TWI495041B - 半導體裝置、用於半導體裝置之製造方法及電子設備 - Google Patents
半導體裝置、用於半導體裝置之製造方法及電子設備 Download PDFInfo
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- TWI495041B TWI495041B TW101121190A TW101121190A TWI495041B TW I495041 B TWI495041 B TW I495041B TW 101121190 A TW101121190 A TW 101121190A TW 101121190 A TW101121190 A TW 101121190A TW I495041 B TWI495041 B TW I495041B
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Classifications
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JP2011210142A JP6127360B2 (ja) | 2011-09-27 | 2011-09-27 | 半導体装置および半導体装置の製造方法 |
JP2012006356A JP6031765B2 (ja) | 2011-07-05 | 2012-01-16 | 半導体装置、電子機器、及び、半導体装置の製造方法 |
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KR102136845B1 (ko) * | 2013-09-16 | 2020-07-23 | 삼성전자 주식회사 | 적층형 이미지 센서 및 그 제조방법 |
US9984191B2 (en) | 2014-08-29 | 2018-05-29 | Taiwan Semiconductor Manufacturing Company | Cell layout and structure |
KR102211143B1 (ko) * | 2014-11-13 | 2021-02-02 | 삼성전자주식회사 | 반도체 장치 및 그 제조 방법 |
JP2019054153A (ja) * | 2017-09-15 | 2019-04-04 | 東芝メモリ株式会社 | 半導体装置の製造方法 |
US11031285B2 (en) | 2017-10-06 | 2021-06-08 | Invensas Bonding Technologies, Inc. | Diffusion barrier collar for interconnects |
JP2019110260A (ja) | 2017-12-20 | 2019-07-04 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置、及びその製造方法 |
JP2019160866A (ja) | 2018-03-08 | 2019-09-19 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置 |
US11742374B2 (en) | 2018-10-05 | 2023-08-29 | Sony Semiconductor Solutions Corporation | Semiconductor device, method of manufacturing semiconductor device, and imaging element |
JP2020191334A (ja) | 2019-05-20 | 2020-11-26 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置及び電子機器 |
US11456328B2 (en) | 2019-10-09 | 2022-09-27 | Omnivision Technologies, Inc. | Stack chip air gap heat insulator |
JP2021082803A (ja) * | 2019-11-18 | 2021-05-27 | ソニーセミコンダクタソリューションズ株式会社 | 撮像素子および撮像素子の製造方法 |
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US6993609B2 (en) * | 2001-09-17 | 2006-01-31 | Canon Kabushiki Kaisha | Method for controlling peripheral device, program for executing same method, storage device storing same program, and computer, peripheral device and system for executing same method |
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