CN101237012A - LED and its assembly method - Google Patents
LED and its assembly method Download PDFInfo
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- CN101237012A CN101237012A CNA2007100032680A CN200710003268A CN101237012A CN 101237012 A CN101237012 A CN 101237012A CN A2007100032680 A CNA2007100032680 A CN A2007100032680A CN 200710003268 A CN200710003268 A CN 200710003268A CN 101237012 A CN101237012 A CN 101237012A
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- colloid
- light
- reflector
- emitting diode
- bottom opening
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Abstract
The present invention discloses a light emitting diode and an assembling method thereof, wherein, the light emitting diode is formed by combining a substrate with a reflector. The surface of the substrate is provided with a colloid which covers a light emitting chip and a plurality of leads; the reflector is provided with a bottom opening, the substrate and the reflector are assembled by pressing the colloid into the bottom opening to fasten the colloid with the bottom opening.
Description
Technical field
The present invention relates to a kind of light-emitting diode and assemble method thereof, and particularly relate to a kind of light-emitting diode of simplifying packaging technology.
Background technology
The purpose of light-emitting diode (LED) encapsulation comprises that the protective core sheet is not subjected to extraneous aqueous vapor, oxygen, radiation or damage of external force, and improves the reliability of assembly and improve the performance of chip.In addition, also can utilize the different packing forms different product of arranging in pairs or groups, increase the range of application of LED.
Tradition LED packaging technology comprises solid crystalline substance, baking, routing, pressing mold, reflector moulding, cutting, electrical measurement and packing etc.Wherein, all carried out on substrate to the reflector moulding by solid crystalline substance, finished product has certain thickness after stacked in multi-layers, in order finished product to be cut into single light-emitting diode, need expend high production cost, for example the loss of blade, material.In addition, because operation is complicated, the finished product that cuts out also has the lower problem of yield.
Summary of the invention
Therefore purpose of the present invention is providing a kind of light-emitting diode and assemble method thereof exactly, improves traditional LED package mode complex procedures, the not good problem of yield.
According to above-mentioned purpose of the present invention, a kind of light-emitting diode is proposed, form by a pedestal and a reflector combination.Base-plates surface has colloid, coats luminescence chip and lead; Reflector has a bottom opening and a upper shed, and colloid is placed in the bottom opening, fastens with bottom opening, and reflector has the inwall that tilts and enlarge towards upper shed, in order to reflection ray and light is penetrated from upper shed.
According to one embodiment of the invention, the periphery of colloid can contact with the inner edge of bottom opening, or at least two summits of colloid and the inner edge of this bottom opening join, so that the opening of colloid and reflector closely is fastened togather.
According to above-mentioned purpose of the present invention, a kind of method of assembling light-emitting diodes is proposed, it is included in and sets firmly at least one luminescence chip on the substrate, utilizes lead to be electrically connected each luminescence chip and substrate, and each luminescence chip is carried out mold pressing forms colloid at least.One reflector is provided, and the reflector bottom has an opening, and this colloid is pressed in the opening, so that colloid is placed in this opening and engaging mutually, finishes the assembling of pedestal and reflector.
According to another embodiment of the present invention, can be earlier on a substrate, form a plurality of colloids, and with after a plurality of reflectors engage mutually, the cutting substrate part promptly is divided into a plurality of light-emitting diodes again.
According to above-mentioned, the method for assembling light-emitting diode of the present invention as can be known can be simplified the LED packaging technology and control yield easily, reaches the effect that reduces materials used, reduces cost and improve the product yield.
In order to make constitutive characteristic of the present invention, method of operation, purpose and advantage be more prone to understand, therefore reach character narrate hereinafter in conjunction with the accompanying drawings, embodiments of the invention are described.
Description of drawings
For above and other objects of the present invention, feature, advantage and embodiment can be become apparent, detailed description of the accompanying drawings is as follows:
Fig. 1 is the flow chart of steps according to the method for the assembling light-emitting diode of one embodiment of the invention;
Fig. 2 A is the packaging body end view of one embodiment of the invention;
Fig. 2 B is the reflector end view of one embodiment of the invention;
Fig. 2 C is the end view of the light-emitting diode of one embodiment of the invention;
Fig. 3 A is the packaging body vertical view of one embodiment of the invention;
Fig. 3 B is the reflector vertical view of one embodiment of the invention;
Fig. 3 C is the vertical view of the light-emitting diode of one embodiment of the invention;
Fig. 4 is the profile of the light-emitting diode of Fig. 3 C along the 4-4 hatching.
Wherein, Reference numeral:
110: step
130: step
210: packaging body
214: colloid
222: the shell body
226: upper shed
230: light-emitting diode 120: step
140: step
212: substrate
220: reflector
224: inwall
228: bottom opening
Embodiment
Please refer to Fig. 1, it shows the method step flow chart of the assembling light-emitting diode of one embodiment of the invention.
Shown in step 110, make pedestal, it places a luminescence chip on a substrate, carry out operations such as generally solid crystalline substance, baking and bonding wire.Wherein substrate can be printed circuit board (PCB), ceramic substrate, metal substrate or lead frame.Luminescence chip can utilize adhesion material, and for example organic and inorganic macromolecule elargol or alloy material are fixed in luminescence chip on the substrate, carries out the bonding wire operation with gold thread or aluminum steel again.
Then shown in step 120, utilize moulding resin to encapsulate this luminescence chip of having finished solid crystalline substance to make colloid.The moulding resin that utilizes light transmission is epoxy resin for example, epoxy resin (Epoxy), polystyrene (Polystyrene; PS), acrylonitrile-butadiene-phenylethylene polymer (Acrylonitrile-Butadene-Styrene; ABS), polymethyl methacrylate (Polymethyl methacrylate; PMMA), acryl (Acrylicresin) or silica gel materials such as (Silicone), form required colloid shape with mould.Please refer to Fig. 2 A and Fig. 3 A, be respectively the packaging body side-looking and the vertical view of one embodiment of the invention.Packaging body 210 comprises substrate 212 and columniform colloid 214, wherein is fixed with a luminescence chip 216 on the substrate 212, and colloid 214 coats luminescence chip 216.
Shown in step 130, a reflector is provided, the bottom has an opening.According to embodiments of the invention, reflector can be made in the mode of plastics ejection formation in advance, and the surface of reflector can be coated with one deck reflectorized material.Please refer to Fig. 2 B and Fig. 3 B, be respectively the reflector side-looking and the vertical view of one embodiment of the invention.Reflector 220 comprises a shell body 222, has a upper shed 226 and a bottom opening 228, and the inwall of shell body 222 224 tilts and enlarges towards upper shed 226, bottom opening 228 be shaped as square.
According to embodiments of the invention, the shape of bottom opening 228 also can be polygon, in order to contact engaging with colloid 214.For example bottom opening 228 is a regular polygon, and as equilateral triangle, regular hexagon, octagon etc., when colloid 214 was cylindrical, each limit of regular polygon can be tangent with the circumference of colloid 214.The shape of bottom opening 228 also can be circle, and colloid 214 is cylindrical, and the circle of bottom opening 228 is big slightly than the circle of colloid 214, with so that colloid 214 closely is sleeved on bottom opening 228.The shape of bottom opening 228 also can be circle or ellipse, and colloid 214 is a polygon, and at least two summits of colloid 214 can join in order to the circumference with bottom opening 228, mutually engaging.
Shown in step 140, combination colloid 214 and reflector 220.Please refer to Fig. 2 C and Fig. 3 C, be respectively the side-looking and the vertical view of the light-emitting diode of one embodiment of the invention.Light-emitting diode 230 of the present invention is tangent with the circumference of columniform colloid 214 and engage mutually by the foursquare bottom opening 228 of reflector 222, finishes the assembling of light-emitting diode.
Please refer to Fig. 4, be the light-emitting diode of Fig. 3 C profile along the 4-4 hatching.Luminescence chip 216 is fixed on the substrate 212, and colloid 214 coats luminescence chip 216, and the bottom opening edge of reflector 222 and the edge of colloid 214 are tangent, closely are fastened togather.
In addition, according to another embodiment of the present invention, light-emitting diode assembling method of the present invention is also applicable to a batch production, can on a substrate, fix a plurality of luminescence chips earlier, and utilize mould on each luminescence chip, to form colloid respectively, again with each colloid with after a plurality of reflectors engage mutually, cutting substrate is divided into a plurality of light-emitting diodes again.
Though the present invention as above describes with a preferred embodiment; but it is not in order to limit the present invention; anyly know those skilled in the art; without departing from the spirit and scope of the present invention; can carry out various variations and improvement to the present invention, so protection scope of the present invention is limited by the accompanying Claim book.
Claims (7)
1. a light-emitting diode is characterized in that, comprises:
One pedestal, this pedestal includes colloid, and this colloid coats at least one luminescence chip; And
One reflector is mounted on this pedestal in the engaging mode, and has a upper shed and a bottom opening, and the inwall of this reflector tilts and enlarges towards upper shed, and the inner edge of this bottom opening is sticked in this colloid, so that this colloid is placed in this bottom opening.
2. light-emitting diode according to claim 1 is characterized in that, the periphery of this colloid engages with the inner edge of this bottom opening is tangent.
3. light-emitting diode according to claim 1 is characterized in that, this colloid is a polygon, the engaging that contacts with the inner edge of this bottom opening of at least two summits of this colloid.
4. light-emitting diode according to claim 1 is characterized in that this reflector surface has a reflective material layer.
5. light-emitting diode according to claim 1 is characterized in that the material of this colloid comprises epoxy resin, epoxy resin, polystyrene, acrylonitrile-butadiene-phenylethylene polymer, polymethyl methacrylate, acryl or silica gel.
6. the assemble method of a light-emitting diode is characterized in that, this method comprises:
Gu it is brilliant: as on a substrate, to set firmly at least one luminescence chip;
Bonding wire: utilize lead to be electrically connected respectively this luminescence chip and this substrate;
Mold pressing: carry out mold pressing and form colloid at least, respectively this colloid comprises at least one luminescence chip; And
Reflector assembling: provide a reflector to this colloid respectively, this reflector bottom has an opening, the colloid of correspondence is pressed in this opening, so that colloid that should correspondence is placed in this opening and engaging mutually.
7. according to the assemble method of the described light-emitting diode of claim 6, it is characterized in that the mold pressing step forms a plurality of colloids on this substrate, these a plurality of colloids with after corresponding reflector engages mutually, divide cutting board to become a plurality of light-emitting diodes respectively again.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100032680A CN101237012B (en) | 2007-02-02 | 2007-02-02 | LED assembly method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100032680A CN101237012B (en) | 2007-02-02 | 2007-02-02 | LED assembly method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101237012A true CN101237012A (en) | 2008-08-06 |
| CN101237012B CN101237012B (en) | 2011-03-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007100032680A Expired - Fee Related CN101237012B (en) | 2007-02-02 | 2007-02-02 | LED assembly method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101237012B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102163601A (en) * | 2010-12-31 | 2011-08-24 | 东莞市万丰纳米材料有限公司 | LED (light emitting diode) packaging module |
| CN103915555A (en) * | 2013-01-04 | 2014-07-09 | 隆达电子股份有限公司 | Manufacturing method of light emitting diode packaging structure |
-
2007
- 2007-02-02 CN CN2007100032680A patent/CN101237012B/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102163601A (en) * | 2010-12-31 | 2011-08-24 | 东莞市万丰纳米材料有限公司 | LED (light emitting diode) packaging module |
| CN103915555A (en) * | 2013-01-04 | 2014-07-09 | 隆达电子股份有限公司 | Manufacturing method of light emitting diode packaging structure |
| CN103915555B (en) * | 2013-01-04 | 2016-12-28 | 隆达电子股份有限公司 | Manufacturing method of light emitting diode packaging structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101237012B (en) | 2011-03-16 |
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Granted publication date: 20110316 Termination date: 20150202 |
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