TWI478761B - Purifying method and purifying apparatus for argon gas - Google Patents

Purifying method and purifying apparatus for argon gas Download PDF

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TWI478761B
TWI478761B TW100102680A TW100102680A TWI478761B TW I478761 B TWI478761 B TW I478761B TW 100102680 A TW100102680 A TW 100102680A TW 100102680 A TW100102680 A TW 100102680A TW I478761 B TWI478761 B TW I478761B
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argon gas
oxygen
adsorption
hydrogen
adsorption tower
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TW201136654A (en
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Mitsutoshi Nakatani
Mitsuru Kishii
Junichi Sakamoto
Nobuyuki Kitagishi
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Sumitomo Seika Chemicals
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    • B01D53/02Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography
    • B01D53/04Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description

氬氣之純化方法及純化裝置Argon purification method and purification device

本發明係關於一種對作為雜質至少含有氧、氫、一氧化碳、及氮之氬氣進行純化之方法及裝置。The present invention relates to a method and apparatus for purifying argon containing at least oxygen, hydrogen, carbon monoxide, and nitrogen as impurities.

例如,於如矽單晶提拉爐、陶瓷燒結爐、製鋼用真空脫氣設備、太陽電池用矽電漿溶解裝置、多晶矽鑄造爐之設備中,氬氣用作爐內環境氣體等。為了再利用而自此種設備回收之氬氣因氫、一氧化碳、空氣等之混入而導致純度降低。因此,為了提高所回收之氬氣之純度,使所混入之雜質吸附於吸附劑。進而,為了高效地對此種雜質進行吸附,提出使雜質中之氧與可燃成分進行反應,作為吸附處理之前處理(參照專利文獻1、2)。For example, in a device such as a ruthenium single crystal pulling furnace, a ceramic sintering furnace, a vacuum degassing apparatus for steelmaking, a tantalum plasma dissolution apparatus for a solar cell, and a polycrystalline tantalum casting furnace, argon gas is used as an ambient gas in a furnace. The argon gas recovered from such equipment for reuse is reduced in purity due to the incorporation of hydrogen, carbon monoxide, air, and the like. Therefore, in order to increase the purity of the recovered argon gas, the mixed impurities are adsorbed to the adsorbent. Further, in order to efficiently adsorb the impurities, it is proposed to react the oxygen in the impurities with the combustible component and treat it as a pretreatment treatment (see Patent Documents 1 and 2).

於專利文獻1所揭示之方法中,調節氬氣中之氧之量,使其稍微小於為了使氫、一氧化碳等可燃成分完全燃燒而必需之化學計量,其次,將使氫與氧之反應優先於一氧化碳與氧之反應之鈀或金作為觸媒,使氬氣中之氧與一氧化碳、氫等進行反應,藉此以殘留一氧化碳之狀態生成二氧化碳及水,接著,使氬氣中所含之二氧化碳及水在常溫下吸附於吸附劑,此後,使氬氣中所含之一氧化碳及氮在-10℃~-50℃之溫度下吸附於吸附劑。In the method disclosed in Patent Document 1, the amount of oxygen in the argon gas is adjusted to be slightly smaller than the stoichiometric amount necessary for completely combusting combustible components such as hydrogen and carbon monoxide, and secondly, the reaction of hydrogen with oxygen is prioritized over Palladium or gold reacting with carbon monoxide and oxygen acts as a catalyst to react oxygen in argon with carbon monoxide, hydrogen, etc., thereby generating carbon dioxide and water in a state of residual carbon monoxide, and then carbon dioxide contained in argon gas and The water is adsorbed to the adsorbent at a normal temperature, and thereafter, one of the carbon oxides and nitrogen contained in the argon gas is adsorbed to the adsorbent at a temperature of -10 ° C to -50 ° C.

於專利文獻2所揭示之方法中,將氬氣中之氧之量設為足以使氫、一氧化碳等可燃成分完全燃燒之量,其次,使用鈀系之觸媒使氬氣中之氧與一氧化碳、氫等進行反應,藉此以殘留氧之狀態生成二氧化碳及水,接著,使氬氣中所含之二氧化碳及水在常溫下吸附於吸附劑,此後,使氬氣中所含之氧及氮在-170℃左右之溫度下吸附於吸附劑。In the method disclosed in Patent Document 2, the amount of oxygen in the argon gas is set to an amount sufficient to completely burn the combustible components such as hydrogen and carbon monoxide, and secondly, the oxygen in the argon gas and carbon monoxide are used using a palladium-based catalyst. Hydrogen or the like is reacted to generate carbon dioxide and water in a state of residual oxygen, and then carbon dioxide and water contained in the argon gas are adsorbed to the adsorbent at normal temperature, and thereafter, oxygen and nitrogen contained in the argon gas are Adsorbed to the adsorbent at a temperature of about -170 °C.

專利文獻1:日本專利第3496079號公報Patent Document 1: Japanese Patent No. 3496079

專利文獻2:日本專利第3737900號公報Patent Document 2: Japanese Patent No. 3737900

於專利文獻1所記載之方法中,在前處理之階段中使氬氣中之氧之量少於為了使氫、一氧化碳等完全燃燒而必需之化學計量,且使用使氫與氧之反應優先於一氧化碳與氧之反應之觸媒,藉此以殘留一氧化碳之狀態生成二氧化碳及水。然而,存在藉由未反應之一氧化碳與水蒸氣發生水煤氣轉移反應而再生成氫,從而無法對應於要求氫之降低之情形之缺點。又,於專利文獻1所記載之方法中,於使雜質中之氧與可燃成分進行反應後之吸附處理之階段中,在使二氧化碳及水於常溫下吸附於吸附劑後,使一氧化碳及氮於-10℃~-50℃下吸附於吸附劑。於在此種低溫下再生吸附一氧化碳及氮之吸附劑之情形時,一氧化碳與氮相比,因為了自吸附劑脫離需要能量,故工業性上不利。In the method described in Patent Document 1, the amount of oxygen in the argon gas is less than the stoichiometric amount necessary for completely burning hydrogen, carbon monoxide or the like in the pretreatment stage, and the reaction of hydrogen and oxygen is prioritized over A catalyst for reacting carbon monoxide with oxygen to generate carbon dioxide and water in a state of residual carbon monoxide. However, there is a drawback in that hydrogen is generated by a water gas shift reaction of carbon monoxide and water vapor which are not reacted, and thus it is impossible to cope with a situation in which hydrogen is required to be lowered. Further, in the method described in Patent Document 1, in the stage of the adsorption treatment in which the oxygen in the impurities is reacted with the combustible component, carbon dioxide and water are adsorbed to the adsorbent at normal temperature, and then carbon monoxide and nitrogen are allowed to be present. Adsorbed to the adsorbent at -10 ° C ~ -50 ° C. In the case where the adsorbent for adsorbing carbon monoxide and nitrogen is regenerated at such a low temperature, carbon monoxide is industrially disadvantageous in that it requires energy from the adsorbent as compared with nitrogen.

於專利文獻2所記載之方法中,在前處理之階段中將氬氣中之氧之量設為足以使氫、一氧化碳等完全燃燒之量,藉此以殘留氧之狀態生成二氧化碳及水。然而,為了吸附氧,需要將吸附時之溫度降至-170℃左右。即,存在為了於吸附處理之前處理中殘留氧,吸附處理時之冷卻能量增大,純化負擔變大之問題。In the method described in Patent Document 2, the amount of oxygen in the argon gas is set to an amount sufficient to completely burn hydrogen, carbon monoxide or the like in the pretreatment stage, whereby carbon dioxide and water are generated in a state of residual oxygen. However, in order to adsorb oxygen, it is necessary to lower the temperature at the time of adsorption to about -170 °C. That is, there is a problem in that the cooling energy in the adsorption treatment is increased in order to prevent residual oxygen in the treatment before the adsorption treatment, and the purification burden is increased.

本發明之目的在於提供一種可解決此種先前技術之問題之氬氣之純化方法及純化裝置。It is an object of the present invention to provide a method and a purification apparatus for purifying argon gas which can solve the problems of the prior art.

本發明方法之特徵在於,其係對作為雜質至少含有氧、氫、一氧化碳、及氮之氬氣進行純化者,且於上述氬氣中之氧莫耳濃度為一氧化碳莫耳濃度與氫莫耳濃度之和的1/2以下之情形時,藉由添加氧而設定成超過1/2之值,其次,使用觸媒使上述氬氣中之氧與一氧化碳及氫進行反應,藉此以殘留氧之狀態生成二氧化碳及水,其次,藉由脫水操作降低上述氬氣中之水分含有率,接著,藉由使用碳系吸附劑之變壓式吸附法吸附上述氬氣中之雜質中之至少氧及二氧化碳,此後,藉由-10℃~-50℃下之變溫式吸附法吸附上述氬氣中之雜質中之至少氮。The method of the present invention is characterized in that it purifies an argon gas containing at least oxygen, hydrogen, carbon monoxide, and nitrogen as impurities, and the oxygen molar concentration in the argon gas is a carbon monoxide molar concentration and a hydrogen molar concentration. When the sum is 1/2 or less, the value is set to more than 1/2 by the addition of oxygen, and then the oxygen in the argon gas is reacted with carbon monoxide and hydrogen by using a catalyst, whereby residual oxygen is used. The state generates carbon dioxide and water, and secondly, the water content in the argon gas is lowered by a dehydration operation, and then at least oxygen and carbon dioxide in the impurities in the argon gas are adsorbed by a pressure swing adsorption method using a carbon-based adsorbent. Thereafter, at least nitrogen in the impurities in the argon gas is adsorbed by a temperature swing adsorption method at -10 ° C to -50 ° C.

根據本發明,使氬氣中之氧與一氧化碳及氫進行反應,藉此以殘留氧之狀態生成二氧化碳及水,其次,藉由脫水操作降低氬氣之水分含有率。藉此,由於氬氣之主要之雜質成為氧、二氧化碳、及氮,故而於利用變壓式吸附法吸附雜質時無需吸附水分且吸附負擔減輕,又,作為變壓式吸附法之吸附劑,可使用氧之吸附效果較高之碳系吸附劑。藉此,由於使用PSA(pressure swing adsorption,變壓吸附)單元之變壓式吸附法之氧吸附效果提高,故而無需此後利用使用TSA(Temperature swing adsorption,變溫吸附)單元之變溫式吸附法進行氧之吸附,從而與吸附氧之情形相比,可提高變溫式吸附法之雜質之吸附溫度。藉此,即便於吸附處理之前處理中殘留氧,亦可不會增大冷卻能量而提高氬氣之回收率及純度。According to the present invention, oxygen in argon gas is reacted with carbon monoxide and hydrogen to generate carbon dioxide and water in a state of residual oxygen, and secondly, a water content of argon gas is lowered by a dehydration operation. Therefore, since the main impurities of the argon gas are oxygen, carbon dioxide, and nitrogen, it is not necessary to adsorb moisture when the impurities are adsorbed by the pressure swing adsorption method, and the adsorption load is reduced, and the adsorbent for the pressure swing adsorption method can be used. A carbon-based adsorbent having a high adsorption effect of oxygen is used. Therefore, since the oxygen adsorption effect of the pressure swing adsorption method using the PSA (pressure swing adsorption) unit is improved, it is not necessary to perform oxygen conversion by a temperature swing adsorption method using a TSA (Temperature Swing adsorption) unit. The adsorption is such that the adsorption temperature of the impurities of the temperature swing adsorption method can be increased as compared with the case of adsorbing oxygen. Thereby, even if oxygen remains in the process before the adsorption treatment, the recovery rate and purity of argon gas can be improved without increasing the cooling energy.

於本發明中,就提高變壓式吸附法之氧吸附效果之方面而言,上述碳系吸附劑較佳為碳分子篩。In the present invention, in view of improving the oxygen adsorption effect of the pressure swing adsorption method, the carbon-based adsorbent is preferably a carbon molecular sieve.

本發明裝置之特徵在於,其係對作為雜質至少含有氧、氫、一氧化碳、及氮之氬氣進行純化者,且包含:反應器,其被導入有上述氬氣;濃度調節裝置,其於導入至上述反應器內之上述氬氣中之氧莫耳濃度為一氧化碳莫耳濃度與氫莫耳濃度之和的1/2以下之情形時,藉由添加氧而設定成超過1/2之值;乾燥器,其藉由進行脫水操作降低自上述反應器流出之上述氬氣之水分含有率;及吸附裝置,其連接於上述乾燥器;上述反應器內填充有觸媒,以使得藉由於上述反應器內上述氬氣中之氧與一氧化碳及氫進行反應,而以殘留氧之狀態生成二氧化碳及水,且上述吸附裝置包含:PSA單元,其藉由使用碳系吸附劑之變壓式吸附法吸附上述氬氣中之雜質中之至少氧及二氧化碳;及TSA單元,其藉由-10℃~-50℃下之變溫式吸附法吸附上述氬氣中之雜質中之至少氮。The apparatus of the present invention is characterized in that it purifies an argon gas containing at least oxygen, hydrogen, carbon monoxide, and nitrogen as impurities, and includes a reactor into which the argon gas is introduced, and a concentration adjusting device which is introduced When the oxygen molar concentration in the argon gas in the reactor is 1/2 or less of the sum of the carbon monoxide molar concentration and the hydrogen molar concentration, the value is set to more than 1/2 by adding oxygen; a dryer for reducing a moisture content of the argon gas flowing out of the reactor by performing a dehydration operation; and an adsorption device connected to the dryer; the reactor is filled with a catalyst so that the reaction is The oxygen in the argon gas reacts with carbon monoxide and hydrogen to generate carbon dioxide and water in a state of residual oxygen, and the adsorption device comprises: a PSA unit which is adsorbed by a pressure swing adsorption method using a carbon-based adsorbent. At least oxygen and carbon dioxide in the impurities in the argon gas; and a TSA unit adsorbing at least nitrogen in the impurities in the argon gas by a temperature swing adsorption method at -10 ° C to -50 ° C.

根據本發明裝置,可實施本發明方法。The method of the invention can be carried out in accordance with the apparatus of the invention.

根據本發明,可提供一種藉由有效地降低氬氣之雜質含有率,而減輕此後之吸附處理之負擔,減少純化所需之能量,可以高純度對氬氣進行純化之實用性之方法及裝置。According to the present invention, it is possible to provide a method and apparatus for purifying argon gas with high purity by effectively reducing the impurity content of argon gas, thereby reducing the burden of the subsequent adsorption treatment, reducing the energy required for purification, and reducing the energy required for purification. .

圖1所示之氬氣之純化裝置α係以可將自如例如多晶矽鑄造爐之氬氣供給源1供給之經使用過之氬氣回收並再利用之方式進行純化者,且包含加熱器2、反應器3、濃度調節裝置4、乾燥器5、冷卻器8、及吸附裝置9。The argon purifying apparatus α shown in Fig. 1 is purified by recovering and recycling the used argon gas supplied from an argon gas supply source 1 such as a polycrystalline germanium casting furnace, and includes a heater 2. The reactor 3, the concentration adjusting device 4, the dryer 5, the cooler 8, and the adsorption device 9.

自供給源α供給之氬氣係藉由圖外之過濾器等而除塵,從而經由鼓風機等氣體輸送機構(省略圖示)導入至加熱器2。純化對象之氬氣中所含之微量之雜質至少為氧、氫、一氧化碳、及氮,但亦可含有二氧化碳、烴、水等其他雜質。純化之氬氣中之雜質之濃度並無特別限定,可設為例如5莫耳ppm~40000莫耳ppm左右。就加熱器2之氬氣之加熱溫度而言,為了完成反應器3中之反應,較佳設為250℃以上,而自防止觸媒之壽命縮短之觀點出發,較佳設為450℃以下。The argon gas supplied from the supply source α is dedusted by a filter or the like outside the drawing, and is introduced into the heater 2 via a gas transport mechanism (not shown) such as a blower. The trace amount of impurities contained in the argon gas to be purified is at least oxygen, hydrogen, carbon monoxide, and nitrogen, but may also contain other impurities such as carbon dioxide, hydrocarbons, and water. The concentration of the impurities in the purified argon gas is not particularly limited, and may be, for example, about 5 mol ppm to 40000 mol ppm. The heating temperature of the argon gas of the heater 2 is preferably 250 ° C or higher in order to complete the reaction in the reactor 3, and is preferably 450 ° C or less from the viewpoint of shortening the life of the catalyst.

藉由加熱器2所加熱之氬氣被導入至反應器3內。濃度調節裝置4係於導入至反應器3內之氬氣中之氧莫耳濃度為一氧化碳莫耳濃度與氫莫耳濃度之和的1/2以下之情形時,藉由添加氧而設定成超過1/2之值。本實施形態之濃度調節裝置4包含濃度測定器4a、氧供給源4b、氧量調整器4c、及控制器4d。濃度測定器4a係測定導入至反應器3內之氬氣中之氧莫耳濃度、一氧化碳莫耳濃度、及氫莫耳濃度,並將該測定信號發送至控制器4d。控制器4d係於測定出之氧莫耳濃度為一氧化碳莫耳濃度與氫莫耳濃度之和的1/2以下之情形時,將與為了成為超過1/2之值所需的氧量對應之控制信號發送至氧量調整器4c。氧量調整器4c係將自氧供給源4b至反應器3之流路,以供給對應於控制信號之量的氧之方式進行開度調整。藉此,純化對象之氬氣中之氧莫耳濃度設定成超過一氧化碳莫耳濃度與氫莫耳濃度之和的1/2之值。Argon gas heated by the heater 2 is introduced into the reactor 3. When the concentration of oxygen in the argon gas introduced into the reactor 3 is 1/2 or less of the sum of the concentration of the carbon monoxide and the hydrogen molar concentration, the concentration adjusting device 4 is set to exceed the oxygen concentration by adding oxygen. 1/2 value. The concentration adjusting device 4 of the present embodiment includes a concentration measuring device 4a, an oxygen supply source 4b, an oxygen amount adjuster 4c, and a controller 4d. The concentration measuring device 4a measures the oxygen molar concentration, the carbon monoxide molar concentration, and the hydrogen molar concentration in the argon gas introduced into the reactor 3, and transmits the measurement signal to the controller 4d. When the measured oxygen molar concentration is 1/2 or less of the sum of the carbon monoxide molar concentration and the hydrogen molar concentration, the controller 4d corresponds to the amount of oxygen required to become a value exceeding 1/2. The control signal is sent to the oxygen amount adjuster 4c. The oxygen amount adjuster 4c adjusts the opening degree so as to supply oxygen corresponding to the amount of the control signal from the flow path from the oxygen supply source 4b to the reactor 3. Thereby, the oxygen molar concentration in the argon gas to be purified is set to be more than 1/2 of the sum of the carbon monoxide molar concentration and the hydrogen molar concentration.

於反應器3內,填充有使氧與氫及一氧化碳進行反應之觸媒。藉此,於反應器3內,藉由氬氣中之氧與一氧化碳及氫進行反應,而以殘留氧之狀態生成二氧化碳及水。再者,自多晶矽鑄造爐等回收之氬氣中包含烴作為可燃成分,但其莫耳濃度通常係,氫與一氧化碳之合計莫耳濃度為1/100以下。藉此,若通常以稍微超過一氧化碳莫耳濃度與氫莫耳濃度之和的1/2之方式設定氧莫耳濃度,則可以殘留氧之狀態生成二氧化碳及水。填充於反應器3內之觸媒若為使氧與一氧化碳及氫進行反應者則無特別限定,例如可使用由氧化鋁等承載鉑、鉑合金、鈀等之觸媒。The reactor 3 is filled with a catalyst for reacting oxygen with hydrogen and carbon monoxide. Thereby, in the reactor 3, carbon dioxide and water are generated in a state of residual oxygen by reacting oxygen in argon with carbon monoxide and hydrogen. Further, the argon gas recovered from the polycrystalline tantalum casting furnace or the like contains hydrocarbon as a combustible component, but the molar concentration thereof is usually such that the total molar concentration of hydrogen and carbon monoxide is 1/100 or less. Thereby, if the oxygen molar concentration is usually set so as to slightly exceed 1/2 of the sum of the hydrogen monoxide molar concentration and the hydrogen molar concentration, carbon dioxide and water can be generated in a state of residual oxygen. The catalyst to be charged in the reactor 3 is not particularly limited as long as it reacts with carbon monoxide and hydrogen. For example, a catalyst such as platinum, platinum alloy or palladium supported on alumina or the like can be used.

乾燥器5係藉由進行脫水操作降低自反應器3流出之氬氣之水分含有率。作為乾燥器5,只要使用市售者即可,例如可使用對氬氣進行加壓而藉由吸附劑去除水分並於減壓狀態下再生吸附劑之加壓式脫水裝置、對氬氣進行加壓冷卻而去除經冷凝之水分之冷凍式脫水裝置、藉由脫水劑去除氬氣中所含之水分並對脫水劑進行加熱而使其再生之加熱再生式脫水裝置等,加就有效地降低水分含有率之方面而言熱再生式脫水裝置較佳,且可將氬氣中之水分去除約99%左右者較佳。The dryer 5 reduces the moisture content of the argon gas flowing out of the reactor 3 by performing a dehydration operation. As the dryer 5, a commercially available one may be used. For example, a pressurized dehydration device that pressurizes argon gas to remove moisture by an adsorbent and regenerates the adsorbent under reduced pressure may be used, and argon gas may be added. A refrigerating type dehydration device that removes condensed water by pressure cooling, a heated regenerative dehydration device that removes moisture contained in argon by a dehydrating agent, and regenerates the dehydrating agent, thereby effectively reducing moisture The heat regenerative dehydration device is preferable in terms of the content rate, and it is preferable to remove the moisture in the argon gas by about 99%.

吸附裝置9經由冷卻器8而連接於乾燥器5。藉由乾燥器5而受到脫水處理並降低了水分含有率之氬氣係,於藉由冷卻器8冷卻後被導入至吸附裝置9。吸附裝置9具有PSA單元10及TSA單元20。PSA單元10係藉由使用碳系吸附劑之常溫下之變壓式吸附法,吸附氬氣中之雜質中之至少氧及二氧化碳。TSA單元20係藉由-10℃~-50℃下之變溫式吸附法,吸附氬氣中之雜質中之至少氮。The adsorption device 9 is connected to the dryer 5 via a cooler 8 . The argon gas system which is subjected to dehydration treatment by the dryer 5 and has a reduced moisture content is cooled by the cooler 8 and introduced into the adsorption device 9. The adsorption device 9 has a PSA unit 10 and a TSA unit 20. The PSA unit 10 adsorbs at least oxygen and carbon dioxide among the impurities in the argon gas by a pressure swing adsorption method at a normal temperature using a carbon-based adsorbent. The TSA unit 20 adsorbs at least nitrogen among the impurities in the argon gas by a temperature swing adsorption method at -10 ° C to -50 ° C.

PSA單元10可使用公知者。例如,圖2所示之PSA單元10為4塔式,具有對自反應器3流出之氬氣進行壓縮之壓縮機12、及4個第1~第4吸附塔13,且於各吸附塔13中填充有碳系吸附劑。作為該碳系吸附劑,就提高氧吸附效果之方面而言,較佳為碳分子篩。The PSA unit 10 can use a well-known person. For example, the PSA unit 10 shown in FIG. 2 is a 4-tower type, and has a compressor 12 that compresses argon gas flowing out of the reactor 3, and four first to fourth adsorption towers 13, and in each adsorption tower 13 It is filled with a carbon-based adsorbent. As the carbon-based adsorbent, a carbon molecular sieve is preferred in terms of improving the oxygen adsorption effect.

壓縮機12經由切換閥13b而連接於各吸附塔13之入口13a。吸附塔13之入口13a分別經由切換閥13e及消音器13f而連接於大氣中。The compressor 12 is connected to the inlet 13a of each adsorption tower 13 via a switching valve 13b. The inlet 13a of the adsorption tower 13 is connected to the atmosphere via a switching valve 13e and a muffler 13f, respectively.

吸附塔13之出口13k係分別經由切換閥131而連接於流出配管13m,經由切換閥13n而連接於升壓配管13o,經由切換閥13p而連接於均壓‧清潔出側配管13q,經由流量控制閥13r而連接於均壓‧清潔入側配管13s。The outlet 13k of the adsorption tower 13 is connected to the outflow pipe 13m via the switching valve 131, is connected to the pressure rising pipe 13o via the switching valve 13n, and is connected to the pressure equalizing and cleaning side pipe 13q via the switching valve 13p, and is controlled by the flow rate. The valve 13r is connected to the pressure equalizing ‧ cleaning inlet side pipe 13s.

流出配管13m經由壓力調節閥13t而連接於TSA單元20,從而導入至TSA單元20之氬氣之壓力成為固定。The outflow pipe 13m is connected to the TSA unit 20 via the pressure regulating valve 13t, so that the pressure of the argon gas introduced into the TSA unit 20 becomes fixed.

升壓配管13o經由流量控制閥13u、流量指示調節計13v而連接於流出配管13m,將升壓配管13o中之流量調節成固定,藉此可防止導入至TSA單元20之氬氣之流量變動。The pressure increasing pipe 13o is connected to the outflow pipe 13m via the flow rate control valve 13u and the flow rate indicating regulator 13v, and the flow rate in the pressure increasing pipe 13o is adjusted to be fixed, whereby the flow rate of the argon gas introduced into the TSA unit 20 can be prevented from fluctuating.

均壓‧清潔出側配管13q與均壓‧清潔入側配管13s係經由一對連結配管13w彼此連接,且於各連結配管13w上設置有切換閥13x。The pressure equalization ‧ the cleaning outlet pipe 13q and the pressure equalizing ‧ the cleaning inlet pipe 13 s are connected to each other via a pair of connecting pipes 13 w , and the switching pipes 13 x are provided in the respective connecting pipes 13 w .

於PSA單元10之第1~第4吸附塔13中,分別依次進行吸附步驟、減壓I步驟(清潔氣體排出步驟)、減壓II步驟(均壓氣體排出步驟)、脫附步驟、清潔步驟(清潔氣體流入步驟)、升壓I步驟(均壓氣體流入步驟)、升壓II步驟。In the first to fourth adsorption columns 13 of the PSA unit 10, an adsorption step, a pressure reduction I step (clean gas discharge step), a pressure reduction II step (pressure equalization gas discharge step), a desorption step, and a cleaning step are sequentially performed. (Clean gas inflow step), boost I step (pressure equalization gas inflow step), and boost II step.

即,於第1吸附塔13中,僅打開切換閥13b及切換閥131,從而自反應器3供給之氬氣自壓縮機12經由切換閥13b導入至第1吸附塔13。藉此,於第1吸附塔13中,藉由所導入之氬氣中之至少二氧化碳及水分吸附於吸附劑而進行吸附步驟,雜質之含有率降低之氬氣自第1吸附塔13經由流出配管13m輸送至TSA單元20。此時,輸送至流出配管13m之氬氣之一部分經由升壓配管13o、流量控制閥13u而輸送至另一吸附塔(於本實施形態中為第2吸附塔13),於第2吸附塔13中進行升壓II步驟。In other words, in the first adsorption tower 13, only the switching valve 13b and the switching valve 131 are opened, and the argon gas supplied from the reactor 3 is introduced from the compressor 12 to the first adsorption tower 13 via the switching valve 13b. In the first adsorption tower 13, the adsorption step is performed by adsorbing at least carbon dioxide and water in the introduced argon gas to the adsorbent, and the argon gas having a reduced impurity content is discharged from the first adsorption tower 13 via the outflow piping. 13m is delivered to the TSA unit 20. At this time, one of the argon gas sent to the outflow pipe 13m is sent to the other adsorption tower (the second adsorption tower 13 in the present embodiment) via the pressure increasing pipe 13o and the flow rate control valve 13u, and the second adsorption tower 13 is provided in the second adsorption tower 13 The boost II step is performed.

其次,關閉第1吸附塔13之切換閥13b、131,打開切換閥13p,打開另一吸附塔(於本實施形態中為第4吸附塔13)之流量控制閥13r,打開切換閥13x中之1個。藉此,第1吸附塔13之上部之雜質含有率比較少之氬氣經由均壓‧清潔入側配管13s而輸送至第4吸附塔13,於第1吸附塔13中進行減壓I步驟。此時,於第4吸附塔13中,打開切換閥13e,進行清潔步驟。Then, the switching valves 13b and 131 of the first adsorption tower 13 are closed, the switching valve 13p is opened, the flow control valve 13r of the other adsorption tower (the fourth adsorption tower 13 in the present embodiment) is opened, and the switching valve 13x is opened. One. In this way, the argon gas having a relatively small impurity content in the upper portion of the first adsorption column 13 is sent to the fourth adsorption column 13 via the pressure equalization ‧ cleaning inlet pipe 13 s, and the pressure reduction step 1 is performed in the first adsorption column 13 . At this time, in the fourth adsorption tower 13, the switching valve 13e is opened to perform a cleaning step.

接著,打開第1吸附塔13之切換閥13p及第4吸附塔13之流量控制閥13r,於該狀態下,關閉第4吸附塔13之切換閥13e,藉此於第4吸附塔13中進行實施氣體之回收之減壓II步驟,直至於第1吸附塔13與第4吸附塔13之間,內部壓力變得彼此均勻、或大致均勻為止。此時,切換閥13x亦可根據情形打開2個。Then, the switching valve 13p of the first adsorption tower 13 and the flow rate control valve 13r of the fourth adsorption tower 13 are opened, and in this state, the switching valve 13e of the fourth adsorption tower 13 is closed, thereby performing the fourth adsorption tower 13 The pressure reduction II step of recovering the gas is performed until the internal pressure becomes uniform or substantially uniform between the first adsorption tower 13 and the fourth adsorption tower 13. At this time, the switching valve 13x can also be opened two depending on the situation.

然後,打開第1吸附塔13之切換閥13e,關閉切換閥13p,藉此進行自吸附劑脫附雜質之脫附步驟,雜質連同氣體一併經由消音器13f而排出至大氣中。Then, the switching valve 13e of the first adsorption tower 13 is opened, and the switching valve 13p is closed, whereby the desorption step of desorbing impurities from the adsorbent is performed, and the impurities are discharged together with the gas to the atmosphere via the muffler 13f.

之後,打開第1吸附塔13之流量控制閥13r,關閉處於已結束吸附步驟之狀態的第2吸附塔13之切換閥13b、131,打開切換閥13p。藉此,第2吸附塔13之上部之雜質含有率比較少之氬氣經由均壓‧清潔入側配管13s而輸送至第1吸附塔13,於第1吸附塔13中進行清潔步驟。於第1吸附塔13中,清潔步驟中所使用之氣體經由切換閥13e、消音器13f而排出至大氣中。此時,於第2吸附塔13中,進行減壓I步驟。其次,打開第2吸附塔13之切換閥13p及第1吸附塔13之流量控制閥13r,於該狀態下,關閉第1吸附塔之切換閥13e,藉此進行升壓I步驟。此時,切換閥13x亦可根據情形打開2個。Thereafter, the flow rate control valve 13r of the first adsorption tower 13 is opened, and the switching valves 13b and 131 of the second adsorption tower 13 in the state in which the adsorption step has been completed are closed, and the switching valve 13p is opened. In this way, the argon gas having a relatively small impurity content in the upper portion of the second adsorption tower 13 is sent to the first adsorption tower 13 via the pressure equalization ‧ cleaning inlet side pipe 13 s, and the cleaning step is performed in the first adsorption tower 13 . In the first adsorption tower 13, the gas used in the cleaning step is discharged to the atmosphere via the switching valve 13e and the muffler 13f. At this time, in the second adsorption tower 13, a pressure reduction I step is performed. Then, the switching valve 13p of the second adsorption tower 13 and the flow rate control valve 13r of the first adsorption tower 13 are opened, and in this state, the switching valve 13e of the first adsorption tower is closed, thereby performing the step I of the pressure increase. At this time, the switching valve 13x can also be opened two depending on the situation.

此後,關閉第1吸附塔13之流量控制閥13r,暫時成為無步驟之待機狀態。該待機狀態持續至第4吸附塔13之升壓II步驟完成為止。若第4吸附塔13之升壓完成,吸附步驟自第3吸附塔13切換至第4吸附塔13,則打開第1吸附塔之切換閥13n,自處於吸附步驟之另一吸附塔(於本實施形態中為第4吸附塔13)輸送至流出配管13m之氬氣之一部分經由升壓配管13o、流量控制閥13u而輸送至第1吸附塔13,於第1吸附塔13中進行升壓II步驟。Thereafter, the flow rate control valve 13r of the first adsorption tower 13 is closed, and the standby state is temporarily completed. This standby state continues until the step of boosting II of the fourth adsorption tower 13 is completed. When the pressure increase of the fourth adsorption tower 13 is completed, the adsorption step is switched from the third adsorption tower 13 to the fourth adsorption tower 13, and the switching valve 13n of the first adsorption tower is opened, and the adsorption tower is in the adsorption step. In the embodiment, part of the argon gas which is sent to the outflow pipe 13m by the fourth adsorption tower 13) is sent to the first adsorption tower 13 via the pressure increasing pipe 13o and the flow rate control valve 13u, and the pressure is increased in the first adsorption tower 13 step.

上述各步驟分別於第1~第4吸附塔13中依次重複進行,藉此,雜質含有率降低之氬氣被連續輸送至TSA單元20。Each of the above-described steps is sequentially repeated in the first to fourth adsorption columns 13, whereby the argon gas having a reduced impurity content is continuously transported to the TSA unit 20.

再者,PSA單元10並不限定於圖2所示者,例如塔數量可為4個以外,例如2、3個均可。Further, the PSA unit 10 is not limited to the one shown in FIG. 2, and for example, the number of towers may be four or more, for example, two or three.

TSA單元20可使用公知者。例如,圖3所示之TSA單元20為2塔式,具有對自PSA單元10輸送來之氬氣進行預冷之熱交換型預冷器21、對藉由預冷器21所冷卻之氬氣進一步進行冷卻之熱交換型冷卻器22、第1、第2吸附塔23、及覆蓋各吸附塔23之熱交換器24。熱交換器24係於吸附步驟時藉由冷媒將吸附劑冷卻,於脫附步驟時藉由熱媒將吸附劑加熱。各吸附塔23具有填充有吸附劑之多個內管。作為該吸附劑,可使用適於吸附氮者,較佳為使用交換離子為2價之陽離子之X型沸石或Y型沸石,例如可使用藉由鈣(Ca)或鋰(Li)進行離子交換之沸石系吸附劑,進而,該2價之陽離子更佳為選自鎂(Mg)、鈣(Ca)、鍶(Sr)、鋇(Ba)中之至少1種。The TSA unit 20 can use a well-known person. For example, the TSA unit 20 shown in FIG. 3 is a 2-tower type, and has a heat exchange type pre-cooler 21 that pre-cools argon gas sent from the PSA unit 10, and argon gas cooled by the pre-cooler 21. The heat exchange cooler 22, the first and second adsorption towers 23, and the heat exchanger 24 covering the adsorption towers 23 are further cooled. The heat exchanger 24 cools the adsorbent by a refrigerant during the adsorption step, and heats the adsorbent by a heat medium during the desorption step. Each adsorption tower 23 has a plurality of inner tubes filled with an adsorbent. As the adsorbent, those suitable for adsorbing nitrogen can be used, and it is preferred to use an X-type zeolite or a Y-type zeolite in which the exchange ion is a divalent cation, and for example, ion exchange by calcium (Ca) or lithium (Li) can be used. Further, the divalent cation is more preferably at least one selected from the group consisting of magnesium (Mg), calcium (Ca), strontium (Sr), and barium (Ba).

冷卻器22經由開關閥23b而連接於各吸附塔23之入口23a。The cooler 22 is connected to the inlet 23a of each adsorption tower 23 via the on-off valve 23b.

吸附塔23之入口23a分別經由開關閥23c而通向大氣中。The inlet 23a of the adsorption tower 23 is opened to the atmosphere via the on-off valve 23c.

吸附塔23之出口23e係分別經由開關閥23f而連接於流出配管23g,經由開關閥23h而連接於冷卻‧升壓用配管23i,經由開關閥23j而連接於清潔用配管23k。The outlet 23e of the adsorption tower 23 is connected to the outflow piping 23g via the switching valve 23f, is connected to the cooling/boosting piping 23i via the switching valve 23h, and is connected to the cleaning piping 23k via the switching valve 23j.

流出配管23g構成預冷器21之一部分,且藉由自流出配管23g流出之經純化之氬氣將自PSA單元10輸送來之氬氣冷卻。自流出配管23g經純化之氬氣經由一次側壓力控制閥231流出。The outflow pipe 23g constitutes a part of the precooler 21, and the argon gas sent from the PSA unit 10 is cooled by the purified argon gas flowing out from the outflow pipe 23g. The purified argon gas from the outflow pipe 23g flows out through the primary side pressure control valve 231.

冷卻‧升壓用配管23i、清潔用配管23k經由流量計23m、流量控制閥23o、開關閥23n而連接於流出配管23g。The cooling/boosting pipe 23i and the cleaning pipe 23k are connected to the outflow pipe 23g via the flow meter 23m, the flow rate control valve 23o, and the on-off valve 23n.

熱交換器24設為多管式,且由包圍構成吸附塔23之多個內管的外管24a、冷媒供給源24b、冷媒用散熱器24c、熱媒供給源24d、熱媒用散熱器24e構成。又,設置有複數個開關閥24f,該等開關閥24f係用以切換為使自冷媒供給源24b供給之冷媒經由外管24a、冷媒用散熱器24c而循環之狀態、及使自熱媒供給源24d供給之熱媒經由外管24a、熱媒用散熱器24e而循環之狀態。進而,藉由自冷媒用散熱器24c分支出之配管構成冷卻器22之一部分,藉由自冷媒供給源24b供給之冷媒而使氬氣於冷卻器22中冷卻,該冷媒回流至貯槽24g。The heat exchanger 24 is a multi-tube type, and is surrounded by an outer tube 24a, a refrigerant supply source 24b, a refrigerant radiator 24c, a heat medium supply source 24d, and a heat medium radiator 24e that surround the plurality of inner tubes constituting the adsorption tower 23. Composition. Further, a plurality of on-off valves 24f for switching the refrigerant supplied from the refrigerant supply source 24b through the outer tube 24a and the refrigerant radiator 24c and supplying the self-heating medium are provided. The heat medium supplied from the source 24d is circulated through the outer tube 24a and the heat medium radiator 24e. Further, a part of the cooler 22 is formed by a pipe branched from the refrigerant radiator 24c, and the argon gas is cooled in the cooler 22 by the refrigerant supplied from the refrigerant supply source 24b, and the refrigerant is returned to the storage tank 24g.

於TSA單元20之第1、第2吸附塔23中,分別依次進行吸附步驟、脫附步驟、清潔步驟、冷卻步驟、升壓步驟。The adsorption step, the desorption step, the cleaning step, the cooling step, and the pressure increasing step are sequentially performed in the first and second adsorption towers 23 of the TSA unit 20, respectively.

即,於TSA單元20中,自PSA單元10供給之氬氣於在預冷器21、冷卻器22中冷卻後,經由開關閥23b而被導入至第1吸附塔23。此時,第1吸附塔23成為藉由熱交換器24中冷媒之循環而冷卻至-10℃~-50℃之狀態,且開關閥23c、23h、23j關閉,開關閥23f打開,氬氣中所含之至少氮吸附於吸附劑。藉此,於第1吸附塔23中進行吸附步驟,從而雜質之含有率降低之純化氬氣自吸附塔23經由一次側壓力控制閥231流出。In other words, in the TSA unit 20, the argon gas supplied from the PSA unit 10 is cooled in the precooler 21 and the cooler 22, and then introduced into the first adsorption tower 23 via the on-off valve 23b. At this time, the first adsorption tower 23 is cooled to -10 ° C to -50 ° C by the circulation of the refrigerant in the heat exchanger 24, and the on-off valves 23c, 23h, and 23j are closed, and the on-off valve 23f is opened, in the argon gas. At least the nitrogen contained is adsorbed to the adsorbent. Thereby, the adsorption step is performed in the first adsorption tower 23, and the purified argon gas having a reduced impurity content is discharged from the adsorption tower 23 through the primary pressure control valve 231.

於在第1吸附塔23中進行吸附步驟期間,於第2吸附塔23中進行脫附步驟、清潔步驟、冷卻步驟、升壓步驟。During the adsorption step in the first adsorption tower 23, a desorption step, a cleaning step, a cooling step, and a pressure increasing step are performed in the second adsorption tower 23.

即,於第2吸附塔23中,為了在吸附步驟結束後實施脫附步驟而關閉開關閥23b、23f,打開開關閥23c。藉此,於第2吸附塔23中,包含雜質之氦氣排出至大氣中,且壓力大致降至大氣壓。於該脫附步驟中,將在第2吸附塔23中於吸附步驟時使冷媒循環之熱交換部24之開關閥24f切換為關閉狀態而使冷媒之循環停止,且將使冷媒自熱交換部24抽出而返回至冷媒供給源24b之開關閥24f切換為打開狀態。In other words, in the second adsorption tower 23, in order to perform the desorption step after the end of the adsorption step, the on-off valves 23b and 23f are closed, and the on-off valve 23c is opened. Thereby, in the second adsorption tower 23, helium gas containing impurities is discharged to the atmosphere, and the pressure is substantially reduced to atmospheric pressure. In the desorption step, the switching valve 24f of the heat exchange unit 24 that circulates the refrigerant in the second adsorption tower 23 is switched to the closed state to stop the circulation of the refrigerant, and the refrigerant is supplied to the heat exchange unit. The on-off valve 24f that has been withdrawn and returned to the refrigerant supply source 24b is switched to the open state.

其次,為了於第2吸附塔23中實施清潔步驟,第2吸附塔23之開關閥23c、23j及清潔用配管23k之開關閥23n成為打開狀態,將藉由熱交換型預冷器21之熱交換所加熱之純化氬氣之一部分經由清潔用配管23k而導入至第2吸附塔23。藉此,於第2吸附塔23中,實施雜質自吸附劑之脫附、及藉由純化氬氣之清潔,且該清潔所使用之氬氣連同雜質一併自開關閥23c排出至大氣中。於該清潔步驟中,將於第2吸附塔23中用以使熱媒循環之熱交換部24之開關閥24f切換為打開狀態。Then, in order to perform the cleaning step in the second adsorption tower 23, the on-off valves 23c and 23j of the second adsorption tower 23 and the on-off valve 23n of the cleaning piping 23k are opened, and the heat of the heat exchange type precooler 21 is used. One part of the purified argon heated by the exchange is introduced into the second adsorption tower 23 via the cleaning pipe 23k. Thereby, in the second adsorption tower 23, desorption of impurities from the adsorbent and purification by argon purification are performed, and the argon gas used for the cleaning is discharged together with the impurities to the atmosphere from the on-off valve 23c. In the cleaning step, the on-off valve 24f of the heat exchange unit 24 for circulating the heat medium is switched to the open state in the second adsorption tower 23.

接著,為了於第2吸附塔23中實施冷卻步驟,第2吸附塔23之開關閥23j、及清潔用配管23k之開關閥23n成為關閉狀態,第2吸附塔23之開關閥23h、及冷卻‧升壓用配管23i之開關閥23n成為打開狀態,將自第1吸附塔23流出之純化氬氣之一部分經由冷卻‧升壓用配管23i導入至第2吸附塔23。藉此,已於第2吸附塔23內冷卻之純化氬氣經由開關閥23c而排出至大氣中。於該冷卻步驟中,將用於使熱媒循環之開關閥24f切換為關閉狀態而使熱媒停止循環,且將使熱媒自熱交換部24抽出而返回至熱媒供給源24d之開關閥24f切換為打開狀態。於結束熱媒之抽出後,將於第2吸附塔23中用以使冷媒循環之熱交換部24之開關閥24f切換為打開狀態,從而成為冷媒循環狀態。該冷媒循環狀態持續至下一升壓步驟、及後續之吸附步驟結束為止。Then, in order to perform the cooling step in the second adsorption tower 23, the on-off valve 23j of the second adsorption tower 23 and the on-off valve 23n of the cleaning piping 23k are turned off, the on-off valve 23h of the second adsorption tower 23, and the cooling ‧ The on-off valve 23n of the pressure increasing pipe 23i is opened, and one part of the purified argon gas flowing out from the first adsorption tower 23 is introduced into the second adsorption tower 23 via the cooling/boosting pipe 23i. Thereby, the purified argon gas which has been cooled in the second adsorption tower 23 is discharged to the atmosphere via the on-off valve 23c. In the cooling step, the on-off valve 24f for circulating the heat medium is switched to the closed state to stop the circulation of the heat medium, and the heat medium is taken out from the heat exchange portion 24 to return to the on-off valve of the heat medium supply source 24d. 24f is switched to the on state. After the completion of the extraction of the heat medium, the on-off valve 24f of the heat exchange unit 24 for circulating the refrigerant in the second adsorption tower 23 is switched to the open state to be in a refrigerant circulation state. The refrigerant circulation state continues until the next step of boosting and the subsequent adsorption step ends.

之後,為了於第2吸附塔23中實施升壓步驟,關閉第2吸附塔23之開關閥23c,導入自第1吸附塔23流出之純化氬氣之一部分,藉此使第2吸附塔23之內部升壓。該升壓步驟係持續至第2吸附塔23之內壓變得與第1吸附塔23之內壓大致相等為止。若升壓步驟結束,則第2吸附塔23之開關閥23h、及冷卻‧升壓用配管23i之開關閥23n關閉,藉此,第2吸附塔23之全部之開關閥23b、23c、23f、23h、23j成為關閉狀態,從而直至下一吸附步驟為止,第2吸附塔23成為待機狀態。Thereafter, in order to carry out the pressure increasing step in the second adsorption tower 23, the on-off valve 23c of the second adsorption tower 23 is closed, and one part of the purified argon gas flowing out from the first adsorption tower 23 is introduced, thereby making the second adsorption tower 23 Internal boost. This step of boosting continues until the internal pressure of the second adsorption tower 23 becomes substantially equal to the internal pressure of the first adsorption tower 23. When the step of raising the pressure is completed, the on-off valve 23h of the second adsorption tower 23 and the on-off valve 23n of the cooling/boosting piping 23i are closed, whereby all of the on-off valves 23b, 23c, and 23f of the second adsorption tower 23 are 23h and 23j are in a closed state, and the second adsorption tower 23 is in a standby state until the next adsorption step.

第2吸附塔23之吸附步驟係與第1吸附塔23之吸附步驟相同地實施。於在第2吸附塔23中進行吸附步驟期間,於第1吸附塔23中,與第2吸附塔23相同地進行脫附步驟、清潔步驟、冷卻步驟、升壓步驟。The adsorption step of the second adsorption tower 23 is carried out in the same manner as the adsorption step of the first adsorption tower 23. During the adsorption step in the second adsorption tower 23, the desorption step, the cleaning step, the cooling step, and the pressure increasing step are performed in the first adsorption tower 23 in the same manner as in the second adsorption tower 23.

再者,TSA單元20並不限定於圖3所示者,例如塔數量可為2個以上,例如3、4個均可。Further, the TSA unit 20 is not limited to the one shown in FIG. 3. For example, the number of towers may be two or more, for example, three or four.

根據上述純化裝置α,於對至少含有氧、氫、一氧化碳及氮之氬氣進行純化時,當該氬氣中之氧莫耳濃度為一氧化碳莫耳濃度與氫莫耳濃度之和的1/2以下之情形時,藉由添加氧而設定成超過一氧化碳莫耳濃度與氫莫耳濃度之和的1/2之值後,使用觸媒使該氬氣中之氧與一氧化碳及氫進行反應,藉此以殘留氧之狀態生成二氧化碳及水,接著,藉由脫水操作降低該氬氣中之水分含有率。藉此,由於氬氣之主要雜質成為氧、二氧化碳、及氮,故而於此後利用變壓式吸附法吸附雜質時無需吸附水分從而吸附負擔減輕,又,作為變壓式吸附法之吸附劑,可使用氧之吸附效果較高之碳系吸附劑。藉此,由於變壓式吸附法之氧吸附效果提高,故而無需此後利用變溫式吸附法吸附氧,從而與吸附氧之情形相比,可提高變溫式吸附法之雜質之吸附溫度。藉此,即便於吸附處理之前處理中殘留氧,亦可不會增大冷卻能量而提高氬氣之回收率及純度。According to the above purification apparatus α, when the argon gas containing at least oxygen, hydrogen, carbon monoxide and nitrogen is purified, the oxygen molar concentration in the argon gas is 1/2 of the sum of the carbon monoxide molar concentration and the hydrogen molar concentration. In the following case, by adding oxygen to a value exceeding 1/2 of the sum of the molar concentration of carbon monoxide and the concentration of hydrogen mole, the catalyst is used to react oxygen in the argon with carbon monoxide and hydrogen. This generates carbon dioxide and water in the state of residual oxygen, and then reduces the moisture content in the argon by a dehydration operation. Therefore, since the main impurities of the argon gas are oxygen, carbon dioxide, and nitrogen, the adsorption of the impurities by the pressure swing adsorption method is not required to adsorb the water, and the adsorption load is reduced, and the adsorbent for the pressure swing adsorption method can be used. A carbon-based adsorbent having a high adsorption effect of oxygen is used. Thereby, since the oxygen adsorption effect of the pressure swing adsorption method is improved, it is not necessary to adsorb oxygen by the temperature swing adsorption method, and the adsorption temperature of the impurities of the temperature change adsorption method can be improved as compared with the case of adsorbing oxygen. Thereby, even if oxygen remains in the process before the adsorption treatment, the recovery rate and purity of argon gas can be improved without increasing the cooling energy.

實施例1Example 1

使用上述純化裝置α對氬氣進行純化。氬氣中,作為雜質分別含有氧500莫耳ppm、氫20莫耳ppm、一氧化碳1800莫耳ppm、氮1000莫耳ppm、二氧化碳20莫耳ppm、水分20莫耳ppm。將該氬氣以標準狀態且以3.74 L/min之流量導入至反應器3,進而,向該氬氣以標準狀態且以3.4 mL/min之流量添加氧。向反應器3內填充45 mL之氧化鋁承載之鉑觸媒,且反應條件設為溫度300℃、大氣壓、空間速度5000/h。The argon gas was purified using the above purification apparatus α. The argon gas contains 500 ppm of oxygen, 20 ppm of hydrogen, 1800 ppm of carbon monoxide, 1000 ppm of nitrogen, 20 ppm of carbon dioxide, and 20 ppm of moisture as impurities. The argon gas was introduced into the reactor 3 in a standard state at a flow rate of 3.74 L/min, and further, oxygen was added to the argon gas in a standard state at a flow rate of 3.4 mL/min. The reactor 3 was filled with 45 mL of alumina-supported platinum catalyst, and the reaction conditions were set to a temperature of 300 ° C, atmospheric pressure, and a space velocity of 5000 / h.

對自反應器3流出之氬氣,使用冷凍式脫水裝置作為乾燥器5而冷卻至-35℃並去除水分,藉此進行脫水操作,降低氬氣之水分含有率。The argon gas flowing out of the reactor 3 was cooled to -35 ° C using a refrigerating dehydration apparatus as a dryer 5 to remove water, thereby performing a dehydration operation to reduce the moisture content of argon gas.

於藉由冷卻器8將自乾燥器5流出之氬氣冷卻後,藉由吸附裝置9降低雜質之含有率。PSA單元10設為3塔式,向各塔中填充1.25 L之直徑為2 mm之圓柱狀成形碳之碳分子篩(日本Enviro Chemicals製3k-172)作為吸附劑,且吸附壓力設為0.9 Mpa,脫附壓力設為0.1 MPa。After the argon gas flowing out of the dryer 5 is cooled by the cooler 8, the content of the impurities is lowered by the adsorption device 9. The PSA unit 10 was set to a three-tower type, and each column was filled with 1.25 L of a carbon-shaped molecular sieve of cylindrical shaped carbon having a diameter of 2 mm (3k-172 manufactured by Enviro Chemicals, Japan) as an adsorbent, and the adsorption pressure was set to 0.9 Mpa. The desorption pressure was set to 0.1 MPa.

將藉由PSA單元10所純化之氬氣導入至TSA單元20。TSA單元20設為2塔式,向各塔中填充1.5 L之CaX型沸石作為吸附劑,且吸附壓力設為0.8 Mpa,吸附溫度設為-35℃,脫附壓力設為0.1 Mpa,脫附溫度設為40℃。The argon gas purified by the PSA unit 10 is introduced to the TSA unit 20. The TSA unit 20 was set to a two-tower type, and each column was filled with 1.5 L of CaX-type zeolite as an adsorbent, and the adsorption pressure was set to 0.8 Mpa, the adsorption temperature was set to -35 ° C, and the desorption pressure was set to 0.1 Mpa, desorption. The temperature was set to 40 °C.

將自TSA單元20流出之經純化之氬氣之組成示於以下之表1中。再者,經純化之氬氣中之氧濃度係藉由Teledyne公司製造之微量氧濃度計型式311測定,一氧化碳及二氧化碳之濃度係使用島津製作所製造之GC-FID並經由甲烷化器(Methanizer)測定。對於氫濃度係使用GLscience公司製造之GC-PID測定。The composition of the purified argon flowing from the TSA unit 20 is shown in Table 1 below. Further, the oxygen concentration in the purified argon gas was measured by a trace oxygen concentration meter type 311 manufactured by Teledyne Co., Ltd., and the concentrations of carbon monoxide and carbon dioxide were measured by a Methanizer using a GC-FID manufactured by Shimadzu Corporation. . For the hydrogen concentration, the GC-PID measurement by GLscience was used.

實施例2Example 2

除將氧之添加流量以標準狀態設為5.00 mL/min外,與實施例1相同地對氬氣進行純化。將該經純化之氬氣之組成示於以下之表1中。Argon gas was purified in the same manner as in Example 1 except that the oxygen addition flow rate was set to 5.00 mL/min in a standard state. The composition of the purified argon is shown in Table 1 below.

實施例3Example 3

除將TSA單元20中所使用之吸附劑設為MgX型沸石外,與實施例1相同地對氬氣進行純化。將該經純化之氬氣之組成示於以下之表1中。Argon gas was purified in the same manner as in Example 1 except that the adsorbent used in the TSA unit 20 was changed to MgX type zeolite. The composition of the purified argon is shown in Table 1 below.

實施例4Example 4

除將TSA單元20中之吸附溫度設為-50℃外,與實施例1相同地對氬氣進行純化。將該經純化之氬氣之組成示於以下之表1中。Argon gas was purified in the same manner as in Example 1 except that the adsorption temperature in the TSA unit 20 was set to -50 °C. The composition of the purified argon is shown in Table 1 below.

比較例1Comparative example 1

除將氧之添加流量以標準狀態設為1 mL/min外,與實施例1相同地對氬氣進行純化。將該經純化之氬氣之組成示於以下之表1中。Argon gas was purified in the same manner as in Example 1 except that the oxygen addition flow rate was set to 1 mL/min in a standard state. The composition of the purified argon is shown in Table 1 below.

比較例2Comparative example 2

除將PSA單元10中所使用之吸附劑設為CaA型沸石外,與實施例1相同地對氬氣進行純化。將該經純化之氬氣之組成示於以下之表1中。Argon gas was purified in the same manner as in Example 1 except that the adsorbent used in the PSA unit 10 was a CaA type zeolite. The composition of the purified argon is shown in Table 1 below.

比較例3Comparative example 3

除未利用乾燥器進行脫水操作外,與實施例1相同地對氬氣進行純化。將該經純化之氬氣之組成示於以下之表1中。Argon gas was purified in the same manner as in Example 1 except that the dehydration operation was not carried out using a dryer. The composition of the purified argon is shown in Table 1 below.

根據上述表1可明確,各實施例較之各比較例之氬氣純度更高,較之比較例2、3之氧濃度更低,較之比較例1之一氧化碳濃度更低,且較之比較例1、3之氫濃度更低。According to the above Table 1, it is clear that the argon gas of each of the examples is higher in purity than the comparative examples, and the oxygen concentration is lower than that of Comparative Examples 2 and 3, and the carbon oxide concentration is lower than that of Comparative Example 1, and compared. The hydrogen concentrations of Examples 1 and 3 were lower.

1...氬氣供給源1. . . Argon supply

2...加熱器2. . . Heater

3...反應器3. . . reactor

4...濃度調節裝置4. . . Concentration adjusting device

4a...濃度測定器4a. . . Concentration tester

4b...氧供給源4b. . . Oxygen supply

4c...氧量調整器4c. . . Oxygen regulator

4d...控制器4d. . . Controller

5...乾燥器5. . . Dryer

8、22...冷卻器8, 22. . . Cooler

9...吸附裝置9. . . Adsorption device

10...PSA單元10. . . PSA unit

12...壓縮機12. . . compressor

13、23...吸附塔13,23. . . Adsorption tower

13a...吸附塔13之入口13a. . . Entrance of adsorption tower 13

13b、13e、131、...切換閥13b, 13e, 131,. . . Switching valve

13n、13p、13x13n, 13p, 13x

13f...消音器13f. . . silencer

13k...吸附塔13之出口13k. . . The outlet of the adsorption tower 13

13m、23g...流出配管13m, 23g. . . Outflow piping

13o...升壓配管13o. . . Boost piping

13q...均壓及清潔出側配管13q. . . Pressure equalization and cleaning side piping

13r、13u...流量控制閥13r, 13u. . . Flow control valve

13s...均壓及清潔入側配管13s. . . Pressure equalization and cleaning inlet piping

13t...壓力調節閥13t. . . A pressure regulating valve

13v...流量指示調節計13v. . . Flow indicator regulator

13w...連結配管13w. . . Connecting piping

20...TSA單元20. . . TSA unit

21...預冷器twenty one. . . Precooler

23a...吸附塔23之入口23a. . . Entrance to adsorption tower 23

23b、23c、23f、...開關閥23b, 23c, 23f,. . . Switch valve

23h、23j、23n、23h, 23j, 23n,

24f24f

23e...吸附塔23之出口23e. . . The outlet of the adsorption tower 23

23i...冷卻‧升壓用配管23i. . . Cooling ‧ boosting piping

23k...清潔用配管23k. . . Cleaning pipe

23l...一次側壓力控制閥23l. . . Primary side pressure control valve

23m...流量計23m. . . Flow meter

23o...流量控制閥23o. . . Flow control valve

24...熱交換器twenty four. . . Heat exchanger

24a...外管24a. . . Outer tube

24b...冷媒供給源24b. . . Refrigerant supply

24c...冷媒用散熱器24c. . . Refrigerant radiator

24d...熱媒供給源24d. . . Heat medium supply

24e...熱媒用散熱器24e. . . Heat medium radiator

24g...貯槽24g. . . Storage tank

α...純化裝置α. . . Purification device

圖1係本發明之實施形態之氬氣之純化裝置的構成說明圖。Fig. 1 is a view showing the configuration of an apparatus for purifying an argon gas according to an embodiment of the present invention.

圖2係本發明之實施形態之氬氣之純化裝置中的變壓式吸附裝置之構成說明圖。Fig. 2 is a block diagram showing the configuration of a pressure swing type adsorption apparatus in an apparatus for purifying an argon gas according to an embodiment of the present invention.

圖3係本發明之實施形態之氬氣之純化裝置中的變溫式吸附裝置之構成說明圖。Fig. 3 is a block diagram showing the configuration of a variable temperature adsorption device in an apparatus for purifying argon gas according to an embodiment of the present invention.

1...氬氣供給源1. . . Argon supply

2...加熱器2. . . Heater

3...反應器3. . . reactor

4...濃度調節裝置4. . . Concentration adjusting device

4a...濃度測定器4a. . . Concentration tester

4b...氧供給源4b. . . Oxygen supply

4c...氧量調整器4c. . . Oxygen regulator

4d...控制器4d. . . Controller

5...乾燥器5. . . Dryer

8...冷卻器8. . . Cooler

9...吸附裝置9. . . Adsorption device

10...PSA單元10. . . PSA unit

20...TSA單元20. . . TSA unit

α...純化裝置α. . . Purification device

Claims (3)

一種氬氣之純化方法,其係對作為雜質至少含有氧、氫、一氧化碳及氮之氬氣進行純化者,且於上述氬氣中之氧莫耳濃度為一氧化碳莫耳濃度與氫莫耳濃度之和的1/2以下之情形時,藉由添加氧而設定成超過1/2之值;其次,使用觸媒使上述氬氣中之氧與一氧化碳及氫進行反應,藉此以殘留氧之狀態生成二氧化碳及水;接著,藉由脫水操作降低上述氬氣中之水分含有率;然後,藉由使用碳系吸附劑之常溫下之變壓式吸附法吸附上述氬氣中之雜質中之至少氧及二氧化碳;此後,藉由-10℃~-50℃下之變溫式吸附法吸附上述氬氣中之雜質中之至少氮。 A method for purifying argon gas, which is characterized in that argon gas containing at least oxygen, hydrogen, carbon monoxide and nitrogen as impurities is purified, and the oxygen molar concentration in the argon gas is a carbon monoxide molar concentration and a hydrogen molar concentration. When the ratio is 1/2 or less, the value is set to more than 1/2 by adding oxygen; secondly, the oxygen in the argon gas is reacted with carbon monoxide and hydrogen by using a catalyst, thereby maintaining the state of residual oxygen. Producing carbon dioxide and water; then, reducing the moisture content in the argon gas by a dehydration operation; and then adsorbing at least the oxygen in the argon gas by a pressure swing adsorption method at a normal temperature using a carbon-based adsorbent And carbon dioxide; thereafter, at least nitrogen in the impurities in the argon gas is adsorbed by a temperature swing adsorption method at -10 ° C to -50 ° C. 如請求項1之氬氣之純化方法,其中上述碳系吸附劑為碳分子篩。 The method for purifying argon according to claim 1, wherein the carbon-based adsorbent is a carbon molecular sieve. 一種氬氣之純化裝置,其特徵在於:其係對作為雜質至少含有氧、氫、一氧化碳及氮之氬氣進行純化者,且包含:反應器,其被導入上述氬氣;濃度調節裝置,其於導入於上述反應器之上述氬氣中之氧莫耳濃度為一氧化碳莫耳濃度與氫莫耳濃度之和的1/2以下之情形時,藉由添加氧而設定成超過1/2之值;乾燥器,其藉由進行脫水操作而降低自上述反應器流出之上述氬氣之水分含有率;及 吸附裝置,其連接於上述乾燥器;於上述反應器內填充有觸媒,以使得藉由於上述反應器內上述氬氣中之氧與一氧化碳及氫進行反應,而以殘留氧之狀態生成二氧化碳及水;上述吸附裝置包含:PSA單元,其藉由使用碳系吸附劑之常溫下之變壓式吸附法吸附上述氬氣中之雜質中之至少氧及二氧化碳;及TSA單元,其藉由-10℃~-50℃下之變溫式吸附法吸附上述氬氣中之雜質中之至少氮。 An apparatus for purifying argon gas, which is characterized in that an argon gas containing at least oxygen, hydrogen, carbon monoxide and nitrogen as impurities is purified, and comprises: a reactor introduced into the argon gas; and a concentration adjusting device When the oxygen molar concentration in the argon gas introduced into the reactor is 1/2 or less of the sum of the carbon monoxide molar concentration and the hydrogen molar concentration, the value is set to more than 1/2 by adding oxygen. a dryer that reduces the moisture content of the argon gas flowing out of the reactor by performing a dehydration operation; An adsorption device connected to the dryer; the reactor is filled with a catalyst to generate carbon dioxide in a state of residual oxygen by reacting oxygen in the argon gas with carbon monoxide and hydrogen in the reactor Water; the adsorption device comprises: a PSA unit that adsorbs at least oxygen and carbon dioxide in the impurities in the argon gas by a pressure swing adsorption method at a normal temperature using a carbon-based adsorbent; and a TSA unit, which is 10 The variable temperature adsorption method at ° C to -50 ° C adsorbs at least nitrogen in the impurities in the above argon gas.
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