TWI485889B - Method for manufacturing a light-emitting diode package structure - Google Patents

Description

Method for manufacturing light emitting diode package structure

The present invention relates to a method of fabricating a package structure, and more particularly to a method of fabricating a light emitting diode package structure.

The manufacturing method of the conventional light-emitting diode package structure is to perform a die-bonding process on a substrate, forming a fluorescent glue protective layer on the substrate by using a stamper, and then cutting the protective layer of the fluorescent glue to form a filling. The space of the cup wall fills the wall material with the space and finally cuts out the monomer.

However, with the above method of cutting the protective layer of the fluorescent glue, only the wall of the cup having the vertical wall can be formed, and the vertical wall cannot increase the amount of light, so that the amount of light emitted from the light-emitting diode is inferior. In addition, the method of filling the cup wall material is coating or dispensing, and if it is filled by coating, it is easy to cause dirt and reduce light emission, and if it is filled by dispensing, the production efficiency is low.

The invention relates to a manufacturing method of a light emitting diode package structure, which utilizes a mold having a groove of a slanted side wall to manufacture a cup wall of a package structure, and can mass-produce a package structure having a slanted cup wall, so that the light emitting diode emits light. The efficiency is improved, and according to the flexibility of the process flow, the wall of the cup is first made to perform solid crystal bonding, or the solid crystal is used to make the wall.

According to the present invention, a method for fabricating a light emitting diode package structure includes: providing a substrate having a plurality of die bonding regions and perforations, wherein the die bonding regions are arranged in an array, the perforations being along at least one side of the substrate and/or each solid Crystal zone Arranged around. A heat-resistant adhesive tape having a plurality of holes aligned with the perforations is adhered to the back surface of the substrate. A mold is clamped to the front side of the substrate, and the mold includes a plurality of grooves having inclined side walls, the corresponding perforations being arranged in an array. The holes and perforations from the back side of the substrate fill the reflective cup glue into the grooves and cure the reflective cup glue. The mold is separated from the film to form a plurality of cup walls on the front side of the substrate, and each cup wall surrounds each of the solid crystal regions, and then the substrate is cut.

In order to better understand the above and other aspects of the present invention, the following detailed description of the embodiments of the present invention will be described in detail below. The following examples are intended to illustrate the invention.

Hereinafter, a method of manufacturing a light emitting diode package structure according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. It is to be noted that the detailed structures of the various elements of the embodiments are merely illustrative and are not intended to limit the scope of the invention. The drawings have been simplified to clearly illustrate the contents of the embodiments, and the dimensional ratios in the drawings are not drawn to scale in accordance with the actual products, and thus are not intended to limit the scope of the present invention.

First embodiment

A substrate 100 is provided. The substrate 100 is a non-conductive substrate, for example, a composite material of an epoxy resin plus a filler and a glass fiber, or a National Electrical Manufacturers Association (NEMA) for general circuit boards. ) FR-4 grade material as defined. The substrate 100 includes a plurality of die attach regions 110 and vias 120. Please refer to FIG. 1A for the substrate of the embodiment of the present invention. In a top view of 100, the die bonding regions 110 are arranged in an array, and the through holes 120 are arranged along the four sides of the substrate 100 and around the respective die bonding regions 110, but are not limited thereto. For example, the through holes may also be along the substrate 100. At least one side (as shown in FIG. 1B) or only along the circumference of each solid crystal region 110. The shape of the perforation 120 may be a rectangle as shown in FIG. 1A or a circle as shown in FIG. 1B, or may be an L-shaped perforation 120A and a rectangular perforation 120B as shown in FIG. 1C. In addition, as shown in FIGS. 1A to 1C, the substrate 100 may have four circular alignment holes 150 disposed at four corners of the substrate 100, but the shape and position of the alignment holes are not limited thereto.

Adhesive heat-resistant tape (reference numeral 200 in Fig. 4) is attached to the back surface of the substrate 100. The heat resistant tape 200 has a plurality of holes aligned with the perforations 120, the holes being shaped to correspond to the perforations 120. The heat resistant tape 200 is heat resistant to, for example, 150 to 200 degrees Celsius to protect the substrate 100 from contamination.

The mold 300 is clamped to the front side of the substrate 100. 2 is a side cross-sectional view of a mold 300 in accordance with an embodiment of the present invention. The mold 300 includes a plurality of grooves 310 arranged in an array, and each of the grooves 310 has an inclined side wall. In one embodiment, the mold 300 is aligned by the alignment holes 150 of the substrate, so that the grooves 310 are arranged in an array corresponding to the through holes 120 of the substrate.

From the back side of the substrate 100, the reflective cup rubber 400 is filled into the recess 310 through the holes of the perforation 120 and the heat-resistant adhesive tape 200. Referring to FIG. 3, a plan view of filling the reflective cup rubber 400 into the groove 310 is shown, and FIG. 4 is a cross-sectional view showing a section along the line AA' in FIG. 3, first providing the reflective cup rubber 400 to the substrate. 100 the first side of the back side 130, then a scraping The plate 410 moves from the first side 130 along the first direction D1 toward the opposite second side 140, and then the squeegee 410 from the second side 140 is opposite to the first direction D1 toward the first side 130. Move, several times, until the reflective cup 400 is completely filled in the recess 310. The reflective cup rubber 400 is, for example, a silicone epoxy resin or other thermosetting plastic, and the flow of the reflective cup rubber 400 can be as shown in FIG.

In another embodiment of the present invention, the step of filling the reflective cup rubber 400 into the recess 310 can also be as shown in FIG. Figure 5 is a cross-sectional view showing a section along the line BB' in Figure 1B. First, a plurality of glue injection tubes 420 are provided, the reflection cup material 400 is filled with the glue tube 420, and then the glue tube 420 is inserted into the substrate 100. The perforations 120 allow the reflective cup rubber 400 to be filled into the recess 310. The flow of the reflective cup adhesive 400 can be as shown in FIG. 5 until the recess 310 completely fills the reflective cup adhesive 400. The portion of the perforation 120 of the glue tube 420 inserted into the substrate 100 is filled into the reflective cup adhesive 400, so that the reflective cup material 400 can eliminate the air in the groove 310 during the injection process.

After filling the reflective cup adhesive 400 to the recess 310, the reflective cup adhesive 400 is cured. The step of curing the reflective cup adhesive 400 is, for example, a baking process. In one embodiment, the heat resistant tape 200 may be peeled from the back side of the substrate 100 prior to curing the reflective cup adhesive 400.

The mold 300 is peeled off from the film. FIG. 6 is a partial flow chart showing a first embodiment of the present invention. After the mold 300 is separated from the film, a plurality of cup walls 500 may be formed on the front surface of the substrate 100, wherein each cup wall 500 is a solid crystal surrounding the substrate. The region 110 exposes the die bonding region 110. Next, a light-emitting diode 600 is disposed on the exposed solid crystal region 110 of each of the cup walls 500, and is performed. Wire routing process and packaging process.

The substrate 100 is cut. As shown in FIG. 6, the substrate 100 is cut into a plurality of cells 900 of a plurality of light emitting diode packages, and since each of the grooves 310 of the mold forming the cup wall 500 has inclined side walls, these light emitting diodes The cup wall 500 of the unit 900 of the package structure also has sloped side walls.

Second embodiment

The second embodiment of the present invention differs from the manufacturing method of the light-emitting diode package structure of the first embodiment in the structure of the mold and the order of the manufacturing steps, and other similar parts will not be described again. As shown in FIG. 7, a side cross-sectional view of a mold 700 according to a second embodiment of the present invention has a recess 720 between the grooves 710 of the mold 700. The recessed portions 720 are disposed corresponding to the respective solid crystal regions 110 of the substrate 100 such that the reflective cup rubber 400 does not fill the recessed portions 720 when the reflective cup rubber 400 is filled.

FIG. 8 is a partial flow chart showing the second embodiment of the present invention. As shown in FIG. 8, since the mold 700 has the recessed portions 720 corresponding to the respective solid crystal regions 110 of the substrate 100, when the reflective cup rubber is filled, the reflective cup rubber is not filled in the recesses 720, and thus is pasted. Before the heat-resistant adhesive tape 200 is disposed on the back surface of the substrate 100 (not shown in FIG. 8), the light-emitting diode 600 may be disposed on the die-bonding region 110, and a wire bonding process and a packaging process are performed. The subsequent steps are the same as those of the first embodiment, and will not be described again.

9A-9B are rear views of a single body 900 of a light emitting diode package structure according to an embodiment of the present invention. As shown, the back side of the unit 900 of the LED package structure includes a fiberglass region 1001, two non-connected The metal region 1101 and the plurality of reflective cup rubber regions 1201 are connected. The unconnected metal region 1101 is adjacent to the glass fiber region 1001, and the unconnected metal region 1101 is formed by the solid crystal region 110. The reflective cup rubber region 1201 corresponds to the perforations 120 and is discontinuously adjacent to the fiberglass region 1001 or the metal region 1101. However, the shape of the reflective cup rubber region 1201 is not limited to, for example, the rectangle illustrated in FIG. 9A or the L-shape illustrated in FIG. 9B. Any of the reflective cup rubber regions 1201 corresponding to the shape and position of the perforations 120 of the substrate are within the scope of embodiments of the present invention.

It can be seen from the above embodiments that the manufacturing method of the LED package structure of the present invention can produce a light-emitting diode having better light-emitting efficiency than the conventional technology, and can be used for mass-making a cup wall having inclined sidewalls. . In addition, the process of the invention is more stable, and the mold structure can be changed according to the elasticity of the process flow, and the wall is manufactured by first performing solid crystal wire bonding, or by first solidifying wire bonding to manufacture the cup wall.

In conclusion, the present invention has been disclosed in the above embodiments, but it is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

100‧‧‧Substrate

110‧‧‧ Gujing District

120‧‧‧Perforation

130‧‧‧First side

140‧‧‧Second side

200‧‧‧heat resistant tape

300, 700‧‧‧ mould

310, 710‧‧‧ grooves

400‧‧‧Reflecting cup glue

410‧‧‧Scraper

500‧‧‧ cup wall

600‧‧‧Lighting diode

720‧‧‧Depression

900‧‧‧Single-emitting diode package

1001‧‧‧glass fiber area

1101‧‧‧Do not connect metal areas

1201‧‧‧Reflecting cup glue area

1A-1C are top views of a substrate in accordance with an embodiment of the present invention.

Fig. 2 is a side sectional view showing a mold according to a first embodiment of the present invention.

FIG. 3 illustrates filling the reflective cup glue to the concave according to an embodiment of the invention. A top view of the steps in the tank.

Fig. 4 is a cross-sectional view showing a section along the line AA' in Fig. 3.

Fig. 5 is a cross-sectional view showing a section along the line BB' in Fig. 1B.

FIG. 6 is a partial flow chart showing a first embodiment of the present invention.

Figure 7 is a side cross-sectional view showing a mold in accordance with a second embodiment of the present invention.

FIG. 8 is a partial flow chart showing a second embodiment of the present invention.

9A-9B are rear views of the single body of the light emitting diode package structure according to the embodiment of the present invention.

100‧‧‧Substrate

110‧‧‧ Gujing District

300‧‧‧Mold

500‧‧‧ cup wall

600‧‧‧Lighting diode

900‧‧‧Single-emitting diode package

Claims (16)

A method of fabricating a light emitting diode package structure, comprising: providing a substrate comprising: a plurality of die bonding regions arranged in an array; a plurality of through holes extending along at least one side of the substrate and/or each of the die bonds Arranging around the area; pasting a heat-resistant adhesive tape on the back surface of the substrate, wherein the heat-resistant adhesive tape has a plurality of holes, the holes are aligned with the through holes; and a mold is clamped to the front surface of the substrate, the mold comprising: a plurality of a groove, the grooves are arranged in an array corresponding to the perforations, and each of the grooves has an inclined side wall; and from the back surface of the substrate, the reflective cup material is filled into the grooves through the holes and the perforations; curing The reflective cup material; the mold is separated from the film to form a plurality of cup walls on the front surface of the substrate, wherein each of the cup walls surrounds each of the die bonding regions; and the substrate is cut into a plurality of light emitting diode packages The monomer of the structure. The method of claim 1, wherein before the step of cutting the substrate, the method further comprises: disposing a light-emitting diode on the solid crystal region exposed by each of the cup walls, and performing a wire bonding process and A packaging process. The method of claim 1, wherein each of the grooves further has a recess corresponding to each of the solid crystal regions, so that the reflective cup rubber does not fill when the reflective cup is filled. Fill in the recess. The method of claim 3, wherein the method is pasted Before the step of the heat-resistant adhesive tape on the back surface of the substrate, the method further comprises: disposing a light-emitting diode on the solid crystal region, and performing a wire bonding process and a packaging process. The method of claim 1, wherein the step of filling the reflective cup material into the grooves through the holes and the perforations further comprises: providing the reflective cup material to one of the back surfaces of the substrate a side edge; and moving a squeegee to fill the reflective cup of glue into the grooves. The method of claim 5, wherein the moving the squeegee comprises: moving the squeegee from the first side along a first direction toward a second side of the opposite side; The squeegee moves from the second side edge opposite the first direction toward the first side edge; and several times until the grooves completely fill the reflective cup glue. The method of claim 1, wherein the holes have a shape corresponding to the perforations. The method of claim 7, wherein the step of filling the reflective cup material into the grooves from the holes and the perforations of the back surface of the substrate further comprises: providing a plurality of glue injection tubes; The cup of rubber fills the rubber injection tubes; the rubber injection tubes are inserted into the partial perforations; and the reflective cup rubber is filled until the grooves completely fill the reflective cup rubber. The method of claim 1, wherein the shapes of the perforations are selected from the group consisting of a circle, a rectangle, and an L-shape. The method of claim 1, wherein the plurality of the perforations are arranged along a horizontal direction and a vertical direction around the respective solid crystal regions. The method of claim 1, wherein the material of the substrate comprises glass fibers. The method of claim 1, wherein the reflective cup material is a thermoset plastic. The method of claim 1, wherein the step of curing the reflective cup is a baking process. The method of claim 1, wherein the heat resistant tape has a heat resistance of 150 to 200 degrees Celsius. The method of claim 1, wherein before the step of curing the reflective cup glue, the method further comprises: peeling the heat resistant tape from the back side of the substrate. The method of claim 1, wherein after the substrate is cut, the back surface of the monomer of the light emitting diode package structure comprises: a fiberglass region; two unconnected metal regions, and the glass fiber Adjacent to the region, the unconnected metal regions are formed by the solid crystal regions; and a plurality of reflective cup rubber regions corresponding to the perforations, the reflective cup rubber regions are discontinuously adjacent to the glass fibers Area or the metal areas.