TWI478782B - Design method of resin covered wire saws - Google Patents

Design method of resin covered wire saws Download PDF

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Publication number
TWI478782B
TWI478782B TW100105986A TW100105986A TWI478782B TW I478782 B TWI478782 B TW I478782B TW 100105986 A TW100105986 A TW 100105986A TW 100105986 A TW100105986 A TW 100105986A TW I478782 B TWI478782 B TW I478782B
Authority
TW
Taiwan
Prior art keywords
resin
cut
wire saw
workpiece
abrasive grains
Prior art date
Application number
TW100105986A
Other languages
English (en)
Chinese (zh)
Other versions
TW201200273A (en
Inventor
Kazuo Yoshikawa
Hiroshi Yaguchi
Akinori Uratsuka
Takashi Kobori
Yoshitake Matsushima
Original Assignee
Kobelco Res Inst Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobelco Res Inst Inc filed Critical Kobelco Res Inst Inc
Publication of TW201200273A publication Critical patent/TW201200273A/zh
Application granted granted Critical
Publication of TWI478782B publication Critical patent/TWI478782B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185—Saw wires; Saw cables; Twisted saw strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D65/00—Making tools for sawing machines or sawing devices for use in cutting any kind of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
TW100105986A 2010-02-23 2011-02-23 Design method of resin covered wire saws TWI478782B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010038017 2010-02-23
JP2010161093A JP4939635B2 (ja) 2010-02-23 2010-07-15 樹脂被覆ソーワイヤの設計方法

Publications (2)

Publication Number Publication Date
TW201200273A TW201200273A (en) 2012-01-01
TWI478782B true TWI478782B (zh) 2015-04-01

Family

ID=44506852

Family Applications (2)

Application Number Title Priority Date Filing Date
TW100105986A TWI478782B (zh) 2010-02-23 2011-02-23 Design method of resin covered wire saws
TW103126885A TWI478783B (zh) 2010-02-23 2011-02-23 Design method of resin covered wire saws

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW103126885A TWI478783B (zh) 2010-02-23 2011-02-23 Design method of resin covered wire saws

Country Status (5)

Country Link
JP (1) JP4939635B2 (ja)
KR (1) KR101403078B1 (ja)
CN (2) CN102762338B (ja)
TW (2) TWI478782B (ja)
WO (1) WO2011105450A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5733120B2 (ja) * 2011-09-09 2015-06-10 住友電気工業株式会社 ソーワイヤおよびそれを用いたｉｉｉ族窒化物結晶基板の製造方法
CN104596829A (zh) * 2015-01-20 2015-05-06 苏州同冠微电子有限公司 硅片二次缺陷检测液及检测方法
TWI632041B (zh) * 2017-09-11 2018-08-11 環球晶圓股份有限公司 晶棒切割方法及切削磨料套組
KR102164683B1 (ko) 2018-08-10 2020-10-12 서명배 거품 코팅 공정을 이용한 와이어 쏘우의 제조방법 및 이에 의해 제조된 와이어 쏘우

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006179677A (ja) * 2004-12-22 2006-07-06 Japan Fine Steel Co Ltd ソーワイヤ
JP2009023066A (ja) * 2007-07-23 2009-02-05 Hitoshi Suwabe ソーワイヤ及びそのソーワイヤを用いたワイヤソーによる切断方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0469155A (ja) * 1990-07-09 1992-03-04 Kobe Steel Ltd 研磨用ワイヤソー
JPH10138114A (ja) * 1996-11-08 1998-05-26 Hitachi Cable Ltd ワイヤソー用ワイヤ
JPH11138414A (ja) * 1997-11-14 1999-05-25 Tokyo Seimitsu Co Ltd エンドレスワイヤソーの固定砥粒付ワイヤ
JP4262922B2 (ja) 2002-01-25 2009-05-13 日立金属株式会社 固定砥粒ワイヤソーを用いた高硬度材料の切断方法および磁気ヘッド用セラミックス基板の製造方法
JP2004283966A (ja) * 2003-03-24 2004-10-14 Noritake Super Abrasive:Kk レジンボンドワイヤソーの製造方法
JP4111928B2 (ja) * 2004-03-24 2008-07-02 株式会社ノリタケスーパーアブレーシブ レジンボンドワイヤソーおよびその製造方法
CN1810425A (zh) * 2005-12-23 2006-08-02 浙江工业大学 光敏树脂结合剂线锯的制备方法
CN101439502B (zh) * 2008-12-11 2010-08-11 浙江工业大学 喷覆线锯的制作方法及其设备
CN101564828B (zh) * 2009-06-03 2011-02-09 南京师范大学 切割硬、脆性材料的丝锯及其制造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006179677A (ja) * 2004-12-22 2006-07-06 Japan Fine Steel Co Ltd ソーワイヤ
JP2009023066A (ja) * 2007-07-23 2009-02-05 Hitoshi Suwabe ソーワイヤ及びそのソーワイヤを用いたワイヤソーによる切断方法

Also Published As

Publication number Publication date
KR101403078B1 (ko) 2014-06-02
CN104260215A (zh) 2015-01-07
CN102762338B (zh) 2015-03-18
CN104260215B (zh) 2017-09-29
JP2011194559A (ja) 2011-10-06
JP4939635B2 (ja) 2012-05-30
TW201200273A (en) 2012-01-01
CN102762338A (zh) 2012-10-31
TW201442808A (zh) 2014-11-16
TWI478783B (zh) 2015-04-01
WO2011105450A1 (ja) 2011-09-01
KR20120120344A (ko) 2012-11-01

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MM4A Annulment or lapse of patent due to non-payment of fees