TWI466251B - 半導體裝置及其組裝方法 - Google Patents

半導體裝置及其組裝方法 Download PDF

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Publication number
TWI466251B
TWI466251B TW099146360A TW99146360A TWI466251B TW I466251 B TWI466251 B TW I466251B TW 099146360 A TW099146360 A TW 099146360A TW 99146360 A TW99146360 A TW 99146360A TW I466251 B TWI466251 B TW I466251B
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Taiwan
Prior art keywords
pads
semiconductor device
conductive blocks
conductive
wafer
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TW099146360A
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English (en)
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TW201227889A (en
Inventor
Yu Min Lin
Chau Jie Zhan
Su Tsai Lu
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Ind Tech Res Inst
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Priority to TW099146360A priority Critical patent/TWI466251B/zh
Priority to CN2010106196417A priority patent/CN102569235A/zh
Priority to US13/089,289 priority patent/US8415795B2/en
Publication of TW201227889A publication Critical patent/TW201227889A/zh
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Publication of TWI466251B publication Critical patent/TWI466251B/zh

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Description

半導體裝置及其組裝方法
本發明是有關於一種半導體裝置及其組裝方法，且特別是有關於一種採用覆晶接合技術的半導體裝置及其組裝方法。
覆晶接合製程中，影響產品可靠度的有兩種習知的破壞方式。一種是機械性的破壞，例如溫度循環可靠度測試時因材料間熱膨脹係數的差異過大產生的殘留應力造成接點破壞。另一種是因為高電流時的電遷移效應使銲錫接點出現孔洞，進而影響接點品質以及結構強度。
另一方面，在銲錫接點的組裝或者高溫回銲的過程中，銲錫接點的介面上可能因為高溫而產生介金屬化合物(intermetallic compound,IMC)，通常這種介金屬化合物的材料硬度比原來的銲錫接點硬，剛性較高而缺乏彈性，較容易在溫度循環的可靠度測試中被破壞。但是，介金屬化合物具有可減緩電遷移效應的特性，提高介金屬化合物含量反而可以增加銲錫接點抵抗電遷移效應的能力。
本發明提供一種半導體裝置，可避免熱應力以及電遷移效應造成的破壞。
本發明提供一種半導體裝置的組裝方法，所組裝成的半導體裝置可避免熱應力以及電遷移效應造成的破壞。
本發明的半導體裝置包括一第一晶片、一承載裝置、多個第一導電塊以及多個第二導電塊。第一晶片具有多個第一接墊。承載裝置具有多個第二接墊，使第二接墊對應於第一接墊。多個第一導電塊分別配置於第一接墊其中之一與第二接墊其中之一之間。多個第二導電塊分別配置於第一接墊其中之一與第二接墊其中之一之間。第二導電塊的介金屬化合物的成分比例大於第一導電塊的介金屬化合物的成分比例。
在本發明之半導體裝置的一實施例中，第二導電塊的介金屬化合物的成分比例實質上為100%。
在本發明之半導體裝置的一實施例中，承載裝置為一線路基板或另一晶片。
在本發明之半導體裝置的一實施例中，半導體裝置更包括一底膠材料，填充於第一晶片與承載裝置之間，並包圍第一導電塊與第二導電塊。
在本發明之半導體裝置的一實施例中，第一晶片更具有至少一加熱迴路，電性絕緣於第一接墊，且鄰近於第二導電塊。加熱迴路可製作為特殊形狀，增加長度提高熱阻，可有效增加局部溫度，例如呈城垛狀。
在本發明之半導體裝置的一實施例中，承載裝置更具有至少一加熱迴路，電性絕緣於第二接墊，且鄰近於第二導電塊。加熱迴路可製作為特殊形狀，增加長度提高熱阻，可有效增加局部溫度，例如呈城垛狀。
在本發明之半導體裝置的一實施例中，半導體裝置更包括一第二晶片、多個第三導電塊以及多個第四導電塊。第二晶片具有多個第三接墊。第一晶片位於第二晶片與承載裝置之間，且第一晶片更具有多個第四接墊。多個第三導電塊分別配置於第三接墊其中之一與第四接墊其中之一之間。多個第四導電塊分別配置於第三接墊其中之一與第四接墊其中之一之間。第三導電塊的介金屬化合物的成分比例大於第四導電塊的介金屬化合物的成分比例。
本發明的半導體裝置的組裝方法包括下列步驟。將一晶片的多個第一接墊經由多個第一導電塊電性連接一承載裝置的多個第二接墊。加熱部分的第一導電塊而形成多個第二導電塊，以使第二導電塊的介金屬化合物的成分比例大於第一導電塊的介金屬化合物的成分比例。
在本發明之半導體裝置的組裝方法的一實施例中，在形成第二導電塊之後，更包括填充一底膠材料於晶片與承載裝置之間。底膠材料並包圍第一導電塊與第二導電塊。
在本發明之半導體裝置的組裝方法的一實施例中，在將第一接墊電性連接第二接墊之後與形成第二導電塊之前，更包括填充一底膠材料於晶片與承載裝置之間。底膠材料並包圍第一導電塊與第二導電塊。
在本發明之半導體裝置的組裝方法的一實施例中，形成第二導電塊的步驟包括通電於晶片的至少一加熱迴路。加熱迴路電性絕緣於第一接墊，且鄰近於第二導電塊。
在本發明之半導體裝置的組裝方法的一實施例中，形成第二導電塊的步驟包括通電於承載裝置的至少一加熱迴路。加熱迴路電性絕緣於第一接墊，且鄰近於第二導電塊。
基於上述，在本發明的半導體裝置及其組裝方法中，導電塊的介金屬化合物的成分比例不同而可分別抵抗熱應力以及電遷移效應可能造成的破壞。
為讓本發明之上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。
圖1是本發明一實施例的半導體裝置的透視圖。請參照圖1，本實施例的半導體裝置100包括一晶片110、一承載裝置120、多個第一導電塊130以及多個第二導電塊140。晶片110具有多個第一接墊112。承載裝置120具有多個第二接墊122。每個第一導電塊130配置於一個第一接墊112與一個第二接墊122之間。每個第二導電塊140配置於一個第一接墊112與一個第二接墊122之間。第二導電塊140的介金屬化合物的成分比例大於第一導電塊130的介金屬化合物的成分比例。本實施例中，第一導電塊130與第二導電塊140的介金屬化合物的成分比例的差異，是在半導體裝置100製作完成時就已經形成，或者在半導體裝置售出後再形成。
舉例而言，第一導電塊130的材質為錫銀，與第一導電塊130接觸的材質為銅，則第二導電塊140中的介金屬化合物可能是錫銅化合物(如Cu3 Sn或者Cu6 Sn5 )。或者，第一導電塊130為錫銀銅，與第一導電塊130接觸的材質為鎳，則第二導電塊140中的介金屬化合物可能是錫鎳銅化合物(如(Cu,Ni)3 Sn4 或(Cu,Ni)6 Sn5 )。根據第一導電塊130的材質以及與第一導電塊130接觸的材質的不同，可能同時出現很多種不同的介金屬化合物，這邊只是舉例。本說明書中所謂的介金屬化合物的成分比例的百分比是以所有介金屬化合物體積總和相對於非介金屬化合物體積而言。
在本實施例的半導體裝置100中，晶片110與承載裝置120的熱膨脹係數可能不同，在半導體裝置100因工作而升溫以及因停止工作而降溫的溫度變化過程中，位於晶片110與承載裝置120之間的第一導電塊130因介金屬化合物的成分比例較小，剛性及硬度較低可承受較大的熱應力而不會被破壞。
另一方面，介金屬化合物的成分比例較大的第二導電塊140對於電遷移效應所造成的破壞具有較佳的抵抗能力。因此，將第二導電塊140做為傳遞大電流的途徑時，可提升半導體裝置100的可靠度。
本實施例的第二導電塊140的介金屬化合物的成分比例甚至有機會達到實質上為100%。因此，第二導電塊140即使做為主要的電流輸入途徑，仍可大幅降低因為電遷移效應而造成破壞的可能性。另外，本實施例以兩種不同介金屬化合物的成分比例的導電塊為例，但在其他實施例中也可同時採用更多種不同介金屬化合物的成分比例的導電塊。
本實施例的承載裝置120是以線路基板為例。然而，在其他實施例中，承載裝置120也可以為另一個晶片。換言之，製作介金屬化合物的成分比例不同的導電塊的技術可應用在晶片與線路基板之間，也可以應用在兩個晶片之間，或者是其他以導電塊做為電性傳導途徑的裝置中。亦即是，本實施例的半導體裝置100可以是由多個晶片堆疊而成，只要半導體裝置100中包括兩種介金屬化合物的成分比例不同的導電塊，即屬本發明所欲保護的範疇。
本實施例的半導體裝置100可更包括一底膠材料150，填充於晶片110與承載裝置120之間，並包圍第一導電塊130與第二導電塊140。底膠材料150用以第一導電塊130與第二導電塊140裸露出之部分，並同時減緩晶片110與承載裝置120之間因溫度變化而所產生的熱應力，還可預防外界之濕氣進入半導體裝置100的內部。
本實施例的承載裝置120可更具有至少一加熱迴路124。加熱迴路124與第二接墊122電性絕緣，亦即加熱迴路124並不連接第二接墊122。而且，加熱迴路124鄰近於第二導電塊140。在輸入電流至加熱迴路124後，加熱迴路124會因為本身的電阻而逐漸升溫，並使得鄰近的第二導電塊140的溫度被提高。另一方面，較為遠離加熱迴路124的第一導電塊130的溫度則提升有限。由於介金屬化合物的含量會隨著溫度升高而增加，因此利用加熱迴路124的作用即可產生介金屬化合物的成分比例不同的第一導電塊130與第二導電塊140。當半導體裝置100完成後，加熱迴路124斷電流，加熱迴路124不需取出，使加熱迴路124還可在半導體裝置100工作時做為提升散熱效率之用。
此外，改變加熱迴路的形狀也可增加加熱迴路長度以及電阻值進而提高第二導電塊受加熱時的溫度，可有效增加第二導電塊的介金屬化合物的成分比例。例如，圖2的加熱迴路200就以城垛狀設計增加迴路長度而具有較高的電阻值。
另外，加熱迴路的分佈位置是根據要產生介金屬化合物的成分比例較高的第二導電塊的位置而決定。例如，圖3A至圖3C就分別列示了三種加熱迴路310、320與330的分佈方式。其中，圖3C的加熱迴路330的數量為兩個，而加熱迴路330的數量也可依需求進一步增加。故本發明之各實施例之加熱迴路可依不同幾何形狀設計來達到欲加熱第一導電塊使形成第二導電塊的目的。
在第一導電塊與第二導電塊的相對位置方面，同樣可依需求作適當調整。主要考量在於，應在使用時通過電流量較大而易發生電遷移效應的位置配置介金屬化合物的成分比例高的第二導電塊，並在承受較大熱應力的位置配置介金屬化合物的成分比例低的第一導電塊。圖4A至圖4F即分別列示六種第一導電塊410與第二導電塊420的排列方式。
圖4A顯示第一導電塊410分佈於晶片一側，第二導電塊420分佈於其它大部分區域。而第二導電塊420欲達到此種分佈效果，加熱迴路432可預先於第二導電塊420的區域中佈置。圖4B顯示第一導電塊410分佈於晶片上近似T字形，第二導電塊420分佈於其它區域。而加熱迴路434可預先於第二導電塊420的區域中佈置。圖4C顯示第一導電塊410分佈於第二導電塊420外緣。而加熱迴路436可預先於第二導電塊420的區域從中佈置，且電流輸出入可由垂直晶片表面方向設計。圖4D顯示第一導電塊410分佈於晶片對角線部分，第二導電塊420分佈於其它區域並對稱。而加熱迴路438可預先於第二導電塊420的區域中佈置。圖4E顯示第二導電塊420分佈於晶片上呈十字形，第一導電塊410分佈於其它區域。而加熱迴路442可預先於第二導電塊420的區域中佈置。圖4F顯示第二導電塊420分佈於晶片上呈L形，第一導電塊410分佈於其它區域。而加熱迴路444可預先於第二導電塊420的區域中佈置。
圖5是本發明另一實施例的半導體裝置的透視圖。請參照圖5，本實施例的半導體裝置500與圖1的半導體裝置100相似，差異在於承載裝置520沒有加熱迴路，而晶片510具有至少一加熱迴路514。加熱迴路514與第一接墊512電性絕緣，且加熱迴路514鄰近於第二導電塊140。亦即是，加熱迴路514的使用方式、產生的作用及可能的變化都與圖1的加熱迴路124相同。
圖6是本發明再一實施例的半導體裝置的局部剖面圖。請參照圖6，本實施例的半導體裝置600與圖1的半導體裝置100相似，差異在於在本實施例的半導體裝置600更包括一晶片610、多個第三導電塊620以及多個第四導電塊630。晶片610具有多個第三接墊612。晶片110位於晶片610與承載裝置120之間，且晶片110更具有多個第四接墊114。每個第三導電塊620配置於一個第三接墊612與一個第四接墊114之間。每個第四導電塊630配置於一個第三接墊612與一個第四接墊114之間。第三導電塊620的介金屬化合物的成分比例大於第四導電塊630的介金屬化合物的成分比例。亦即是，製作介金屬化合物的成分比例不同的導電塊的技術也可應用在晶片堆疊式的半導體裝置600，以提升晶片堆疊式的半導體裝置600的可靠度。
圖7為本發明一實施例的半導體裝置的組裝方法的流程圖，而圖8A至圖8C為圖7之組裝方法所組裝的半導體裝置在組裝時的剖面圖。請參照圖7與圖8A，本實施例的半導體裝置的組裝方法是先將晶片810的第一接墊812經由第一導電塊830電性連接承載裝置820的第二接墊822，步驟S110。此時，所有第一接墊812與第二接墊822之間的導電塊都是第一導電塊830，且所有的第一導電塊830的成分在不考慮製程差異時基本上都相同。第一導電塊830可能由第一接墊812上的凸塊(未繪示)、第二接墊822上的凸塊(未繪示)與兩個凸塊之間的銲料構成。兩個凸塊的材質都可以是錫鉛合金、金或其他導體。另外，第一接墊812與凸塊之間可能還形成有凸塊底層金屬(under bump metallurgy,UBM)，而第二接墊822與凸塊之間同樣可能形成有凸塊底層金屬。此外，第一導電塊830也可能只由第一接墊812上的凸塊(未繪示)與第二接墊822上的凸塊(未繪示)構成，兩者之間以雷射或其他方式進行接合。本技術領域中具有通常知識者當知，第一導電塊830的構成方式上有許多其他可能，在此並不一一說明。
接著，請參照圖7與圖8B，加熱部分的第一導電塊830而形成第二導電塊840，以使第二導電塊840的介金屬化合物的成分比例大於第一導電塊830的介金屬化合物的成分比例，步驟S120。具體而言，被加熱的第一導電塊830中的介金屬化合物的成分比例會增加，而這種介金屬化合物的成分比例增加後的第一導電塊830在此被稱為第二導電塊840，以區隔介金屬化合物的成分比例不同的兩種導電塊。加熱第一導電塊830而形成第二導電塊840的方式有很多種，其中一種就是利用如圖1的承載裝置120的加熱迴路124或圖5的晶片510的加熱迴路514的加熱迴路而加熱第一導電塊830。根據實驗，利用通電於加熱迴路而加熱第一導電塊的方式，甚至有機會形成介金屬化合物的成分比例實質上為100%的第二導電塊。
請參照圖7與圖8C，在形成第二導電塊840之後，還可選擇性地填充底膠材料850於晶片810與承載裝置820之間，步驟S130。底膠材料850與圖1的底膠材料150相同。
圖9為本發明一實施例的半導體裝置的組裝方法的流程圖。請參照圖9，本實施例的半導體裝置的組裝方法與圖7的實施例相似，差異在於填充底膠材料的步驟S140是在將第一接墊電性連接第二接墊的步驟S110之後與形成第二導電塊的步驟S120之前進行。
綜上所述，在本發明的半導體裝置及其組裝方法中，具備了兩種不同介金屬化合物的成分比例的導電塊。其中，介金屬化合物的成分比例較小的導電塊對於熱應力具有較佳的抵抗能力，介金屬化合物的成分比例較大的導電塊則對於電遷移效應具有較佳的抵抗能力。因此，本發明的半導體裝置及其組裝方法具有較佳的可靠度。
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，故本發明之保護範圍當視後附之申請專利範圍所界定者為準。
100、500、600．．．半導體裝置
110、510、610、810．．．晶片
112、512、812．．．第一接墊
114．．．第四接墊
120、520、820．．．承載裝置
122、822．．．第二接墊
124、200、310、320、330、514、432、434、436、438、442、444．．．加熱迴路
130、410、830．．．第一導電塊
140、420、840．．．第二導電塊
150、850．．．底膠材料
612．．．第三接墊
620．．．第三導電塊
630．．．第四導電塊
S110～S140．．．步驟
圖1是本發明一實施例的半導體裝置的透視圖。
圖2是另一種加熱迴路。
圖3A至圖3C分別列示三種加熱迴路的分佈方式。
圖4A至圖4F分別列示六種第一導電塊與第二導電塊的排列方式。
圖5是本發明另一實施例的半導體裝置的透視圖。
圖6是本發明再一實施例的半導體裝置的局部剖面圖。
圖7為本發明一實施例的半導體裝置的組裝方法的流程圖。
圖8A至圖8C為圖7之組裝方法所組裝的半導體裝置在組裝時的剖面圖。
圖9為本發明一實施例的半導體裝置的組裝方法的流程圖。
100．．．半導體裝置
110．．．晶片
112．．．第一接墊
120．．．承載裝置
122．．．第二接墊
124．．．加熱迴路
130．．．第一導電塊
140．．．第二導電塊
150．．．底膠材料

Claims (14)

  1. 一種半導體裝置，包括：一第一晶片，具有多個第一接墊；一承載裝置，具有多個第二接墊，使該些第二接墊對應於該些第一接墊；多個第一導電塊，分別配置於該些第一接墊其中之一與該些第二接墊其中之一之間；以及多個第二導電塊，分別配置於該些第一接墊其中之一與該些第二接墊其中之一之間，其中該些第一導電塊與該些第二導電塊是由相同材料形成，經加熱後的該些第二導電塊的介金屬化合物的成分比例大於該些第一導電塊的介金屬化合物的成分比例，且該些第一導電塊的介金屬化合物的成分與該些第二導電塊的介金屬化合物的成分相同。
  2. 如申請專利範圍第1項所述之半導體裝置，其中該些第二導電塊的介金屬化合物的成分比例實質上為100%。
  3. 如申請專利範圍第1項所述之半導體裝置，其中該承載裝置為一線路基板或另一晶片。
  4. 如申請專利範圍第1項所述之半導體裝置，更包括一底膠材料，填充於該第一晶片與該承載裝置之間，並包圍該些第一導電塊與該些第二導電塊。
  5. 如申請專利範圍第1項所述之半導體裝置，其中該第一晶片更具有至少一加熱迴路，電性絕緣於該些第一接墊，且鄰近於該些第二導電塊。
  6. 如申請專利範圍第5項所述之半導體裝置，其中該 加熱迴路呈城垛狀。
  7. 如申請專利範圍第1項所述之半導體裝置，其中該承載裝置更具有至少一加熱迴路，電性絕緣於該些第二接墊，且鄰近於該些第二導電塊。
  8. 如申請專利範圍第7項所述之半導體裝置，其中該加熱迴路呈城垛狀。
  9. 如申請專利範圍第1項所述之半導體裝置，更包括：一第二晶片，具有多個第三接墊，其中該第一晶片位於該第二晶片與該承載裝置之間，該第一晶片更具有多個第四接墊；多個第三導電塊，分別配置於該些第三接墊其中之一與該些第四接墊其中之一之間；以及多個第四導電塊，分別配置於該些第三接墊其中之一與該些第四接墊其中之一之間，其中該些第三導電塊的介金屬化合物的成分比例大於該些第四導電塊的介金屬化合物的成分比例。
  10. 一種半導體裝置的組裝方法，包括：將一晶片的多個第一接墊經由相同材料形成的多個第一導電塊電性連接一承載裝置的多個第二接墊；以及加熱部分的該些第一導電塊而形成多個第二導電塊，以使經加熱後的該些第二導電塊的介金屬化合物的成分比例大於該些第一導電塊的介金屬化合物的成分比例，且該些第一導電塊的介金屬化合物的成分與該些第二導電塊的介金屬化合物的成分相同。
  11. 如申請專利範圍第10項所述之半導體裝置的組裝方法，其中在形成該些第二導電塊之後，更包括填充一底膠材料於該晶片與該承載裝置之間，該底膠材料並包圍該些第一導電塊與該些第二導電塊。
  12. 如申請專利範圍第10項所述之半導體裝置的組裝方法，其中在將該些第一接墊電性連接該些第二接墊之後與形成該些第二導電塊之前，更包括填充一底膠材料於該晶片與該承載裝置之間，該底膠材料並包圍該些第一導電塊與該些第二導電塊。
  13. 如申請專利範圍第10項所述之半導體裝置的組裝方法，其中形成該些第二導電塊的步驟包括通電於該晶片的至少一加熱迴路，該加熱迴路電性絕緣於該些第一接墊，且鄰近於該些第二導電塊。
  14. 如申請專利範圍第10項所述之半導體裝置的組裝方法，其中形成該些第二導電塊的步驟包括通電於該承載裝置的至少一加熱迴路，該加熱迴路電性絕緣於該些第一接墊，且鄰近於該些第二導電塊。
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