、2,2,4-及/或2,4,4-三甲基六亞甲基二異氰酸酯、雙(4,4’-異氰酸基環己基)甲烷異構物及其具有任何所需異構物含量之混合物、異氰酸基甲基-1,8-辛烷二異氰酸酯、1,4-伸環己基二異氰酸酯、環己烷二亞甲基二異氰酸酯異構物、1,4-伸苯基二異氰酸酯、2,4-及/或2,6-甲伸苯基二異氰酸酯、1,5-伸萘基二異氰酸酯、2,4’-或4,4’-二苯基甲烷二異氰酸酯及/或三苯基甲烷4,4’,4’-三異氰酸酯係適合的。
亦可使用具有胺基甲酸酯、脲、碳二醯亞胺、醯基脲、異三聚氰酸酯、脲基甲酸酯、縮二脲、氧雜二三酮、脲基二酮及/或亞胺氧雜二二酮結構之單體二-或三異氰酸酯的衍生物。
較佳係使用以脂族及/或環脂族二-或三異氰酸酯為主之聚異氰酸酯。
組分a)之聚異氰酸酯特佳係二聚化或寡聚脂族及/或環脂族二-或三異氰酸酯。
極特佳係以HDI、1,8-二異氰酸基-4-(異氰酸基甲基)辛烷或其混合物為主之異三聚氰酸酯、脲基二酮及/或亞胺氧雜二二酮。
亦可使用具有胺基甲酸酯、脲基甲酸酯、縮二脲及/或醯胺基之NCO官能基預聚物作為組分a)。組分a)之預聚物係以熟諳此技者本身所熟知的方式藉由單體、寡聚或聚異氰酸酯a)與異氰酸酯反應性化合物a2)以適合化學計量並選擇使用觸媒及溶劑的情況下反應所獲得。
適合的聚異氰酸酯a1)係所有熟諳此技者本身所熟知之脂族、環脂族、芳族或芳脂族二-或三異氰酸酯,此等物係藉由光氣法或非光氣法所獲得並不重要的。此外,亦可在各情況下個別使用或以彼此任何所需混合物形式使用具有胺基甲酸酯、脲、碳二醯亞胺、醯基脲、異三聚氰酸酯、脲基甲酸酯、縮二脲、氧雜二三酮、脲基二酮或亞胺氧雜二二酮結構之單體二-及/或三異氰酸酯之較高分子量二次產物,該等二次產物係為熟諳此技者本身所熟知的。
可使用作為組分a1)之適合單體二-及/或三異氰酸酯之實例係伸丁基二異氰酸酯、六亞甲基二異氰酸酯(HDI)、異佛酮二異氰酸酯(IPDI)、三甲基六亞甲基二異氰酸酯(TMDI)、1,8-二異氰酸基-4-(異氰酸基甲基)辛烷、異氰酸基甲基-1,8-辛烷二異氰酸酯(TIN)、2,4-及/或2,6-甲苯二異氰酸酯。
OH官能基化合物較佳係用作異氰酸酯反應性化合物a2)以合成預聚物。此等物係類似下述組分b)之OH官能基化合物。
亦可將胺用於預聚物之製備。例如,伸乙二胺、二伸乙三胺、三伸乙四胺、伸丙二胺、二胺基環己烷、二胺基苯、二胺基聯苯基、二官能基聚胺,如(例如)Jeffamine(具有數目平均莫耳質量高達10 000克/莫耳之經胺封端之聚合物)或其彼此之任何所需混合物係適合的。
為製備含有縮二脲基之預聚物,異氰酸酯係以過量與胺反應並在製程中形成縮二脲基。在此情況下適合與所提二-、三-及聚異氰酸酯反應之胺係上述類型之所有寡聚或聚合一級或二級之二官能基胺。
較佳預聚物係由脂族異氰酸酯官能基化合物與具有數目平均莫耳質量為200至10000克/莫耳之寡聚或聚合異氰酸酯反應性化合物所獲得之胺基甲酸酯、脲基甲酸酯或縮二脲;特佳係由脂族異氰酸酯官能基化合物與具有數目平均莫耳質量為500至8500克/莫耳之寡聚或聚合多元醇或聚胺所獲得之胺基甲酸酯、脲基甲酸酯或縮二脲,極特佳係由HDI或TMDI與具有數目平均莫耳質量為1000至8200克/莫耳之二官能基聚醚多元醇所獲得之脲基甲酸酯。
上述預聚物較佳係具有低於1重量%,特佳係低於0.5重量%,極特佳係低於0.2重量%之游離異氰酸酯單體之殘留含量。
當然,該異氰酸酯組分除了所述預聚物之外可成比例地包含其他異氰酸酯組分。芳族、芳脂族、脂族及環脂族二-、三-或聚異氰酸酯係適合用於此所用目的。亦可使用此等二-、三-或聚異氰酸酯之混合物。適合的二-、三-或聚異氰酸酯之實例係伸丁基二異氰酸酯、六亞甲基二異氰酸酯(HDI)、異佛酮二異氰酸酯(IPDI)、1,8-二異氰酸基-4-(異氰酸基甲基)辛烷、2,2,4-及/或2,4,4-三甲基六亞甲基二異氰酸酯(TMDI)、雙(4,4’-異氰酸基環己基)甲烷異構物及其具有任何所需異構物含量之混合物、異氰酸基甲基-1,8-辛烷二異氰酸酯、1,4-伸環己基二異氰酸酯、環己烷二亞甲基二異氰酸酯異構物、1,4-伸苯基二異氰酸酯、2,4-及/或2,6-甲伸苯基二異氰酸酯、1,5-伸萘基二異氰酸酯、2,4’-或4,4’-二苯基甲烷二異氰酸酯、三苯基甲烷4,4’,4’-三異氰酸酯或其具有胺基甲酸酯、脲、碳二醯亞胺、醯基脲、異三聚氰酸酯、脲基甲酸酯、縮二脲、氧雜二三酮、脲基二酮或亞胺氧雜二二酮結構之衍生物及其混合物。較佳係以藉由適合方法自過量二異氰酸酯游離之寡聚化及/或衍生化之二異氰酸酯為主的聚異氰酸酯,特別係彼等具六亞甲基二異氰酸酯者。特佳係HDI之寡聚異三聚氰酸酯、脲基二酮及亞胺氧雜二二酮及其混合物。
異氰酸酯組分a)視情況亦可成比例地含有與異氰酸酯反應性乙烯系(ethylenically)不飽和化合物部分反應之異氰酸酯。在此較佳係使用α,β-不飽和羧酸衍生物,如丙烯酸酯、甲基丙烯酸酯、馬來酸酯、延胡索酸酯、馬來醯亞胺、丙烯醯胺及乙烯基醚、丙烯基醚、烯丙基醚及含有二環戊二烯基單位並具有至少一個對異氰酸酯聚具反應性之基團的化合物以作為異氰酸酯反應性乙烯系不飽和化合物;此等物特佳係具有至少一個異氰酸酯反應性基團之丙烯酸酯及甲基丙烯酸酯。例如,化合物如2-羥基乙基(甲基)丙烯酸酯、聚環氧乙烷單(甲基)丙烯酸酯、聚環氧丙烷單(甲基)丙烯酸酯、聚環氧烷單(甲基)丙烯酸酯、聚(ε-己內酯)單(甲基)丙烯酸酯,如(例如)M100(Dow,USA)、2-羥基丙基(甲基)丙烯酸酯、4-羥基丁基(甲基)丙烯酸酯、3-羥基-2,2-二甲基丙基(甲基)丙烯酸酯、多元醇之羥基官能基單-、二-或四(甲基)丙烯酸酯,如三羥甲基丙烷、甘油、季戊四醇、二季戊四醇、乙氧基化、丙氧基化或烷氧基化三羥甲基丙烷,甘油、季戊四醇、二季戊四醇或其工業混合物係適合作為羥基官能基丙烯酸酯或甲基丙烯酸酯。此外,單獨或與上述單體化合物組合之含有丙烯酸酯及/或甲基丙烯酸酯基團之異氰酸酯反應性寡聚或聚合不飽和化合物皆適合。以異氰酸酯組分a)計,與異氰酸酯反應性乙烯系不飽和化合物部分反應之異氰酸酯的比例係0至99%,較佳係0至50%,特佳係0至25%,極特佳係0至15%。
上述異氰酸酯組分a)視情況亦可完全或成比例地包含與熟諳此技者由塗料技術已知之封端劑(blocking agent)完全或部分反應之異氰酸酯。可提及下列各者以作為封端劑之實例:醇、內醯胺、肟、丙二酸酯、乙醯乙酸烷酯、三唑、酚、咪唑、吡唑及胺,如(例如)丁酮肟、二異丙基胺、1,2,4-三唑、二甲基-1,2,4-三唑、咪唑、丙二酸二乙酯、乙醯乙酸乙酯、丙酮肟、3,5-二甲基吡唑、ε-己內酯、N-第三丁基苯甲基胺、環戊酮羧基乙基酯或此等封端劑之任何所需混合物。
基本上,每分子平均具有至少1.5個異氰酸酯反應性基團之所有多官能基異氰酸酯反應性化合物皆可用作組分b)。
在本發明背景中,異氰酸酯反應性基團較佳係羥基、胺基或硫基;特佳係羥基化合物。
適合的多官能基異氰酸酯反應性化合物係(例如)聚酯-、聚醚-、聚碳酸酯-、聚(甲基)丙烯酸酯-及/或聚胺基甲酸酯多元醇。
適合的聚酯多元醇係(例如)如可以已知方式由脂族、環脂族或芳族二-或多羧酸或其酸酐與具有OH官能度為2之多元醇獲得之線性聚酯二元醇或經分支聚酯多元醇。
此等二-或多羧酸或酸酐之實例係丁二酸、戊二酸、己二酸、庚二酸、辛二酸、壬二酸、癸二酸、壬烷二羧酸、癸烷二羧酸、對酞酸、間酞酸、鄰酞酸、四氫酞酸、六氫酞酸或偏苯三甲酸及酸酐,如鄰酞酸酐、偏苯三甲酸酐或丁二酸酐或其彼此之任何所需混合物。
此等適合醇之實例係乙二醇、二-、三-及四乙二醇、1,2-丙二醇、二-、三-及四丙二醇、1,3-丙二醇、1,4-丁二醇、1,3-丁二醇、2,3-丁二醇、1,5-戊二醇、1,6-己二醇、2,2-二甲基-1,3-丙二醇、1,4-二羥基環己烷、1,4-二羥甲基環己烷、1,8-辛二醇、1,10-癸二醇、1,12-十二烷二醇、三羥甲基丙烷、甘油或其彼此之任何所需混合物。
聚酯多元醇亦可以天然原料,如蓖麻油為主。該等聚酯多元醇亦可以內酯之均聚物或共聚物為主,如較佳可藉由內酯或內酯混合物,如丁內酯、ε-己內酯及/或甲基-ε-己內酯與羥基官能基化合物,如具有OH官能度2之多元醇,例如上述類型者之加成反應所獲得。
此等聚酯多元醇較佳具有400至4000克/莫耳,特佳係500至2000克/莫耳之數目平均莫耳質量。其OH官能度較佳係1.5至3.5,特佳係1.8至3.0。
適合的聚碳酸酯多元醇可以已知方式藉由有機碳酸酯或光氣與二元醇或二元醇混合物反應獲得。
適合的有機碳酸酯係二甲基、二乙基及二苯基碳酸酯。
適合的二元醇或混合物包含所提與聚酯片段有關並具有2之OH官能度之多元醇,較佳係1,4-丁二醇、1,6-己二醇及/或3-甲基戊二醇,或聚酯多元醇可轉化成聚碳酸酯多元醇。
該等聚碳酸酯多元醇較佳係具有400至4000克/莫耳,特佳係500至2000克/莫耳之數目平均莫耳質量。此等多元醇之OH官能度較佳係1.8至3.2,特佳係1.9至3.0。
適合的聚醚多元醇視情況為環狀醚與OH-或NH-官能基起始分子之聚加成物,該等聚加成物具有嵌段結構。
適合的環狀醚係(例如)苯乙烯氧化物、環氧乙烷、環氧丙烷、四氫呋喃、環氧丁烷、表氯醇及其任何所需混合物。
可使用所提及與聚酯多元醇有關並具有2之OH官能度之多元醇及一級或二級胺及胺基醇作為起始物。
較佳聚醚多元醇係彼等上述類型專門以環氧丙烷為主者,或以環氧丙烷與其他1-環氧烷為主之無規或嵌段共聚物,其中1-環氧烷之比例不高於80重量%。此外,較佳係聚(三亞甲基氧化物)及所提為較佳之多元醇的混合物。特佳係具有氧乙烯、氧丙烯及/或氧丁烯單位之環氧丙烷均聚物及無規或嵌段共聚物,氧丙烯單位之比例以所有氧乙烯、氧丙烯及氧丁烯單位之總量計係佔至少20重量%,較佳係至少45重量%。在此,氧丙烯及氧丁烯包含所有個別線性及經分支C3
-及C4
-異構物。
此等聚醚多元醇較佳係具有250至10 000克/莫耳,特佳係500至8500克/莫耳,極特佳係600至4500克/莫耳之數目平均莫耳質量。OH官能度較佳係1.5至4.0,特佳係1.8至3.1。
此外,具有低分子量,即具有低於500克/莫耳之分子量並具有短鏈,即含2至20個碳原子之脂族、芳脂族或環脂族二、三或多官能基醇亦適合作為組分b)之組成分之多官能基異氰酸酯反應性化合物。
此等物可為(例如)乙二醇、二乙二醇、三乙二醇、四乙二醇、二丙二醇、三丙二醇、1,2-丙二醇、1,3-丙二醇、1,4-丁二醇、新戊二醇、2-乙基-2-丁基丙二醇、三甲基戊二醇、二乙基辛二醇之位置異構物、1,3-丁二醇、環己二醇、1,4-環己烷二甲醇、1,6-己二醇、1,2-及1,4-環己二醇、氫化雙酚A(2,2-雙(4-羥基環己基)丙烷)、2,2-二甲基-3-羥基丙酸(2,2-二甲基-3-羥基丙基酯)。適合的三元醇之實例係三羥甲基乙烷、三羥甲基丙烷或甘油。適合的高官能基醇係二-三羥甲基丙烷、季戊四醇、二季戊四醇或山梨醇。
使用一或多種光起始劑作為組分c)。此等物通常係可藉由光化輻射活化並引發對應可聚合基團聚合之起始劑。光起始劑係本身已知商業銷售之化合物、單分子(第I型)與雙分子(第II型)起始劑間係有差別的。此外,視此等起始劑之化學本質而定,其係用於上述聚合之自由基、陰離子(或)陽離子(或混合)形式。
自由基光聚合之(第I型)系統係(例如)芳族酮化合物,如二苯基酮與三級胺之組合、烷基二苯基酮、4,4’-雙(二甲基胺基)二苯基酮(Michlers酮)、蒽酮及鹵化二苯基酮或該等類型之混合物。其他適合者係(第II型)起始劑,如安息香及其衍生物、二苯乙二酮縮酮(benzil ketals)、醯基膦氧化物,如2,4,6-三甲基苯甲醯基二苯基膦氧化物、雙醯基膦氧化物、苯基乙醛酸酯、樟腦醌、α-胺基烷基酮(alpha-aminoalkylphenones)、α,α-二烷氧基苯乙酮、1-[4-(苯基硫基)苯基]辛-1,2-二酮2-(O-苯甲醯基肟)、經不同取代之六芳基雙咪唑(HABI)及適合的共起始劑,如(例如)氫硫基苯并唑及α-羥基烷基酮(alpha-hydroxyalkylphenones)。描述於EP-A 0223587並由芳烷基硼酸銨與一或多種染料之混合物組成之光起始劑系統亦可用作光起始劑。適合的芳基硼酸銨係(例如)三苯基己基硼酸四丁基銨、三苯基丁基硼酸四丁基銨、三萘基丁基硼酸四丁基銨、三苯基苯甲基硼酸四甲基銨、(第二丁基)三苯基硼酸四(正己基)銨、二戊基二苯基硼酸1-甲基-3-辛基咪唑、參(4-第三丁基)苯基丁基硼酸四丁基銨、參(3-氟苯基)己基硼酸四丁基銨及參(3-氯-4-甲基苯基)己基硼酸四丁基銨。適合的染料係(例如)新亞甲基藍、硫堇、鹼性黃、氯化頻哪氰醇(Pinacynol)、玫瑰紅(Rhodamine)6G、棓花青(Gallocyanine)、乙基紫、維多利亞(Victoria)藍R、天青石藍、甲喹啉紅、結晶紫、孔雀綠、鹼性橙G(Astrazone orange G)、達羅(Darrow)紅、哌咯寧(Pyronine)Y、鹼性紅29、吡喃(Pyrillium)I、番紅O,花青及亞甲基藍、天青A(Cunningham等人,RadTech’98 North America UV/EB Conference Proceedings,Chicage,Apr. 19-22,1998)。
用於陰離子聚合之光起始劑通常係(第I型)系統並衍生自第一系列之過渡金屬錯合物。在此係鉻鹽,如(例如)反-Cr(NH3
)2
(NCS)4 -
(Kutal等人,Macromolecules 1991,24,6872)或二茂鐵(ferrocenyl)化合物(Yamaguchi等人,Macromolecules 2000,33,1152)。另一種可能陰離子聚合係在於染料,如結晶紫、無色腈(leuconitrile)或孔雀石綠無色腈(malchite green leuconitrile)的使用,其可藉由光分解聚合氰基丙烯酸酯(Neckers等人,Macromolecules 2000,33,7761)。然而,將發色團摻入聚合物中,藉此使所得聚合物完全染色。
用於陽離子聚合之光起始劑實質上包含三個類別:芳基重氮鹽、鎓鹽(在此特別係:碘鎓、鋶及鹽)及有機金屬化合物。在有及無氫供體的存在下照射時,苯基重氮鹽可產生引發聚合之陽離子。整個系統之效率係由用於重氮化合物之相對離子的本質決定。在此較佳係反應性不太大但非常昂貴之SbF6-
、AsF6-
或PF6-
。此等化合物通常不是非常適合用於塗佈薄膜,因為表面品質在曝光後所釋放之氮而降低(針孔,Li等人,Polymeric Materials Science and Engineering,2001,84,139)。極廣泛使用並亦可以多種形式商業購得者係鎓鹽,特別係鋶及碘鎓鹽。早已研究此等化合物之光化學多年。激發後,碘鎓鹽起初均裂並因此產生自由基和自由基陰離子,其係藉由H抽取安定化並釋出質子,然後引發陽離子聚合反應(Dektar等人,J. Org. Chem. 1990,55,639;J. Org. Chem.,1991,56,1838)。此機制亦可將碘鎓鹽用於自由基光聚合中。相對離子之選擇在此又具顯著重要性;同樣較佳係SbF6-
、AsF6-
或PF6-
。此外,芳族化合物取代之選擇在此結構類別中係完全自由且實質上係由適合用於合成之起始建構塊的可取得性決定。鋶鹽係根據Norrish(II)分解之化合物(Crivello等人,Macromolecules,2000,33,825)。在鋶鹽之情況下,相對離子之選擇亦具關鍵重要性,其本身實質上清楚顯示於聚合物之硬化速率上。最佳結果通常係以SbF6-
鹽獲得。因為碘鎓及鋶鹽之自吸收係發生在<300毫微米,此等化合物必須經適當敏化以藉由近UV或短波長可見光光聚合。此係利用更高度吸收的芳族化合物如(例如)蒽及其衍生物(Gu等人,Am. Chem. Soc. Polymer Preprints,2000,41(2),1266)或酚噻或其衍生物(Hua等人,Macromolecules 2001,34,2488-2494)進行。
使用此等化合物之混合物亦可能有利。視用於硬化之輻射源而定,光起始劑之類型及濃度必須以熟諳此技者已知方式修改。其他細節係描述於(例如)P. K. T.Oldring(著),Chemistry & Technology of UV & EB Formulations For Coatings,Inks & Paints,第3卷,1991,SITA Technology,London,第61-328頁中。
較佳光起始劑c)係三苯基己基硼酸四丁基銨、三苯基丁基硼酸四丁基銨、三萘基丁基硼酸四丁基銨、參(4-第三丁基)苯基丁基硼酸四丁基銨、參(3-氟苯基)己基硼酸四丁基銨及參(3-氯-4-甲基苯基)己基硼酸四丁基銨與染料,如(例如)鹼性橙G、亞甲基藍、新亞甲基藍、天青A、吡喃I、番紅O、花青、棓花青、孔雀綠、結晶紫、乙基紫及硫堇之混合物。
作為組分d),極佳結果係可以高度折射之丙烯酸酯作為光聚合物調配物中賦予對比之組分而獲得,如(例如)US 6,780,546所述般。
因此,根據本發明該光聚合物調配物中該等寫入單體較佳係丙烯酸酯,特佳係彼等具有>1.5之折射率n20
;D
者。極特佳係胺基甲酸酯丙烯酸酯,特佳係如(例如)WO 2008/125199中所述般,在589毫微米下具有折射率n20
;D
>1.5之芳族胺基甲酸酯丙烯酸酯。
本發明另外關於用於紀錄可利用式(I)氟胺基甲酸酯獲得之視覺全像圖之媒體,此等媒體作為光學元件或影像或用於影像呈現或投影之用途及一種紀錄使用此等媒體之全像圖的方法。
根據本發明光聚合物調配物可特別包含15至79重量%,較佳係30至60重量%之基質聚合物,5至50重量%,較佳係10至40重量%之寫入單體、1至10重量%,較佳係1至3重量%之光起始劑及5至50重量%,較佳係10至40重量%之氟胺基甲酸酯和0至10重量%之其他添加劑,組成分之總和為100重量%。
本發明之第二態樣係關於一種製備根據本發明光聚合物調配物之方法,其中基質聚合物、寫入單體、光起始劑與作為塑化劑之氟胺基甲酸酯混合以獲得光聚合物調配物。
本發明之第三態樣係關於可藉由該方法獲得之光聚合物調配物。
本發明之第四態樣係關於包含該光聚合物調配物之板、薄膜、層、層結構或模製物。
包含根據本發明光聚合物調配物之層、層結構及模製物一般具有藉由”Measurement of the holographic properties DE and △n of the holographic media by means of two-beam interference in reflection arrangement”部分中所述方法量得為>0.0120,較佳係>0.0130,特佳係>0.0140,極特佳係>0.0150之△n值。
本發明之第五態樣係關於光聚合物調配物用於製備光學元件,特別係製造全像元件及影像之用途。
本發明亦關於一種使包含根據本發明光聚合物調配物之全像媒體曝光之方法,其中該等寫入單體係經電磁輻射以空間解析度選擇性地聚合。
全像曝光後,此等全像媒體係適合用於製造全像光
學元件,該等全像光學元件可具有(例如)光學鏡片、鏡子、偏向鏡、過濾器、漫散屏、繞射元件、光導體、波導、投影屏及/或光罩之功能。此外,亦可製造全像影像或表徵,如(例如)用於個人肖像、安全文件中之生物特徵量測表徵者,或一般廣告用之影像或影像結構、安全標號、商標保護、商標品牌、標籤、設計元件、裝飾、圖解、收藏品、影像及類似物和可代表數位資料之影像,尤其亦與上述產物結合者。
先前技術揭示某些氟胺基甲酸酯。因此,US 2003/105263 A1描述可藉由縮二脲、異三聚氰酸酯、脲基二酮、聚脲、特定聚異氰酸酯與氟化醇反應獲得之氟胺基甲酸酯。WO 03/023519 A揭示可藉由含有縮二脲之聚異氰酸酯與氟化醇反應獲得之氟胺基甲酸酯。
本發明之另一態樣係關於可藉由含有亞胺氧雜二二酮或氧雜二氮雜二酮並具有至少一個游離異氰酸酯基之聚異氰酸酯與醇反應獲得之氟胺基甲酸酯,該聚異氰酸酯及/或醇係經至少一個氟原子取代。
最後,本發明亦關於根據通式(III)之氟胺基甲酸酯
其中m係1且m係8,R4
、R5
、R6
係氫及/或彼此獨立地之未經取代或視情況亦經雜原子取代並具有亞胺氧雜二二酮及/或氧雜二氮雜二酮結構件之線性、經分支、環狀或雜環狀有機基團,同時基團R4
、R5
、R6
中至少兩者係經至少一個氟原子取代。
本發明係參照實例更詳細地解釋於下。
除非另外指出,所有陳述之百分率係以重量百分率計。
所陳述NCO值(異氰酸酯含量)係根據DIN EN ISO 11909測得。
視實例化合物之本質而定,折射率測量係藉由下列三種方法中之一者進行:
在405毫微米之波長下測量折射率n(方法A):隨樣品波長而變之折射率n係由透射及反射光譜獲得。基於此目的,約100-300毫微米厚之樣品膜係藉由旋轉塗佈以乙酸丁酯稀溶液施用於石英玻璃基板上。此層堆疊之透射及反射光譜係利用獲自STEAG ETA-Optik,CD-測量系統ETA-RT之光譜儀測得,然後將層厚度及n之光譜曲線係與所量得之透射及反射光譜一致。此係利用光譜儀之內部軟體進行並另外需要事先在空白測量中所測得之石英玻璃基板的n數據。
在589毫微米之波長下測量折射率n20
;D
(方法B):將實例化合物之樣品導入Abbe折射儀中,然後測量n20
;D
。
在589毫微米之波長下測量半濃縮溶液之折射率n20
;D
(方法C):利用N-乙基吡咯啶酮以50:50(重量%)稀釋實例化合物之樣品並將其導入Abbe折射儀中,然後測量n20
;D
。由其計算分析物之近似折射率;N-乙基吡咯啶酮之n20
;D
係1.4658。
然後,如下藉由根據圖1之測量裝置測試所製得之媒體的全像特性:
借助於空間濾波器(SF)與準直透鏡(CL)一起將He-Ne雷射光束(放射波長633毫微米)轉化成平行均勻光束。信號與參考光束之最終橫截面係藉由可變光圈(Iris diaphragms)(I)建立。此可變光圈開口之直徑係0.4厘米。極化相依性光束分光鏡(PBS)將雷射光束分成兩條具有相同極化之同調光束。經由λ/2板,將參考光束之功率調整至0.5毫瓦且信號光束之功率為0.65毫瓦。利用半導體偵測器(D)測定功率並移開樣品。參考光束之入射角(α0
)係-21.8°且信號光束之入射角(β0
)係41.8°。該等角度係由垂直於光束方向之樣品開始測量。根據圖1,α0
因此具有負號,而β0
具有正號。在樣品(媒體)位置處,兩條重疊光束之干涉場產生明亮及昏暗條紋(fringes)的光柵(反射全像圖),其中該等條紋係垂直於樣品中兩條入射光束之角平分線。媒體中亦稱為光柵週期之條紋間隔Λ係~225毫微米(假設媒體之折射率為~1.504)。
圖1顯示全像媒體測試器(HMT)於λ=633毫微米(He-Ne雷射)之幾何結構:M=鏡子,S=光閘,SF=空間濾波器,CL=準直透鏡、λ/2=λ/2板,PBS=極化相依性光束分光鏡,D=偵測器,I=可變光圈,α0
=-21.8°,β0
=41.8°係於樣品外(媒體外)所量得之同調光束的入射角。RD=旋轉台之參考方向。
媒體之繞射效率(DE)係利用圖1所示之實驗全像設備量得。
全像圖係以下列方式記錄於媒體中:
‧ 兩光閘(S)打開達曝光時間t。
‧ 之後,藉由關閉之光閘(S)容許媒體可使仍未聚合之寫入單體擴散5分鐘的時間。
現依下列方式讀出所紀錄之全像圖。信號光束之光閘仍保持關閉。打開參考光束之光閘。將參考光束之可變光圈關閉至直徑<1釐米。此確保該光束在先前紀錄之全像圖中始終完全用於該媒體之所有旋轉角度(Ω)。在電腦控制下,旋轉台現以0.05°之角度步寬涵蓋Ωmin
至Ωmax
之角度範圍。Ω係由垂直於旋轉台之參考方向的樣品測得。旋轉台之參考方向係在紀錄全像圖時參考光束之入射角與信號光束之入射角具有相同大小,即α0
=-31.8°及β0
=31.8°時獲得。Ω紀錄
則為0°。對於α0
=-21.8°且β0
=41.8°,Ω紀錄
因此係10°。一般,下列對紀錄全像圖期間之干涉場為真:
α0
=θ0
+Ω紀錄
.
θ0
係在實驗室系統中媒體外之半角且紀錄全像圖時存在下列恆等式:
在此情況下,θ0
因此係-31.8°。在各所達旋轉角度Ω,以零級透射之光束功率係藉由對應偵測器D測得並以一級繞射之光束功率係藉由偵測器D測得。在各所達角度Ω下,繞射效率係以下式之商獲得:
PD
係偵測器中繞射光束之功率且PT
係偵測器中透射光束之功率。
藉由上述方法測量布拉格(Bragg)曲線(其描述以繞射效率η隨所紀錄全像圖之旋轉角度Ω而變)並將其儲存在電腦中。此外,以零級透射之強度亦對旋轉角度Ω作圖並儲存在電腦中。
全像圖之最大繞射效率(DE=ηmax
),即最大值(peak value)係在Ω重建(reconstruction)
之情況下測得。為達此目的,可能需要改變繞射光束之偵測器的位置以測定此最大值。
光聚合物層之折射率對比Δn及厚度d現係藉由耦合波理論(參照H. Kogelnik,The Bell SyStem Technical Journal,第48卷,1969年11月,第9期,第2909-2947頁)由所測得布拉格曲線及透射強度隨角度之變化測得。由於光聚合所造成之厚度縮小,應注意全像圖之條紋間隔Δ’及條紋之位向(傾斜)可能偏離干涉圖案之條紋間隔Δ及其位向。因此,在達到最大繞射效率之旋轉台Ω重建
的角度Δ0’或對應角度亦將偏離Δ0’或對應Ω紀錄
。因此,布拉格條件改變。將此改變納入評估方法之考慮中。評估方法係描述於下:
所有與所紀錄之全像圖相關,但與干涉圖案無關之幾何量係以虛線所示量表示。
根據Kogelnik,下列確實根據反射全像圖之布拉格曲線η(Ω):
其中:
讀取全像圖(“重建”)時,類似上述般下列為真:
在布拉格條件下,”相位偏移”DP係0。因此:
α'0
=θ0
+Ω重建
sin(α'0
)=n
‧sin(α')
仍未知之角度β’可由紀錄全像圖時干涉場之布拉格條件與讀取全像圖時之布拉格條件的比較測得,假設僅發生厚度縮小。然後依照下式:
ν係光柵厚度,ξ係失調(detuning)參數及Ψ’係所紀錄之折射率光柵的位向(傾斜)。α’及β’相當於紀錄全像圖時,但在媒體中所測得並可應用於全像圖之光柵(厚度收縮後)之干涉場的角度α0
及β0
。n係光聚合物之平均折射率並設為1.504。λ係在真空中雷射光之波長。
然後,ξ=0之最大繞射效率(DE=ηmax
)係以下式獲得:
圖2顯示對角度失調ΔΩ作圖之所測得透射功率PT
(右邊y軸)之實線、對角度失調ΔΩ作圖之所測得繞射效率η(左邊y軸)之實心圓(若偵測器之有限尺寸允許)及Kogelnik理論相稱性之虛線(左邊y軸)。
如圖2所示繞射效率之測量數據、理論布拉格曲線及透射強度係對亦稱為角度失調之旋轉中心角ΔΩ≡Ω重建
-Ω=α’0
-作圖。
因為DE已知,根據Kogelnik之理論布拉格曲線的形狀僅藉由光聚合物層之厚度d’測得。接著針對既定厚度d’利用DE修正Δn而使DE之測量及理論值總是一致。現調整d’直到理論布拉格曲線之第一次第二最小值(first secondary minima)之角度位置與透射強度之第一次第二最大值(first secondary maxima)之角度位置一致且另外理論布拉格曲線之半高全幅值(full width at half height,FWHM)與透射強度之半高全幅值一致。
由於反射全像圖在藉由Ω掃描重建時同時旋轉之方向,但繞射光之偵測器僅可偵測有限角度範圍,寬全像圖(小d’)之布拉格曲線無法以Ω掃描偵測到,但僅中央區域經適合的偵測器定位。與布拉格曲線互補之透射強度的形狀因此另外可用於調整層厚度d’。
圖2顯示根據耦合波理論之布拉格曲線η(虛線)、所測得繞射效率(實心圓)及透射功率(黑實線)對角度失調ΔΩ作圖。
對於一調配物,可在不同媒體上以不同曝光時間t重覆此程序數次以測定DE在紀錄全像圖期間達到飽和值之入射雷射光束的平均能量劑量。平均能量劑量E係如下由角度α0
及β0
定座標之兩部分光束的功率(Pr
=0.50毫瓦之參考光束及Ps
=0.63毫瓦之信號光束)、曝光時間t及可變光圈之直徑(0.4厘米)獲得:
調整個別光束之功率以致媒體中在所用角度α0
及β0
下獲得相同功率密度。
Fluorlink E 10/H係Solvay Solexis所製造並以氟化醇為主具有750克/莫耳之平均分子量為的反應性添加劑。
CGI-909(參(3-氯-4-甲基苯基)(己基)硼酸四丁基銨,[1147315-11-4])係CIBA Inc.,Basle,瑞士所製造之實驗產物。
1,8-二異氰酸基-4-(異氰酸基甲基)辛烷(TIN)係如EP 749958中所述般製得。
所用氟化醇及單官能基異氰酸酯係由化學貿易獲得且所用聚異氰酸酯(Desmodur H(HDI),Desmodur I(IPDI),Desmodur W,Desmodur LD,Desmodur N3400,Desmodur N3600,Desmodur N3900,Baymicron OXA)係BayerMaterialScience AG,Leverkusen德國之商業產品。
2,4,4-三甲基己烷1,6-二異氰酸酯(Vestanst TMDI)係Evonik Degussa GmbH,Marl德國之產品。
起初在80℃下將684克之六亞甲基二異氰酸酯(HDI)導入1公升圓底燒瓶中並加入0.002克之間酞醯二氯。逐滴緩慢加入54.4克之三氟乙醇並進行攪拌直到NCO值為43.2重量%。藉於薄膜蒸發器上蒸餾分離混合物並獲得47克(=理論值之47%)具有NCO含量為22.7重量%之標題化合物。
起初在80℃下將399克之六亞甲基二異氰酸酯(HDI)導入1公升圓底燒瓶中並加入0.002克之間酞醯二氯。逐滴緩慢加入73.4克之2,2,3,3,4,4,5,5-八氟戊醇並進行攪拌直到NCO值為39.4重量%。藉於薄膜蒸發器上蒸餾分離混合物並獲得40克(=理論值之40%)NCO含量為12.4重量%之標題化合物。
起初將0.07克之Desmorapid Z及64.4克6-二異氰酸基己烷(HDI)導入500毫升圓底燒瓶中並加熱至60℃。之後,逐滴加入81.5克之三氟乙醇並將混合物另外保持在60℃下,直到異氰酸酯含量下降至0.1%以下。然後冷卻之。獲得無色固體之產物。
依實例1所述方式以所陳述組成物製備下表1中所述實例。
起初將2,2,3,3,4,4,5,5,6,6,7,7-十二氟-1,8-辛二醇導入250毫升圓底燒瓶中並加入0.05克之二月桂酸二丁基錫(Desmorapid Z,Bayer MaterialScience AG, Leverkusen,德國)且加熱至60℃。分數份加入18.7克之異氰酸酯正丁酯並在60℃下攪拌3小時。之後,逐滴加入19.9克之2,4,4-三甲基己烷1,6-二異氰酸酯(TMDI)並將混合物另外保持在60℃下,直到異氰酸酯含量下降至0.1%以下。之後,進行冷卻並獲得無色油之產物;根據方法B所測得之折射率n20
;D
=1.4131。
起初將2,2,3,3,4,4,5,5,6,6,7,7-十二氟-1,8-辛二醇導入100毫升圓底燒瓶中並加入0.01克之二月桂酸二丁基錫(Desmorapid Z,Bayer MaterialScience AG,Leverkusen,德國)且加熱至60℃。分數份加入3.63克之異氰酸酯正丁酯並在60℃下攪拌3小時。之後,逐滴加入3.08克之1,8-二異氰酸基-4-(異氰酸基甲基)辛烷(TIN)並將混合物另外保持在60℃下,直到異氰酸酯含量下降至0.1%以下。之後,進行冷卻並獲得無色油之產物;根據方法A所測得之折射率n=1.4200。
製造媒體並如下述般以光學方式測量之以測試光學特性。
起初將0.18克之辛酸錫、374.8克之ε-己內酯及374.8克之二官能基聚四氫呋喃聚醚多元醇(當量500克/莫耳OH)導入1公升燒瓶中並加熱至120℃和保持在此溫度下,直到固體含量(非揮發性組成分之比例)為99.5重量%或更高。之後,進行冷卻並獲得蠟狀固體之產物。
起初將0.1克之2,6-二-第三丁基-4-甲基酚、0.05克二月桂酸二丁基錫(Desmorapid Z,Bayer MaterialScience AG,Leverkusen,德國)及213.07克強度為27%之參(對-異氰酸基苯基)硫磷酸酯於乙酸乙酯的溶液(DesmodurRFE,Bayer MaterialScience AG,Leverkusen,德國之產品)導入500毫升圓底燒瓶中並加熱至60℃。之後,逐滴加入42.37克之2-羥基乙基丙烯酸酯並將混合物另外保持在60℃下,直到異氰酸酯含量下降至0.1%以下。之後,進行冷卻並在真空下完全去除乙酸乙酯。獲得半結晶固體之產物。
起初將0.05克之2,6-二-第三丁基-4-甲基酚、0.02克Desmorapid Z及26.8克於50克乙酸乙酯之3-(甲基硫基)苯基異氰酸酯導入250毫升圓底燒瓶中並加熱至60℃。之後,逐滴加入21.1克之2-羥基乙基丙烯酸酯並將混合物另外保持在60℃下,直到異氰酸酯含量下降至0.1%以下。之後,在5毫巴下蒸掉乙酸乙酯並冷卻之。獲得淡黃色液體之產物。
3.82克如上述製得之多元醇組分係與2.50克之偶磷基亞硫醯基參(氧基苯-4,1-二基胺甲醯基氧基乙-2,1-二基)參丙烯酸酯(胺基甲酸酯丙烯酸酯1)、2.50克之2,2,2-三氟乙基己基胺甲酸酯(實例4)、0.10克之CGI 909(Ciba Inc,Basle,瑞士之實驗產物)、0.01克之新亞甲基藍及0.35克之N-乙基吡咯啶酮在60℃下混合以獲得澄清溶液。之後,冷卻至30℃,加入0.71克之DesmodurN3900(Bayer MaterialScience AG,Leverkusen,德國之商業產品,以己烷二異氰酸酯為主之聚異氰酸酯,亞胺氧雜二二酮之比例為至少30%,NCO含量:23.5%)並再度混合之。最後,加入0.006克之Fomrez UL28(胺甲酸酯化觸媒,Momentive Performance Chemicals,Wilton,CT,USA之商業產品)並再度短暫混合之。然後,將所得液體物質倒在玻璃板上,以第二玻璃板覆蓋之並以間隔件保持20微米之距離。令此測試樣品在室溫下靜置12小時並硬化之。
依類似方式由表1所示實例製備媒體2-13。在各情況下,表2陳述何者實例化合物係以何者含量存在於光聚合物調配物中。由所製得光聚合物調配物測得之Δn值同樣概述於表2中。
3.40克如上述製得之多元醇組分係與2.00克之偶磷基亞硫醯基參(氧基苯-4,1-二基胺甲醯基氧基乙-2,1-二基)參丙烯酸酯(胺基甲酸酯丙烯酸酯1)、2.00克之2-({[3-(甲基磺醯基)苯基]胺甲醯基}氧基)乙基丙-2-烯酸酯(胺基甲酸酯丙烯酸酯2)、1.50克之2,2,2-三氟乙基己基胺甲酸酯(實例4)、0.10克之CGI 909(Ciba Inc,Basle,瑞士之實驗產物)、0.01克之新亞甲基藍及0.35克之N-乙基吡咯啶酮在60℃下混合以獲得一澄清溶液。之後,冷卻至30℃,加入0.64克N3900(Bayer MaterialScience AG,Leverkusen,德國之商業產品,以己烷二異氰酸酯為主之聚異氰酸酯,亞胺氧雜二二酮之比例為至少30%,NCO含量:23.5%)並再度混合之。最後,加入0.006克之Fomrez UL28(胺甲酸酯化觸媒,Momentive Performance Chemicals,Wilton,CT,USA之商業產品)並再度短暫混合之。然後,將所得液體物質倒在玻璃板上,以第二玻璃板覆蓋之並以間隔件保持20微米之距離。令此測試樣品在室溫下靜置12小時並硬化。
依類似方式由表1所示實例製備媒體14-70。在各情況下,表3陳述何者實例化合物係以何者含量存在於光聚合物調配物中。由所製得光聚合物調配物測得之Δn值同樣概述於表3中。
8.89克如上述製得之多元醇組分係與3.75克之偶磷基亞硫醯基參(氧基苯-4,1-二基胺甲醯基氧基乙-2,1-二基)參丙烯酸酯(胺基甲酸酯丙烯酸酯1)、0.15克之CGI 909(Ciba Inc,Basle,瑞士之實驗產物)、0.015克之新亞甲基藍及0.53克之N-乙基吡咯啶酮在60℃下混合以獲得一澄清溶液。之後,冷卻至30℃,加入1.647克DesmodurN3900(Bayer MaterialScience AG,Leverkusen,德國之商業產品,以己烷二異氰酸酯為主之聚異氰酸酯,亞胺氧雜二二酮之比例為至少30%,NCO含量:23.5%)並再度混合之。最後,加入0.009克之Fomrez UL28(胺甲酸酯化觸媒,Momentive Performance Chemicals,Wilton,CT,USA之商業產品)並再度短暫混合之。然後,將所得液體物質倒在玻璃板上,以第二玻璃板覆蓋之並以間隔件保持20微米之距離。令此測試樣品在室溫下靜置12小時並硬化之。
3.82克如上述製得之多元醇組分係與2.50克之偶磷基亞硫醯基參(氧基苯-4,1-二基胺甲醯基氧基乙-2,1-二基)參丙烯酸酯(胺基甲酸酯丙烯酸酯1)、2.50克之伸丙基碳酸酯(對照實例II)、0.10克之CGI 909(Ciba Inc,Basle,瑞士之實驗產物)、0.010克之新亞甲基藍及0.35克之N-乙基吡咯啶酮在60℃下混合以獲得一澄清溶液。之後,冷卻至30℃,加入0.702克DesmodurN3900(Bayer MaterialScience AG,Leverkusen,德國之商業產品,以己烷二異氰酸酯為主之聚異氰酸酯,亞胺氧雜二二酮之比例為至少30%,NCO含量:23.5%)並再度混合之。最後,加入0.022克之Fomrez UL28(胺甲酸酯化觸媒,Momentive Performance Chemicals,Wilton,CT,USA之商業產品)並再度短暫混合之。然後,將所得液體物質倒在玻璃板上,以第二玻璃板覆蓋之並以間隔件保持20微米之距離。令此測試樣品在室溫下靜置12小時並硬化之。
依類似方式由表2所示對照實例製備對照媒體III-V。
4.66克如上述製得之多元醇組分係與2.00克之偶磷基亞硫醯基參(氧基苯-4,1-二基胺甲醯基氧基乙-2,1-二基)參丙烯酸酯(胺基甲酸酯丙烯酸酯1)、2.00克之2-({[3-(甲基磺醯基)苯基]胺甲醯基}氧基)乙基丙-2-烯酸酯(胺基甲酸酯丙烯酸酯2)、0.10克之CGI 909(Ciba Inc,Basle,瑞士之實驗產物)、0.010克之新亞甲基藍及0.35克之N-乙基吡咯啶酮在60℃下混合以獲得一澄清溶液。之後,冷卻至30℃,加入0.87克DesmodurN3900(Bayer MaterialScience AG,Leverkusen,德國之商業產品,以己烷二異氰酸酯為主之聚異氰酸酯,亞胺氧雜二二酮之比例為至少30%,NCO含量:23.5%)並再度混合之。最後,加入0.006克之Fomrez UL28(胺甲酸酯化觸媒,Momentive Performance Chemicals,Wilton,CT,USA之商業產品)並再度短暫混合之。然後,將所得液體物質倒在玻璃板上,以第二玻璃板覆蓋之並以間隔件保持20微米之距離。令此測試樣品在室溫下靜置12小時並硬化之。
所述Δn值係以4-32毫焦耳/平方厘米之劑量獲得。
全像媒體之全像特性Δn之實驗值顯示對照媒體中所用之商業添加劑較不適合用於全像媒體中,反之,根據本發明胺基甲酸酯由於較高Δn值故極適合用於媒體1至13中以製備全像媒體。
所述Δn值係以4-32毫焦耳/平方厘米之劑量獲得。
全像媒體之全像特性Δn之實驗值顯示根據本發明氟化胺基甲酸酯由於較高Δn值故極適合用於媒體14至70中以製備全像媒體。
M...鏡子
S...光閘
PBS...極化相依性光束分光鏡
SF...空間濾波器
CL...準直透鏡
D...偵測器
RD...旋轉階段之參考方向
I...可變光圈
λ/2...λ/2板
圖1顯示全像媒體測試器(HMT)於λ=633毫微米(He-Ne雷射)之幾何結構。
圖2顯示根據耦合波理論之布拉格曲線η(虛線)、所測得繞射效率(實心圓)及透射功率(黑實線)對角度失調ΔΩ作圖。
Claims (36)
- 一種光聚合物調配物,其包含基質聚合物、寫入單體及光起始劑,其特徵在於其包含作為塑化劑之氟胺基甲酸酯,其中,該等氟胺基甲酸酯具有通式(II)
- 根據申請專利範圍第1項之光聚合物調配物,其特徵在於R1 係具有至少一個氟原子之有機基團。
- 根據申請專利範圍第1項之光聚合物調配物,其特徵在於R1 包括1-20 CF2 基團及/或一或多個CF3 基團,,R2 包含C1-C20烷基或氫及/或R3 包含C1-C20烷基或氫。
- 根據申請專利範圍第3項之光聚合物調配物,其特徵在於R1 包括1-15 CF2 基團及/或一或多個CF3 基團。
- 根據申請專利範圍第3項之光聚合物調配物,其特徵在於R1 包括1-10 CF2 基團及/或一或多個CF3 基團。
- 根據申請專利範圍第3項之光聚合物調配物,其特徵在於R1 包括1-8 CF2 基團及/或一或多個CF3 基團。
- 根據申請專利範圍第3項之光聚合物調配物,其特徵在於R2 包括C1-C15烷基或氫。
- 根據申請專利範圍第3項之光聚合物調配物,其特徵在於R2 包括C1-C10烷基或氫。
- 根據申請專利範圍第3項之光聚合物調配物,其特徵在於R2 包括C1-C15烷基或氫。
- 根據申請專利範圍第3項之光聚合物調配物,其特徵在於R3 包括C1-C10烷基或氫。
- 根據申請專利範圍第1至10項中任一項之光聚合物調配物,其特徵在於該等氟胺基甲酸酯具有脲二酮、異三聚氰酸酯、縮二脲、脲基甲酸酯、聚脲、氧雜二氮雜二酮及/或亞胺氧雜二二酮結構件及/或此等結構件之混合物。
- 根據申請專利範圍第1至10項中任一項之光聚合物調配物,其特徵在於該等氟胺基甲酸酯具有1.4600之折射率n20 ;D 。
- 根據申請專利範圍第1至10項中任一項之光聚合物調配物,其特徵在於該等氟胺基甲酸酯具有1.4500之折射率n20 ;D 。
- 根據申請專利範圍第1至10項中任一項之光聚合物調配物,其特徵在於該等氟胺基甲酸酯具有1.4400之折射率n20 ;D 。
- 根據申請專利範圍第1至10項中任一項之光聚合物調配物,其特徵在於該等氟胺基甲酸酯具有1.4300之折射率n20 ;D 。
- 根據申請專利範圍第1至10項中任一項之光聚合物調配物,其特徵在於該等氟胺基甲酸酯可具有10-80重量%之氟含量。
- 根據申請專利範圍第1至10項中任一項之光聚合物調配物,其特徵在於該等氟胺基甲酸酯可具有12.5-75重量%之氟含量。
- 根據申請專利範圍第1至10項中任一項之光聚合物調配物,其特徵在於該等氟胺基甲酸酯可具有15-70重量%之氟含量。
- 根據申請專利範圍第1至10項中任一項之光聚合物調配物,其特徵在於該等氟胺基甲酸酯可具有17.5-65重量%之氟含量。
- 根據申請專利範圍第1至10項中任一項之光聚合物調配物,其特徵在於該等基質聚合物係聚胺基甲酸酯。
- 根據申請專利範圍第1至10項中任一項之光聚合物調配物,其特徵在於該等寫入單體係丙烯酸酯。
- 根據申請專利範圍第21項之光聚合物調配物,其特徵在於該丙烯酸酯具有>1.50之折射率n20 ;D 。
- 根據申請專利範圍第1至10項中任一項之光聚合物調配物,其特徵在於該等寫入單體係胺基甲酸酯丙烯酸酯。
- 根據申請專利範圍第23項之光聚合物調配物,其特徵在於該胺基甲酸酯丙烯酸酯具有>1.50之折射率n20 ;D 。
- 根據申請專利範圍第1至10項中任一項之光聚合物調配物,其特徵在於該等寫入單體係芳族胺基甲酸酯丙烯酸酯。
- 根據申請專利範圍第25項之光聚合物調配物,其特徵在於該芳族胺基甲酸酯丙烯酸酯具有>1.50之折射率n20 ;D 。
- 根據申請專利範圍第1至10項中任一項之光聚合物調配物,其特徵在於其含有15至79重量%之基質聚合物,5至50重量%之寫入單體、1至10重量%之光起始劑及5至50重量%之氟胺基甲酸酯和0至10重量%之其他添加劑,組成分之總和為100重量%。
- 根據申請專利範圍第27項之光聚合物調配物,其特徵在於其含有30至60重量%之基質聚合物。
- 根據申請專利範圍第27項之光聚合物調配物,其特徵在於其含有10至40重量%之寫入單體。
- 根據申請專利範圍第27項之光聚合物調配物,其特徵在於其含有1至3重量%之光起始劑。
- 根據申請專利範圍第27項之光聚合物調配物,其特徵 在於其含有10至40重量%之氟胺基甲酸酯。
- 一種根據申請專利範圍第1至31項中任一項之光聚合物調配物之用途,其係用於製造光學元件。
- 根據申請專利範圍第32項之用途,其中光學元件為全像元件及影像。
- 一種使含有根據申請專利範圍第1至31項中任一項之光聚合物調配物之全像媒體曝光之方法,其中該等寫入單體係藉由電磁輻射以空間解析度選擇性地聚合。
- 一種氟胺基甲酸酯,其可藉由含有亞胺氧雜二二酮或氧雜二氮雜二酮並具有至少一個游離異氰酸酯基之聚異氰酸酯與醇反應獲得,該聚異氰酸酯及/或醇係經至少一個氟原子取代。
- 一種根據通式(III)之氟胺基甲酸酯,
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- 2010-11-02 WO PCT/EP2010/066591 patent/WO2011054795A1/de active Application Filing
- 2010-11-02 BR BR112012010471-3A patent/BR112012010471B1/pt not_active IP Right Cessation
- 2010-11-02 US US13/504,357 patent/US8999608B2/en active Active
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- 2010-11-02 KR KR1020127014264A patent/KR101727770B1/ko active IP Right Grant
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- 2010-11-02 PL PL10771479T patent/PL2497082T3/pl unknown
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JP3339873B2 (ja) * | 1992-03-23 | 2002-10-28 | 大日本印刷株式会社 | ホログラム形成材料 |
US20060166104A1 (en) * | 2004-12-27 | 2006-07-27 | Inphase Technologies, Inc. | Equipment and method of manufacturing a holographic recording medium and precursors thereof |
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RU2570662C2 (ru) | 2015-12-10 |
US8999608B2 (en) | 2015-04-07 |
ES2433235T3 (es) | 2013-12-10 |
KR101727770B1 (ko) | 2017-04-17 |
US20120231376A1 (en) | 2012-09-13 |
EP2497082B1 (de) | 2013-09-04 |
CN102667934A (zh) | 2012-09-12 |
CN102667934B (zh) | 2015-09-09 |
JP2017071790A (ja) | 2017-04-13 |
JP2015108148A (ja) | 2015-06-11 |
RU2570662C9 (ru) | 2016-07-20 |
KR20120107086A (ko) | 2012-09-28 |
JP2016145352A (ja) | 2016-08-12 |
BR112012010471B1 (pt) | 2020-10-20 |
WO2011054795A1 (de) | 2011-05-12 |
RU2012122590A (ru) | 2013-12-10 |
EP2497082A1 (de) | 2012-09-12 |
JP6581559B2 (ja) | 2019-09-25 |
TW201129529A (en) | 2011-09-01 |
PL2497082T3 (pl) | 2013-12-31 |
JP6069294B2 (ja) | 2017-02-01 |
BR112012010471A2 (pt) | 2016-03-08 |
IN2012DN03890A (zh) | 2015-09-04 |
JP2013510203A (ja) | 2013-03-21 |
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