CN101237012B

CN101237012B - LED assembly method

Info

Publication number: CN101237012B
Application number: CN2007100032680A
Authority: CN
Inventors: 张正宜
Original assignee: Everlight Electronics Co Ltd
Current assignee: Everlight Electronics Co Ltd
Priority date: 2007-02-02
Filing date: 2007-02-02
Publication date: 2011-03-16
Anticipated expiration: 2027-02-02
Also published as: CN101237012A

Abstract

The present invention discloses a light emitting diode and an assembling method thereof, wherein, the light emitting diode is formed by combining a substrate with a reflector. The surface of the substrate is provided with a colloid which covers a light emitting chip and a plurality of leads; the reflector is provided with a bottom opening, the substrate and the reflector are assembled by pressing the colloid into the bottom opening to fasten the colloid with the bottom opening.

Description

The assemble method of light-emitting diode

Technical field

The present invention relates to a kind of assemble method of light-emitting diode, and particularly relate to a kind of assemble method of simplifying the light-emitting diode of packaging technology.

Background technology

The purpose of light-emitting diode (LED) encapsulation comprises that the protective core sheet is not subjected to extraneous aqueous vapor, oxygen, radiation or damage of external force, and improves the reliability of assembly and improve the performance of chip.In addition, also can utilize the different packing forms different product of arranging in pairs or groups, increase the range of application of LED.

Tradition LED packaging technology comprises solid crystalline substance, baking, routing, pressing mold, reflector moulding, cutting, electrical measurement and packing etc.Wherein, all carried out on substrate to the reflector moulding by solid crystalline substance, finished product has certain thickness after stacked in multi-layers, in order finished product to be cut into single light-emitting diode, need expend high production cost, for example the loss of blade, material.In addition, because operation is complicated, the finished product that cuts out also has the lower problem of yield.

Summary of the invention

Therefore purpose of the present invention is exactly that a kind of assemble method of light-emitting diode is being provided, and improves traditional LED package mode complex procedures, the not good problem of yield.

According to above-mentioned purpose of the present invention, a kind of method of assembling light-emitting diodes is proposed, it is included in and sets firmly at least one luminescence chip on the substrate, utilizes lead to be electrically connected each luminescence chip and substrate, and each luminescence chip is carried out mold pressing forms colloid at least.One reflector is provided, and the reflector bottom has an opening, and this colloid is pressed in the opening, so that colloid is placed in this opening and engaging mutually, finishes the assembling of pedestal and reflector.

According to another embodiment of the present invention, can be earlier on a substrate, form a plurality of colloids, and with after a plurality of reflectors engage mutually, the cutting substrate part promptly is divided into a plurality of light-emitting diodes again.

According to above-mentioned, the method for assembling light-emitting diode of the present invention as can be known can be simplified the LED packaging technology and control yield easily, reaches the effect that reduces materials used, reduces cost and improve the product yield.

In order to make constitutive characteristic of the present invention, method of operation, purpose and advantage be more prone to understand, therefore reach character narrate hereinafter in conjunction with the accompanying drawings, embodiments of the invention are described.

Description of drawings

For above and other objects of the present invention, feature, advantage and embodiment can be become apparent, detailed description of the accompanying drawings is as follows:

Fig. 1 is the flow chart of steps according to the method for the assembling light-emitting diode of one embodiment of the invention;

Fig. 2 A is the packaging body end view of one embodiment of the invention;

Fig. 2 B is the reflector end view of one embodiment of the invention;

Fig. 2 C is the end view of the light-emitting diode of one embodiment of the invention;

Fig. 3 A is the packaging body vertical view of one embodiment of the invention;

Fig. 3 B is the reflector vertical view of one embodiment of the invention;

Fig. 3 C is the vertical view of the light-emitting diode of one embodiment of the invention;

Fig. 4 is the profile of the light-emitting diode of Fig. 3 C along the 4-4 hatching.

Wherein, Reference numeral:

110: step

130: step

210: packaging body

214: colloid

222: the Shell body

226: upper shed

230: light-emitting diode 120: step

140: step

212: substrate

220: reflector

224: inwall

228: bottom opening

Embodiment

Please refer to Fig. 1, it shows the method step flow chart of the assembling light-emitting diode of one embodiment of the invention.

Shown in step 110, make pedestal, it places a luminescence chip on a substrate, carry out operations such as generally solid crystalline substance, baking and bonding wire.Wherein substrate can be printed circuit board (PCB), ceramic substrate, metal substrate or lead frame.Luminescence chip can utilize adhesion material, and for example organic and inorganic macromolecule elargol or alloy material are fixed in luminescence chip on the substrate, carries out the bonding wire operation with gold thread or aluminum steel again.

Then shown in step 120, utilize moulding resin to encapsulate this luminescence chip of having finished solid crystalline substance to make colloid.The moulding resin that utilizes light transmission is epoxy resin (Epoxy), polystyrene (Polystyrene for example; PS), acrylonitrile-butadiene-phenylethylene polymer (Acrylonitrile-Butadene-Styrene; ABS), polymethyl methacrylate (Polymethyl methacrylate; PMMA), acryl (Acrylic resin) or silica gel materials such as (Silicone), form required colloid shape with mould.Please refer to Fig. 2 A and Fig. 3 A, be respectively the packaging body side-looking and the vertical view of one embodiment of the invention.Packaging body 210 comprises substrate 212 and columniform colloid 214, wherein is fixed with a luminescence chip 216 on the substrate 212, and colloid 214 coats luminescence chip 216.

Shown in step 130, a reflector is provided, the bottom has an opening.According to embodiments of the invention, reflector can be made in the mode of plastics ejection formation in advance, and the surface of reflector can be coated with one deck reflectorized material.Please refer to Fig. 2 B and Fig. 3 B, be respectively the reflector side-looking and the vertical view of one embodiment of the invention.Reflector 220 comprises a Shell body 222, has a upper shed 226 and a bottom opening 228, and the inwall of Shell body 222 224 tilts and enlarges towards upper shed 226, bottom opening 228 be shaped as square.

According to embodiments of the invention, the shape of bottom opening 228 also can be polygon, in order to contact engaging with colloid 214.For example bottom opening 228 is a regular polygon, and as equilateral triangle, regular hexagon, octagon etc., when colloid 214 was cylindrical, each limit of regular polygon can be tangent with the circumference of colloid 214.The shape of bottom opening 228 also can be circle, and colloid 214 is cylindrical, and the circle of bottom opening 228 is big slightly than the circle of colloid 214, with so that colloid 214 closely is sleeved on bottom opening 228.The shape of bottom opening 228 also can be circle or ellipse, and colloid 214 is a polygon, and at least two summits of colloid 214 can join in order to the circumference with bottom opening 228, mutually engaging.

Shown in step 140, combination colloid 214 and reflector 220.Please refer to Fig. 2 C and Fig. 3 C, be respectively the side-looking and the vertical view of the light-emitting diode of one embodiment of the invention.Light-emitting diode 230 of the present invention is tangent with the circumference of columniform colloid 214 and engage mutually by the foursquare bottom opening 228 of reflector 222, finishes the assembling of light-emitting diode.

Please refer to Fig. 4, be the light-emitting diode of Fig. 3 C profile along the 4-4 hatching.Luminescence chip 216 is fixed on the substrate 212, and colloid 214 coats luminescence chip 216, and the bottom opening edge of reflector 222 and the edge of colloid 214 are tangent, closely are fastened togather.

In addition, according to another embodiment of the present invention, light-emitting diode assembling method of the present invention is also applicable to a batch production, can on a substrate, fix a plurality of luminescence chips earlier, and utilize mould on each luminescence chip, to form colloid respectively, again with each colloid with after a plurality of reflectors engage mutually, cutting substrate is divided into a plurality of light-emitting diodes again.

Though the present invention as above describes with a preferred embodiment; but it is not in order to limit the present invention; anyly know those skilled in the art; without departing from the spirit and scope of the present invention; can carry out various variations and improvement to the present invention, so protection scope of the present invention is limited by the accompanying Claim book.

Claims

1. the assemble method of a light-emitting diode is characterized in that, this method comprises:

Set firmly a plurality of luminescence chips on a substrate;

Borrow lead to be electrically connected to this substrate respectively by a plurality of luminescence chips;

Carry out mold pressing a plurality of colloids are encapsulated these a plurality of luminescence chips respectively on this substrate;

Make a plurality of reflectors with the plastics ejection formation, each this reflector has a upper shed and a bottom opening; And

Each this colloid is pressed into this bottom opening of each this reflector, and utilizes this colloid to engage, so as to fixing each this reflector on this substrate with the madial wall of this bottom opening.

2. according to the assemble method of the described light-emitting diode of claim 1, it is characterized in that, encapsulate these a plurality of luminescence chips and after on this substrate, also comprise: divide cutting board to become a plurality of light-emitting diodes again.