TWI775074B - Method for forming surrounding walls on a circuit-laid ceramic substrate and the substrate - Google Patents

Abstract

A method for forming a surrounding wall on a ceramic substrate with a circuit layout and the substrate, the method enables at least one insulating surrounding wall to be formed on a ceramic substrate, the ceramic substrate has a ceramic substrate body and a metal circuit layer, the ceramic substrate body Comprising an upper surface and a lower surface, the metal circuit layer is arranged on at least the upper surface for arranging at least one electronic component, wherein the metal circuit layer includes at least a plurality of mutually independent metal pads/conductors, and the aforementioned independent pads There is a gap between the wires; the upper and lower molds are heated and pressed to make the above-mentioned adhesive base material at least partially fill the above-mentioned space, so that the above-mentioned pads/wires sandwiched to form the above-mentioned space are insulated from each other. After the adhesive base material is cured At least one insulating surrounding wall is formed surrounding at least a portion of the metal circuit layer.

Description

Method for forming a surrounding wall on a circuit-laid ceramic substrate and the substrate

The present invention relates to a ceramic substrate and a manufacturing method, in particular, to a method for forming a surrounding wall on a ceramic substrate with a circuit layout and the substrate.

With the continuous and rapid evolution of technology, optical products such as mobile phone flashes, identification systems, car headlights, fishing lights, engineering lighting or landscape lighting are all developing in the direction of high efficiency and miniaturization. Among them, optical products are most commonly used. The technologies used are LED (Light Emitting Diode) and VCSEL (Vertical Resonant Cavity Surface Emitting Laser), but due to the limitation of process technology, the miniaturization of component size has reached a bottleneck, and the gap between the retaining wall and the ceramic substrate The adhesion is extremely poor, resulting in a significant drop in product yield.

Generally, the packaging structure of optical components includes a substrate and a surrounding wall connecting the substrate, and the die is arranged in the accommodating space formed by the substrate and the surrounding wall. Finally, the packaging is completed by colloid, plastic sheet or glass sheet. The luminous efficacy and color temperature uniformity of optical products have a great influence. The most common process today is to connect the metal surrounding wall to the substrate by welding, electroplating or aluminum plate bonding. However, due to the conductive properties of the metal surrounding wall, the circuit planning is limited. In addition, due to the process technology, the use of metal The substrate surrounding the wall can only be reduced to a size of 35mm square at most, and it is difficult to achieve the goal of miniaturization. The cost of production is greatly increased. In addition, the above methods all have the problem of high process temperature, and thus the production The phenomenon that materials with different expansion coefficients are deformed by thermal stress greatly reduces the yield of the process.

Therefore, how to propose a method for forming a surrounding wall on a ceramic substrate and a ceramic substrate, so that the process temperature can be reduced, the overall manufacturing yield can be improved, and the luminous efficacy and color temperature uniformity can be improved at the same time, and the circuit configuration can be avoided. effort issue.

In view of the above shortcomings, the main purpose of the present invention is to provide a method for forming a surrounding wall on a ceramic substrate with a circuit layout, which can greatly reduce the process temperature and reduce the thermal deformation of the structure, thereby improving the manufacturing yield of the ceramic substrate.

Another object of the present invention is to provide a ceramic substrate with a surrounding wall and a circuit layout, which can effectively improve the luminous efficacy and color temperature uniformity of the chips disposed on the ceramic substrate.

Another object of the present invention is to provide a ceramic substrate with surrounding walls and a circuit layout, which can additionally ensure that the metal pads/conductors of the metal circuit layer are insulated from each other.

Another object of the present invention is to provide a ceramic substrate with a surrounding wall and a circuit layout, which can further form through-conducting ports in the surrounding wall, thereby increasing the flexibility of the circuit layout of the product.

In order to achieve the above object, the present invention provides a ceramic substrate with surrounding walls and arranged with circuits, the substrate includes: a ceramic substrate body, including an upper surface and a lower surface opposite to the upper surface; a layout on at least the upper surface The metal circuit layer is used to set at least one electronic component, wherein the metal circuit layer includes at least a plurality of mutually independent metal pads/conductors, and there is a space between the above-mentioned independent pads/conductors; at least one surrounds at least part of the metal The insulating surrounding wall of the circuit layer, the insulating surrounding wall is made of an adhesive base material, and the insulating surrounding wall extends from the upper surface to the direction of the metal circuit layer and is higher than the metal circuit layer, so that the insulating surrounding wall is higher than the metal circuit layer. The edge surrounding wall and the ceramic substrate body together form an accommodating space that partially surrounds the electronic components; and the adhesive base material at least partially fills the space, so that the pads/wires sandwiched to form the space are insulated from each other.

In order to achieve the above object, the present invention also provides a method for forming a surrounding wall on a ceramic substrate with a circuit layout, so that at least one insulating surrounding wall is formed on a ceramic substrate, and the ceramic substrate has a ceramic substrate body and a metal circuit layer, The ceramic substrate body includes an upper surface and a lower surface opposite to the upper surface, the metal circuit layer is arranged on at least the upper surface for arranging at least one electronic component, wherein the metal circuit layer includes at least a plurality of mutually independent metal pads /wires, and there is a space between the aforementioned pads/wires that are independent of each other, the method includes the following steps: a) Step 1: set the ceramic substrate body on an upper mold, and set a release mold on the lower mold, Wherein the metal circuit layer is arranged towards the lower mold; b) Step 2: inject a liquid adhesive base material on the side of the release mold close to the upper mold; c) Step 3: the upper mold and the upper mold The lower molds are close to each other, and the ceramic substrate body and the adhesive base material are heated and pressed, so that the adhesive base material at least partially fills the space, so that the pads/wires sandwiched to form the space are insulated from each other, and After the adhesive base material is cured, at least one insulating surrounding wall surrounding at least part of the metal circuit layer is formed; d) Step 4: the upper mold and the lower mold are separated from each other, so that the ceramic substrate body is separated from the release mold, wherein the above The insulating surrounding wall extends from the upper surface toward the metal circuit layer and is higher than the metal circuit layer, so that the insulating surrounding wall and the ceramic substrate body together form an accommodating space partially surrounding the electronic components.

Compared with the prior art, the present invention discloses a method for forming a surrounding wall on a ceramic substrate with a circuit layout and the substrate, wherein an adhesive base material is used as the insulating surrounding wall, and is passed through The insulating surrounding wall is formed on the ceramic substrate by low-temperature heating and pressing, which greatly reduces the process temperature and reduces the thermal deformation of the structure. At the same time, some adhesive substrates will be filled into the spacing between the independent pads/conductors of the metal circuit layer to ensure that The metal pads/wires are insulated from each other; in addition, with the adhesive substrates with different characteristics, it is possible to choose to reflect the light of the mounted die as much as possible to improve the luminous efficacy, or to absorb light from a wide angle to avoid the light source between different die Interfering with each other, when used as the light source of face recognition or vehicle recognition system, each surrounding wall can be more miniaturized, so that the overall volume can be reduced or higher resolution can be obtained. Moreover, when additional conductive ports are provided in the surrounding wall, other device devices can also be connected with each other to further provide better flexibility of circuit layout.

1~4: Steps

10, 10', 10": Ceramic substrate

11, 11', 51: ceramic substrate body

12, 12', 52: Metal circuit layer

13, 13': interval

14, 14', 14", 54, 74: Insulating Surround Walls

15, 15': accommodating space

21: Upper mold

22: Lower mold

23: Release model

24: Adhesive substrate

111, 111': upper surface

112, 112': lower surface

121, 121', 521, 721: metal pads

122, 122', 522, 722: Metal contacts

123, 123', 523, 723: metal wire

221: Groove

222: Protrusions

141: Split slot

30, 40: LEDs

31, 41: Die

32, 42, 73: wires

33: Lenses

43: Lens

A, B: dotted line

520, 720: Metal port

55, 75: Through hole

71: Electronic Components

FIG. 1 is a flow chart of a first preferred embodiment of a method for forming a surrounding wall on a ceramic substrate on which circuits are laid out according to the present invention.

FIG. 2 is a schematic diagram of steps of the first preferred embodiment of FIG. 1 .

FIG. 3 is a schematic diagram of another step of the first preferred embodiment of FIG. 1 .

FIG. 4 is a partial enlarged view of the insulating surrounding wall formed on the ceramic substrate of FIG. 3 .

FIG. 5 is the ceramic substrate shown in FIG. 4 before cutting.

6 is a perspective structural view of a first preferred embodiment of a ceramic substrate with a surrounding wall and a circuit layout according to the present invention.

FIG. 7 is a three-dimensional structural view of the embodiment of FIG. 6 as a light-emitting diode.

FIG. 8 is a cross-sectional view of the light emitting diode in FIG. 7 .

9 is a cross-sectional view of a second preferred embodiment of a ceramic substrate with surrounding walls and a circuit layout according to the present invention.

FIG. 10 is a cross-sectional view of the embodiment shown in FIG. 7 when it is used as a light-emitting diode.

11 is a perspective structural view of a third preferred embodiment of a ceramic substrate with a surrounding wall and a circuit layout according to the present invention.

FIG. 12 is a cross-sectional view of the embodiment of FIG. 11 .

13 is a perspective structural view of a fourth preferred embodiment of a ceramic substrate with a surrounding wall and a circuit layout according to the present invention.

14 is a cross-sectional view of a fourth preferred embodiment of a ceramic substrate with surrounding walls and a circuit layout according to the present invention.

The following specific embodiments are used to illustrate the implementation of the present invention, and those skilled in the art can easily understand the advantages and effects of the present invention from the contents disclosed in this specification.

The structures, proportions, sizes, etc. shown in the drawings in this specification are only used to cooperate with the disclosure content of the specification for the understanding and reading of those skilled in the art, and are not intended to limit the conditions for the implementation of the present invention. Any modification of the structure, adjustment of the size, or change of the proportional relationship shall also be regarded as the scope of the present invention, provided that there is no substantial change in the technical content.

A first preferred embodiment of the method for forming a surrounding wall on a ceramic substrate with a circuit layout according to the present invention is shown in FIG. 1 . First, in step 1, as shown in FIG. 2 , the ceramic substrate body 11 is sucked and bonded to the upper mold 21 by, for example, negative pressure. Below, the side to be formed surrounding the wall faces the lower mold 22, and then the release mold 23 is set on the lower mold 22; then as shown in step 2, the adhesive base material 24 is injected into the release mold 23 close to the upper mold 21 side. In this example, the adhesive base material 24 is a liquid and thermosetting silicone rubber. Of course, those with ordinary knowledge in the technical field of the present invention can also arbitrarily select epoxy resins or other resins with cooling curing or ultraviolet light curing characteristics. Adhesive substrates, or composite adhesive substrates made of functional raw materials such as phosphors, light-absorbing materials, and reflective materials, are without prejudice to the implementation of this case.

Through the method in this example, the insulating surrounding wall can be formed on the ceramic substrate. Referring to the enlarged schematic diagram of FIG. 4 , the ceramic substrate 10 in this example mainly includes a ceramic substrate body 11 and a metal circuit that has been arranged on the ceramic substrate body 11 . Layer 12, the ceramic substrate body 11 includes an upper surface 111 and a lower surface 112 opposite to the upper surface 111, and the metal circuit layer 12 includes metal pads 121 arranged on the upper surface 111, lines (not shown), through the ceramic substrate body The metal wires 123 of 11 and the metal contacts 122 arranged on the lower surface 112, because the metal wires 123 lead to the metal pads 121 and the metal contacts 122, so that the LED chips, such as LED chips, to be mounted on the metal pads 121 in the future are connected. Electronic components can obtain enabling currents or electrical signals through the metal contacts 122 .

Next, as described in step 3, the upper mold 21 and the lower mold 22 are close to each other, and the ceramic substrate body 11 and the adhesive substrate 24 are heated and pressed at a temperature lower than 300 degrees. At this time, the adhesive substrate 24 is mainly Extrusion fills the cavity of the lower mold 22, and is gradually bonded to the ceramic substrate body 11 during the pressing process. Especially after the mold is closed, due to the influence of pressure and temperature, the adhesive substrate will be as shown in Figure 4, not only When the cavity is filled, it is also squeezed into the space 13 between the metal pads 121 of tens to hundreds of micrometers (μm), so that the metal pads 121 are insulated from each other. At the same time, the adhesive base material 24 filled in the groove 221 of the lower mold 22 will gradually solidify on the ceramic substrate body 11 to form an insulating surrounding wall 14 surrounding a part of the metal circuit layer 12 .

As shown in FIG. 3, FIG. 4 and step 4, when demoulding, the upper mold 21 and the lower mold 22 are gradually separated from each other. Due to the action of the release mold 23, the formed insulating surrounding wall 14 will not stick to the lower mold at all. 22, and firmly bonded to the ceramic substrate body 11, extending from the upper surface 111 toward the metal circuit layer 12 and having a height higher than the metal circuit layer 12, so that the insulating surrounding wall 14 and the ceramic substrate body 11 together form for arranging electronic components accommodating space 15. The size of the accommodating space 15 here is The height and size of the insulating surrounding wall 14 are determined by the spacing and shape of the grooves 221 of the lower mold 22 . A protrusion 222 can also be formed in the groove 221, so that the insulating surrounding wall 14 is formed with a dividing groove 141 corresponding to the protrusion 222, so that the ceramic substrate 10 can be easily divided into smaller units; of course, it can also be determined according to the conditions of the cutting instrument. It is determined whether a protrusion 222 or a protrusion 222 of a different shape is formed in the groove 221 .

FIG. 5 shows the ceramic substrate 10 before cutting as shown in FIG. 4 . The dotted line in FIG. 5 is the cutting path of the ceramic substrate 10 . The ceramic substrate 10 can be cut into 25 smaller monomers, each of which has an insulating surrounding wall 14 . The accommodating space 15 formed by the accommodating space 15 surrounded by it can be used as the space for arranging the LED die; of course, as can be easily understood by those skilled in the art, if the ceramic substrate is to be used to manufacture a multi-cell VCSEL, it may not be divided. and use it directly. The first preferred embodiment of the ceramic substrate with circuit layout with surrounding walls of the present invention is shown in FIG. 6 . In this example, the ceramic substrate 10 ′ is divided into a single body by dividing the whole ceramic substrate 10 in the previous example. The ceramic substrate 10 'includes a ceramic substrate body 11', a metal circuit layer 12', and an insulating surrounding wall 14', wherein the metal circuit layer 12' includes metal pads 121' on the upper surface 111' and metal contacts 122' on the lower surface 112' and a metal wire 123' electrically conducting both.

FIG. 7 and FIG. 8 use the ceramic substrate 10 ′ of FIG. 6 , a light-emitting diode die 31 is welded on the metal pad 121 ′, and the wire 32 is electrically struck from the upper surface of the light-emitting diode die 31 . Conducted to another metal pad 121 ′, then filled with light-transmitting glue in the accommodating space for packaging, and finally installed the lens 33 above the light-transmitting glue, and finally formed a complete light-emitting diode 30 , wherein FIG. 8 It is a cross-sectional view of the light emitting diode 30 in FIG. 7 cut along the dotted line A. The die 31 is mounted on the metal pad 121 ′ on the upper surface 111 ′ by mounting or spot welding, and is electrically connected to another metal pad 121 ′ on the upper surface 111 ′ by the wire 32 . 31 Permeable to two metals on the lower surface 112' The contact 122' is connected to the external power source and emits light. The space 13 ′ between the two metal pads 121 ′ on the upper surface 111 ′ has a cured adhesive base material, so that the two metal pads 121 ′ can be prevented from being deformed at high temperature or short-circuited during welding, resulting in damage to electronic parts . Especially in the process of continuous miniaturization of electronic components, it provides better insulation protection, thereby improving the yield of products.

When the encapsulant is filled into the accommodating space 15 ′ during the manufacturing process, the insulating surrounding wall 14 ′ can not only avoid the overflow of the encapsulant, but also can be used by adding materials with different properties to the adhesive substrate or using adhesive substrates with different materials material, so that the shaped insulating surrounding wall 14' can have different functions. For example, when a high-transmittance adhesive substrate is used, the light-emitting angle of the light-emitting diode can be increased; when a high-reflection material is added, the light can be irradiated in a concentrated manner to prevent the light from interfering with adjacent light-emitting elements; if fluorescent powder is added, color matching can be achieved , Improve color temperature uniformity or adjust color rendering. Of course, even if there are, for example, three or more pairs of metal pads formed in an accommodating space, and at least one red, green, and blue crystal grains are arranged in a surrounding wall, a white light with good color rendering can be produced. LED.

Of course, those with ordinary knowledge in the technical field of the present invention can also apply the ceramic substrate with surrounding walls and circuit layout in this example to VCSEL fields such as 3D sensing, gesture recognition or face recognition. By setting the VCSEL with infrared chips One of the metal pads and the other metal pad are selectively disposed with the sensing die, and then the diffuser is disposed on the surrounding wall to complete the VCSEL device with excellent adhesion between the surrounding wall and the ceramic substrate. It must be noted here that the above-mentioned lens 33 is not limited to glass material. When an optical element is installed in the surrounding wall, whether it is a generalized light emitting or receiving light, as long as the required wavelength can be allowed to pass through, whether it is infrared or ultraviolet , the lenses here do not necessarily need to allow visible light transmission.

The second preferred embodiment of the ceramic substrate with circuit layout with surrounding walls in this case is shown in FIG. 9 and FIG. 10 . The same parts as those in the previous example will not be repeated in this example, and only the differences will be mentioned. Bright. The structure of the surrounding wall is not limited to the rectangular structure in the foregoing embodiments, and different structures may be used to form the insulating surrounding wall on the ceramic substrate. FIG. 10 shows the ceramic substrate 10 ″ in FIG. 9 provided with a light emitting diode 40 composed of crystal grains 41 for light emitting diodes, wires 42 and lenses 43 , wherein FIG. 10 shows the ceramic substrate 10 ″ in FIG. A cross-sectional view of the light-emitting diode 40 cut along the dotted line B at the back. In this example, the insulating surrounding wall 14" is formed on the ceramic substrate 10" as a circular ring structure, so that the circular lens 43 can be arranged above the insulating surrounding wall 14". It has great flexibility and can manufacture products of different shapes in response to different market demands.

The third preferred embodiment of the ceramic substrate with circuit layout with surrounding walls in this case is shown in FIGS. 11 and 12. In addition to having the same structure as the first embodiment in FIG. 6, the ceramic substrate further includes two walls. shaped metal conductive port 520 . The metal conductive port 520 is formed on the ceramic substrate body 51 by molding before the insulating surrounding wall 54 is formed. The ceramic substrate body 51 is formed with at least one through hole 55 in the range where the insulating surrounding wall 54 is to be formed, the metal conductive port 520 is electrically conductively disposed at the through hole 55, and the metal conductive port 520 and the metal circuit layer 52 are formed with The space formed by the insulating surrounding wall can be electrically insulated from the metal circuit layer 52 or conducted by forming a circuit through the insulating surrounding wall in the metal circuit layer, thereby increasing the flexibility of the circuit layout. The metal conducting port 520 can be formed to a required height at one time, or a part of the height can be formed first, and then thickened to the required height by electroplating. For example, in addition to being mounted on the metal pads 521 , the electronic components can also be connected to the metal conductive ports 520 , and are electrically connected to the metal contacts 522 through the metal wires 523 .

In addition to the wall-shaped metal conducting ports in the foregoing embodiments, the metal conducting ports 720 can also be column-shaped as shown in the embodiments in FIGS. 74, such as the four corners, four sides of the insulating surrounding wall 74 Any position, and the exposed part may be above or on the side of the insulating surrounding wall 74, as a contact point for connecting wires or electronic components. The metal conducting port 720 is formed by forming at least one through hole 75 in the range where the insulating surrounding wall 74 is to be formed, and when forming the insulating surrounding wall 74, at least one through-hole 75 is retained at the insulating surrounding wall 74 by a mold. Corresponding to the plug holes of the through holes 75, and after the insulating surrounding wall 74 is formed, the plug holes are filled with a metal conductive material. The electronic component 71 can be mounted on the metal pad 721, and is electrically connected to the lower metal contact 722 through the metal wire 723, and at the same time, the wire 73 is connected to the metal conductive port 720 in the insulating surrounding wall 74, so that the circuit layout is flexible. can be greatly improved. Of course, as can be easily understood by those skilled in the art, the through hole 75 and the plug hole here can also be cut through, for example, a laser beam after the insulating surrounding wall is completely formed, which does not hinder the present case. implementation.

The method of forming a surrounding wall on a ceramic substrate with a circuit layout and the substrate of the present invention, the liquid glue base material is formed on the ceramic substrate into a cured insulating surrounding wall by means of stamping, on the one hand, it greatly reduces the There is a high temperature environment in the process to prevent the ceramic substrate from producing thermal stress and expansion and contraction due to high temperature, which will lead to a decrease in product yield; in addition, it can also improve the positional accuracy of the insulating surrounding wall formed on the ceramic substrate to avoid errors or dislocations caused by the electric welding process. , can also simplify the operation process at the same time. On the other hand, the liquid adhesive base material also fills the gaps in the metal pads or wires in the metal circuit layer. After the adhesive base material is cured, it can ensure that the metal pads or wires that should be independent of each other are insulated from each other. In addition, the method proposed by the present invention is more suitable for forming various shapes of insulating surrounding walls on the ceramic substrate, which meets various market demands.

However, the above are only preferred embodiments of the present invention, and cannot limit the scope of implementation of the present invention. Any simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the contents of the description should still be used. fall within the scope of the present invention. The preferred implementation of the present invention After the description of the embodiment, those skilled in the art should understand that the present invention is a novel, advanced and industrially practical invention, and has great development value.

11': Ceramic substrate body

12': Metal circuit layer

13': Interval

14': Insulation Surround Wall

15': accommodating space

30: Light Emitting Diodes

31: Die

32: Wire

33: Lenses

111’: top surface

112': lower surface

121': Metal Pad

122': Metal Contact

123': metal wire

Claims (9)

A ceramic substrate with a surrounding wall and a circuit layout, the substrate comprises: a ceramic substrate body, including an upper surface and a lower surface opposite to the upper surface; a metal circuit layer arranged on at least the upper surface for arranging at least An electronic component, wherein the metal circuit layer includes at least a plurality of mutually independent metal pads/conductors, and there is a space between the mutually independent pads/conductors; at least one insulating surrounding wall surrounding at least part of the metal circuit layer, the above The insulating surrounding wall is made of an adhesive base material, and the insulating surrounding wall extends from the upper surface toward the metal circuit layer and is higher than the metal circuit layer, so that the insulating surrounding wall and the ceramic substrate body are formed together An accommodating space that partially surrounds the electronic components; and the adhesive base material is at least partially filled into the space when forming the insulating surrounding wall, so that the pads/wires sandwiched to form the space are insulated from each other. The ceramic substrate with surrounding walls and circuit layout as described in claim 1, wherein the adhesive base material is silicone. The ceramic substrate with surrounding walls and circuit layout as described in claim 1, wherein the adhesive base material is epoxy resin. The ceramic substrate with surrounding walls and circuit layout as described in claim 1, wherein the insulating surrounding walls are perpendicular to the body of the ceramic substrate. The ceramic substrate with surrounding walls and circuit layout as described in claim 1, wherein the electronic component is a VCSEL die. The ceramic substrate with surrounding walls and circuit layout according to claim 1, wherein the insulating surrounding walls and the adhesive base material filling the gaps form an integrated structure. The ceramic substrate with surrounding walls and circuit layout described in claim 6, wherein the insulating surrounding walls and the adhesive base material filled in the space are adjacent to and surround each of the metal pads/conductors. The ceramic substrate with surrounding walls and circuit layout described in claim 1, wherein the height of the top surface of the adhesive base material filled with the space above relative to the body of the ceramic substrate is smaller than the height of the metal pads/conductors. The height of the top surface relative to the above-mentioned ceramic substrate body. The ceramic substrate with surrounding walls and circuit layout described in claim 1, wherein the width of the space is tens of micrometers to hundreds of micrometers.

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