TWI505293B - The surface treated copper powder - Google Patents
The surface treated copper powder Download PDFInfo
- Publication number
- TWI505293B TWI505293B TW102105465A TW102105465A TWI505293B TW I505293 B TWI505293 B TW I505293B TW 102105465 A TW102105465 A TW 102105465A TW 102105465 A TW102105465 A TW 102105465A TW I505293 B TWI505293 B TW I505293B
- Authority
- TW
- Taiwan
- Prior art keywords
- copper powder
- powder
- decane
- treated
- group
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 231
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 claims description 76
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical group CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 claims description 52
- 239000007822 coupling agent Substances 0.000 claims description 49
- 239000002245 particle Substances 0.000 claims description 46
- 238000005245 sintering Methods 0.000 claims description 40
- 125000003277 amino group Chemical group 0.000 claims description 23
- 229910052719 titanium Inorganic materials 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- 229910052684 Cerium Inorganic materials 0.000 claims description 8
- 229910052718 tin Inorganic materials 0.000 claims description 7
- 229910052726 zirconium Inorganic materials 0.000 claims description 7
- -1 Al Si Inorganic materials 0.000 claims description 6
- 239000000843 powder Substances 0.000 description 101
- 229910052751 metal Inorganic materials 0.000 description 79
- 239000002184 metal Substances 0.000 description 79
- 238000000034 method Methods 0.000 description 72
- 239000010949 copper Substances 0.000 description 42
- 238000004381 surface treatment Methods 0.000 description 40
- 239000007864 aqueous solution Substances 0.000 description 30
- 229910052802 copper Inorganic materials 0.000 description 28
- 229910004298 SiO 2 Inorganic materials 0.000 description 27
- 239000003985 ceramic capacitor Substances 0.000 description 26
- 238000004519 manufacturing process Methods 0.000 description 25
- 238000002156 mixing Methods 0.000 description 22
- 239000010410 layer Substances 0.000 description 20
- 239000006185 dispersion Substances 0.000 description 19
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 18
- 238000001035 drying Methods 0.000 description 17
- 238000005259 measurement Methods 0.000 description 17
- 239000010936 titanium Substances 0.000 description 17
- 125000000217 alkyl group Chemical group 0.000 description 16
- 238000009826 distribution Methods 0.000 description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 16
- 238000003756 stirring Methods 0.000 description 16
- 238000011282 treatment Methods 0.000 description 15
- 238000010438 heat treatment Methods 0.000 description 14
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 12
- 125000000623 heterocyclic group Chemical group 0.000 description 12
- 229910052710 silicon Inorganic materials 0.000 description 11
- 239000002002 slurry Substances 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 239000004215 Carbon black (E152) Substances 0.000 description 10
- 238000007323 disproportionation reaction Methods 0.000 description 10
- 229930195733 hydrocarbon Natural products 0.000 description 10
- 238000012545 processing Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 9
- 150000001412 amines Chemical class 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- OWEZJUPKTBEISC-UHFFFAOYSA-N decane-1,1-diamine Chemical compound CCCCCCCCCC(N)N OWEZJUPKTBEISC-UHFFFAOYSA-N 0.000 description 9
- 150000002430 hydrocarbons Chemical class 0.000 description 8
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 7
- 238000003917 TEM image Methods 0.000 description 7
- 125000004429 atom Chemical group 0.000 description 7
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 7
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 7
- 229940112669 cuprous oxide Drugs 0.000 description 7
- 238000001914 filtration Methods 0.000 description 7
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 7
- 229920006395 saturated elastomer Polymers 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 229910010413 TiO 2 Inorganic materials 0.000 description 6
- 125000002015 acyclic group Chemical group 0.000 description 6
- 125000003545 alkoxy group Chemical group 0.000 description 6
- 150000004645 aluminates Chemical class 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 6
- 125000004122 cyclic group Chemical group 0.000 description 6
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 6
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 6
- 238000010304 firing Methods 0.000 description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 229910052763 palladium Inorganic materials 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 239000006228 supernatant Substances 0.000 description 6
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 229910052697 platinum Inorganic materials 0.000 description 5
- 239000010944 silver (metal) Substances 0.000 description 5
- ANBBCZAIOXDZPV-UHFFFAOYSA-N 1,1,1-trimethoxy-2-methyldecane Chemical compound CC(C(OC)(OC)OC)CCCCCCCC ANBBCZAIOXDZPV-UHFFFAOYSA-N 0.000 description 4
- 244000215068 Acacia senegal Species 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- 229920000084 Gum arabic Polymers 0.000 description 4
- XJDCHDFUMGSEHD-UHFFFAOYSA-N NCCCC(C(OC)(OC)OC)CCCCCCCC Chemical compound NCCCC(C(OC)(OC)OC)CCCCCCCC XJDCHDFUMGSEHD-UHFFFAOYSA-N 0.000 description 4
- 235000010489 acacia gum Nutrition 0.000 description 4
- 239000000205 acacia gum Substances 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine hydrate Chemical compound O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000002244 precipitate Substances 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 229930195734 saturated hydrocarbon Natural products 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 125000000879 imine group Chemical group 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 238000001420 photoelectron spectroscopy Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 3
- WJMXTYZCTXTFJM-UHFFFAOYSA-N 1,1,1,2-tetraethoxydecane Chemical compound C(C)OC(C(OCC)(OCC)OCC)CCCCCCCC WJMXTYZCTXTFJM-UHFFFAOYSA-N 0.000 description 2
- AAMHBRRZYSORSH-UHFFFAOYSA-N 2-octyloxirane Chemical compound CCCCCCCCC1CO1 AAMHBRRZYSORSH-UHFFFAOYSA-N 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- XEEHRQPQNJOFIQ-UHFFFAOYSA-N N(C1=CC=CC=C1)CCCC(C(OC)(OC)OC)CCCCCCCC Chemical compound N(C1=CC=CC=C1)CCCC(C(OC)(OC)OC)CCCCCCCC XEEHRQPQNJOFIQ-UHFFFAOYSA-N 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 125000001165 hydrophobic group Chemical group 0.000 description 2
- 238000002354 inductively-coupled plasma atomic emission spectroscopy Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 238000006722 reduction reaction Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- 238000009210 therapy by ultrasound Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 2
- PAWQVTBBRAZDMG-UHFFFAOYSA-N 2-(3-bromo-2-fluorophenyl)acetic acid Chemical compound OC(=O)CC1=CC=CC(Br)=C1F PAWQVTBBRAZDMG-UHFFFAOYSA-N 0.000 description 1
- SXPGQGNWEWPWQZ-UHFFFAOYSA-N 4-(triethoxymethyl)dodecan-1-amine Chemical compound NCCCC(C(OCC)(OCC)OCC)CCCCCCCC SXPGQGNWEWPWQZ-UHFFFAOYSA-N 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- ACCTYMOIXKVRFY-UHFFFAOYSA-N C(=C)C(C1=CC=CC=C1)NCCCC(C(OC)(OC)OC)(CCCCCCCC)CCN Chemical compound C(=C)C(C1=CC=CC=C1)NCCCC(C(OC)(OC)OC)(CCCCCCCC)CCN ACCTYMOIXKVRFY-UHFFFAOYSA-N 0.000 description 1
- LKYCIZFMSSPSQN-UHFFFAOYSA-N C(CC)C(C(OC)(OC)C)CCCCCCCC Chemical compound C(CC)C(C(OC)(OC)C)CCCCCCCC LKYCIZFMSSPSQN-UHFFFAOYSA-N 0.000 description 1
- KFIMDALFEKQXFC-UHFFFAOYSA-N CCCCCCCCC(C(C(C)N)N)C(OC)(OC)OC Chemical compound CCCCCCCCC(C(C(C)N)N)C(OC)(OC)OC KFIMDALFEKQXFC-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VMQMZMRVKUZKQL-UHFFFAOYSA-N Cu+ Chemical compound [Cu+] VMQMZMRVKUZKQL-UHFFFAOYSA-N 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 240000007472 Leucaena leucocephala Species 0.000 description 1
- 235000010643 Leucaena leucocephala Nutrition 0.000 description 1
- HNJYHRSYMUUVEX-UHFFFAOYSA-N NC(CC(C(OC)(OC)OC)CCCCCCCC)C Chemical compound NC(CC(C(OC)(OC)OC)CCCCCCCC)C HNJYHRSYMUUVEX-UHFFFAOYSA-N 0.000 description 1
- XDCUFVCHHQXHQH-UHFFFAOYSA-N NC(CC)C(C(OC)(OC)OC)CCCCCCCC Chemical compound NC(CC)C(C(OC)(OC)OC)CCCCCCCC XDCUFVCHHQXHQH-UHFFFAOYSA-N 0.000 description 1
- BENJPVFWAKDABS-UHFFFAOYSA-N NC(CCC#CC)CCCCCCC(OC)(OC)OC Chemical compound NC(CCC#CC)CCCCCCC(OC)(OC)OC BENJPVFWAKDABS-UHFFFAOYSA-N 0.000 description 1
- IVDNKXGDZZVMSJ-UHFFFAOYSA-N NC(CCC=CC)CCCCCCC(OC)(OC)OC Chemical compound NC(CCC=CC)CCCCCCC(OC)(OC)OC IVDNKXGDZZVMSJ-UHFFFAOYSA-N 0.000 description 1
- KTGXWDZUZLWXOF-UHFFFAOYSA-N NCCNCCCC(C(OC)(OC)C)CCCCCCCC Chemical compound NCCNCCCC(C(OC)(OC)C)CCCCCCCC KTGXWDZUZLWXOF-UHFFFAOYSA-N 0.000 description 1
- PEXBBTCNDBSFHT-UHFFFAOYSA-N NCCNCCCC(C(OC)(OC)OC)CCCCCCCC Chemical compound NCCNCCCC(C(OC)(OC)OC)CCCCCCCC PEXBBTCNDBSFHT-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N benzene Substances C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000010908 decantation Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000010332 dry classification Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 125000001841 imino group Chemical group [H]N=* 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000012643 polycondensation polymerization Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000002335 surface treatment layer Substances 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/10—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/15—Nickel or cobalt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Conductive Materials (AREA)
- Powder Metallurgy (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electric Cables (AREA)
- Ceramic Capacitors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012025328 | 2012-02-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201340120A TW201340120A (zh) | 2013-10-01 |
| TWI505293B true TWI505293B (zh) | 2015-10-21 |
Family
ID=48947644
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102105465A TWI505293B (zh) | 2012-02-08 | 2013-02-08 | The surface treated copper powder |
| TW104118893A TWI624842B (zh) | 2012-02-08 | 2013-02-08 | Surface treated metal powder, conductive metal powder paste, electrode, wafer laminated ceramic capacitor, multilayer substrate, electronic part |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104118893A TWI624842B (zh) | 2012-02-08 | 2013-02-08 | Surface treated metal powder, conductive metal powder paste, electrode, wafer laminated ceramic capacitor, multilayer substrate, electronic part |
Country Status (3)
| Country | Link |
|---|---|
| JP (2) | JP6285185B2 (fr) |
| TW (2) | TWI505293B (fr) |
| WO (1) | WO2013118892A1 (fr) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6719323B2 (ja) | 2016-08-03 | 2020-07-08 | 日本ピラー工業株式会社 | 往復動ポンプ |
| CA3039936C (fr) * | 2017-09-29 | 2021-05-25 | Jx Nippon Mining & Metals Corporation | Poudre metallique pour stratifie metallique de fabrication additive et objet fabrique par un additif metallique fabrique a l'aide de ladite poudre metallique |
| JP6526888B1 (ja) * | 2018-08-01 | 2019-06-05 | Ｊｘ金属株式会社 | セラミックス層と銅粉ペースト焼結体の積層体 |
| JP6526889B1 (ja) * | 2018-08-01 | 2019-06-05 | Ｊｘ金属株式会社 | セラミックス層と銅粉ペースト焼結体の積層体 |
| JP6549298B1 (ja) | 2018-09-21 | 2019-07-24 | Ｊｘ金属株式会社 | 易解砕性銅粉及びその製造方法 |
| JP6866408B2 (ja) * | 2019-01-11 | 2021-04-28 | Ｊｘ金属株式会社 | 表面処理された金属粉及び導電性組成物 |
| CN113707360B (zh) * | 2021-10-22 | 2022-02-25 | 西安宏星电子浆料科技股份有限公司 | 一种适用于不同类型不锈钢基体的厚膜电阻浆料 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001059101A (ja) * | 1999-08-18 | 2001-03-06 | Sumitomo Metal Mining Co Ltd | 積層セラミックコンデンサー用ニッケル粉末の焼結性制御方法 |
| JP2004183060A (ja) * | 2002-12-04 | 2004-07-02 | Mitsui Mining & Smelting Co Ltd | ポリアニリン系樹脂コート銅粉並びにそのポリアニリン系樹脂コート銅粉の製造方法及びそのポリアニリン系樹脂コート銅粉を用いた導電性ペースト |
| JP2006225691A (ja) * | 2005-02-15 | 2006-08-31 | Mitsui Mining & Smelting Co Ltd | スズコート銅粉及び当該スズコート銅粉を用いた導電性ペースト |
| TW200707469A (en) * | 2005-07-08 | 2007-02-16 | Murata Manufacturing Co | Electrically conducting powder, electrically conducting paste and process for production of laminated ceramic electronic components |
| JP2009293126A (ja) * | 2008-06-05 | 2009-12-17 | Xerox Corp | コア−シェル金属ナノ粒子を形成する方法 |
| TW201028437A (en) * | 2008-12-05 | 2010-08-01 | Daicel Evonik Ltd | Spherical composite particle and method for producing the same |
| TW201100184A (en) * | 2009-06-29 | 2011-01-01 | Mitsui Mining & Smelting Co Ltd | Composite copper particle |
| TW201202447A (en) * | 2010-07-14 | 2012-01-16 | Mitsui Mining & Amp Smelting Co Ltd | Copper powder for conductive paste and conductive paste |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5191844B2 (ja) * | 2008-09-10 | 2013-05-08 | 国立大学法人東北大学 | 水溶媒分散性銀微粉の製造方法 |
-
2013
- 2013-02-08 JP JP2013557610A patent/JP6285185B2/ja active Active
- 2013-02-08 TW TW102105465A patent/TWI505293B/zh active
- 2013-02-08 TW TW104118893A patent/TWI624842B/zh active
- 2013-02-08 WO PCT/JP2013/053142 patent/WO2013118892A1/fr active Application Filing
-
2015
- 2015-11-09 JP JP2015219926A patent/JP6297018B2/ja active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001059101A (ja) * | 1999-08-18 | 2001-03-06 | Sumitomo Metal Mining Co Ltd | 積層セラミックコンデンサー用ニッケル粉末の焼結性制御方法 |
| JP2004183060A (ja) * | 2002-12-04 | 2004-07-02 | Mitsui Mining & Smelting Co Ltd | ポリアニリン系樹脂コート銅粉並びにそのポリアニリン系樹脂コート銅粉の製造方法及びそのポリアニリン系樹脂コート銅粉を用いた導電性ペースト |
| JP2006225691A (ja) * | 2005-02-15 | 2006-08-31 | Mitsui Mining & Smelting Co Ltd | スズコート銅粉及び当該スズコート銅粉を用いた導電性ペースト |
| TW200707469A (en) * | 2005-07-08 | 2007-02-16 | Murata Manufacturing Co | Electrically conducting powder, electrically conducting paste and process for production of laminated ceramic electronic components |
| JP2009293126A (ja) * | 2008-06-05 | 2009-12-17 | Xerox Corp | コア−シェル金属ナノ粒子を形成する方法 |
| TW201028437A (en) * | 2008-12-05 | 2010-08-01 | Daicel Evonik Ltd | Spherical composite particle and method for producing the same |
| TW201100184A (en) * | 2009-06-29 | 2011-01-01 | Mitsui Mining & Smelting Co Ltd | Composite copper particle |
| TW201202447A (en) * | 2010-07-14 | 2012-01-16 | Mitsui Mining & Amp Smelting Co Ltd | Copper powder for conductive paste and conductive paste |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6297018B2 (ja) | 2018-03-20 |
| JPWO2013118892A1 (ja) | 2015-05-11 |
| JP2016106175A (ja) | 2016-06-16 |
| TW201340120A (zh) | 2013-10-01 |
| TWI624842B (zh) | 2018-05-21 |
| JP6285185B2 (ja) | 2018-02-28 |
| WO2013118892A1 (fr) | 2013-08-15 |
| TW201535416A (zh) | 2015-09-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI547326B (zh) | A surface-treated metal powder, and a method for producing the same | |
| TWI505293B (zh) | The surface treated copper powder | |
| JP6212480B2 (ja) | 金属粉ペースト、及びその製造方法 | |
| KR101729455B1 (ko) | 표면 처리된 금속 분말, 및 그 제조 방법 | |
| EP3034202A1 (fr) | Pâte de poudre métallique et procédé de fabrication de celle-ci | |
| JP5843820B2 (ja) | 表面処理された金属粉の製造方法 | |
| JP5843819B2 (ja) | 表面処理された金属粉の製造方法 | |
| JP2013171745A (ja) | 銅粉ペースト、及びその製造方法 | |
| TWI547325B (zh) | A surface-treated metal powder, and a method for producing the same | |
| JP2015036440A (ja) | 表面処理された金属粉、及びその製造方法 | |
| JP6630208B2 (ja) | 金属粉ペーストの製造方法、金属粉ペーストのスクリーン印刷方法、電極の製造方法、チップ積層セラミックコンデンサーの製造方法および金属粉ペースト | |
| JP5869538B2 (ja) | 表面処理された金属粉の製造方法 | |
| JP5986046B2 (ja) | 表面処理された金属粉、及びその製造方法 | |
| JP2015131997A (ja) | 表面処理された銅粉及びその製造方法 | |
| JP2015132000A (ja) | 表面処理された銅粉及びその製造方法 | |
| JP2015132001A (ja) | 表面処理された銅粉及びその製造方法 |