TWI484863B - Light emitting device and electronic apparatus - Google Patents
Light emitting device and electronic apparatus Download PDFInfo
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
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- H10K50/82—Cathodes
- H10K50/824—Cathodes combined with auxiliary electrodes
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
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- H—ELECTRICITY
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Description
本發明乃有關利用有機EL(電激發光)元件等之發光元件之發光裝置。The present invention relates to a light-emitting device using a light-emitting element such as an organic EL (electroluminescence) element.
於基板上的有效範圍,配列複數的發光元件,於包圍有效範圍之周邊範圍,配置各種配線等之發光裝置。各發光元件係具有以挾持於第1電極和第2電極間之有機EL材料等的發光材料所形成之發光層。多半,此第2電極係共通於複數的發光元件而設置之共通電極,於上述有效範圍整體加以設置。但是,較具有電極本身之阻抗,在於電極的面內,產生電壓下降,經由基板之位置,供給於發光元件之電位則不均,恐發光元件亮度會由於位置而有不均之問題。於此,在於以往,設置較共通電極低阻抗的材料加以形成,與共通電極電性連接之補助電極,使共通電極的阻抗下降(例如,專利文獻1)。A plurality of light-emitting elements are arranged in an effective range on the substrate, and light-emitting devices such as various wirings are disposed in a range around the effective range. Each of the light-emitting elements has a light-emitting layer formed of a light-emitting material such as an organic EL material held between the first electrode and the second electrode. In many cases, the second electrode is a common electrode provided in common to a plurality of light-emitting elements, and is provided over the entire effective range. However, the impedance of the electrode itself is lower in the surface of the electrode, and the voltage is lowered in the surface of the electrode. The potential applied to the light-emitting element is uneven through the position of the substrate, and the brightness of the light-emitting element may be uneven due to the position. Here, in the related art, a material having a lower resistance than the common electrode is formed, and the auxiliary electrode electrically connected to the common electrode is used to lower the impedance of the common electrode (for example, Patent Document 1).
[專利文獻]日本特開2002-352963號公報[Patent Document] Japanese Patent Laid-Open Publication No. 2002-352963
但是,補助電極係例如以鋁膜等遮光性構件加以形成的情形為多。為此,為不遮蔽由發光元件射出的光線,期望通過發光元件的間隙的範圍而形成,並期望使用高精度 位置機構加以形成。對此,共通電極係以光透過性的材料而形成,於被覆有效範圍整體之範圍一樣地形成。因此,與補助電極相較,可得定位之容許誤差。因此,相較補助電極,共通電極定位的誤差會成為問題。因此,為可吸收共通電極的誤差,於基板上,期望有充分確保周邊範圍寬度(即邊框範圍),而阻礙裝置之小型化。However, the auxiliary electrode is formed by, for example, a light-blocking member such as an aluminum film. Therefore, in order not to shield the light emitted from the light-emitting element, it is desirable to form the range of the gap of the light-emitting element, and it is desirable to use high precision. The location mechanism is formed. On the other hand, the common electrode is formed of a light transmissive material, and is formed in the same range as the entire effective range of the coating. Therefore, the tolerance of the positioning can be obtained as compared with the auxiliary electrode. Therefore, the error in common electrode positioning becomes a problem compared to the auxiliary electrode. Therefore, in order to absorb the error of the common electrode, it is desirable to sufficiently ensure the width of the peripheral range (i.e., the frame range) on the substrate, and the device is prevented from being miniaturized.
又,為控制發光元件的發光之電晶體等的電路元件,係配置於共通電極或補助電極的下層。為此,於共通電極及補助電極間,設置絕緣層,使共通電極及補助電極由電路元件被絕緣。但是,絕緣層包含階差時,在與該階差重疊上層的部分,於電極恐有產生斷線或龜裂之虞。產生斷線或龜裂處因會增加電極的阻抗值之故,發光元件的亮度會變得不均。Further, a circuit element such as a transistor for controlling light emission of the light-emitting element is disposed under the common electrode or the auxiliary electrode. Therefore, an insulating layer is provided between the common electrode and the auxiliary electrode, and the common electrode and the auxiliary electrode are insulated by the circuit element. However, when the insulating layer includes a step, the portion overlapping the step with the step may cause a break or crack in the electrode. The occurrence of a broken wire or a crack may increase the impedance of the electrode, and the brightness of the light-emitting element may become uneven.
本發明係鑑於上述事情而成者,可縮小發光裝置邊框範圍之同時,提供可抑制發光元件的亮度不均之發光裝置為解決課題。The present invention has been made in view of the above circumstances, and it is possible to provide a light-emitting device capable of suppressing uneven brightness of a light-emitting element while reducing the range of the light-emitting device frame.
為解決上述課題,本發明的第1發光裝置,係於在基板上,具有排列複數之發光元件之有效範圍與包圍該有效範圍之周邊範圍,前述各發光元件乃具有在於第1電極與第2電極兩者間之發光層,前述第2電極乃共通設於前述複數之發光元件,具有為控制前述發光元件之發光的電路元件的元件層之發光層,其特徵乃具有:與前述第2電極 電性連接之補助電極,和配置於前述元件層之上層的同時,具有較前述第2電極及前述補助電極配置於下層之部分,為使前述第2電極及前述補助電極,自前述電路元件加以絕緣的絕緣層,前述第2電極乃被覆前述有效範圍,溢出於前述周邊範圍,一形式地加以形成,前述補助電極乃於前述有效範圍,通過前述複數之發光元件之間隙,形成於前述周邊範圍之一部分,於前述周邊範圍中,前述第2電極之端乃在於前述基板之面內,較前述補助電極之端及前述絕緣層之端更位於內側者。In order to solve the above problems, the first light-emitting device of the present invention has an effective range of a plurality of light-emitting elements arranged on a substrate and a peripheral range surrounding the effective range, and each of the light-emitting elements has a first electrode and a second electrode. a light-emitting layer between the electrodes, wherein the second electrode is provided in common to the plurality of light-emitting elements, and has a light-emitting layer of an element layer of a circuit element for controlling light emission of the light-emitting element, and is characterized in that: the second electrode The auxiliary electrode that is electrically connected is disposed on the upper layer of the element layer, and has a portion in which the second electrode and the auxiliary electrode are disposed on the lower layer, and the second electrode and the auxiliary electrode are provided from the circuit element. In the insulating insulating layer, the second electrode covers the effective range and overflows in the peripheral range, and is formed in one form. The auxiliary electrode is formed in the peripheral range by the gap of the plurality of light-emitting elements in the effective range. In some of the peripheral ranges, the end of the second electrode is located in the plane of the substrate, and is located further inside than the end of the auxiliary electrode and the end of the insulating layer.
於本發明的發光裝置中,補助電極之端係相較共通電極之端配置於外側。又,補助電極係於有效範圍中,通過發光元件的間隙加以形成。為此,期望使用高精度的定位機構加以形成。對此,共通電極係於被覆有效範圍整體之範圍,一樣地形成之故,共通電極形成時,定位精度無需如補助電極。即,補助電極係較共通電極為小之誤差形成之情形為多。因此,根據本發明,與使共通電極之端較補助電極之端,配置於外側之構成相較,對應補助電極的誤差,可縮小邊框範圍,可進行裝置的小型化。然後,補助電極乃較第2電極阻抗為低地加以構成。尤其,補助電極乃較第2電極以低阻抗材料形成者佳。In the light-emitting device of the present invention, the end of the auxiliary electrode is disposed outside the end of the common electrode. Further, the auxiliary electrode is formed in the effective range and formed by the gap of the light-emitting element. For this reason, it is desirable to form using a high-precision positioning mechanism. In this regard, the common electrode is formed in the same range as the entire effective range of the coating, and the positioning accuracy is not required to be the auxiliary electrode when the common electrode is formed. That is, there are many cases where the auxiliary electrode is formed with an error that is extremely small in total co-energization. Therefore, according to the present invention, compared with the configuration in which the end of the common electrode is disposed on the outer side of the auxiliary electrode, the error of the auxiliary electrode can be reduced, and the size of the frame can be reduced, and the size of the device can be reduced. Then, the auxiliary electrode is configured to have a lower impedance than the second electrode. In particular, the auxiliary electrode is preferably formed of a low-impedance material than the second electrode.
更且,於本發明的發光裝置中,共通電極之端係較絕緣層之端配置於內側。絕緣層係例如電路階差平坦化膜,為平坦化下層凸凹加厚形成的情形為多。因此,絕緣層之端係成為大的階差。對此,共通電極係以脆的材料形成, 或形成較薄之情形為多,會有由於絕緣層之端的階差影響,於共通電極產生斷線或龜裂之情形。但是,於本發明,共通電極之端係較絕緣層之端配置於內側之故,可防止共通電極斷線或龜裂。因此,可防範斷線或龜裂所造成阻抗值的增加於未然。因此,可抑制發光元件的亮度不均。於本發明較佳的形態,前述第2電極乃配置於前述補助電極的下層為佳。根據此形態,可由外氣保護第2電極。Further, in the light-emitting device of the present invention, the end of the common electrode is disposed on the inner side of the end of the insulating layer. The insulating layer is, for example, a circuit step flattening film, and is formed by flattening the lower layer convex and concave thickening. Therefore, the end of the insulating layer becomes a large step. In this regard, the common electrode is formed of a brittle material. Or there are many cases where the thinner one is formed, and there is a case where the common electrode is broken or cracked due to the step of the end of the insulating layer. However, in the present invention, the end of the common electrode is disposed on the inner side of the end of the insulating layer, and the common electrode can be prevented from being broken or cracked. Therefore, it is possible to prevent an increase in the impedance value caused by the disconnection or cracking. Therefore, unevenness in luminance of the light-emitting element can be suppressed. In a preferred aspect of the invention, the second electrode is preferably disposed on the lower layer of the auxiliary electrode. According to this aspect, the second electrode can be protected by the outside air.
更且,本發明之第2發光裝置,係屬於在於基板上,具有排列複數之發光元件之有效範圍與包圍該有效範圍之周邊範圍的發光裝置,其中,對應於各前述複數之發光元件而設置之複數之第1電極,和共通設於前述複數之發光元件之第2電極,介入存在於前述複數之第1電極與前述第2電極之發光層,與前述第2電極電性連接之補助電極,和配置為控制前述發光元件之發光電路元件之元件層,和絕緣前述第2電極或前述補助配線與前述元件層間之絕緣層,前述第2電極乃設於包含前述有效範圍整體與前述周邊範圍之至少一部分之第1之範圍,前述絕緣層乃在於前述有效範圍整體,與前述第1之範圍重疊,於前述周邊範圍,較前述第1之範圍,向第1之方向溢出之第2之範圍,前述補助電極乃於前述有效範圍,通過前述複數之發光元件之間隙地加以設置,且前述周邊範圍中,在於前述第1之範圍之內側與前述第1之範圍之外側,且通過是為前述第2之範圍之內側的範圍,到達前述第2之範圍 之外側地加以設置者。Furthermore, the second light-emitting device of the present invention belongs to a light-emitting device having an effective range in which a plurality of light-emitting elements are arranged and a peripheral range surrounding the effective range, and is provided corresponding to each of the plurality of light-emitting elements. a plurality of first electrodes and a second electrode common to the plurality of light-emitting elements, and intervening in the light-emitting layers of the plurality of first electrodes and the second electrodes, and the auxiliary electrodes electrically connected to the second electrodes And an element layer configured to control the light-emitting circuit element of the light-emitting element, and an insulating layer between the second electrode or the auxiliary wiring and the element layer, wherein the second electrode is provided to include the entire effective range and the peripheral range In the first range of at least a part of the first insulating layer, the entire effective range is overlapped with the first range, and the second range is overflowed in the first direction from the first range in the peripheral range. The auxiliary electrode is disposed in the gap of the plurality of light-emitting elements by the effective range, and the peripheral range is In the range of the inside of the first range and the outside of the first range, and the range of the inside of the second range, the range of the second range is reached. Set on the outside.
於上述第2發光裝置中,補助電極係較設置共通電極之第1範圍設置於外側的範圍。因此,補助電極之端係相較共通電極之端則配置於外側。又,補助電極係於有效範圍中,通過發光元件的間隙加以形成之故,補助電極的形成中,則使用高精度的定位機構。對此,共通電極係於被覆有效範圍整體之範圍,一形式地加以形成之故,共通電極形成時,定位精度無需如補助電極。因此,補助電極的誤差係較共通電極為小之故,根據本發明,與共通電極之端較補助電極之端,配置於外側構成相較,對應補助電極的誤差,而可縮小邊框範圍,可進行裝置的小型化。In the second light-emitting device described above, the auxiliary electrode is disposed outside the first range in which the common electrode is provided. Therefore, the end of the auxiliary electrode is disposed outside the end of the common electrode. Further, since the auxiliary electrode is in the effective range and formed by the gap of the light-emitting element, a high-precision positioning mechanism is used in the formation of the auxiliary electrode. In this regard, the common electrode is formed in one form in the entire range of the effective range of the coating. When the common electrode is formed, the positioning accuracy does not need to be an auxiliary electrode. Therefore, since the error of the auxiliary electrode is extremely smaller than the total energization, according to the present invention, the end of the auxiliary electrode is disposed closer to the outer side than the end of the auxiliary electrode, and the error of the auxiliary electrode can be reduced, thereby reducing the range of the frame. Miniaturize the device.
更且,於上述第2發光裝置中,設置共通電極之第1範圍較設置絕緣層之第2範圍配置於內側。因此,於絕緣層之端與共通電極重疊的部分中,可防範共通電極之斷線或龜裂所造成阻抗值的增加於未然。因此,可抑制發光元件的亮度不均。Further, in the second light-emitting device described above, the first range in which the common electrode is provided is disposed on the inner side than the second range in which the insulating layer is provided. Therefore, in the portion where the end of the insulating layer overlaps with the common electrode, the increase in the impedance value caused by the breakage or crack of the common electrode can be prevented. Therefore, unevenness in luminance of the light-emitting element can be suppressed.
於上述第2發光裝置較佳的形態中,前述複數之發光元件乃排列呈矩陣狀,前述補助電極乃具有通過前述複數之發光元件之間隙,且從前述有效範圍之內側到達外側地,沿第1之方向,設呈條紋狀之複數之個別電極。較佳地,前述補助電極於前述周邊範圍,更具有相互連接前述複數之個別電極之連接電極者。此時,前述絕緣層之前述第1之方向之端乃與前述連接電極重疊地,配置前述連接電極者。In a preferred aspect of the second light-emitting device, the plurality of light-emitting elements are arranged in a matrix, and the auxiliary electrode has a gap passing through the plurality of light-emitting elements and extends from the inside to the outside of the effective range. In the direction of 1 , a plurality of individual electrodes in a stripe shape are provided. Preferably, the auxiliary electrode has a connection electrode that connects the plurality of individual electrodes to each other in the peripheral range. At this time, the end of the insulating layer in the first direction is overlapped with the connection electrode, and the connection electrode is disposed.
於上述第2發光裝置另外較佳的形態中,前述複數之發光元件乃排列呈矩陣狀,前述補助電極乃通過前述複數之發光元件之間隙,且從前述有效範圍之內側到達前述第2之範圍之外側地,沿前述第1之方向,設呈條紋狀之複數之個別電極。In a further preferred embodiment of the second light-emitting device, the plurality of light-emitting elements are arranged in a matrix, and the auxiliary electrode passes through a gap of the plurality of light-emitting elements and reaches the second range from the inside of the effective range. On the outer side, a plurality of individual electrodes in a stripe shape are provided along the first direction.
又,對於上述第2發光裝置,於上述任一形態中,於前述第2電極,為供給電位之第2電極用電源線,則與前述第1之方向交叉地,設置於前述周邊範圍,前述第2電極用電源線乃與前述補助電極電性連接者。此時,較佳地,前述第2電極用電源線乃設於前述第1之範圍之外側者。In the above-described second light-emitting device, the second electrode is a second electrode power supply line that supplies a potential, and is disposed in the peripheral range so as to intersect the first direction. The second electrode power supply line is electrically connected to the auxiliary electrode. In this case, it is preferable that the second electrode power supply line is provided on the outer side of the first range.
更且,本發明係亦可作為具有上述任一形態的第1或第2發光裝置之電子機器。根據此電子機器,可達成上述任一效果。Furthermore, the present invention can also be used as an electronic device having the first or second light-emitting device of any of the above aspects. According to this electronic device, any of the above effects can be achieved.
以下,參照附加圖面,說明關於本發明之實施形態。然而,於圖面中,使各部之尺寸比率與實際者適切變更而說明。Hereinafter, embodiments of the present invention will be described with reference to additional drawings. However, in the drawing, the size ratio of each part is changed as appropriate to the actual person.
圖1(A)係顯示關於本發明第1實施形態之發光裝置1的構成一部分概略平面圖,圖1(B)係於圖1(A)的狀態後,更加形成補助電極150及畫素電極76狀態之平面圖。如圖1(A)所示,此發光裝置1係具備基板10及可撓 性配線基板20。基板10的端部中,形成連接端子,形成於此連接端子和可撓性配線基板20之連接端子則藉由含有稱為ACF(anisotropic conductive film:向異性導電膜)之導電粒子之薄膜狀黏著劑加以壓著固定。又,可撓性配線基板20中,設置資料線驅動電路200,更且,藉由可撓性配線基板20,各種電源電壓則供給於基板10。Fig. 1(A) is a schematic plan view showing a part of a configuration of a light-emitting device 1 according to a first embodiment of the present invention, and Fig. 1(B) is a state in which the auxiliary electrode 150 and the pixel electrode 76 are further formed after the state of Fig. 1(A). Plan of the state. As shown in FIG. 1(A), the light-emitting device 1 is provided with a substrate 10 and is flexible. The wiring board 20 is provided. A connection terminal is formed in an end portion of the substrate 10, and a connection terminal formed between the connection terminal and the flexible wiring substrate 20 is formed by a film-like adhesion containing conductive particles called an ACF (anisotropic conductive film). The agent is fixed by pressing. Moreover, the data line drive circuit 200 is provided in the flexible wiring board 20, and various power supply voltages are supplied to the board|substrate 10 by the flexible wiring board 20.
基板10中,設置有效範圍A和該外側(即,基板或基板10外周的有效範圍A間)的周邊範圍B。周邊範圍B中,形成掃描線驅動電路100A及100B,以及預充電電路120。預充電電路120係於寫入動作之前,將資料線112的電位設定在特定的電位電路。掃描線驅動電路100A及100B,預充電電路120係有效範圍A的周邊之周邊電路。但是,周邊電路可含有檢查單位電路P或配線良窳之檢查電路(未圖示),資料線驅動電路200為設置於周邊範圍B之周邊電路亦可。In the substrate 10, a peripheral range B of the effective range A and the outer side (that is, between the effective range A of the outer periphery of the substrate or the substrate 10) is set. In the peripheral range B, scanning line driving circuits 100A and 100B and precharge circuit 120 are formed. The precharge circuit 120 sets the potential of the data line 112 to a specific potential circuit before the write operation. The scanning line driving circuits 100A and 100B are preamplifier circuits 120 which are peripheral circuits of the effective range A. However, the peripheral circuit may include an inspection circuit (not shown) for inspecting the unit circuit P or the wiring, and the data line driving circuit 200 may be a peripheral circuit provided in the peripheral range B.
有效範圍A中,形成複數掃描線111和複數資料線112,於此等交叉點各附近中,設置複數單位電路(畫素電路)P。單位電路P係含有OLED(organic light emitting diode)元件,由電流供給線113接受供電。複數電流供給線113係連接於第1電極用電源線130。In the effective range A, the complex scanning line 111 and the complex data line 112 are formed, and in the vicinity of each of the intersections, a complex unit circuit (pixel circuit) P is provided. The unit circuit P includes an OLED (organic light emitting diode) element, and receives power from the current supply line 113. The complex current supply line 113 is connected to the first electrode power supply line 130.
圖2乃顯示發光裝置1的單位電路P之詳細電路圖。各單位電路P係含有n通道型電晶體68,p通道型電晶體60,電容元件69,及發光元件(OLED元件)70。p通道型電晶體60之源極電極乃連接於電流供給線113,另一方 面該汲極電極乃連接於發光元件70之陽極。又,於電晶體60之源極電極和閘極電極間,設置電容元件69。n通道型電晶體68之閘極電極乃連接於掃描線111,該源極電極乃連接於資料線112,該汲極電極乃與電晶體60之閘極電極連接。2 is a detailed circuit diagram showing a unit circuit P of the light-emitting device 1. Each unit circuit P includes an n-channel type transistor 68, a p-channel type transistor 60, a capacitor element 69, and a light-emitting element (OLED element) 70. The source electrode of the p-channel type transistor 60 is connected to the current supply line 113, and the other side The surface of the drain electrode is connected to the anode of the light-emitting element 70. Further, a capacitor element 69 is provided between the source electrode and the gate electrode of the transistor 60. The gate electrode of the n-channel transistor 68 is connected to the scan line 111, and the source electrode is connected to the data line 112, which is connected to the gate electrode of the transistor 60.
單位電路P係使對應於該單位電路之掃描線111,藉由掃描線驅動電路100A及100B加以選擇時,電晶體68則開啟將藉由資料線112所供給資料訊號保持於內部的電容元件69。然後,電晶體60對應資料訊號位準電流,供給於發光元件70。由此,發光元件70係以對應資料訊號位準亮度而發光。The unit circuit P is such that when the scanning line 111 corresponding to the unit circuit is selected by the scanning line driving circuits 100A and 100B, the transistor 68 turns on the capacitor element 69 which holds the data signal supplied from the data line 112. . Then, the transistor 60 is supplied to the light-emitting element 70 corresponding to the data signal level current. Thereby, the light-emitting element 70 emits light in accordance with the brightness of the data signal level.
又,如圖1(A)所示,周邊範圍B的外周部側(即基板或基板10外周和周邊範圍B間)中,形成ㄈ字狀的第2電極用電源線140。第2電極用電源線140係如後述,於發光元件的陰極(第2電極)供給電源電壓(此例中,Vss:接地線)之配線。然而,代替第2電極用電源線140配設呈ㄈ字狀(即,沿著基板10的3邊),沿著基板10對向的2邊加以設置形態亦可。即,圖示例中,沿著各掃描線驅動電路100A及100B加以配設亦可。Further, as shown in FIG. 1(A), in the outer peripheral portion side of the peripheral range B (that is, between the outer periphery of the substrate or the substrate 10 and the peripheral portion B), a U-shaped second electrode power supply line 140 is formed. The second electrode power supply line 140 is a wiring for supplying a power source voltage (in this example, Vss: ground line) to the cathode (second electrode) of the light-emitting element as will be described later. However, instead of the second electrode power supply line 140 being disposed in a U shape (that is, along the three sides of the substrate 10), the two sides facing each other along the substrate 10 may be provided. That is, in the example of the drawing, the scanning line driving circuits 100A and 100B may be disposed.
發光元件70係具有挾持畫素電極76(陽極)和共通電極72(陰極)間之發光機能層(含有發光層)74(參照圖4)。共通電極72係形成於跨有如圖1(B)所示有效範圍A整體和周邊範圍B一部份範圍(第1範圍)。又,連接共通電極72和第2電極用電源線140之補助電極150,於周邊範圍 B,被覆周邊電路地加以形成。補助電極150係包含設置於有效範圍A之補助電極的第1部分150a和設置於周邊範圍B之補助電極的第2部分150b。有效範圍A中,不接觸補助電極150的第1部分150a和畫素電極76地,補助電極150的第1部分150a乃形成於格子狀。即,於發光元件70的間隙,配置補助電極150的第1部分150a。本說明書所謂補助電極,重疊於共通電極72加以電性連接,使共通電極72的阻阬下降之導體。為更明確,圖3顯示擴大圖1(B)的一部分。The light-emitting element 70 has an illuminating function layer (including a light-emitting layer) 74 between the pixel electrode 76 (anode) and the common electrode 72 (cathode) (see FIG. 4). The common electrode 72 is formed to span a range of the effective range A as shown in FIG. 1(B) and a part of the peripheral range B (first range). Further, the auxiliary electrode 150 connecting the common electrode 72 and the second electrode power supply line 140 is in the peripheral range B, formed by covering the peripheral circuits. The auxiliary electrode 150 includes a first portion 150a of the auxiliary electrode provided in the effective range A and a second portion 150b of the auxiliary electrode provided in the peripheral range B. In the effective range A, the first portion 150a of the auxiliary electrode 150 and the pixel electrode 76 are not in contact with each other, and the first portion 150a of the auxiliary electrode 150 is formed in a lattice shape. That is, the first portion 150a of the auxiliary electrode 150 is disposed in the gap of the light-emitting element 70. In the present specification, the auxiliary electrode is a conductor that is electrically connected to the common electrode 72 and is connected to the common electrode 72 to lower the resistance of the common electrode 72. To be more specific, Figure 3 shows an enlargement of a portion of Figure 1 (B).
此實施形態的發光裝置1係以頂發射之形式構成,由發光機能層74的光,則通過共通電極72射出。共通電極72乃由透明材料所形成。為此,周邊範圍B無法經由共通電極72遮光。另一方面,上述補助電極150中,使用具有導電性及遮光性金屬之故,可經由補助電極150遮光。由此,於周邊電路入射光線,可抑制發生光電流。又,補助電極150係可以有效範圍A的畫素電極76同一工程加以形成獲得。因此,於周邊範圍B,無需為附加遮光性,加上特別的工程。The light-emitting device 1 of this embodiment is configured to emit in the form of a top emission, and the light from the light-emitting function layer 74 is emitted through the common electrode 72. The common electrode 72 is formed of a transparent material. For this reason, the peripheral range B cannot be shielded from light by the common electrode 72. On the other hand, in the auxiliary electrode 150, since the conductive and light-shielding metal is used, the auxiliary electrode 150 can be shielded from light. Thereby, light is incident on the peripheral circuit, and the occurrence of photocurrent can be suppressed. Further, the auxiliary electrode 150 can be obtained by forming the pixel electrode 76 of the effective range A in the same manner. Therefore, in the peripheral range B, it is not necessary to add special light shielding properties, and special engineering is added.
圖4乃顯示發光裝置1的部分截面圖。於同圖中,有效範圍A中,形成發光元件70,另一方面,於周邊範圍B中,形成周邊電路之掃描線驅動電路100A。於同圖中,發光裝置1的上面,成為射出光線之射出面。如同圖所示,於基板10上,形成基材保護層31,於其上,形成電晶體40,50及60。電晶體40係為n通道型、電晶體 50及60係p通道型。電晶體40,50係掃描線驅動電路100A的一部分,電晶體60和發光元件70係單位電路P的一部份。4 is a partial cross-sectional view showing the light-emitting device 1. In the same figure, in the effective range A, the light-emitting element 70 is formed, and on the other hand, in the peripheral range B, the scanning line drive circuit 100A of the peripheral circuit is formed. In the same figure, the upper surface of the light-emitting device 1 serves as an emitting surface for emitting light. As shown in the figure, on the substrate 10, a substrate protective layer 31 is formed on which transistors 40, 50 and 60 are formed. The transistor 40 is an n-channel type, transistor 50 and 60 series p channel type. The transistor 40, 50 is part of the scanning line driving circuit 100A, and the transistor 60 and the light emitting element 70 are part of the unit circuit P.
電晶體40、50及60係設於形成於基板10的表面氧化矽為主體之基材保護層31上。基材保護層31上層中,形成矽層401、501及601。被覆矽層401、501及601地,閘極絕緣層32則設置於基材保護層31的上層。閘極絕緣層32係例如由氧化矽所成。閘極絕緣層32的上面中,對向於矽層401、501及601部分,設置閘極電極42、52及62。於電晶體40,藉由閘極電極42,於矽層401中,摻雜V族元素,形成汲極範圍40c及源極範圍40a。於此,未摻雜V族元素範圍,成為通道範圍40b。The transistors 40, 50, and 60 are provided on the substrate protective layer 31 mainly composed of ruthenium oxide formed on the surface of the substrate 10. In the upper layer of the substrate protective layer 31, germanium layers 401, 501, and 601 are formed. The gate insulating layer 32 is provided on the upper layer of the substrate protective layer 31 in the cap layer 401, 501, and 601. The gate insulating layer 32 is made of, for example, hafnium oxide. In the upper surface of the gate insulating layer 32, gate electrodes 42, 52, and 62 are provided opposite to the germanium layers 401, 501, and 601. In the transistor 40, the gate electrode 401 is doped with a group V element by the gate electrode 401 to form a drain region 40c and a source region 40a. Here, the undoped group V element range becomes the channel range 40b.
於電晶體50及60,藉由閘極電極52及62,於矽層501及601中,藉由閘極電極52及62,摻雜III族元素,形成汲極範圍50a及60a,以及源極範圍50c及60c。於此,未摻雜III族元素範圍,成為通道範圍50b及60b。然而,形成電晶體40、50及60的閘極電極42、52及62之同時,形成掃描線111。In the transistors 50 and 60, the gate electrodes 52 and 62 are doped with the group III elements by the gate electrodes 52 and 62 to form the drain regions 50a and 60a, and the source. Ranges 50c and 60c. Here, the range of the undoped group III element becomes the channel range 50b and 60b. However, while the gate electrodes 42, 52, and 62 of the transistors 40, 50, and 60 are formed, the scanning line 111 is formed.
第1層間絕緣層33,則被覆閘極電極42、52及62,而形成於閘極絕緣層32的上層。第1層間絕緣層33的材料中,使用氧化矽等。更且,源極電極41、51及63、汲極、源極電極43,以及汲極電極61則在於閘極絕緣層32及第1層間絕緣層33,藉由開孔連接孔,與矽層401、501及601連接。又,以與此等電極同一工程,形成第2 電極用電源線140、資料線112及電流供給線113。此等電極及第2電極用電源線140等乃以具有導電性鋁等之材料形成。The first interlayer insulating layer 33 is formed on the upper layer of the gate insulating layer 32 by covering the gate electrodes 42, 52 and 62. As the material of the first interlayer insulating layer 33, ruthenium oxide or the like is used. Furthermore, the source electrodes 41, 51 and 63, the drain electrode, the source electrode 43, and the drain electrode 61 are in the gate insulating layer 32 and the first interlayer insulating layer 33, and the opening layer is connected to the germanium layer. 401, 501 and 601 are connected. In addition, the same project as these electrodes forms the second The electrode power supply line 140, the data line 112, and the current supply line 113. These electrodes and the second electrode power supply line 140 and the like are formed of a material having conductive aluminum or the like.
電路保護膜34被覆源極電極41、51及63,汲極、源極電極43、汲極電極61、以及第2電極用電源線140地,設置於第1層間絕緣層33的上層。電路保護膜34係例如由氮化矽或氧化矽等氣體透過率低的材料所形成。又,此等氮化矽或氮氧化矽可為非晶質材料,包含氫亦可。經由電路保護膜34,可防止電晶體40、50、及60等之氫的脫離。然而,將電路保護膜34形成於源極電極或汲極電極下亦可。The circuit protection film 34 is covered with the source electrodes 41, 51, and 63, and the drain electrode, the source electrode 43, the drain electrode 61, and the second electrode power supply line 140 are provided on the upper layer of the first interlayer insulating layer 33. The circuit protection film 34 is formed of, for example, a material having a low gas permeability such as tantalum nitride or ruthenium oxide. Further, such tantalum nitride or lanthanum oxynitride may be an amorphous material and may contain hydrogen. The detachment of hydrogen of the transistors 40, 50, 60, and the like can be prevented via the circuit protection film 34. However, it is also possible to form the circuit protection film 34 under the source electrode or the drain electrode.
第2層間絕緣膜35係設置於電路保護膜34的上層。於此,第2層間絕緣膜係設置於源極電極41、51及63,汲極、源極電極43、汲極電極61、以及第2電極用電源線140,和後述畫素電極76、補助電極150或共通電極72間,此等則達到絕緣效果。此時,不使供給於掃描線或訊號線之訊號延遲,設定膜厚。然而,第2層間絕緣膜35係較對向電路保護膜34之下面凹凸,使與電路保護膜34相反上面的凹凸為小者為佳。即,為平坦化電晶體40,50,60掃描線111,資料線112,電流供給線113等所產生凹凸,使用第2層間絕緣膜35。此第2層間絕緣膜35係在有效範圍A整體與上述第1範圍重疊(形成共通電極72之範圍),在周邊範圍B,較第1範圍,設置於向第1方向溢出之第2範圍。更詳細而言,於本實施形態, 於配設基板10的4邊中之第2電極用電源線140之左右兩邊及上邊之至少3邊側,第2範圍較第1範圍,向基板10面內之外側方向突出。The second interlayer insulating film 35 is provided on the upper layer of the circuit protective film 34. Here, the second interlayer insulating film is provided on the source electrodes 41, 51, and 63, the drain electrode, the source electrode 43, the drain electrode 61, and the second electrode power supply line 140, and the pixel electrode 76 and the support described later. Between the electrode 150 or the common electrode 72, these achieve an insulating effect. At this time, the film thickness is set without delaying the signal supplied to the scanning line or the signal line. However, the second interlayer insulating film 35 is more uneven than the lower surface of the counter circuit protective film 34, and it is preferable that the unevenness on the surface opposite to the circuit protective film 34 is small. That is, the second interlayer insulating film 35 is used to flatten the crystals 40, 50, 60, the scanning line 111, the data line 112, the current supply line 113, and the like. The second interlayer insulating film 35 is formed so as to overlap the first range (the range in which the common electrode 72 is formed) in the effective range A as a whole, and is provided in the second range which overflows in the first direction in the peripheral range B from the first range. More specifically, in this embodiment, At least three sides of the left and right sides and the upper side of the second electrode power supply line 140 among the four sides of the substrate 10 are disposed, and the second range is smaller than the first range, and protrudes in the in-plane direction of the substrate 10.
第2層間絕緣層35的材料中,例如使用丙烯酸系、聚醯亞胺系的有機高分子材料。此時,於有機樹脂混合為圖案化的感光性材料,與光阻膜相同進行曝光而圖案化。或者,由氧化矽、氮氧化矽等無機材料經由化學氣相成長法(chemical vapor deposition:CVD)形成第2層間絕緣膜35,經由蝕刻法等,平坦化該上面亦可。無機材料係經由化學氣相成長法形成膜時,該膜厚係1μm以下,且幾近一樣之故,相較於上面容易接受下層凹凸的影響,有機樹脂係經由塗佈形成之故,該膜厚可大於2~3μm程度,且,該上面係難以受下層凹凸的影響之故,而適於做為第2層間絕緣膜35的材料。尤其,容許某種程度的凹凸的話,可將氧化矽,氧氮化矽等無機材料適用於第2層間絕緣膜35。如以上所述,第2層間絕緣膜係必需特定的膜厚之故,於周邊範圍會發生階差。Among the materials of the second interlayer insulating layer 35, for example, an acrylic or polyimine-based organic polymer material is used. At this time, the photosensitive material mixed with the organic resin as a pattern is exposed and patterned in the same manner as the photoresist film. Alternatively, the second interlayer insulating film 35 may be formed by an inorganic material such as cerium oxide or cerium oxynitride via chemical vapor deposition (CVD), and the upper surface may be planarized by an etching method or the like. When the inorganic material is formed into a film by a chemical vapor phase growth method, the film thickness is 1 μm or less, and nearly the same, the organic resin is formed by coating, and the film is formed by coating. The thickness can be more than about 2 to 3 μm, and the upper surface is hardly affected by the unevenness of the lower layer, and is suitable as the material of the second interlayer insulating film 35. In particular, when a certain degree of unevenness is allowed, an inorganic material such as cerium oxide or cerium oxynitride can be applied to the second interlayer insulating film 35. As described above, the second interlayer insulating film is required to have a specific film thickness, and a step is generated in the peripheral range.
於第2層間絕緣膜35上,於有效範圍A形成畫素電極76(第1電極)及補助電極的第1部分150a之同時,於周邊範圍B,形成補助電極的第2部分150b。即,畫素電極76和補助電極150係於同一層,使用同一材料,同時形成。此實施形態之畫素電極76係發光元件70的陽極,於每一發光元件70相互隔離形成,藉由貫通第2層間絕緣膜35及電路保護膜34之連接孔,與電晶體60的汲極 電極61連接。又,做為陽極之畫素電極76的材料,期望為工作函數大的材料,例如,適合為鎳、金、白金等或此等合金。此等的材料係具有反射性之故,將發光機能層74所發光之光線朝向共通電極72反射。此時,補助電極150亦由此等材料形成。On the second interlayer insulating film 35, the pixel electrode 76 (first electrode) and the first portion 150a of the auxiliary electrode are formed in the effective range A, and the second portion 150b of the auxiliary electrode is formed in the peripheral region B. That is, the pixel electrode 76 and the auxiliary electrode 150 are formed in the same layer and formed using the same material. The pixel electrode 76 of this embodiment is an anode of the light-emitting element 70, and is formed separately from each other by the light-emitting element 70, and penetrates the connection hole of the second interlayer insulating film 35 and the circuit protection film 34, and the drain of the transistor 60. The electrodes 61 are connected. Further, as the material of the anode pixel electrode 76, a material having a large work function is desired, and for example, nickel, gold, platinum, or the like is suitable. These materials are reflective, and the light emitted by the luminescent function layer 74 is reflected toward the common electrode 72. At this time, the auxiliary electrode 150 is also formed of such a material.
又,作為畫素電極76,包含具備工作函數高之如ITO(indium tin oxide)、IZO(indium zinc oxide)、或ZnO2 之氧化導電材料所成光透過性、導電性之第1層,和反射性的金屬,例如包含由鋁膜所成第2層,於發光機能層側設置第1層而構成亦可。此時,補助電極150係可具有第1層和第2層兩方,具有此等任一層亦可。Further, the pixel electrode 76 includes a first layer having a light transmittance and conductivity of an oxidized conductive material such as ITO (indium tin oxide), IZO (indium zinc oxide), or ZnO 2 having a high work function, and The reflective metal may include, for example, a second layer made of an aluminum film and a first layer provided on the side of the light-emitting function layer. At this time, the auxiliary electrode 150 may have both the first layer and the second layer, and may have any of these layers.
補助電極150係於有效範圍A,通過複數的發光元件70的間隙而形成呈格子狀(第1部分150a),於周邊範圍,形成第2層間絕緣膜35之第2範圍,則在較形成共通電極72之第1範圍溢出側(本實施形態中,基板10的左右兩邊及上邊側),通過第1範圍的內側和第1範圍的外側中且第2範圍的內側範圍,到達第2範圍的外側而形成(第2部分150b)。補助電極150係於周邊範圍B,藉由形成電路保護膜34之連接孔,與第2電極用電源線140連接。如圖所示,於第2電極用電源線140上,未形成第2層間絕緣膜35,僅於電路保護膜34形成連接孔,可將補助電極150的第2部分150b直接接觸於第2電極用電源線140。The auxiliary electrode 150 is formed in a lattice shape (first portion 150a) by a gap of the plurality of light-emitting elements 70, and forms a second range of the second interlayer insulating film 35 in the peripheral region in the effective range A. The first range overflow side of the electrode 72 (in the present embodiment, the left and right sides and the upper side of the substrate 10) pass through the inner side of the first range and the outer side of the first range and the inner range of the second range, and reach the second range. Formed on the outside (second part 150b). The auxiliary electrode 150 is connected to the second electrode power supply line 140 by forming a connection hole of the circuit protection film 34 in the peripheral range B. As shown in the figure, the second interlayer insulating film 35 is not formed on the second electrode power supply line 140, and only the connection hole is formed in the circuit protection film 34, and the second portion 150b of the auxiliary electrode 150 can be directly in contact with the second electrode. Use power cord 140.
接著,形成間隔壁37。間隔壁37係將各畫素電極76 的外形緣經由間隔壁37加以被覆形成而具有開口部37a。因此,開口部37a的各整體係重疊於畫素電極76,在形成發光機能層74的前階段中,通過開口部37a,露出畫素電極76。間隔壁37係絕緣畫素電極76與之後形成之共通電極72(第2電極)間,或絕緣複數的畫素電極76之間。經由設置間隔壁37,可獨立控制各畫素電極76,可將複數的發光元件以各個特定的亮度發光。即,間隔壁37係分割複數的發光元件。例如,丙烯酸或聚醯亞胺等為間隔壁37的絕緣性材料。此時,混合為了圖案化的感光性材料,與光阻膜相同以曝光加以圖案化。間隔壁37中同時形成連接孔CH。於有效範圍A中,藉由此連接孔CH,連接與補助電極150的第1部分150a與後述之共通電極72。又,於周邊範圍B之補助電極150的第2部分150b上,未設置與間隔壁37之同一層。Next, the partition wall 37 is formed. The partition wall 37 is a layer of each pixel electrode 76 The outer edge of the outer shape is covered by the partition wall 37 and has an opening 37a. Therefore, each of the openings 37a is superposed on the pixel electrode 76, and the pixel electrode 76 is exposed through the opening 37a in the previous stage of forming the luminescent function layer 74. The partition wall 37 is between the insulating pixel electrode 76 and the common electrode 72 (second electrode) formed later, or between the insulating pixel electrodes 76. By providing the partition walls 37, the respective pixel electrodes 76 can be independently controlled, and a plurality of light-emitting elements can be illuminated with respective specific brightnesses. That is, the partition wall 37 divides a plurality of light-emitting elements. For example, acrylic acid or polyimine or the like is an insulating material of the partition wall 37. At this time, the photosensitive material to be patterned is mixed and patterned by exposure as in the case of the photoresist film. A connection hole CH is simultaneously formed in the partition wall 37. In the effective range A, the first portion 150a of the auxiliary electrode 150 and the common electrode 72 to be described later are connected by the connection hole CH. Moreover, the same layer as the partition wall 37 is not provided in the second portion 150b of the auxiliary electrode 150 in the peripheral range B.
接著,於畫素電極76上,至少形成包含發光層之發光機能層74。發光層中使用有機EL物質。有機EL物質可為低分子材料,亦可為高分子材料。作為構成發光機能層74之其他層,具備正孔植入層、正孔輸送層、電子輸送層、電子植入層、正孔阻隔層、及電子阻隔層的一部分或全部亦可。Next, at least the luminescent function layer 74 including the luminescent layer is formed on the pixel electrode 76. An organic EL substance is used in the light-emitting layer. The organic EL material may be a low molecular material or a high molecular material. The other layer constituting the luminescence functional layer 74 may include a part or all of the positive hole implantation layer, the positive hole transport layer, the electron transport layer, the electron implantation layer, the positive hole barrier layer, and the electron blocking layer.
接著,在於有效範圍A及周邊範圍B,被覆補助電極150及發光機能層74,而形成共通電極72(第2電極)。共通電極72為透光性,由發光元件70的光線係透過共通電極72,向圖中上側的方向射出。為了將此實施形態之共 通電極72做為所有發光元件70的陰極加以工作,使共通電極72容易注入電子地,經由工作函數低的材料加以形成。例如鋁、鈣、鎂、或鋰金屬或此等之金屬化合物。又,此合金係期望使用工作函數低的材料和安定化該材料之材料。例如,鎂和銀合金為適切者。將此等金屬或合金使用於共通電極72時,為獲得透光性,縮小厚度即可。Next, the auxiliary electrode 150 and the light-emitting function layer 74 are covered in the effective range A and the peripheral range B to form the common electrode 72 (second electrode). The common electrode 72 is translucent, and the light from the light-emitting element 70 is transmitted through the common electrode 72 and is emitted in the upper direction in the drawing. In order to share this embodiment The through electrode 72 operates as a cathode of all of the light-emitting elements 70, and the common electrode 72 is easily injected into the electrons and formed by a material having a low work function. For example, aluminum, calcium, magnesium, or lithium metal or such metal compounds. Also, this alloy is expected to use a material having a low work function and a material that stabilizes the material. For example, magnesium and silver alloys are suitable. When these metals or alloys are used for the common electrode 72, in order to obtain light transmittance, the thickness may be reduced.
又,共通電極72(第2電極),包含上述工作函數低之材料,或工作函數低之材料和安定化該材料所成第1層,和如ITO(氧化銦錫)、IZO(氧化銦鋅)、或ZnO2 之氧化導電材料所成光透過性、導電性之第2層;於發光機能層側設置第1層而構成亦可。如ITO、IZO、或ZnO2 的氧化導電材料係緊密的素材,氣體透過率為低。於如此的材料,形成共通電極72時,共通電極72為在於有效範圍A及周邊範圍B加以形成之故,可使有效範圍A的單位電路P及周邊範圍B的周邊電路由外氣保護,而抑制此等劣化。如此,共通電極72(第2電極)為包含上述第2層之構成時,與構成第1層材料相比,光透過性、導電性為優之故,可大幅減低共通電極72的電源阻抗之同時,可提升由發光機能層的光取出效率。又,共通電極72(第2電極)經由包含由工作函數低的材料和安定化該材料所成第1層,和由上述氧化導電材料所成第2層而構成,使第1層和第2層反應,可防止電子植入效率劣化。Further, the common electrode 72 (second electrode) includes a material having a low work function, a material having a low work function, and a first layer which is stabilized by the material, and such as ITO (indium tin oxide) or IZO (indium zinc oxide). Or a second layer which is light-transmitting and conductive by the oxidized conductive material of ZnO 2 and a first layer provided on the side of the light-emitting function layer. An oxidized conductive material such as ITO, IZO, or ZnO 2 is a close material and has a low gas permeability. When the common electrode 72 is formed in such a material, the common electrode 72 is formed in the effective range A and the peripheral range B, so that the peripheral circuits of the unit circuit P and the peripheral range B of the effective range A can be protected by the outside air. This deterioration is suppressed. When the common electrode 72 (second electrode) is configured to include the second layer, the light transmittance and conductivity are superior to those of the first layer material, and the power supply impedance of the common electrode 72 can be greatly reduced. At the same time, the light extraction efficiency by the illuminating function layer can be improved. Further, the common electrode 72 (second electrode) is formed by including a material having a low work function and a first layer formed by stabilizing the material, and a second layer formed of the oxidized conductive material, so that the first layer and the second layer are formed. The layer reaction prevents deterioration of electron implantation efficiency.
又,在形成共通電極72之前,於間隔壁37,形成連接孔CH。藉由此連接孔CH,於有效範圍A,連接補助電 極的第1部分150a與共通電極72。於有效範圍A,於形成呈格子狀之補助電極的第1部分150a(參照圖1(B)),經由連接共通電極72,可大幅減低共通電極72的電源阻抗。除此之外,補助電極的第2部分150b,係於周邊範圍B,不經由間隔壁37被覆之故,與共通電極72在廣面積面接觸之故,可降低接續阻阬。因此,可大幅減低電源阻抗。Further, before the formation of the common electrode 72, the connection hole CH is formed in the partition wall 37. By connecting the hole CH, in the effective range A, connecting the auxiliary power The first portion 150a of the pole and the common electrode 72. In the effective range A, the first portion 150a (see FIG. 1(B)) in which the auxiliary electrode is formed in a lattice shape can greatly reduce the power supply impedance of the common electrode 72 by connecting the common electrode 72. In addition, the second portion 150b of the auxiliary electrode is in the peripheral range B and is not covered by the partition wall 37, so that the common electrode 72 is in contact with the wide-area surface, so that the connection resistance can be reduced. Therefore, the power supply impedance can be greatly reduced.
接著,被覆共通電極72及補助電極150,形成封閉膜80。封閉膜80中,例如,使用透明度高、防濕性良好的氧氮化矽、氧化矽等氣體透過率低的無機材料。此封閉膜80係被覆周邊電路(具有電晶體40,50之掃描線驅動電路100A、100B及預充電電路120)的範圍整體。惟,基板10的外端緣中,不形成封閉膜80,於此外端緣中,於電路保護膜34上,接合密封材90,於該上部,接合透明封閉基板(對向基板)110。密封材90係例如可為黏著劑,亦可將為保持對向基板110之間隔物以黏著劑加以黏合。Next, the common electrode 72 and the auxiliary electrode 150 are covered to form a sealing film 80. In the sealing film 80, for example, an inorganic material having a low gas permeability such as yttrium oxynitride or cerium oxide having high transparency and good moisture resistance is used. The sealing film 80 covers the entire range of the peripheral circuits (the scanning line driving circuits 100A and 100B having the transistors 40 and 50 and the precharge circuit 120). However, in the outer end edge of the substrate 10, the sealing film 80 is not formed, and in the other end edge, the sealing material 90 is bonded to the circuit protection film 34, and the transparent sealing substrate (opposing substrate) 110 is bonded to the upper portion. The sealing material 90 may be, for example, an adhesive, or may be adhered by an adhesive to maintain the spacer of the opposite substrate 110.
圖5乃圖4之範圍C的簡略截面圖。即,周邊範圍B中,較掃描線驅動電路100一部分之電晶體40,50為外側之端部的截面圖。為方便說明,將如圖4所示基材保護層31,閘極絕緣層32,第1層間絕緣層33,電路保護膜34及顯示挾於此等各層之電晶體40、50及60的各電極,於圖5中做為元件層30加以整體顯示。於此元件層30內的上層部中,形成第2電極用電源線140,如上述,第2電極用電源線140的上面,係做為上層的電極和接點 範圍加以工作。圖4中,除了元件層30及第2電極用電源線140之外,顯示第2層間絕緣膜35、補助電極150、共通電極72、封閉膜80、密封材90及對向基板110。以下,參照此圖,對於各層的相對位置關係,詳細加以說明。Figure 5 is a schematic cross-sectional view of the range C of Figure 4. That is, in the peripheral range B, the transistor 40, 50 which is a part of the scanning line driving circuit 100 is a cross-sectional view of the outer end portion. For convenience of explanation, the substrate protective layer 31, the gate insulating layer 32, the first interlayer insulating layer 33, the circuit protective film 34, and the transistors 40, 50, and 60 each of which is shown in FIG. The electrode is shown as an element layer 30 in Fig. 5 as a whole. The second electrode power supply line 140 is formed in the upper layer portion of the element layer 30. As described above, the upper surface of the second electrode power supply line 140 is used as the upper electrode and the contact. The scope works. In FIG. 4, in addition to the element layer 30 and the second electrode power supply line 140, the second interlayer insulating film 35, the auxiliary electrode 150, the common electrode 72, the sealing film 80, the sealing material 90, and the counter substrate 110 are displayed. Hereinafter, the relative positional relationship of each layer will be described in detail with reference to this drawing.
然而,如上述,第2層間絕緣膜35係將經由配置於下層之電晶體或配線等所產生之凹凸,為平坦化而使用。另外,第2層間絕緣膜35係具有以丙烯酸系、聚醯亞胺系絕緣性有機高分子材料等形成之故,具有自配置於元件層30內之電晶體40、50、60等電路元件,絕緣陽極76、共通電極72、補助電極150等電極之機能。即,做為自控制發光元件的發光之電路元件絕緣各電極之絕緣層加以工作。However, as described above, the second interlayer insulating film 35 is used for flattening through irregularities generated by a transistor or wiring disposed in the lower layer. In addition, the second interlayer insulating film 35 is formed of an acrylic or polyimide-based insulating organic polymer material, and has circuit elements such as transistors 40, 50, and 60 disposed in the element layer 30. The functions of the electrodes such as the insulating anode 76, the common electrode 72, and the auxiliary electrode 150. That is, it functions as an insulating layer for insulating the respective electrodes from the circuit element for controlling the light emission of the light-emitting element.
如圖5所示,包含第2電極用電源線140之元件層30的上層中,形成第2層間絕緣膜35,第2層間絕緣膜35之端E2係較第2電極用電源線140的接點範圍的內側之端E3更為內側。挾持於第2層間絕緣膜35上面,和挾於元件層30上面中的第2層間絕緣膜35之端E2和端E3範圍及接點範圍中,形成補助電極150的第2部分150b(以下,單稱為「補助電極150」)。由此,補助電極150係與第2電極用電源線140連接重疊,與第2電極用電源線140電性連接。於圖示的例子中,補助電極150之端E4係與接點範圍外側之端一致,但未必需一致,只要補助電極150被覆接點範圍加以形成即可。即,補助電極 之端E4係於較接點範圍外側之端更為外側而構成亦可。As shown in FIG. 5, in the upper layer of the element layer 30 including the second electrode power supply line 140, the second interlayer insulating film 35 is formed, and the end E2 of the second interlayer insulating film 35 is connected to the second electrode power supply line 140. The inner end E3 of the dot range is further inside. The second portion 150b of the auxiliary electrode 150 is formed on the upper surface of the second interlayer insulating film 35 and the end portion E2 and the end E3 of the second interlayer insulating film 35 on the upper surface of the element layer 30 (hereinafter, Simply referred to as "subsidy electrode 150"). Thereby, the auxiliary electrode 150 is connected to the second electrode power supply line 140 and electrically connected to the second electrode power supply line 140. In the illustrated example, the end E4 of the auxiliary electrode 150 coincides with the end of the outer side of the contact range, but it is not necessary to be uniform, and the auxiliary electrode 150 may be formed by covering the contact range. That is, the auxiliary electrode The end E4 may be formed on the outer side of the outer side of the contact range.
然而,本說明書中,「內側」「外側」係顯示將基板10之端E5作為基準之時之基板面內之相對位置。因此,例如,「端E1係較(略)端E2為內側」端E1和基板10之端E5的距離,係顯示較端E2和端E5的距離為長。However, in the present specification, "inside" and "outer side" indicate the relative positions in the substrate surface when the end E5 of the substrate 10 is used as a reference. Therefore, for example, "the distance between the end E1 is the inner side" and the end E1 of the substrate E1 is the distance between the end E1 and the end E5 of the substrate 10, and the distance between the end E2 and the end E5 is long.
於補助電極150上,形成共通電極72。共通電極72之端E2係較第1層間絕緣膜35之端El外側。又,補助電極150之端E4較共通電極72之端E1位於外側地加以形成。然而,如上述,補助電極150係與畫素電極76同時形成,其次,依序形成問隔壁37、發光機能層74之後,被覆間隔壁37及發光機能層74,形成共通電極72。A common electrode 72 is formed on the auxiliary electrode 150. The end E2 of the common electrode 72 is outside the end El of the first interlayer insulating film 35. Further, the end E4 of the auxiliary electrode 150 is formed outside the end E1 of the common electrode 72. However, as described above, the auxiliary electrode 150 is formed simultaneously with the pixel electrode 76, and secondly, the partition wall 37 and the light-emitting function layer 74 are sequentially formed, and then the partition wall 37 and the light-emitting function layer 74 are covered to form the common electrode 72.
如上述,補助電極150中,使用具有導電性及遮光性之金屬。為此,有效範圍A中,使補助電極150和畫素電極76不重疊,補助電極150的第1部分150a乃形成呈格子狀。即,於有效範圍A中,使不遮斷由發光元件70的射出光線,僅於發光元件70的間隙,配置補助電極150的第1部分150a。發光元件70係以彼此微小的間隔加以配置之故,補助電極150係使用高精度的對準機構加以形成為佳。對此,共通電極72係由透明材料形成之故,於有效範圍A,被覆發光元件70地,於有效範圍A內同樣地加以形成。為此,共通電極72係使用較使用於補助電極150的形成對準機構精度為低者亦可形成。但是,使用精度低對準機構,形成共通電極72時,恐有共通電極72之端E1的位置變動之虞。As described above, a metal having conductivity and light blocking properties is used for the auxiliary electrode 150. Therefore, in the effective range A, the auxiliary electrode 150 and the pixel electrode 76 are not overlapped, and the first portion 150a of the auxiliary electrode 150 is formed in a lattice shape. In other words, in the effective range A, the light emitted from the light-emitting element 70 is not blocked, and the first portion 150a of the auxiliary electrode 150 is disposed only in the gap of the light-emitting element 70. Since the light-emitting elements 70 are arranged at a slight interval from each other, it is preferable that the auxiliary electrode 150 is formed using a high-precision alignment mechanism. On the other hand, since the common electrode 72 is formed of a transparent material, the light-emitting element 70 is covered in the effective range A, and is formed in the effective range A in the same manner. For this reason, the common electrode 72 may be formed using a lower alignment precision than that of the auxiliary electrode 150. However, when the common electrode 72 is formed using the low-precision alignment mechanism, the position of the end E1 of the common electrode 72 may fluctuate.
在此,令共通電極72之端E1的位置誤差範圍為t1,令補助電極150之端E4的位置誤差範圍為t2。對於補助電極150,使用精度更高對準機構時,則成為t1>t2。又,將具有補助電極150形成所需程度精度之單一對準機構,對於補助電極和共通電極72的雙方使用時,大約成為t1=t2。因此,補助電極150的誤差t2較共通電極72的誤差變大的可能性為低,相反地,於後者時,即使成為t1<t2,使用高精度的對準機構之故,t1的誤差不會成為大大問題。在此,於本實施形態中,補助電極150之端E4較共通電極72之端E1位於外側地加以構成。根據此構成,補助電極150的誤差考量在基板10端E5側,成為最大位置E4max(端E4亦接近於基板10之端E5側時的位置)至端E5的距離,而決定周邊範圍B的寬度(即,可決定「邊框範圍」)。因此,將容許更大的誤差之共通電極72之端E1與較補助電極150之端E4配置於外側相比,可縮小邊框範圍。即,使用於共通電極72形成對準機構的精度,可減低賦予邊框範圍寬度的影響。然而,使共通電極72的誤差於基板10之端E5側成為最大之位置E1max,較在補助電極150的誤差於基板10端E5側成為最大位置E4max為內側,而訂定端E2及端E4的基準位置(無誤差時的位置)為佳。Here, the position error of the end E1 of the common electrode 72 is set to t1, and the position error of the end E4 of the auxiliary electrode 150 is t2. When the auxiliary electrode 150 is used with a higher precision alignment mechanism, it is t1>t2. Further, the single alignment mechanism having the auxiliary electrode 150 to a desired degree of precision is approximately t1=t2 when used for both the auxiliary electrode and the common electrode 72. Therefore, the error t2 of the auxiliary electrode 150 is lower than the error of the common electrode 72. Conversely, in the latter case, even if t1 < t2, a high-precision alignment mechanism is used, and the error of t1 does not occur. Become a big problem. Here, in the present embodiment, the end E4 of the auxiliary electrode 150 is configured to be located outside the end E1 of the common electrode 72. According to this configuration, the error of the auxiliary electrode 150 is determined by the distance from the maximum position E4max (the position at which the end E4 is close to the end E5 side of the substrate 10) to the end E5 on the side E5 of the substrate 10, and the width of the peripheral range B is determined. (ie, you can determine the "border range"). Therefore, it is possible to reduce the frame range as compared with the case where the end E1 of the common electrode 72 which allows a larger error is disposed on the outer side than the end E4 of the auxiliary electrode 150. That is, the accuracy of forming the alignment mechanism by the common electrode 72 can reduce the influence of the width of the frame. However, the error E1max at which the error of the common electrode 72 is maximized on the end E5 side of the substrate 10 is the inner side of the maximum position E4max on the side of the substrate 10 end E5 from the error of the auxiliary electrode 150, and the end E2 and the end E4 are set. The reference position (position at the time of no error) is preferred.
於圖6,做為比較例,顯示共通電極72重疊於第2層間絕緣膜35之端E2而形成的情形。如圖6所示,於此比較例,共通電極72之端E1係較第2層間絕緣膜35之 端E2配置於外側。如上所述,第2層間絕緣膜35係為平坦化下層凸凹而加厚形成的情形為多。因此,第2層間絕緣膜35之端E2係成為大的階差。對此,共通電極72係例如以ITO等薄膜材料形成。為此,於示於比較例構成中,由於第2層間絕緣膜35之端E2的階差影響,於共通電極72,產生圖6所示龜裂I。產生龜裂I時,在龜裂部分阻抗值會增加之故,產生龜裂I部分與未產生龜裂I部分,流入電流值會有不同,電壓下降量則有所不同。但是,於本實施形態,共通電極72之端E1係較第2層間絕緣膜35層之端E2配置於內側之故,可防止共通電極72斷線或龜裂。因此,可防範斷線或龜裂所造成阻抗值的增加於未然。因此,可抑制發光元件70的亮度不均。FIG. 6 shows a case where the common electrode 72 is formed by being superposed on the end E2 of the second interlayer insulating film 35 as a comparative example. As shown in FIG. 6, in this comparative example, the end E1 of the common electrode 72 is lower than that of the second interlayer insulating film 35. End E2 is arranged on the outside. As described above, the second interlayer insulating film 35 is formed by flattening the lower layer convex and concave and thickening. Therefore, the end E2 of the second interlayer insulating film 35 has a large step. On the other hand, the common electrode 72 is formed of, for example, a thin film material such as ITO. For this reason, in the configuration of the comparative example, the crack I shown in FIG. 6 is generated in the common electrode 72 due to the step difference of the end E2 of the second interlayer insulating film 35. When crack I is generated, the resistance value of the crack portion increases, and the crack I portion and the crack portion I are not generated, and the inflow current value is different, and the voltage drop amount is different. However, in the present embodiment, the end E1 of the common electrode 72 is disposed inside the end E2 of the second interlayer insulating film 35, and the common electrode 72 can be prevented from being broken or cracked. Therefore, it is possible to prevent an increase in the impedance value caused by the disconnection or cracking. Therefore, unevenness in luminance of the light-emitting element 70 can be suppressed.
上述實施形態中,雖對於補助電極150和畫素電極76同時形成時的構成加以說明,不與畫素電極76同時形成,在間隔壁37後的工程,形成補助電極150亦可。In the above-described embodiment, the configuration in which the auxiliary electrode 150 and the pixel electrode 76 are simultaneously formed will be described, and the pixel electrode 76 may not be formed at the same time. The auxiliary electrode 150 may be formed in the process after the partition wall 37.
圖7係關於本變形例之發光裝置1A的部分截面圖。如圖7所示,於發光裝置1A中,被覆第2層間絕緣膜35及間隔壁37,形成補助電極150(150a,150b)。上述實施形態中,如圖4所示,補助電極150係具有形成第2層間絕緣膜35和間隔壁37上之部分。對此,此變形例中,有間隔壁37部分中,於問隔壁37上形成補助電極150。於此,間隔壁37係與第2層間絕緣膜35相同,令共通電極72或補助電極150做為由電晶體40,50,60分離之絕緣 層加以工作。又,與上述第1實施形態相同,補助電極150之端E4係與第2電極用電源線140重疊,共通電極72之端E1較補助電極150之端E4為內側,且,形成於第2層間絕緣膜35之端E2的內側。Fig. 7 is a partial cross-sectional view showing a light-emitting device 1A of the present modification. As shown in FIG. 7, in the light-emitting device 1A, the second interlayer insulating film 35 and the partition walls 37 are covered to form the auxiliary electrodes 150 (150a, 150b). In the above embodiment, as shown in FIG. 4, the auxiliary electrode 150 has a portion on which the second interlayer insulating film 35 and the partition wall 37 are formed. On the other hand, in this modification, in the portion of the partition wall 37, the auxiliary electrode 150 is formed on the partition wall 37. Here, the partition wall 37 is the same as the second interlayer insulating film 35, and the common electrode 72 or the auxiliary electrode 150 is insulated as the separation of the transistors 40, 50, and 60. The layer works. Further, similarly to the first embodiment, the end E4 of the auxiliary electrode 150 is overlapped with the second electrode power supply line 140, and the end E1 of the common electrode 72 is inside the end E4 of the auxiliary electrode 150, and is formed between the second layers. The inner side of the end E2 of the insulating film 35.
發光裝置1A的製造工程概略係如以下所述。形成第2層間絕緣膜35後,於第2層間絕緣膜35的上層,形成畫素電極76。之後,於畫素電極76的上層,形成間隔壁37,於去除第2層間絕緣膜35及間隔壁37上的開口部37a之表面,形成補助電極150。接著,於以間隔壁37分隔之畫素電極76上的空間(即,開口部37a),形成發光機能層74。然而,相反地,形成發光機能層74後,形成補助電極150亦可。更且,將具有透明性的共通電極72,於有效範圍A及周邊範圍B加以形成。之後,於共通電極72上,形成封閉膜80。但是,於基板10的外端緣,未形成封閉膜80,於此外端緣中,於電路保護膜34上,接合密封材90,於該上部,接合透明封閉基板110。The outline of the manufacturing process of the light-emitting device 1A is as follows. After the second interlayer insulating film 35 is formed, the pixel electrode 76 is formed on the upper layer of the second interlayer insulating film 35. Thereafter, a partition wall 37 is formed on the upper layer of the pixel electrode 76, and the surface of the opening portion 37a of the second interlayer insulating film 35 and the partition wall 37 is removed to form the auxiliary electrode 150. Next, the light-emitting function layer 74 is formed in the space on the pixel electrode 76 partitioned by the partition wall 37 (that is, the opening portion 37a). However, conversely, after the light-emitting function layer 74 is formed, the auxiliary electrode 150 may be formed. Further, the common electrode 72 having transparency is formed in the effective range A and the peripheral range B. Thereafter, a sealing film 80 is formed on the common electrode 72. However, on the outer edge of the substrate 10, the sealing film 80 is not formed, and in the other end, the sealing material 90 is bonded to the circuit protection film 34, and the transparent sealing substrate 110 is bonded to the upper portion.
形成補助電極150後,有形成發光機能層74的話,在形成補助電極150的時點,未形成發光機能層74之故,於補助電極150的形成,使用微縮術,亦不會有劣化發光機能層74之虞。因此,經由微縮術可形成補助電極150的圖案,以與電晶體40、50、60或掃描線111等的配線同樣的精度,可形成補助電極150。另一方面,形成發光機能層74後,形成補助電極150的話,有補助電極150不會污染發光材料,可連接補助電極150和共通電極 72的優點。When the auxiliary electrode 150 is formed, if the luminescent function layer 74 is formed, the luminescent function layer 74 is not formed at the time of forming the auxiliary electrode 150, and the micron technique is used for the formation of the auxiliary electrode 150, and the luminescent function layer is not deteriorated. After 74. Therefore, the pattern of the auxiliary electrode 150 can be formed by the micron reduction, and the auxiliary electrode 150 can be formed with the same precision as the wiring of the transistor 40, 50, 60 or the scanning line 111. On the other hand, when the auxiliary electrode 150 is formed after the light-emitting function layer 74 is formed, the auxiliary electrode 150 does not contaminate the luminescent material, and the auxiliary electrode 150 and the common electrode can be connected. 72 advantages.
更且,本變形例中,於補助電極150的上層,形成共通電極72之故,形成較共通電極72為厚之補助電極150,亦不會對共通電極72產生應力。因此,可抑制由上層應力所造成共通電極72的變形。Further, in the present modification, the common electrode 72 is formed on the upper layer of the auxiliary electrode 150, and the auxiliary electrode 150 having a thicker common electrode 72 is formed, and stress is not applied to the common electrode 72. Therefore, deformation of the common electrode 72 caused by the upper layer stress can be suppressed.
接著,對於關於本發明之第2實施形態之發光裝置加以說明。圖8係關於本實施形態之發光裝置2A的部分截面圖。如圖8所示,補助電極150係於共通電極72上,呈面接觸地加以形成,被覆補助電極150及共通電極72地,形成封閉膜80。發光裝置2A係除了共通電極72形成於補助電極150下層部分之外,與第1實施形態的發光裝置1A(圖7)相同。因此,適宜省略該說明。Next, a light-emitting device according to a second embodiment of the present invention will be described. Fig. 8 is a partial cross-sectional view showing a light-emitting device 2A of the present embodiment. As shown in FIG. 8, the auxiliary electrode 150 is formed on the common electrode 72 and is formed in surface contact, and covers the auxiliary electrode 150 and the common electrode 72 to form a sealing film 80. The light-emitting device 2A is the same as the light-emitting device 1A (FIG. 7) of the first embodiment except that the common electrode 72 is formed in the lower portion of the auxiliary electrode 150. Therefore, the description is suitably omitted.
與上述發光裝置1A相同,本實施形態中,有間隔壁37之部分中,於間隔壁37之更上層形成補助電極150。因此,間隔壁37係與第2層間絕緣膜35相同,將共通電極72或補助電極150做為由電晶體40,50,60分離之絕緣層加以工作。Similarly to the above-described light-emitting device 1A, in the present embodiment, the auxiliary electrode 150 is formed on the upper portion of the partition wall 37 in the portion of the partition wall 37. Therefore, the partition wall 37 is the same as the second interlayer insulating film 35, and the common electrode 72 or the auxiliary electrode 150 is operated as an insulating layer separated by the transistors 40, 50, and 60.
發光裝置2A的製造工程概略係如以下所述。形成第2層間絕緣膜35後,於第2層間絕緣膜35的上層,形成畫素電極76。之後,於畫素電極76的上層,形成間隔壁37,於以間隔壁37分隔之畫素電極76上的空間(即,開口部37a),形成發光機能層74。更且,令透明的共通電極72,在有效範圍A及周邊範圍B加以形成。之後,於 排除共通電極72上的開口部37a的上層之範圍,形成補助電極150,形成封閉膜80。但是,於基板10的外端緣,未形成封閉膜80,於此外端緣中,於電路保護膜34上,接合密封材90,於該上部,接合透明封閉基板110。The outline of the manufacturing process of the light-emitting device 2A is as follows. After the second interlayer insulating film 35 is formed, the pixel electrode 76 is formed on the upper layer of the second interlayer insulating film 35. Thereafter, a partition wall 37 is formed on the upper layer of the pixel electrode 76, and a light-emitting function layer 74 is formed in a space (i.e., the opening portion 37a) of the pixel electrode 76 partitioned by the partition wall 37. Further, the transparent common electrode 72 is formed in the effective range A and the peripheral range B. After that, The range of the upper layer of the opening portion 37a on the common electrode 72 is excluded, and the auxiliary electrode 150 is formed to form the sealing film 80. However, on the outer edge of the substrate 10, the sealing film 80 is not formed, and in the other end, the sealing material 90 is bonded to the circuit protection film 34, and the transparent sealing substrate 110 is bonded to the upper portion.
圖9乃顯示圖8之範圍F的部分簡略截面圖。如圖8及圖9所示,於發光裝置2A中,藉由掃描線驅動電路100的一部份之電晶體40,50,於基板10的面內外側,共通電極72之端E1,係較第2層間絕緣膜35之端E2形成於內側,較補助電極150之端E4形成於內側。因此,可得與上述第1實施形態相同的效果。Figure 9 is a partial cross-sectional view showing a range F of Figure 8. As shown in FIG. 8 and FIG. 9, in the light-emitting device 2A, a portion of the transistor 40, 50 of the scanning line driving circuit 100 is disposed on the inner side of the substrate 10, and the end E1 of the common electrode 72 is compared. The end E2 of the second interlayer insulating film 35 is formed on the inner side, and is formed on the inner side from the end E4 of the auxiliary electrode 150. Therefore, the same effects as those of the first embodiment described above can be obtained.
(1)於上述第1及第2實施形態中,雖然將共通電極72或補助電極150的上層經由以封閉膜80被覆,將包含元件層30、第2電極用電源線140、第2層間絕緣膜35、共通電極72、補助電極150之層構造,作為由外氣保護之構成,但省去封閉膜80之構成亦可。(1) In the first and second embodiments, the upper layer of the common electrode 72 or the auxiliary electrode 150 is covered with the sealing film 80, and the element layer 30, the second electrode power supply line 140, and the second interlayer are insulated. The layer structure of the film 35, the common electrode 72, and the auxiliary electrode 150 is configured to be protected by the outside air, but the configuration of the sealing film 80 may be omitted.
圖10係顯示關於本變形例之發光裝置1C的簡略截面圖。如圖10所示,於發光裝置1C中,未設置封閉膜80,經由密封材90和對向基板110,保護形成於基板10上之層構造。然而,於對向基板110的內側,配置為吸著水分之乾燥劑(圖示略),或者,於對向基板110本身,使用埋入乾燥劑之構成亦可。又,於對向基板110和密封材90的替換中,使用封閉罐。Fig. 10 is a schematic cross-sectional view showing a light-emitting device 1C according to the present modification. As shown in FIG. 10, in the light-emitting device 1C, the sealing film 80 is not provided, and the layer structure formed on the substrate 10 is protected via the sealing material 90 and the opposite substrate 110. However, a desiccant (not shown) that absorbs moisture may be disposed on the inner side of the counter substrate 110, or a configuration in which the desiccant is embedded may be used in the counter substrate 110 itself. Further, in the replacement of the opposite substrate 110 and the sealing material 90, a closed can is used.
圖11係顯示關於本變形例之另外的發光裝置1D的 簡略截面圖。如圖11所示,於發光裝置1D中,在形成於對向基板110和基板10上之層構造間,經由填充防濕性填充材65,可使層構造由外氣保護。做為防濕性填充材65,以光透過性低吸濕者為佳,可使用環氧系或胺基甲酸乙酯系黏著劑等。Figure 11 is a view showing another light-emitting device 1D according to the present modification. A brief cross-section. As shown in FIG. 11, in the light-emitting device 1D, the layer structure can be protected by the outside air by filling the moisture-proof filler 65 between the layer structures formed on the opposite substrate 110 and the substrate 10. As the moisture-proof filler 65, it is preferable that the light-transmitting property is low in moisture absorption, and an epoxy-based or urethane-based pressure-sensitive adhesive or the like can be used.
(2)於上述第1~第4實施形態中,雖對於第2電極用電源線140在於周邊範圍B形成呈ㄈ字狀形態加以說明,但未限定於此等,做可適宜變形。(2) In the above-described first to fourth embodiments, the second electrode power supply line 140 is formed in a U shape in the peripheral range B. However, the present invention is not limited thereto, and may be appropriately modified.
各圖12及圖13係為說明關於本變形例之各發光裝置的佈局之概略說明圖。於此等圖中,對於與上述實施形態共通部分中,附上同一符號,該說明則適宜省略。12 and 13 are schematic explanatory views for explaining the layout of each of the light-emitting devices of the present modification. In the drawings, the same reference numerals are given to the same portions as those of the above-described embodiments, and the description is omitted as appropriate.
如圖12(A)所示,於發光裝置3A中,沿著基板10對向2邊的各邊緣部,配設第2電極用電源線140。更且,沿著剩餘2邊一方之邊範圍,配設訊號輸入端子G,於該訊號輸入端子G的基板10面內之內側,配設第1電極用電源線130。第2電極用電源線140的內側中,沿著有效範圍A,掃描線驅動電路100A及100B則沿著各個有效範圍A加以配置,經由第2電極用電源線140供電之同時,藉由訊號輸入端子G,供予由外部之控制訊號。又,於第1電極用電源線130的內側中,資料線驅動電路200沿著有效範圍A加以配置。資料線驅動電路200係由第1電極用電源線130一一給電,藉由訊號輸入端子G,接受由外部的控制訊號,給與各資料線。As shown in FIG. 12(A), in the light-emitting device 3A, the second electrode power supply line 140 is disposed along each of the two edge portions of the substrate 10 facing the two sides. Further, the signal input terminal G is disposed along the side of the remaining two sides, and the first electrode power supply line 130 is disposed inside the surface of the substrate 10 of the signal input terminal G. In the inner side of the second electrode power supply line 140, along the effective range A, the scanning line driving circuits 100A and 100B are arranged along the respective effective ranges A, and are supplied by the second electrode power supply line 140 while being input by the signal. Terminal G, for external control signals. Further, in the inner side of the first electrode power supply line 130, the data line drive circuit 200 is disposed along the effective range A. The data line driving circuit 200 is powered by the first electrode power supply line 130 one by one, and receives an external control signal from the signal input terminal G, and supplies it to each data line.
於此例中,第2層間絕緣膜35係被覆有效範圍A、 掃描線驅動電路100A,100B、及資料線驅動電路200的全部、以及第1電極用電源線130的一部分(圖示例中,將配設訊號輸入端子G之邊做為長度方向之時,於延伸存在於長度方向之部分全部和與長度方向正交之方向,朝向基板10的下邊而延伸部分的一部分而形成)。又,共通電極72係被覆有效範圍A及掃描線驅動電路100A,100B的全部,配設第2電極用電源線140之側的左右端,係較第2層問絕緣膜35之端為內側加以形成。又,共通電極72之端中、下邊側(訊號輸入端子G側)端,乃位於有效範圍A的外側且位於資料線驅動電路200的內側,上邊側之端係較第2層間絕緣膜35之端位於內側。即,共通電極72之四邊各端係較第2層間絕緣膜35之對應各邊之端位於內側。換言之,第2層間絕緣膜35之端係在所有的邊下,較共通電極72之端突出於外側。即,第2範圍係被覆第1範圍整體,且,於所有的邊側,較第1範圍向外側突出。In this example, the second interlayer insulating film 35 is covered with the effective range A, All of the scanning line driving circuits 100A and 100B and the data line driving circuit 200 and a part of the first electrode power supply line 130 (in the example, when the side of the signal input terminal G is disposed as the longitudinal direction) All of the portions extending in the longitudinal direction are formed in a direction orthogonal to the longitudinal direction, and are formed toward a lower portion of the substrate 10 to extend a part thereof. Further, the common electrode 72 covers the effective range A and all of the scanning line driving circuits 100A and 100B, and the left and right ends on the side of the second electrode power supply line 140 are disposed on the inner side of the second layer insulating film 35. form. Further, the middle end and the lower side (signal input terminal G side) end of the common electrode 72 are located outside the effective range A and are located inside the data line driving circuit 200, and the upper side is closer to the second interlayer insulating film 35. The end is on the inside. That is, the respective ends of the four sides of the common electrode 72 are located on the inner side than the ends of the corresponding sides of the second interlayer insulating film 35. In other words, the end of the second interlayer insulating film 35 is under all sides, and the end of the common electrode 72 protrudes outside. In other words, the second range covers the entire first range, and protrudes outward from the first range on all sides.
補助電極係令與配設訊號輸入端子G之邊同方向,做為長度之條紋狀的個別電極150c加以形成。詳細而言,個別電極150c係於有效範圍A,通過發光元件70的間隙,於周邊範圍B,第1範圍的內側和第1範圍的外側中,且通過第2範圍的內側範圍,到達第2範圍的外側,延伸至與第2電極用電源線140重疊之範圍,與第2電極用電源線140電性連接。即,該端係較第2層間絕緣膜35之端位於外側,且較共通電極72之端位於外側。經由 本變形例,可得與上述各實施形態相同的效果。The auxiliary electrode is formed in the same direction as the side on which the signal input terminal G is disposed, and is formed as a stripe-shaped individual electrode 150c having a length. Specifically, the individual electrode 150c is in the effective range A, and passes through the gap of the light-emitting element 70 in the peripheral range B, the inside of the first range and the outside of the first range, and reaches the second range through the inner range of the second range. The outer side of the range extends to a range overlapping the second electrode power supply line 140, and is electrically connected to the second electrode power supply line 140. That is, the end is located outside the end of the second interlayer insulating film 35 and is located outside the end of the common electrode 72. via According to this modification, the same effects as those of the above embodiments can be obtained.
接著,如圖12(B)所示,發光裝置3B係除了掃描線驅動電路和資料線驅動電路的位置相反之外,成為與發光裝置3A同樣的構成。即,於發光裝置3B,掃描線驅動電路100於基板10的下邊側的周邊範圍B,沿著有效範圍A加以配置,資料線驅動電路200A,200B配置於基板10的各左邊及右邊側的周邊範圍B。第2電極用電源線140係於各資料線驅動電路200A,200B的外側,沿著基板10對向2邊(左右兩邊)加以配置,補助電極150係形成呈令與第2電極用電源線140正交方向(即,與配設訊號輸入端子G相同方向)作為長度之條紋狀。與發光裝置3A相同,補助電極150c的左右各端,係較共通電極72之端位於外側,更且,較第2層間絕緣膜35之端位於外側,與第2電極用電源線140重疊連接地加以形成。因此,經由發光裝置3B,可得與上述和實施形態相同的效果。Next, as shown in FIG. 12(B), the light-emitting device 3B has the same configuration as that of the light-emitting device 3A except that the scanning line driving circuit and the data line driving circuit are opposite in position. In other words, in the light-emitting device 3B, the scanning line driving circuit 100 is disposed along the effective range A in the peripheral range B on the lower side of the substrate 10, and the data line driving circuits 200A and 200B are disposed on the left and right sides of the substrate 10. Range B. The second electrode power supply line 140 is disposed outside the data line drive circuits 200A and 200B, and is disposed on the two sides (left and right sides) along the substrate 10, and the auxiliary electrode 150 is formed to be the second electrode power supply line 140. The orthogonal direction (that is, the same direction as the arrangement of the signal input terminal G) is a stripe shape of length. Similarly to the light-emitting device 3A, the left and right ends of the auxiliary electrode 150c are located outside the end of the common electrode 72, and are located outside the end of the second interlayer insulating film 35, and are overlapped with the second electrode power supply line 140. Formed. Therefore, the same effects as those of the above-described embodiment can be obtained via the light-emitting device 3B.
然而,於發光裝置3A及3B任一情形中,如圖12(A)右側所示,補助電極150形成於條紋狀的複數個別電極150c和周邊範圍B,具有連接複數個別電極150c之連接電極150d亦可。此時,連接電極150d係具有重疊於第1範圍的內側部分,和通過第1範圍的外側且為第2範圍的內側範圍到達第2範圍的外側部分,更且,與第2電極用電源線140重疊而形成。即,連接電極150d係不僅與第2電極用電源線140重疊,第2層間絕緣膜35之端及共通電極72之端則與連接電極150d重疊加以配置。However, in either case of the light-emitting devices 3A and 3B, as shown on the right side of FIG. 12(A), the auxiliary electrode 150 is formed in a stripe-shaped plurality of individual electrodes 150c and a peripheral range B, and has a connection electrode 150d that connects the plurality of individual electrodes 150c. Also. At this time, the connection electrode 150d has an inner portion that overlaps the first range, and an outer portion that passes through the outer side of the first range and that is inside the second range, and reaches the outer portion of the second range, and further, the power supply line for the second electrode 140 is formed by overlapping. In other words, the connection electrode 150d is not only overlapped with the second electrode power supply line 140, but also the end of the second interlayer insulating film 35 and the end of the common electrode 72 are overlapped with the connection electrode 150d.
圖13(A)及(B)乃顯示發光裝置其他的佈局例。如圖13(A)所示,於發光裝置4A中,沿著基板10下邊緣,配設訊號輸入端子G,於該內側,第2電極用電源線140配設呈ㄈ字狀。更且,於第2電極用電源線140的內側中,第1電極用電源線130配設呈ㄈ字狀,此第1電極用電源線130和有效範圍A間,配設資料線驅動電路200。掃描線驅動電路100A,100B係沿著有效範圍A的左右各邊之範圍各別配設。13(A) and (B) show other layout examples of the light-emitting device. As shown in FIG. 13(A), in the light-emitting device 4A, a signal input terminal G is disposed along the lower edge of the substrate 10, and the second electrode power supply line 140 is disposed in a U-shape on the inner side. Further, in the inner side of the second electrode power supply line 140, the first electrode power supply line 130 is disposed in a U shape, and the data line driving circuit 200 is disposed between the first electrode power supply line 130 and the effective range A. . The scanning line driving circuits 100A and 100B are disposed along the respective ranges of the left and right sides of the effective range A.
如圖示所示,第2層間絕緣膜35係被覆有效範圍A整體、掃描線驅動電路100A,100B、及資料線驅動電路200的全部、以及第1電極用電源線130的一部分(圖示例中,令配設訊號輸入端子G之邊做為長度方向之時,延伸存在於長度方向之部分而形成)。共通電極72係被覆與第2層間絕緣膜35幾乎相同部分,且於共通電極72的四邊各端,成為較第2層間絕緣膜35對應之端位於內側地加以形成。因此,於本變形例中,於基板10所有的邊側,形成第2層間絕緣膜35之第2範圍,係於基板10的面內外側方向,較形成共通電極72之第1範圍更為冒出。As shown in the figure, the second interlayer insulating film 35 covers the entire effective range A, all of the scanning line driving circuits 100A and 100B, and the data line driving circuit 200, and a part of the first electrode power supply line 130 (example example) In the case where the side where the signal input terminal G is disposed is formed in the longitudinal direction, the portion extending in the longitudinal direction is formed. The common electrode 72 is formed in almost the same portion as the second interlayer insulating film 35, and is formed on the inner side of the four sides of the common electrode 72 so as to be located inside the end corresponding to the second interlayer insulating film 35. Therefore, in the present modification, the second range of the second interlayer insulating film 35 is formed on all sides of the substrate 10, and is in the in-plane outer direction of the substrate 10, which is more serious than the first range in which the common electrode 72 is formed. Out.
如圖所示,補助電極係將與掃描線驅動電路100A,100B平行的方向,做為長度延伸存在之條紋狀的個別電極150e加以形成。基板10下端側之個別電極150e端係與第2電極用電源線140重疊連接加以形成。然而,於此例中,個別電極150e雖與第1電極用電源線130交叉, 經由第1電極用電源線130和第2電極用電源線140在個別層形成,個別電極150e沒有與第1電極用電源線130連接,僅與第2電極用電源線140連接形成。同樣地,共通電極72與第1電極用電源線130雖為重疊,藉由第1電極用電源線130和第2電極用電源線140在個別層形成,共通電極72和第1電極用電源線130成為不電性接觸之構成。另一方面,基板10上端側之個別電極150e之端,係較共通極72之端之個別電極150e位於外側,更且,較第2層間絕緣膜35之端(第2範圍)位於外側地加以形成。因此,經由發光裝置4A,可獲得與上述各實施形態相同的效果。As shown in the figure, the auxiliary electrode is formed as a stripe-shaped individual electrode 150e having a length extending in a direction parallel to the scanning line driving circuits 100A and 100B. The end of the individual electrode 150e on the lower end side of the substrate 10 is formed by overlapping and connecting the second electrode power supply line 140. However, in this example, the individual electrode 150e intersects with the first electrode power supply line 130, The first electrode power supply line 130 and the second electrode power supply line 140 are formed in separate layers, and the individual electrode 150e is not connected to the first electrode power supply line 130, and is formed only by being connected to the second electrode power supply line 140. Similarly, the common electrode 72 and the first electrode power supply line 130 are overlapped, and the first electrode power supply line 130 and the second electrode power supply line 140 are formed in individual layers, and the common electrode 72 and the first electrode power supply line are formed. 130 becomes a component of non-electrical contact. On the other hand, the end of the individual electrode 150e on the upper end side of the substrate 10 is located outside the individual electrode 150e at the end of the common electrode 72, and is located outside the end (second range) of the second interlayer insulating film 35. form. Therefore, the same effects as those of the above embodiments can be obtained via the light-emitting device 4A.
接著,如圖13(B)所示,發光裝置4B係除了掃描線驅動電路和資料線驅動電路的位置相反部分之外,與發光裝置4A同樣的構成。即,於發光裝置4B,掃描線驅動電路100於基板10的下邊側的周邊範圍B中,沿著有效範圍A加以配置,資料線驅動電路200A,200B配置於基板10的各左邊及右邊側的周邊範圍B。第2電極用電源線140於基板10下端側,在較訊號輸入端子G之內側,配置呈ㄈ字狀,補助電極150係形成呈與資料線驅動電路200A,200B平行的方向做為長度之條紋狀。與發光裝置4A相同,補助電極150的上下各端,係較共通電極72之端位於外側,且,較第2層間絕緣膜35之端位於外側之同時,與第2電極用電源線140重疊連接地加以形成。因此,經由發光裝置4B,可獲得與上述實施形態相同的效 果。Next, as shown in FIG. 13(B), the light-emitting device 4B has the same configuration as that of the light-emitting device 4A except for the portion where the scanning line driving circuit and the data line driving circuit are opposite to each other. In other words, in the light-emitting device 4B, the scanning line driving circuit 100 is disposed along the effective range A in the peripheral range B on the lower side of the substrate 10, and the data line driving circuits 200A and 200B are disposed on the left and right sides of the substrate 10. Peripheral range B. The second electrode power supply line 140 is disposed on the lower end side of the substrate 10, and is disposed in a U shape on the inner side of the signal input terminal G. The auxiliary electrode 150 is formed as a stripe of a length parallel to the data line driving circuits 200A and 200B. shape. Similarly to the light-emitting device 4A, the upper and lower ends of the auxiliary electrode 150 are located outside the end of the common electrode 72, and are overlapped with the second electrode power supply line 140 while being located outside the end of the second interlayer insulating film 35. The ground is formed. Therefore, the same effect as the above embodiment can be obtained via the light-emitting device 4B. fruit.
如圖12(A)、圖12(B)、圖13(A)及圖13(B)所示,於周邊範圍B,補助配線150係對於第2電極用電源線140延伸方向呈交叉之方向,延伸存在於條紋狀。即,圖1至圖3中,補助配線150b雖亦延伸存在於第2電極用電源線140延伸方向,僅延伸存在於對於第2電極用電源線140的延伸存在方向交叉方向。換言之,補助配線150係未必需與第2電極用電源線140的延伸存在方向平行形成,與第2電極用電源線140交叉加以形成亦可。As shown in FIGS. 12(A), 12(B), 13(A), and 13(B), in the peripheral range B, the auxiliary wiring 150 is in the direction in which the second electrode power supply line 140 extends in the direction in which it extends. The extension exists in a stripe shape. In other words, in FIG. 1 to FIG. 3, the auxiliary wiring 150b also extends in the extending direction of the second electrode power supply line 140, and extends only in the direction in which the extending direction of the second electrode power supply line 140 intersects. In other words, the auxiliary wiring 150 is not necessarily formed in parallel with the extending direction of the second electrode power supply line 140, and may be formed to cross the second electrode power supply line 140.
接著,對於利用關於本發明之發光裝置之電子機器加以說明。圖14至圖16中,圖示將關於以上任一形態之發光裝置做為顯示裝置加以採用的電子機器的形態。Next, an electronic device using the light-emitting device of the present invention will be described. In FIGS. 14 to 16, an embodiment of an electronic device to which the light-emitting device of any of the above aspects is used as a display device is illustrated.
圖14係顯示採用發光裝置之可攜型之個人電腦之構成斜視圖。個人電腦2000係具備顯示各種畫像之發光裝置1,1A,1C,1D,2A,3A,3B,4A,4B,和設置電源開關2001或鍵盤2002之本體部2010。發光裝置1,1A,1C,1D,2A,3A,3B,4A,4B,係將有機發光二極體元件做為發光元件70加以使用之故,可顯示視野寬廣而易見的畫面。Fig. 14 is a perspective view showing the configuration of a portable personal computer using a light-emitting device. The personal computer 2000 is provided with light-emitting devices 1, 1A, 1C, 1D, 2A, 3A, 3B, 4A, 4B for displaying various portraits, and a main body portion 2010 in which a power switch 2001 or a keyboard 2002 is provided. The light-emitting devices 1, 1A, 1C, 1D, 2A, 3A, 3B, 4A, and 4B use an organic light-emitting diode element as the light-emitting element 70, and can display a wide-view and easy-to-see picture.
圖15乃顯示適用發光裝置之攜帶電話機之構成的斜視圖。攜帶電話機3000係具備複數操作鈕3001及捲軸鈕3002,和顯示各種畫像之發光裝置1,1A,1C,1D,2A,3A,3B,4A,4B。經由操作捲軸鈕3000,顯示發光 裝置1,1A,1C,1D,2A,3A,3B,4A,4B之畫面。Figure 15 is a perspective view showing the configuration of a portable telephone to which a light-emitting device is applied. The portable telephone 3000 is provided with a plurality of operation buttons 3001 and a reel button 3002, and light-emitting devices 1, 1A, 1C, 1D, 2A, 3A, 3B, 4A, 4B for displaying various portraits. Display light by operating the scroll button 3000 Screens of devices 1, 1A, 1C, 1D, 2A, 3A, 3B, 4A, 4B.
圖16乃顯示適用發光裝置之攜帶資訊終端(PDA:Personal Digital Assistants)構成之斜視圖。資訊攜帶終端4000係具備複數操作鈕4001及電源開關4002,和顯示各種畫像之發光裝置1,1A,1C,1D,2A,3A,3B,4A,4B。操作電源開關4002時,住址或行程資訊等則顯示於發光裝置1,1A,1C,1D,2A,3A,4A,4B。Fig. 16 is a perspective view showing the configuration of a portable information terminal (PDA: Personal Digital Assistants) to which a light-emitting device is applied. The information carrying terminal 4000 includes a plurality of operation buttons 4001 and a power switch 4002, and light-emitting devices 1, 1A, 1C, 1D, 2A, 3A, 3B, 4A, and 4B for displaying various images. When the power switch 4002 is operated, the address or the trip information and the like are displayed on the light-emitting devices 1, 1A, 1C, 1D, 2A, 3A, 4A, 4B.
然而,做為適用關於本發明之發光裝置之電子機器,除了圖14至圖16所示者之外,可列舉數位相機、電視、攝錄放影機、汽車導航裝置、呼叫器、電子筆記本、電子紙、電算機、文字處理機、工作站、電視電話、POS終端、印表機、掃描器、影印機、錄放影機、具備觸控面板之機器等。又,關於本發明之發光裝置之用途乃不限定於畫像之顯示。例如於光寫入型之印表機或電子影印機之畫像形成裝置中,雖使用曝光對應於欲形成在用紙等之畫像之感光體之光學頭,做為此種之光學頭亦可利用本發明之發光裝置。However, as an electronic apparatus to which the light-emitting device of the present invention is applied, in addition to those shown in FIGS. 14 to 16, a digital camera, a television, a video recorder, a car navigation device, a pager, an electronic notebook, Electronic paper, computer, word processor, workstation, videophone, POS terminal, printer, scanner, photocopying machine, video recorder, machine with touch panel, etc. Further, the use of the light-emitting device of the present invention is not limited to the display of an image. For example, in an image forming apparatus of an optical writing type printer or an electronic photocopier, an optical head that is exposed to a photoreceptor that is to be formed in an image such as paper is used, and the optical head can be used as such. The illuminating device of the invention.
1,1A,1C,1D,2A,3A,3B,4A,4B‧‧‧發光裝置1,1A,1C,1D,2A,3A,3B,4A,4B‧‧‧Lighting device
10‧‧‧基板10‧‧‧Substrate
70‧‧‧發光元件70‧‧‧Lighting elements
34‧‧‧電路保護膜34‧‧‧ circuit protection film
35‧‧‧第2層間絕緣膜(絕緣層)35‧‧‧Second interlayer insulating film (insulation layer)
37‧‧‧間隔壁37‧‧‧ partition wall
37a‧‧‧開口部37a‧‧‧ Opening
65‧‧‧防濕性填充材65‧‧‧Moisture-proof filler
72‧‧‧共通電極(第2電極)72‧‧‧Common electrode (2nd electrode)
74‧‧‧發光機能層74‧‧‧Lighting function layer
76‧‧‧畫素電極(第1電極)76‧‧‧ pixel electrode (first electrode)
80封‧‧‧閉膜80 ‧ ‧ closed film
90‧‧‧密封材90‧‧‧ Sealing material
100A,100B‧‧‧掃描線驅動電路100A, 100B‧‧‧ scan line driver circuit
110‧‧‧對向基板110‧‧‧ opposite substrate
111‧‧‧掃描線111‧‧‧ scan line
112‧‧‧資料線112‧‧‧Information line
113‧‧‧電源供給線113‧‧‧Power supply line
120‧‧‧預充電電路120‧‧‧Precharge circuit
140‧‧‧第2電極用電源線140‧‧‧second electrode power cord
150‧‧‧補助電極150‧‧‧Assisted electrode
150c,150e‧‧‧個別電極150c, 150e‧‧‧ individual electrodes
150d‧‧‧連接電極150d‧‧‧Connected electrode
200,200A,200B‧‧‧資料線驅動電路200,200A,200B‧‧‧data line driver circuit
A‧‧‧有效範圍A‧‧‧ effective range
B‧‧‧周邊範圍B‧‧‧around range
C,F‧‧‧範圍C, F‧‧‧ range
E1~E5‧‧‧端E1~E5‧‧‧
G‧‧‧訊號輸入端子G‧‧‧ signal input terminal
P‧‧‧單位電路P‧‧‧ unit circuit
圖1(A)係顯示關於本發明第1實施形態之發光裝置的構成一部分概略平面圖,(B)係於(A)的狀態後,更形成補助電極及畫素電極狀態之平面圖。Fig. 1(A) is a plan view showing a part of a configuration of a light-emitting device according to a first embodiment of the present invention, and (B) is a plan view showing a state in which a supplementary electrode and a pixel electrode are formed in a state of (A).
圖2顯示同裝置之畫素電路的詳細電路圖。Figure 2 shows a detailed circuit diagram of the pixel circuit of the same device.
圖3乃圖1(B)一部分擴大圖。Figure 3 is a partial enlarged view of Figure 1 (B).
圖4係同裝置的部分之截面圖。Figure 4 is a cross-sectional view of a portion of the same device.
圖5係同裝置的部分之簡略截面圖。Figure 5 is a schematic cross-sectional view of a portion of the same device.
圖6係於比較例,顯示於共通電極產生龜裂情形之圖。Fig. 6 is a view showing a state in which cracks occur in the common electrode in the comparative example.
圖7係關於第1實施形態變形例之發光裝置部分截面圖。Fig. 7 is a partial cross-sectional view showing a light-emitting device according to a modification of the first embodiment.
圖8係關於本發明第2實施形態之發光裝置部分截面圖。Fig. 8 is a partial cross-sectional view showing a light-emitting device according to a second embodiment of the present invention.
圖9係同裝置的部分之簡略截面圖。Figure 9 is a schematic cross-sectional view of a portion of the same device.
圖10係關於本發明變形例之發光裝置部分簡略截面圖。Fig. 10 is a schematic cross-sectional view showing a portion of a light-emitting device according to a modification of the present invention.
圖11係關於本發明變形例之發光裝置部分簡略截面圖。Figure 11 is a schematic cross-sectional view showing a portion of a light-emitting device according to a modification of the present invention.
圖12係關於本發明變形例之發光裝置佈局概略圖。Fig. 12 is a schematic view showing the layout of a light-emitting device according to a modification of the present invention.
圖13係關於本發明變形例之發光裝置佈局概略圖。Fig. 13 is a schematic view showing the layout of a light-emitting device according to a modification of the present invention.
圖14係顯示採用發光裝置之可攜型之個人電腦之構成斜視圖。Fig. 14 is a perspective view showing the configuration of a portable personal computer using a light-emitting device.
圖15乃顯示適用發光裝置之攜帶電話機之構成的斜視圖。Figure 15 is a perspective view showing the configuration of a portable telephone to which a light-emitting device is applied.
圖16乃顯示適用發光裝置之攜帶資訊終端的構成的斜視圖。Figure 16 is a perspective view showing the configuration of a portable information terminal to which a light-emitting device is applied.
10‧‧‧基板10‧‧‧Substrate
30‧‧‧元件層30‧‧‧Component layer
35‧‧‧第2層間絕緣膜(絕緣層)35‧‧‧Second interlayer insulating film (insulation layer)
72‧‧‧共通電極(第2電極)72‧‧‧Common electrode (2nd electrode)
80‧‧‧封閉膜80‧‧‧Closed film
90‧‧‧密封材90‧‧‧ Sealing material
110‧‧‧對向基板110‧‧‧ opposite substrate
140‧‧‧第2電極用電源線140‧‧‧second electrode power cord
150b‧‧‧第2部分150b‧‧‧Part 2
E1~E5‧‧‧端E1~E5‧‧‧
G‧‧‧訊號輸入端子G‧‧‧ signal input terminal
P‧‧‧單位電路P‧‧‧ unit circuit
E1max‧‧‧最大位置E1max‧‧‧Maximum location
E4max‧‧‧最大位置E4max‧‧‧Maximum location
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TW200847848A (en) | 2008-12-01 |
CN101242692B (en) | 2011-04-27 |
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JP5327354B2 (en) | 2013-10-30 |
CN101242692A (en) | 2008-08-13 |
JP2008218395A (en) | 2008-09-18 |
JP5104274B2 (en) | 2012-12-19 |
JP2012142315A (en) | 2012-07-26 |
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