TWI478782B - Design method of resin covered wire saws - Google Patents
Design method of resin covered wire saws Download PDFInfo
- Publication number
- TWI478782B TWI478782B TW100105986A TW100105986A TWI478782B TW I478782 B TWI478782 B TW I478782B TW 100105986 A TW100105986 A TW 100105986A TW 100105986 A TW100105986 A TW 100105986A TW I478782 B TWI478782 B TW I478782B
- Authority
- TW
- Taiwan
- Prior art keywords
- resin
- cut
- wire saw
- workpiece
- abrasive grains
- Prior art date
Links
- 229920005989 resin Polymers 0.000 title claims description 216
- 239000011347 resin Substances 0.000 title claims description 216
- 238000000034 method Methods 0.000 title claims description 35
- 238000013461 design Methods 0.000 title description 3
- 239000006061 abrasive grain Substances 0.000 claims description 102
- 229910000831 Steel Inorganic materials 0.000 claims description 93
- 239000010959 steel Substances 0.000 claims description 93
- 238000005520 cutting process Methods 0.000 claims description 42
- 230000003746 surface roughness Effects 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 20
- 229910003460 diamond Inorganic materials 0.000 claims description 13
- 239000010432 diamond Substances 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 12
- 238000005507 spraying Methods 0.000 claims description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 25
- 239000002966 varnish Substances 0.000 description 25
- 238000005259 measurement Methods 0.000 description 19
- 239000002002 slurry Substances 0.000 description 18
- 239000012530 fluid Substances 0.000 description 14
- 239000002245 particle Substances 0.000 description 13
- 239000013078 crystal Substances 0.000 description 12
- 238000012545 processing Methods 0.000 description 11
- 230000003287 optical effect Effects 0.000 description 10
- 238000007796 conventional method Methods 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 239000007864 aqueous solution Substances 0.000 description 8
- 238000005530 etching Methods 0.000 description 7
- 229920000728 polyester Polymers 0.000 description 7
- 238000007542 hardness measurement Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 238000000691 measurement method Methods 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000009499 grossing Methods 0.000 description 4
- 239000004814 polyurethane Substances 0.000 description 4
- 229920002635 polyurethane Polymers 0.000 description 4
- 229910000677 High-carbon steel Inorganic materials 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004972 Polyurethane varnish Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- YYCULGQEKARBDA-UHFFFAOYSA-N copper;formaldehyde Chemical compound [Cu].O=C YYCULGQEKARBDA-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- WXANAQMHYPHTGY-UHFFFAOYSA-N cerium;ethyne Chemical compound [Ce].[C-]#[C] WXANAQMHYPHTGY-UHFFFAOYSA-N 0.000 description 1
- ZJUWXBLGLGUFMC-UHFFFAOYSA-N copper;ethyl carbamate Chemical compound [Cu].CCOC(N)=O ZJUWXBLGLGUFMC-UHFFFAOYSA-N 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- AZQWKYJCGOJGHM-UHFFFAOYSA-N para-benzoquinone Natural products O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- -1 quinone imide Chemical class 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052902 vermiculite Inorganic materials 0.000 description 1
- 235000019354 vermiculite Nutrition 0.000 description 1
- 239000010455 vermiculite Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
- B23D61/185—Saw wires; Saw cables; Twisted saw strips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D65/00—Making tools for sawing machines or sawing devices for use in cutting any kind of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010038017 | 2010-02-23 | ||
JP2010161093A JP4939635B2 (ja) | 2010-02-23 | 2010-07-15 | 樹脂被覆ソーワイヤの設計方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201200273A TW201200273A (en) | 2012-01-01 |
TWI478782B true TWI478782B (zh) | 2015-04-01 |
Family
ID=44506852
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103126885A TWI478783B (zh) | 2010-02-23 | 2011-02-23 | Design method of resin covered wire saws |
TW100105986A TWI478782B (zh) | 2010-02-23 | 2011-02-23 | Design method of resin covered wire saws |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103126885A TWI478783B (zh) | 2010-02-23 | 2011-02-23 | Design method of resin covered wire saws |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4939635B2 (ja) |
KR (1) | KR101403078B1 (ja) |
CN (2) | CN102762338B (ja) |
TW (2) | TWI478783B (ja) |
WO (1) | WO2011105450A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5733120B2 (ja) * | 2011-09-09 | 2015-06-10 | 住友電気工業株式会社 | ソーワイヤおよびそれを用いたiii族窒化物結晶基板の製造方法 |
CN104596829A (zh) * | 2015-01-20 | 2015-05-06 | 苏州同冠微电子有限公司 | 硅片二次缺陷检测液及检测方法 |
TWI632041B (zh) * | 2017-09-11 | 2018-08-11 | 環球晶圓股份有限公司 | 晶棒切割方法及切削磨料套組 |
KR102164683B1 (ko) | 2018-08-10 | 2020-10-12 | 서명배 | 거품 코팅 공정을 이용한 와이어 쏘우의 제조방법 및 이에 의해 제조된 와이어 쏘우 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006179677A (ja) * | 2004-12-22 | 2006-07-06 | Japan Fine Steel Co Ltd | ソーワイヤ |
JP2009023066A (ja) * | 2007-07-23 | 2009-02-05 | Hitoshi Suwabe | ソーワイヤ及びそのソーワイヤを用いたワイヤソーによる切断方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0469155A (ja) * | 1990-07-09 | 1992-03-04 | Kobe Steel Ltd | 研磨用ワイヤソー |
JPH10138114A (ja) * | 1996-11-08 | 1998-05-26 | Hitachi Cable Ltd | ワイヤソー用ワイヤ |
JPH11138414A (ja) * | 1997-11-14 | 1999-05-25 | Tokyo Seimitsu Co Ltd | エンドレスワイヤソーの固定砥粒付ワイヤ |
JP4262922B2 (ja) | 2002-01-25 | 2009-05-13 | 日立金属株式会社 | 固定砥粒ワイヤソーを用いた高硬度材料の切断方法および磁気ヘッド用セラミックス基板の製造方法 |
JP2004283966A (ja) * | 2003-03-24 | 2004-10-14 | Noritake Super Abrasive:Kk | レジンボンドワイヤソーの製造方法 |
JP4111928B2 (ja) * | 2004-03-24 | 2008-07-02 | 株式会社ノリタケスーパーアブレーシブ | レジンボンドワイヤソーおよびその製造方法 |
CN1810425A (zh) * | 2005-12-23 | 2006-08-02 | 浙江工业大学 | 光敏树脂结合剂线锯的制备方法 |
CN101439502B (zh) * | 2008-12-11 | 2010-08-11 | 浙江工业大学 | 喷覆线锯的制作方法及其设备 |
CN101564828B (zh) * | 2009-06-03 | 2011-02-09 | 南京师范大学 | 切割硬、脆性材料的丝锯及其制造方法 |
-
2010
- 2010-07-15 JP JP2010161093A patent/JP4939635B2/ja not_active Expired - Fee Related
-
2011
- 2011-02-23 CN CN201180010405.8A patent/CN102762338B/zh not_active Expired - Fee Related
- 2011-02-23 KR KR1020127021986A patent/KR101403078B1/ko not_active IP Right Cessation
- 2011-02-23 WO PCT/JP2011/054032 patent/WO2011105450A1/ja active Application Filing
- 2011-02-23 CN CN201410436912.3A patent/CN104260215B/zh not_active Expired - Fee Related
- 2011-02-23 TW TW103126885A patent/TWI478783B/zh not_active IP Right Cessation
- 2011-02-23 TW TW100105986A patent/TWI478782B/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006179677A (ja) * | 2004-12-22 | 2006-07-06 | Japan Fine Steel Co Ltd | ソーワイヤ |
JP2009023066A (ja) * | 2007-07-23 | 2009-02-05 | Hitoshi Suwabe | ソーワイヤ及びそのソーワイヤを用いたワイヤソーによる切断方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201442808A (zh) | 2014-11-16 |
KR101403078B1 (ko) | 2014-06-02 |
TW201200273A (en) | 2012-01-01 |
CN104260215B (zh) | 2017-09-29 |
TWI478783B (zh) | 2015-04-01 |
JP2011194559A (ja) | 2011-10-06 |
KR20120120344A (ko) | 2012-11-01 |
CN102762338A (zh) | 2012-10-31 |
WO2011105450A1 (ja) | 2011-09-01 |
JP4939635B2 (ja) | 2012-05-30 |
CN102762338B (zh) | 2015-03-18 |
CN104260215A (zh) | 2015-01-07 |
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Legal Events
Date | Code | Title | Description |
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MM4A | Annulment or lapse of patent due to non-payment of fees |