TWI466340B - 封膠材料形成裝置及其方法 - Google Patents

封膠材料形成裝置及其方法 Download PDF

Info

Publication number
TWI466340B
TWI466340B TW100137184A TW100137184A TWI466340B TW I466340 B TWI466340 B TW I466340B TW 100137184 A TW100137184 A TW 100137184A TW 100137184 A TW100137184 A TW 100137184A TW I466340 B TWI466340 B TW I466340B
Authority
TW
Taiwan
Prior art keywords
resin
mold
cavity
substrate
loading space
Prior art date
Application number
TW100137184A
Other languages
English (en)
Chinese (zh)
Other versions
TW201220553A (en
Inventor
Dae Su Seuk
Eun Sook Park
Young Gyu Choi
Dong Joo Hwang
Original Assignee
Shinhan Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinhan Diamond Ind Co Ltd filed Critical Shinhan Diamond Ind Co Ltd
Publication of TW201220553A publication Critical patent/TW201220553A/zh
Application granted granted Critical
Publication of TWI466340B publication Critical patent/TWI466340B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
TW100137184A 2010-10-19 2011-10-13 封膠材料形成裝置及其方法 TWI466340B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100101948A KR101087031B1 (ko) 2010-10-19 2010-10-19 봉지재 성형장치 및 방법

Publications (2)

Publication Number Publication Date
TW201220553A TW201220553A (en) 2012-05-16
TWI466340B true TWI466340B (zh) 2014-12-21

Family

ID=45398222

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100137184A TWI466340B (zh) 2010-10-19 2011-10-13 封膠材料形成裝置及其方法

Country Status (4)

Country Link
JP (1) JP5474212B2 (fr)
KR (1) KR101087031B1 (fr)
TW (1) TWI466340B (fr)
WO (1) WO2012053757A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009045911A1 (de) 2009-10-22 2011-04-28 Robert Bosch Gmbh Koppelvorrichtung, Anordnung mit einer Koppelvorrichtung, Verfahren zur Herstellung einer Anordnung mit einer Koppelvorrichtung
KR101441966B1 (ko) * 2013-11-19 2014-09-30 인탑스 주식회사 휴대폰케이스의 방수처리장치
JP6525805B2 (ja) * 2015-08-10 2019-06-05 アピックヤマダ株式会社 モールド金型及びモールド装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003133352A (ja) * 2001-10-30 2003-05-09 Sainekkusu:Kk 半導体樹脂封止装置
JP2005191064A (ja) * 2003-12-24 2005-07-14 Nec Electronics Corp 樹脂封止方法および樹脂封止装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2635193B2 (ja) * 1990-01-23 1997-07-30 三菱電機株式会社 半導体装置の樹脂封止装置、樹脂封止方法及び樹脂封止型半導体装置
JP3594489B2 (ja) * 1998-07-03 2004-12-02 京セラケミカル株式会社 樹脂封止型電子部品の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003133352A (ja) * 2001-10-30 2003-05-09 Sainekkusu:Kk 半導体樹脂封止装置
JP2005191064A (ja) * 2003-12-24 2005-07-14 Nec Electronics Corp 樹脂封止方法および樹脂封止装置

Also Published As

Publication number Publication date
TW201220553A (en) 2012-05-16
WO2012053757A2 (fr) 2012-04-26
JP5474212B2 (ja) 2014-04-16
JP2013512807A (ja) 2013-04-18
KR101087031B1 (ko) 2011-11-28
WO2012053757A3 (fr) 2012-06-14

Similar Documents

Publication Publication Date Title
JP6491508B2 (ja) 樹脂封止装置及び樹脂成形品の製造方法
US20090291532A1 (en) Method of resin encapsulation molding for electronic part
JP6560498B2 (ja) 樹脂封止方法及び樹脂成形品の製造方法
TW201742201A (zh) 樹脂成型裝置、樹脂成型方法以及樹脂成型模具
JP2005305954A5 (fr)
KR20040022152A (ko) 전자 부품의 수지 밀봉 성형 방법 및 상기 방법에이용되는 수지 밀봉 성형 장치
JP4416218B2 (ja) 樹脂封止方法及び樹脂封止装置
TWI613059B (zh) 樹脂成形裝置及樹脂成形方法以及成形模具
JP6598642B2 (ja) 樹脂封止装置及び樹脂封止方法
WO2017081881A1 (fr) Dispositif d'encapsulation par résine et procédé d'encapsulation par résine
JP2013123849A (ja) 樹脂封止装置および樹脂封止方法
TW201923993A (zh) 樹脂成型裝置及樹脂成型品的製造方法
TWI466340B (zh) 封膠材料形成裝置及其方法
JP2007237740A (ja) 光電子部品および光電子部品の製造方法
TW201902650A (zh) 模製模具及樹脂模製方法
TWI481081B (zh) 封止材料形成方法
JP2004200269A (ja) 電子部品の樹脂封止成形方法及び装置
TWI656006B (zh) Resin forming device
WO2016125571A1 (fr) Matrice de moulage de résine, procédé de moulage de résine, et procédé de production d'article moulé en résine
WO2018139631A1 (fr) Dispositif d'étanchéité en résine et procédé d'étanchéité en résine
JP6028465B2 (ja) 樹脂モールド方法及び樹脂モールド装置
TWI834678B (zh) 用於封裝電子組件之模具、用於此種模具之嵌件、嵌件製作方法、及電子組件封裝方法
JP5027451B2 (ja) 半導体チップの樹脂封止成形方法
CN1868048B (zh) 使用柔性压力元件来密封电子部件的方法和装置
JP4637214B2 (ja) トランスファ成形金型及びこれを用いた樹脂封止方法