TWI495033B - Top pin - Google Patents

Description

Top output

The present invention relates to a lift pin. More specifically, regarding the ejector pin of the surface of the platform, which is present by the insertion hole provided in the stage, the substrate is placed on the surface of the platform. Examples of the substrate include a glass substrate and a semiconductor wafer.

A slit-nozzle coater is used to form a color filter or a TFT (Thin-Film Transistor) on a glass substrate and apply a photoresist liquid to the glass substrate. The surface is composed. In this slotted nozzle coating unit, a lift pin unit is mounted. The ejector pin unit is formed by the ejector pin hole provided in the adsorption platform, and the ejector pin is used for the ejector pin. A glass substrate that is transported by a substrate transport means such as a robot hand is placed on a platform while the glass substrate is in contact with and supported.

FIG. 10 is a partial front cross-sectional view showing a schematic configuration of a ejector pin unit 400 having a conventional ejector pin. In addition, among the components of the ejector pin unit 400 shown in FIG. 10, the same components as those of the ejector pin unit 4 described in one embodiment of the present invention to be described later are the same symbols as the components. .

As shown in FIG. 10, the conventional ejector pin unit 400 includes a plurality of ejector pins 41A, a pin frame 42, a frame driving portion 43, and the like. The ejector pin unit 400 can elevate and drive the pin frame 42 by the frame driving unit 43, and the ejector pin 41A can be moved up and down by the ejector pin hole 33 formed in the suction platform 3 (see Patent Document 1).

In the ejector pin unit 400, when the tip end portion of the ejector pin 41A is brought into contact with the glass substrate K, the glass substrate K is defective or cracked by the collision. Therefore, the ejector pin 41A has a buffer function for absorbing the collision generated in the glass substrate K when the tip end portion of the ejector pin 41A abuts against the glass substrate K. For example, Patent Document 2 describes a case where a coil spring is attached to a portion where the ejector pin hole 33 is inserted into the ejector pin 41A.

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2008-55322

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2007-251073

However, as in Patent Document 2, if various means for collision absorption are disposed in a portion where the ejector pin hole 33 is inserted into the ejector pin 41A, there is a top. The delivery hole 33 has a problem of a large diameter or more. In other words, when the ejector pin hole 33 has a large diameter, when the glass substrate K is held by the vacuum suction or the like on the adsorption stage 3, a large ejector pin is left on the back surface (the bearing surface) of the glass substrate K. The hole marks are such that the ejector pin hole 33 has a large diameter.

An object of the present invention is to provide an ejector pin that absorbs a collision that occurs when a tip end portion of an ejector pin abuts against a substrate while suppressing a large diameter that is more than necessary for the ejector pin hole.

The above object is achieved by the present invention described below. In addition, the bracketed symbols attached to the respective constituent elements in the column of the [patent application scope] and the present invention are related to the specific means described in the embodiment to be described later.

The invention of claim 1 is an ejector pin which is provided by an insertion hole (33) provided in the platform (3), and the carrier substrate (K) is on the surface (31) of the platform (3), and the features thereof include: The insertion hole (33) of the platform (3) is inserted, and the back surface of the substrate (K) is abutted, the upper end portion (41S) of the support substrate (K) is at a predetermined position; and the platform (3) is disposed on the platform (3) a back base side and a pin base portion (41H) coupled to the upper end portion (41S) of the pin, wherein the pin base portion (41H) has a buffer mechanism (44) for mitigating a collision when the upper end portion (41S) of the pin abuts against the substrate (K) A sensor (45) for detecting the support of the substrate (K) is disposed at a position below the opposite side of the pin upper end portion (41S).

According to the invention of claim 1, the pin base portion (41H) is disposed on the back side of the platform (3), and since the pin base portion (41H) has the buffer mechanism (44), the insertion of the platform (3) can be suppressed. The through hole (33) is required to have a larger diameter. That is, because it is not like the conventional ejector pin, the insertion pin hole (insertion hole) is inserted. Since the portion for collision absorption is disposed at the portion, the insertion hole (33) can be inserted through the upper end portion (41S), and it is not necessary to increase the diameter of the insertion hole (33). Therefore, it is possible to absorb the collision that occurs when the tip end portion of the ejector pin (41) abuts against the substrate (K) while suppressing the large diameter of the insertion hole (33).

The invention of claim 2 is characterized in that the buffer mechanism (44) has a pushing means (25) urged in a direction in which the upper end portion (41S) of the pin protrudes from the insertion hole (33), by the upper end of the pin When the portion (41S) abuts against the substrate (K), the pressing means (25) contracts, and the collision at the time of abutting the substrate (K) is alleviated.

The invention of claim 3 is characterized in that the buffer mechanism (44) has an adjustment mechanism (22, 24) for adjusting the pushing force of the pressing means (25).

According to the invention of claim 3, an appropriate buffering action can be imparted even for substrates (K) having different weights.

According to the present invention, it is possible to absorb the collision generated when the tip end portion of the ejector pin (41) abuts against the substrate (K) while suppressing the large diameter of the ejector pin hole or more.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. 1 is a perspective view showing the appearance of a slit nozzle coater 1. FIG. 2 is an external perspective view of the suction platform 3 and a centering unit 5, and FIG. 3 is a schematic view of the configuration of the ejector pin unit 4. FIG. Is the display buffer mechanism Fig. 5 is a partial cross-sectional view of the side surface of the slit nozzle 60, Fig. 6 is a perspective view showing the appearance of the washing unit 8, and Fig. 9 is a view showing the action of the buffer mechanism 44. In Fig. 9, A is a view showing a state in which the tip end portion of the ejector pin 41 is not in contact with the glass substrate K, and Fig. B is a view showing a state in which the tip end portion of the ejector pin 41 abuts against the glass substrate K, and Fig. C is The state in which the tip end portion of the ejector pin 41 abuts against the glass substrate K and supports the glass substrate K is displayed. In each of the figures, the three axes of the orthogonal coordinate system are X, Y, and Z, and the XY plane is a horizontal plane, and the Z direction is a vertical direction. Further, in the case where it is necessary to further distinguish the direction of each direction of XY from left to right, a symbol of [+] or [-] is added at the forefront.

As shown in FIG. 1, the slit nozzle coater 1 includes a machine table 2, an adsorption stage 3, an ejector pin unit 4, a centering unit 5, a coating unit 6, a coating liquid supply unit 7, and a washing unit 8. The control device 10 and the like are configured by applying a photoresist liquid 20 for forming a color filter to the surface of the glass substrate K. Further, the delivery of the glass substrate K to the adsorption stage 3 is performed by the substrate transfer robot 9 provided with the robot 93.

The machine 2 functions as a base that supports the main component (for example, the adsorption stage 3 or the coating unit 6) of the slot nozzle coater 1, and is made of stone. Stone is used to ensure sufficient rigidity and plane accuracy, and to minimize deformation accompanying temperature changes. In particular, the preferred stone is granite.

As shown in FIG. 2, the adsorption stage 3 has a bearing surface 31 that can carry the glass substrate K to be coated with the photoresist liquid 20. The adsorption platform 3 is made of stone like the machine table 2. A plurality of vacuum adsorption holes are bored in the bearing surface 31 32 and a plurality of ejector pin holes 33. In the vacuum suction hole 32, a plurality of fine holes which are formed in a lattice shape in a plan view are dispersedly arranged on the bearing surface 31, and a vacuum is generated in the fine holes by a vacuum generating means such as a vacuum pump. In the state in which the ejector pin hole 33 is separated from the vacuum suction hole 32 by a predetermined interval, a plurality of planar lattices are arranged in a distributed manner on the bearing surface 31. The ejector pin 41, which will be described later, can be ejected from each of the ejector pin holes 33.

The ejector pin unit 4 is a portion for receiving the glass substrate K to be coated and transferring the coated glass substrate K. As shown in FIG. 3, the ejector pin unit 4 includes a plurality of ejector pins 41, a pin frame 42, a frame driving portion 43, and the like. The ejector pin unit 4 can elevate and drive the pin frame 42 by the frame driving unit 43, and the ejector pin 41 formed in the suction platform 3 can perform the lifting operation of the ejector pin 41.

The ejector pin 41 is a pin member that abuts against the glass substrate K by its tip end portion and can support the glass substrate K. The details of this are described later.

The pin frame 42 is a frame member for mounting a plurality of ejector pins 41. Specifically, the pin frame 42 is disposed along the arrangement of the ejector pin holes 33, and the ejector pin 41 is attached at a position corresponding to the ejector pin hole 33. Accordingly, as soon as the pin frame 42 is driven up and down, the ejector pin 41 can be ejected by the ejector pin hole 33. Further, in more detail, the pin frame 42 has a pin frame hole 421 (refer to FIG. 4) to which the ejector pin 41 is attached.

The frame drive unit 43 is configured by elevating and lowering the drive pin frame 42 and includes a ball screw shaft 431, a servo motor 432, and a ball nut 433. Specifically, the ball nut 433 is attached to the pin frame 42 and screwed to the ball screw shaft 431. Ball screw shaft 431 is arranged along the Z axis. The servo motor 432 is attached to the ball screw shaft 431, and the ball screw shaft 431 is rotationally driven about its axis. Therefore, by rotating the ball screw shaft 431 through the servo motor 432, the ball nut 433 can be moved forward and backward in the Z direction. According to this, the pin frame 42 can be moved up and down in the Z direction.

Details are made for the ejector pin 41. As shown in FIG. 4, the ejector pin 41 has a pin upper end portion 41S and a pin base portion 41H.

The pin upper end portion 41S is a portion into which the ejector pin hole 33 can be inserted. The pin upper end portion 41S is formed to have a thickness smaller than the inner diameter of the ejector pin hole 33, and the tip end portion is formed to have a pointed tip shape. Further, a male screw 41a for coupling to the pin base portion 41H is formed at a lower portion thereof.

The pin base portion 41H is a portion for vertically supporting the pin upper end portion 41S, and is disposed on the back side of the suction platform 3 in the pin upper end portion 41S, and is coupled to the pin upper end portion 41S. The pin base portion 41H has a mounting portion 44A and a buffer mechanism 44. Specifically, the pin base portion 41H has a coupling rod 23, and the attachment portion 44A and the buffer mechanism 44 are disposed on the coupling rod 23.

The connecting rod 23 includes a cylindrical large diameter portion 231, and a small diameter portion 232 that is concentric with the large diameter portion 231 and extends downward in the axial direction. The large diameter portion 231 has a female screw hole 23b1 along the center axis thereof at the upper portion. The pin upper end portion 41S is coupled to the connecting rod 23 by screwing the male screw 41a of the pin upper end portion 41S to the female screw hole 23b1. Further, the small diameter portion 232 has a female screw hole 23b along the central axis thereof at the lower portion. A bolt 27 for mounting a lower washer 29 is screwed into the female screw hole 23b.

The mounting portion 44A maintains the vertical posture of the pin frame 42 and mounts the upper end of the pin The part of the part 41S. Specifically, the small diameter portion 232 is inserted into the frame hole 421 in a state in which a hollow cylindrical collar 26 is fitted. The upper end of the cylindrical collar 26 abuts against the upper washer 28, and the lower end of the cylindrical collar 26 abuts against the lower washer 29, and the lower washer 29 is fixed to the small diameter portion 232 by bolts 27. Therefore, the small diameter portion 232 of the fitting cylindrical collar 26 is mounted in a vertical posture between the upper washer 28 and the lower washer 29, and the pin upper end portion 41S can maintain the vertical posture of the pin frame 42.

The buffer mechanism 44 is a mechanism that functions as a cushioning action when the tip end portion of the ejector pin 41 abuts against the glass substrate K. Specifically, it has a coil spring 25, a spring housing tube 24, and a lock nut 22. In the buffer mechanism 44, the spring housing tube 24 is provided with an internal space for housing the coil spring 25. Further, the spring housing tube 24 has a female screw 24b that can be screwed to the male screw 23a of the connecting rod 23, and is integrated with the connecting rod 23 by the screwing of the male screw 23a and the female screw 24b. The lock nut 22 is a male screw 23a that is screwed to the connecting rod 23 in a state where the upper portion of the spring housing tube 24 abuts against the spring housing tube 24. The spring receiving cylinder 24 is restricted from moving in the up and down direction by the lock nut 22.

The coil spring 25 is attached to the small diameter portion 232 of the connecting rod 23 and the root side of the large diameter portion 231 in a state of being housed in the spring housing tube 24. Specifically, the coil spring 25 is disposed in a state in which the upper end portion abuts against the large diameter portion 231 and the lower end portion thereof abuts against the upper washer 28 and is contracted from the natural length. Therefore, since the large diameter portion 231 is urged upward and the upper washer 28 is urged downward, a gap L is formed between the spring housing tube 24 and the upper washer 28. Accordingly, the tip end portion of the ejector pin 41 abuts against the glass substrate K and is on the connecting rod 23 When the screw is lowered, the coil spring 25 contracts, and the buffering action can be exerted.

That is, as the tip end portion of the ejector pin 41 abuts against the glass substrate K, the connecting rod 23 is lowered by the state of FIG. 9(A), and the coil spring 25 is contracted. At this time, the cylindrical collar 26, the lower washer 29, and the bolt 27 are lowered together with the connecting rod 23. That is, since the lower washer 29 is integrally attached to the small diameter portion 232 by the bolts 27, the cylindrical collar 26 and the lower washer 29 are lowered as the small diameter portion 232 is lowered. Therefore, the cylindrical collar 26 is separated from the upper washer 28, and the lower washer 29 is separated from the pin frame 42 (Fig. 9(B)).

Further, a sensor 45 for detecting the support of the glass substrate K is disposed at a position below the ejector pin 41. As shown in FIG. 4, the sensor 45 is composed of a microswitch having a switch portion 451 that outputs a turn-on signal SG1 by being pressed and turned on, and is attached to the pin frame 42 via a bracket 452. Lower part. The mounting position is located below the bolt 27 and has a distance that is shorter than the distance of the bolt 27 from the gap L described above.

That is, after the tip end portion of the ejector pin 41 abuts against the glass substrate K, the cylindrical connecting rod 23, the lower washer 29, and the bolt 27 are lowered as the state connecting rod 23 is lowered in the state of Fig. 9(B), as shown in the figure. In 9 (C), the switch unit 451 is pressed by the bolt 27, and the switch unit 451 outputs the ON signal SG1. This turn-on signal SG1 is taken in the control device 10 to be described later. Further, such a sensor 45 may be provided for each of the ejector pins 41, but only a specific portion of the ejector pins 41 may be disposed to detect the support of the glass substrate K. Further, at this time, the coil spring 25 is more contracted by the state of FIG. 9(B), and the gap L between the spring housing tube 24 and the upper washer 28 disappears. Accordingly, the spring housing tube 24 abuts against the upper gasket 28. As a result, the load of the glass substrate K is supported by the pin frame 42. support.

In addition, the means for detecting the support of the glass substrate K can be used, for example, by a transmissive photoelectric switch, a reflective photoelectric switch, or a proximity sensor, in addition to the sensor 45 of the type that is tightly connected as described above. Proximity sensor), electromagnetic switch, etc. In the case of using the above-described transmissive photoelectric switch, a transmissive photoelectric switch is disposed, and a stopper (light shield) for shielding transmitted light of the transmissive photoelectric switch is disposed at a position of the bolt 27, for example, by ejecting the pin 41. When the glass substrate K is supported and lowered, the stopper blocks the transmitted light of the transmissive photoelectric switch, so that the support of the glass substrate K can be detected.

Moreover, the buffer mechanism 44 can adjust the strength of the buffering action, and accordingly, an appropriate cushioning action can be given for the glass substrate K having different weights. Specifically, by loosening the second nut 22, the spring receiving cylinder 24 and the connecting rod 23 are tightened and loosened, and the length of the gap L is changed to adjust the pushing strength of the coil spring 25.

In this way, in accordance with the ejector pin 41, the pin base portion 41H is disposed on the back side of the suction platform 3, and the pin base portion 41H has the buffer mechanism 44. Therefore, it is possible to reduce the diameter of the ejector pin hole 33 provided in the suction platform 3 by more than necessary. . That is, since the collision absorption means is not provided in the portion where the ejector pin hole is inserted, as in the conventional ejector pin, the insertion hole 33 can be inserted through the upper end portion 41S, and it is not necessary to make the top. The delivery hole 33 is required to have a larger diameter. Therefore, it is possible to absorb the collision that occurs when the tip end portion of the ejector pin 41 abuts against the glass substrate K while suppressing the large diameter of the ejector pin hole 33 or more.

Moreover, the centering unit 5 disposed on the adsorption platform 3 is as shown in FIG. The member 51 and the driving device 52 are provided. The sandwiching member 51 is disposed in a pair of left and right sides on the both sides of the adsorption stage 3 in the Y direction. A pad 53 for pressing the end faces on both sides in the Y direction of the glass substrate K is attached to each of the sandwiching members 51. The spacer 53 is previously adjusted in height, and the gap between the 俾 and the bearing surface 31 of the adsorption platform 3 in the Z direction is 0.1 mm to 0.3 mm. The drive unit 52 is configured, for example, by an air cylinder that is synchronized with each other and operates in the ±Y direction, and an actuator part is coupled to each of the sandwich members 51.

As shown in FIG. 1, the coating unit 6 includes two movable pillar portions 66 that are opposed to each other with a gap wider than the width of the adsorption platform 3, and a slit nozzle that is spanned between the two movable pillar portions 66. 60. A door-shaped body that is disposed across the adsorption platform 3. The two movable pillar portions 66 can be driven in the X direction by a linear motor 67X. The linear motor 67X is disposed in parallel with each other on the base 2 in the X direction. The slit nozzle 60 can be driven in the Z direction by a linear motor 67Z. The linear motor 67Z is disposed in each of the two movable pillar portions 66 along the Z direction.

The slit nozzle 60 is a slightly columnar body that is disposed in the longitudinal direction in the Y direction, and is formed by combining the first lip 61 on the traveling direction side and the second lip 62 on the opposite side as shown in FIG. 5 . A slit-like discharge port 63 for oozing the photoresist 20 is formed on the bottom surface of the glass substrate K. Inside the slit nozzle 60, a manifold 64 that communicates with the internal flow path of the slit-shaped discharge port 63, and a communication path 65 in which the gap is normally set to several tens of μm are formed. The photoresist liquid 20 extruded through the communication path 65 is applied to the glass substrate K while moistening the lip tip end faces 60a and 60b of the coating contact surface.

The slit nozzle 60 is selectively disposed at the coating height H2 and the evacuation height H1 by the lifting operation by the linear motor 67Z. The coating height H2 is such that the gap between the surface of the glass substrate K held on the bearing surface 31 and the discharge port 63 of the slit nozzle 60 is about 100 μm to 200 μm. The evacuation height H1 is a height at which the surface of the glass substrate K held by the bearing surface 31 is sufficiently separated from the discharge port 63 of the slit nozzle 60.

As shown in FIG. 1, the coating liquid supply unit 7 includes a coating liquid storage tank 71, a coating liquid transfer pump 72, and check valves 73 and 74.

The coating liquid storage tank 71 is a tank for temporarily storing a predetermined amount of the coating liquid (for example, an amount that can be applied to a plurality of glass substrates K), and is connected to the coating via a check valve 73. Cloth delivery pump 72.

The coating liquid transfer pump 72 is connected to the slit nozzle 60 via a check valve 74. Flattening of a glass substrate applied to a flat panel display such as a liquid crystal display or a plasma display, or a wafer related to the manufacture of a semiconductor In the apparatus of a single-wafer substrate, it is required to make the film thickness distribution in the coating direction uniform and to form a coating film containing no bubbles or impurities. Therefore, the coating liquid transfer pump 72 preferably has a small pulsation, and has a short start-up time at the start of supply, and is excellent in solvent resistance, and does not cause coagulation or foaming of the liquid in the pump. Rich in airiness and durability. For example, an injection (piston pump) or a bellows pump is preferred. In particular, since the syringe pump directly feeds the inner liquid by the piston, the responsiveness and constant flow characteristics are excellent. Telescopic pump It is a method of indirectly discharging the internal liquid, so that air can be prevented from entering or the like.

As shown in FIG. 6, the cleaning unit 8 includes a scraper 81, a blade drive device 82, a waste liquid receiving portion 83, and the like. The scraper 81 is made of an elastomer such as synthetic rubber, and is a block having a V-shaped groove slightly similar to the outer shape of the slit-shaped discharge port 63 side of the slit nozzle 60. A cleaning liquid injection nozzle 81a and a drying air injection nozzle 81b are provided inside. Although not shown, the cleaning liquid injection nozzle 81a is connected to the cleaning liquid storage tank filled with the cleaning liquid via the control valve piping. The drying air injection nozzle 81b is a drying air storage tank that is connected to the compressed air for filling and drying via a control valve pipe. The blade drive device 82 is configured to move the blade 81 in the ±Y direction, for example, a drive side pulley, a driven side pulley, an endless belt attached to the two pulleys, and the like. It is constituted by a rotary servo motor or the like that rotationally drives the drive side pulley. The waste liquid receiving portion 83 is formed of a metallic long walled disk having a planar viewing area (area viewed in the Z direction) which is larger than the slit nozzle 60 in the longitudinal direction of the Y direction. In addition, an initializing device for returning the wet state of the slit-like discharge port 63 to a constant state may be provided in combination with the washing operation.

The control device 10 is composed of an input/output device such as a touch panel, and an appropriate hardware mainly composed of a memory device and a microprocessor, etc., for causing the hardware to operate. A hard disk device having a computer program; and a suitable interface circuit for performing data communication with the components of the drive device and the like of the slot nozzle coater 1 and the substrate transport robot 9 (interface circnit), etc., output appropriate control signals to each component The squeezing nozzle coater 1 is configured by performing a series of coating operations. The control device 10 specifically drives the control frame drive unit 43 as follows.

In other words, when the glass substrate K is carried into the loading position P2 by the substrate transport robot 9 (see FIG. 8(B)), the control device 10 drives the control frame driving unit 43 to raise the glass substrate K to the substrate standby position P3. , at this position to stop it. Specifically, the memory device in the control device 10 stores in advance the height of the substrate standby position P3 (see FIG. 8(C)) at a position higher than the loading position P2 (see FIG. 8(B)) of the glass substrate K. Data. When the glass substrate K is held at the substrate standby position P3 (see FIG. 8(C)), the control device 10 outputs the substrate-maintained signal to the substrate transfer robot 9 by the signal. When the control device 10 receives the robot retraction signal from the substrate transport robot 9 for the signal that the robot 93 has retracted, the drive control frame drive unit 43 drives the control unit drive unit 43 to lower the ejector pin 41 of the glass substrate K at the substrate standby position P3. . The drive control at this time proceeds until the glass substrate K is carried on the bearing surface 31 of the adsorption stage 3. Further, at the time when the glass substrate K is supported, the sensor 45 outputs an on signal SG1, and when the on signal SG1 is not output, the control device 10 determines that the glass substrate K is performed by the ejector pin 41. The support has some problems and outputs an error signal.

As shown in FIG. 1, the substrate transfer robot 9 includes a motor 91, an arm 92, and a robot 93. The robot 93 is formed into a fork-shaped body that can support the glass substrate K, and is configured to be movably movable in all directions of XYZ θ by the driving arm 92 of the motor 91, and can be selectively disposed in the following retracted position by horizontal movement. P1 and the carry-in position P2. That is, the retreat position P1 is the adsorption platform 3 The outer side has no common area between the adsorption platform 3 and the robot 93 when viewed from the Z direction. Further, the loading position P2 is directly above the suction platform 3, and the height of the robot 93 at this time coincides with the height of the retracted position P1. Further, the control of the robot 93 is performed by a control device provided by the substrate transport robot 9 itself different from the control device 10.

Next, the application operation of the slit nozzle coater 1 will be described with reference to Figs. 7, 8, and 9. Fig. 7 is a flow chart showing the application operation of the slit nozzle coater 1. Fig. 8 is a view showing the application operation of the slit nozzle coater 1 in a series. In Fig. 8, the reversed arrow indicates The direction of movement of the robot 93 and the thick black arrow indicate the direction of movement of the ejector pin 41.

As shown in FIG. 7, the coating operation of the slit nozzle coater 1 is performed by the glass substrate receiving step S1, the centering step S2, the coating step S3, the scraping step S4, and the glass substrate transfer step S5. In FIG. 8, it is assumed that the slit nozzle coater 1 is in the following initial state. In other words, in a state in which the ejector pin 41 is buried below the load-bearing surface 31, the robot 93 is positioned at the retracted position P1 while supporting the glass substrate K (see FIG. 8(A)). Further, the slit nozzle 60 is located at the evacuation height H1 and the standby position Q1 (see FIG. 5).

[Glass substrate acceptance step S1]

The glass substrate receiving operation is performed as follows. First, the substrate transport robot 9 drives the robot 93 that supports the glass substrate K in the horizontal direction, and moves from the retracted position P1 to the carry-in position P2 (see FIG. 8(B)). When the glass substrate K is moved from the retracted position P1 to the carry-in position P2, the robot 93 moves only horizontally.

Then, the control device 10 drives the drive frame drive unit 43 to drive the pin frame 42 upward, and the ejector pin 41 buried under the bearing surface 31 is raised. As a result, the tip end portion of the ejector pin 41 protrudes from the carrying surface 31 and abuts against the back surface of the glass substrate K at the loading position P2. Then, by further raising the ejector pin 41, the coil spring 25 in the damper mechanism 44 is contracted, and the ejector pin 41 is urged upward as shown in Fig. 9(B). In other words, the buffer mechanism 44 exerts a cushioning action when the tip end portion of the ejector pin 41 abuts against the glass substrate K.

When the ejector pin 41 supports the glass substrate K, as shown in FIG. 9(C), the switch portion 451 is turned on. Then, the turn-on signal SG1 of each of the switch sections 451 is emitted. Then, the ejector pin 41 is raised while supporting the glass substrate K at the tip end portion thereof, and the glass substrate K is held at the substrate standby position P3 (see FIG. 8(C)). Thus, the support of the glass substrate K is moved by the robot 93 to the ejector pin 41.

When the glass substrate K is held at the substrate standby position P3, the control device 10 outputs the substrate holding signal to the substrate transfer robot 9. When the substrate is held up, the substrate transport robot 9 drives the robot 93 from which the glass substrate K has been detached in the horizontal direction to move to the retracted position P1 (see FIG. 8(D)). When the substrate transport robot 9 is retracted to the retracted position P1, the substrate transport robot 9 outputs a robot retraction signal to the control device 10.

Next, the control device 10 drives the control frame drive unit 43 by the signal retraction by the robot, and lowers the drive pin frame 42 to lower the ejector pin 41. The ejector pin 41 is lowered while supporting the glass substrate K, and is stopped when it is completely buried below the bearing surface 31. Thereby, the glass substrate K is carried on the bearing surface 31 (refer FIG. 8 (E)).

Thus, the step S1 is accepted in accordance with the glass substrate, by the robot 93 When the glass substrate K carried in the loading position P2 is carried on the bearing surface 31, the glass substrate K is supported at the tip end portion by raising the ejector pin 41 instead of lowering the robot 93 supporting the glass substrate K. After the substrate standby position P3 is held at a position higher than the carry-in position P2, the ejector pin 41 is lowered. Therefore, the robot 93 can be moved only horizontally without dropping the robot 93. Therefore, the number of steps of the substrate transport robot 9 can be reduced, and the portion can be shortened in operation time, and the production efficiency can be improved. Further, although the substrate transport robot 9 is different from the control device of the slit nozzle coater 1, the robot 93 and the ejector pin between the two control devices are small in the operation steps of the substrate transport robot 9 Since the transmission/reception of the control data for the delivery of the glass substrate K between 41 is small, it is possible to shorten the working time. Further, since the buffer mechanism 44 functions as a cushion when the ejector pin 41 abuts against the glass substrate K, the collision of the glass substrate K by the tip end portion of the ejector pin 41 is alleviated and absorbed. Therefore, it is possible to suppress the occurrence of defects or cracks in the glass substrate K.

[Centering step S2]

The centering action is performed as follows. The centering unit 5 drives the sandwiching member 51 by the driving device 52 (refer to FIG. 2), and sandwiches the glass substrate K carried on the bearing surface 31 from both sides in the Y direction. According to this, the glass substrates K are each positioned at equal intervals from the both ends of the adsorption stage 3 in the Y direction, and the center line of the X direction of the glass substrate K and the center line of the X direction of the bearing surface 31 (the center of the width of the Y direction is parallel to The so-called centering of the center line in the X direction is performed. Then, the driving device 52 returns the sandwiching member 51 to the original position.

[Coating step S3]

The coating operation is performed as follows. After the centering is completed, first, vacuum pressure is generated in the vacuum suction hole 32 of the adsorption stage 3, and the glass substrate K is vacuum-sucked to be held on the bearing surface 31. Next, by driving the linear motor 67X, the slit nozzle 60 is moved from the standby position Q1 to the application start position Q2 (see FIG. 5). Next, by driving the linear motor 67Z, the slit nozzle 60 is moved from the retraction height H1 to the coating height H2.

Next, the coating liquid transfer pump 72 sends the photoresist liquid 20 to the slit nozzle 60, and the photoresist liquid 20 is oozing out from the slit-shaped discharge port 63. At this time, a thin film portion 20B that is in contact with both of the discharge ports 63 and the surface of the glass substrate K is formed (see FIG. 5). By driving the linear motor 67X in this state, the slit nozzle 60 is moved in the +X direction (see FIG. 8(F)). With the movement of the slit nozzle 60, the photoresist 20 is applied to the +X direction on the surface of the glass substrate K. When the slit nozzle 60 reaches the coating end position Q3, the coating liquid transfer pump 72 stops the supply of the photoresist liquid 20, and the linear motor 67X stops the driving of the movable stay portion 61 to stop the movement of the slit nozzle 60. Next, the linear motor 67Z is driven to raise the slit nozzle 60 to the retraction height H1. Next, the reverse drive linear motor 67X is stopped in the -X direction, and the slit-shaped discharge port 63 in the slit nozzle 60 comes above the washing unit 8.

[Scraping step S4]

The scraping action is performed as follows. First, the linear motor 67Z is driven to arrange the slit-like discharge port 63 in the slit nozzle 60 so as to be close to the V-shaped groove (see FIG. 6) of the blade 81. Next, the cleaning liquid spray nozzle 81a sprays the cleaning liquid. Simultaneously with the ejection of the cleaning liquid, the blade driving device 82 drives the blade 81 in the +Y direction. According to this, the slit-like discharge port 63 is washed. Scraper 81 When the end portion in the +Y direction is reached, the blade driving device 82 stops the driving of the blade 81. At the same time, the injection of the cleaning liquid also stops. Then, the blade driving device 82 reversely drives the blade 81 in the -Y direction. At this time, the drying air injection nozzle 81b sprays the drying air, and dries the washed slit-shaped discharge port 63. When the blade 81 reaches the end in the -Y direction, the blade driving device 82 stops the driving of the blade 81. At the same time, the spraying of the drying air is also stopped.

[Glass substrate transfer step S5]

The glass substrate transfer operation is performed as follows. First, the vacuum pressure generated in the vacuum adsorption holes 32 of the adsorption platform 3 is broken. Then, the control device 10 drives the drive frame drive unit 43 to drive the pin frame 42 upward, and the ejector pin 41 is protruded by the suction platform 3 to abut against the glass substrate K. Then, it is raised to the substrate standby position P3 while supporting the glass substrate K. At this time, as in the case of receiving the glass substrate K, the buffering action is exerted when the ejector pin 41 abuts against the glass substrate K. According to this, it is possible to suppress the occurrence of defects or cracks in the glass substrate K. Next, the substrate transport robot 9 drives the robot 93 located at the retracted position P1 in the horizontal direction to move to the carry-in position P2. Next, the control frame drive unit 43 is driven by the control device 10 to lower the ejector pin 41 supporting the glass substrate K. The robot 93 receives the coated glass substrate K by the lowering of the glass substrate K. Next, the substrate transport robot 9 drives the robot 93 that has received the glass substrate K at the carry-in position P2 in the horizontal direction, and transmits it to the next process, for example, a vacuum drying process.

Further, in the above-described embodiment, the initial state of the slit nozzle coater 1 is such that the ejector pin 41 is buried below the bearing surface 31, but the ejector pin 41 is projected to a predetermined height in advance. Scheduled height It is also possible to make the rising start position of the ejector pin 41. In other words, the height at which the glass substrate K moved into the loading position P2 does not interfere with the ejector pin 41, for example, the tip end portion of the ejector pin 41 is lower than the glass substrate K moved into the loading position P2. The predetermined height is taken as the rising start position of the ejector pin 41 at the predetermined height. According to this, in the glass substrate receiving step S1, the rising distance of the ejector pin 41 required to raise the glass substrate K to the substrate standby position P3 is shortened, so that the glass substrate K can be shortened to the substrate standby position P3. time.

The embodiments of the present invention have been described above, but the above-described embodiments are merely illustrative, and the scope of the present invention is not limited to the embodiments. The scope of the present invention is to be construed as being limited by the scope of the claims. That is, the structure, shape, size, number, and the like of the entire or a part of the ejector pin 41 can be variously changed in accordance with the gist of the present invention. Further, in the present embodiment, the substrate processing apparatus in which the ejector pin 41 is incorporated is a slit nozzle coater, but can be applied to other than the slit nozzle coater, for example, an exposure device, a cleaning device, and a drying device. And inspection equipment, etc.

1‧‧‧Slot nozzle coating machine (ejector pin)

2‧‧‧ machine

3‧‧‧Adsorption platform (platform)

4‧‧‧Top sales unit

5‧‧‧ centering unit

6‧‧‧ Coating unit

7‧‧‧ Coating Liquid Supply Department

8‧‧‧cleaning unit

9‧‧‧Substrate transport robot

10‧‧‧Control device (pin drive control unit)

10A‧‧‧Control device

20‧‧‧Photoresist

22‧‧‧Lock nut

23‧‧‧ Connecting rod

23a, 41a‧‧‧yang spiral

23b, 23b1‧‧‧ female threaded holes

24‧‧‧Spring storage tube

24b‧‧‧ female thread

25‧‧‧Helical spring

26‧‧‧Cylinder collar

27‧‧‧ bolt

28‧‧‧Upper washer

29‧‧‧ Lower washer

31‧‧‧ bearing surface

32‧‧‧vacuum adsorption holes

33‧‧‧Top pin hole (insertion hole)

41, 41A‧‧‧ top sales

41a‧‧‧yang spiral

41H‧‧ ‧ sales base

41S‧‧‧ upper end

42‧‧ ‧ sales framework

43‧‧‧Frame drive unit (pin drive control unit)

44‧‧‧buffering mechanism

44A‧‧‧Installation Department

45‧‧‧Sensor

231‧‧‧ Most of the trails

232‧‧‧小小部

421‧‧‧ pin frame hole

451‧‧‧Switch Department

452‧‧‧ bracket

H1‧‧‧Retraction height

H2‧‧‧ Coating height

K‧‧‧glass substrate (substrate)

L‧‧‧ gap

P1‧‧‧Retraction position

P2, P2a‧‧‧ moved into position

P3‧‧‧Substrate standby position (higher than the moving position)

Fig. 1 is a perspective view showing the appearance of a slit nozzle coater.

2 is an oblique perspective view of the adsorption platform and the centering unit.

3 is a schematic view showing the configuration of an ejector pin unit.

Figure 4 is a detailed front cross-sectional view showing the buffer mechanism.

Figure 5 is a partial cross-sectional view of the side surface of the slit nozzle.

Fig. 6 is a perspective view showing the appearance of a washing unit.

Fig. 7 is a flow chart showing the coating operation of the slit nozzle coater.

Fig. 8 is a view showing the coating operation of the slit nozzle coater in a time series.

Fig. 9 is a view showing the action of the buffer mechanism.

Fig. 10 is a partial front sectional view showing a schematic configuration of a conventional ejector pin unit.

3‧‧‧Adsorption platform (platform)

22‧‧‧Lock nut

23‧‧‧ Connecting rod

23a‧‧‧yang spiral

23b, 23b1‧‧‧ female threaded holes

24‧‧‧Spring storage tube

24b‧‧‧ female thread

25‧‧‧Helical spring

26‧‧‧Cylinder collar

27‧‧‧ bolt

28‧‧‧Upper washer

29‧‧‧ Lower washer

33‧‧‧Top pin hole (insertion hole)

41‧‧‧Top sales

41a‧‧‧yang spiral

41H‧‧ ‧ sales base

41S‧‧‧ upper end

42‧‧ ‧ sales framework

44‧‧‧buffering mechanism

44A‧‧‧Installation Department

45‧‧‧Sensor

231‧‧‧ Most of the trails

232‧‧‧小小部

421‧‧‧ pin frame hole

451‧‧‧Switch Department

452‧‧‧ bracket

L‧‧‧ gap

Claims (3)

An ejector pin is produced by an insertion hole (33) provided in the platform (3), and the carrier substrate (K) is on the surface (31) of the platform (3), and the feature comprises: a pluggable platform (3) Inserting a through hole (33) and abutting the back surface of the substrate (K), supporting the upper end portion (41S) of the substrate (K) at a predetermined position; and being disposed on the back side of the platform (3), and being coupled to the upper end of the pin a pin base (41H) of the portion (41S), wherein the pin base portion (41H) has a buffer mechanism (44) for mitigating a collision when the pin upper end portion (41S) abuts against the substrate (K), at the upper end portion of the pin (41) 41S) A sensor (45) for detecting the support of the substrate (K) is disposed at a lower position on the opposite side. The ejector pin of claim 1, wherein the buffer mechanism (44) has a pushing means (25) urged in a direction in which the upper end portion (41S) of the pin protrudes from the insertion hole (33), by means of a pin When the upper end portion (41S) abuts against the substrate (K), the pressing means (25) contracts, and the collision at the time of abutting against the substrate (K) is alleviated. The ejector pin of claim 1 or 2, wherein the buffer mechanism (44) has an adjustment mechanism (22, 24) for adjusting the urging force of the urging means (25).