TWI487897B - A substrate processing apparatus, a substrate processing method, a program and a computer memory medium - Google Patents

A substrate processing apparatus, a substrate processing method, a program and a computer memory medium Download PDF

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Publication number
TWI487897B
TWI487897B TW100125141A TW100125141A TWI487897B TW I487897 B TWI487897 B TW I487897B TW 100125141 A TW100125141 A TW 100125141A TW 100125141 A TW100125141 A TW 100125141A TW I487897 B TWI487897 B TW I487897B
Authority
TW
Taiwan
Prior art keywords
substrate
wafer
peripheral
exposure
mirror
Prior art date
Application number
TW100125141A
Other languages
English (en)
Chinese (zh)
Other versions
TW201229501A (en
Inventor
古閑法久
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TW201229501A publication Critical patent/TW201229501A/zh
Application granted granted Critical
Publication of TWI487897B publication Critical patent/TWI487897B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/303—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces using photoelectric detection means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/60—Substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/235—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising optical enhancement of defects or not-directly-visible states
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/9563—Inspecting patterns on the surface of objects and suppressing pattern images
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW100125141A 2010-07-16 2011-07-15 A substrate processing apparatus, a substrate processing method, a program and a computer memory medium TWI487897B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010161713A JP5479253B2 (ja) 2010-07-16 2010-07-16 基板処理装置、基板処理方法、プログラム及びコンピュータ記憶媒体

Publications (2)

Publication Number Publication Date
TW201229501A TW201229501A (en) 2012-07-16
TWI487897B true TWI487897B (zh) 2015-06-11

Family

ID=45466654

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100125141A TWI487897B (zh) 2010-07-16 2011-07-15 A substrate processing apparatus, a substrate processing method, a program and a computer memory medium

Country Status (5)

Country Link
US (1) US8730317B2 (https=)
JP (1) JP5479253B2 (https=)
KR (1) KR101605698B1 (https=)
CN (1) CN102338990B (https=)
TW (1) TWI487897B (https=)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5006122B2 (ja) * 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5128918B2 (ja) 2007-11-30 2013-01-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5160204B2 (ja) * 2007-11-30 2013-03-13 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5179170B2 (ja) 2007-12-28 2013-04-10 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5001828B2 (ja) 2007-12-28 2012-08-15 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP6308958B2 (ja) * 2015-02-25 2018-04-11 東京エレクトロン株式会社 基板処理装置、基板処理方法、プログラム及びコンピュータ記憶媒体
JP6244329B2 (ja) * 2015-05-12 2017-12-06 東京エレクトロン株式会社 基板の検査方法、基板処理システム及びコンピュータ記憶媒体
JP6444909B2 (ja) * 2016-02-22 2018-12-26 東京エレクトロン株式会社 基板処理方法、基板処理装置及びコンピュータ読み取り可能な記録媒体
JP6617050B2 (ja) * 2016-02-22 2019-12-04 東京エレクトロン株式会社 基板撮像装置
JP2018036235A (ja) * 2016-09-02 2018-03-08 株式会社Ｓｃｒｅｅｎホールディングス 基板検査装置、基板処理装置、基板検査方法および基板処理方法
WO2018146981A1 (ja) * 2017-02-07 2018-08-16 東京エレクトロン株式会社 成膜システム、成膜方法及びコンピュータ記憶媒体
TWI786116B (zh) * 2017-06-05 2022-12-11 日商東京威力科創股份有限公司 基板處理系統之處理條件設定方法、基板處理系統及記憶媒體
EP3413339B1 (en) 2017-06-08 2023-05-24 Brooks Automation (Germany) GmbH Inspection system and method of inspection for substrate containers
KR102760744B1 (ko) * 2018-04-27 2025-02-03 도쿄엘렉트론가부시키가이샤 기판 처리 시스템 및 기판 처리 방법
JP7105135B2 (ja) * 2018-08-17 2022-07-22 東京エレクトロン株式会社 処理条件補正方法及び基板処理システム
KR102162187B1 (ko) 2018-08-31 2020-10-07 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP7153521B2 (ja) * 2018-10-05 2022-10-14 東京エレクトロン株式会社 基板処理装置及び検査方法
JP7090005B2 (ja) * 2018-10-05 2022-06-23 東京エレクトロン株式会社 基板処理装置及び検査方法
KR102191836B1 (ko) * 2019-04-30 2020-12-18 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
KR20250083585A (ko) * 2019-05-08 2025-06-10 도쿄엘렉트론가부시키가이샤 접합 장치, 접합 시스템 및 접합 방법
KR102270936B1 (ko) * 2019-06-17 2021-07-01 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
CN111723591B (zh) * 2020-05-22 2021-03-30 杭州长川科技股份有限公司 晶圆id读取装置
CN120972450A (zh) * 2024-05-15 2025-11-18 盛美半导体设备(上海)股份有限公司 基板处理装置及方法

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US6798231B2 (en) * 2001-03-05 2004-09-28 Ishiwawajima-Harima Heavy Industries Co., Ltd. & Sharp Kabushiki Kaisha Inspection device for liquid crystal driving substrate
TW200702656A (en) * 2005-05-25 2007-01-16 Olympus Corp Surface defect inspection apparatus
TW200935537A (en) * 2007-11-05 2009-08-16 Tokyo Electron Ltd Substrate and method and apparatus for examination and memory medium
TW201005282A (en) * 2008-05-21 2010-02-01 Olympus Corp Base plate viewing apparatus, base plate viewing method and control device
US20100114348A1 (en) * 2008-10-31 2010-05-06 Searete Llc, A Limited Liability Corporation Of The States Of Delaware Frozen compositions and methods for piercing a substrate

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JP3067331B2 (ja) * 1991-10-30 2000-07-17 株式会社ニコン 顕微鏡
TW383414B (en) * 1997-03-05 2000-03-01 Tokyo Electron Ltd Photoresist agent processing method and photoresist agent processing system and evaluation method and processing apparatus for photoresist agent film
AU2002349599A1 (en) * 2001-11-30 2003-06-10 International Business Machines Corporation Inspection device and inspection method for pattern profile, exposure system
JP3853685B2 (ja) * 2002-03-28 2006-12-06 大日本スクリーン製造株式会社 基板処理装置
JP2007240519A (ja) * 2006-02-08 2007-09-20 Tokyo Electron Ltd 欠陥検査方法、欠陥検査装置及びコンピュータプログラム
JP2009194335A (ja) * 2008-02-18 2009-08-27 Orc Mfg Co Ltd 露光装置の基板支持機構
JP2010008177A (ja) * 2008-06-26 2010-01-14 Adtec Engineeng Co Ltd 欠陥検出装置及び方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6798231B2 (en) * 2001-03-05 2004-09-28 Ishiwawajima-Harima Heavy Industries Co., Ltd. & Sharp Kabushiki Kaisha Inspection device for liquid crystal driving substrate
TW200702656A (en) * 2005-05-25 2007-01-16 Olympus Corp Surface defect inspection apparatus
TW200935537A (en) * 2007-11-05 2009-08-16 Tokyo Electron Ltd Substrate and method and apparatus for examination and memory medium
TW201005282A (en) * 2008-05-21 2010-02-01 Olympus Corp Base plate viewing apparatus, base plate viewing method and control device
US20100114348A1 (en) * 2008-10-31 2010-05-06 Searete Llc, A Limited Liability Corporation Of The States Of Delaware Frozen compositions and methods for piercing a substrate

Also Published As

Publication number Publication date
CN102338990B (zh) 2014-11-26
US20120013730A1 (en) 2012-01-19
US8730317B2 (en) 2014-05-20
JP2012023289A (ja) 2012-02-02
KR20120008447A (ko) 2012-01-30
JP5479253B2 (ja) 2014-04-23
CN102338990A (zh) 2012-02-01
KR101605698B1 (ko) 2016-03-23
TW201229501A (en) 2012-07-16

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