TWI465732B - Substrate inspecting apparatus and substrate inspecting method - Google Patents
Substrate inspecting apparatus and substrate inspecting method Download PDFInfo
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- TWI465732B TWI465732B TW101125340A TW101125340A TWI465732B TW I465732 B TWI465732 B TW I465732B TW 101125340 A TW101125340 A TW 101125340A TW 101125340 A TW101125340 A TW 101125340A TW I465732 B TWI465732 B TW I465732B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2815—Functional tests, e.g. boundary scans, using the normal I/O contacts
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Measurement Of Resistance Or Impedance (AREA)
Description
本發明係關於用來進行形成於基板上的配線圖案之導電性相關評估的基板檢查裝置及基板檢查方法。The present invention relates to a substrate inspection apparatus and a substrate inspection method for performing conductivity-related evaluation of a wiring pattern formed on a substrate.
形成於基板上的配線圖案之導電檢查，係量測設定於配線圖案上的2個量測位置間之電阻值，並根據其量測結果來進行良否判定。於此一配線圖案之電阻值的量測，為了提高量測值之精度，有人提議採用習知之4端子量測法(參照專利文獻1)。The conductive inspection of the wiring pattern formed on the substrate measures the resistance value between the two measurement positions set on the wiring pattern, and determines the quality based on the measurement result. In order to improve the accuracy of the measured value, it is proposed to use a conventional 4-terminal measurement method (refer to Patent Document 1).
[專利文獻]日本特開平10-123189號公報[Patent Document] Japanese Patent Laid-Open No. Hei 10-123189
另一方面，近年來，隨著微細化之日益進展，配線圖案之寬度逐漸縮窄，配線圖案之寬度(或厚度)的變異對於配線圖案之電阻值所產生的影響也漸增大。因此，配線圖案之電阻值之變異大，在如上述般以高精度量測電阻值之場合，即使判定為優良，亦存在有諸多由判定基準值偏離的情形。此乃由於判定基準值係以設計(理論)基準值為基礎加以設定，而無法將製程中的配線圖案之寬度或厚度的變異之影響列入考慮所致。基於此一緣故，採用4端子量測法，即使能以良好之精度量測配線圖案之電阻值，有時其判定基準值本身並未經有效的設定。On the other hand, in recent years, as the miniaturization progresses, the width of the wiring pattern is gradually narrowed, and the influence of the variation in the width (or thickness) of the wiring pattern on the resistance value of the wiring pattern is gradually increasing. Therefore, when the resistance value of the wiring pattern is large, and the resistance value is measured with high precision as described above, even if it is judged to be excellent, there are many cases where the determination reference value deviates. This is because the determination reference value is set based on the design (theoretical) reference value, and the influence of the variation of the width or thickness of the wiring pattern in the process cannot be considered. For this reason, the 4-terminal measurement method is used, and even if the resistance value of the wiring pattern can be measured with good precision, the determination reference value itself is not effectively set.
因此，本發明之待解決的課題，係提供可適當地評估配線圖 案之電阻值之變異等，而能決定配線圖案之導電檢查之適當的判定基準值之基板檢查裝置及基板檢查方法。Therefore, the problem to be solved by the present invention is to provide an appropriate evaluation of the wiring pattern. A substrate inspection device and a substrate inspection method capable of determining an appropriate determination reference value for the conductive inspection of the wiring pattern, such as a variation in the resistance value of the case.
為了解決上述課題，本發明之基板檢查裝置的第1態樣係關於一種基板檢查裝置，用以對於各自形成有多數配線圖案的多數單位基板相連接而形成的片狀基板，進行該片狀基板內之該單位基板的該配線圖案之導電性相關的評估；包含：基板固持機構，用以固持該片狀基板；探針單元，具有多數探針，該多數探針分別接觸於由該基板固持機構所固持的該片狀基板內之至少一個該單位基板之該配線圖案上所設定的2個量測位置；電阻量測部，利用該探針單元之該探針以量測該配線圖案上所設定的該2個量測位置間之電阻值；及量測電阻值評估部，以既定之基準電阻值作為基準，計算由該電阻量測部所量測得的既定之評估單位片狀基板內之該各單位基板之該各配線圖案的量測電阻值之偏離程度。In order to solve the above problems, a first aspect of the substrate inspection apparatus of the present invention relates to a substrate inspection apparatus for performing a sheet substrate formed by connecting a plurality of unit substrates each having a plurality of wiring patterns. An evaluation of the conductivity of the wiring pattern of the unit substrate; comprising: a substrate holding mechanism for holding the sheet substrate; and a probe unit having a plurality of probes respectively contacting and holding by the substrate The two measurement positions set on the wiring pattern of the at least one unit substrate in the sheet substrate held by the mechanism; the resistance measuring portion, the probe of the probe unit is used to measure the wiring pattern The set resistance value between the two measurement positions; and the measurement resistance value evaluation unit calculates a predetermined evaluation unit sheet substrate measured by the resistance measurement unit based on the predetermined reference resistance value The degree of deviation of the measured resistance values of the respective wiring patterns of the respective unit substrates.
又，本發明之基板檢查裝置的第2態樣，係於上述第1態樣之基板檢查裝置中，該量測電阻值評估部根據該各配線圖案之量測電阻值的該偏離程度之計算結果，而檢測在該評估單位片狀基板內各位置之該配線圖案的該量測電阻值之該偏離程度。According to a second aspect of the invention, in the substrate inspection device according to the first aspect of the invention, the measurement resistance value evaluation unit calculates the degree of deviation of the resistance value based on the measurement values of the respective wiring patterns. As a result, the degree of deviation of the measured resistance value of the wiring pattern at each position in the evaluation unit sheet substrate is detected.
又，本發明之基板檢查裝置的第3態樣，係於上述第2態樣之基板檢查裝置中，該量測電阻值評估部將該評估單位片狀基板內各位置的該配線圖案之該量測電阻值之該偏離程度，以和該評估單位片狀基板內之座標資訊相關連之方式檢測出。According to a third aspect of the invention, in the substrate inspection device of the second aspect of the invention, the measurement resistance value evaluation unit estimates the wiring pattern at each position in the unit sheet substrate. The degree of deviation of the measured resistance value is detected in association with the coordinate information in the evaluation unit sheet substrate.
又，本發明之基板檢查裝置的第4態樣，係於上述第2態樣 之基板檢查裝置中，該量測電阻值評估部計算該評估單位片狀基板內之該各單位基板內之該配線圖案之該量測電阻值之偏離程度，使其與該單位基板之該評估單位片狀基板內之位置資訊相關連。Moreover, the fourth aspect of the substrate inspecting apparatus of the present invention is in the second aspect described above. In the substrate inspection device, the measurement resistance value evaluation unit calculates a degree of deviation of the measurement resistance value of the wiring pattern in the unit substrate in the evaluation unit sheet substrate, and makes the evaluation with the unit substrate The position information in the unit sheet substrate is related.
又，本發明之基板檢查裝置的第5態樣，係於上述第2至4態樣中任一態樣之基板檢查裝置中，該量測電阻值評估部將在檢測出之該評估單位片狀基板內各位置的該配線圖案之該量測電阻值之該偏離程度，以圖解方式顯示於既定之顯示部。Further, a fifth aspect of the substrate inspection apparatus of the present invention is the substrate inspection apparatus according to any one of the second aspect to the fourth aspect, wherein the measurement resistance value evaluation unit detects the evaluation unit piece The degree of deviation of the measured resistance value of the wiring pattern at each position in the substrate is graphically displayed on a predetermined display portion.
又，本發明之基板檢查裝置的第6態樣，係於上述第1至5態樣中任一態樣之基板檢查裝置中，更包含導電判定部，該導電判定部根據該電阻量測部所量測得之評估單位片狀基板內之該各配線圖案的該量測電阻值、該量測電阻值之平均值亦即平均電阻值、及該量測電阻值評估部所計算得之該評估單位片狀基板內之該各配線圖案之該量測電阻值之偏離程度的至少其中之一，決定與該各配線圖案的導電性相關之判定基準值；並藉由比較該各配線圖案之該量測電阻值與該判定基準值，而進行該評估單位片狀基板內之該各配線圖案之良否判定。In the substrate inspection device according to any one of the first to fifth aspects of the present invention, the substrate inspection device of the present invention further includes a conductivity determination unit, wherein the conductivity determination unit is based on the resistance measurement unit. The measured resistance value of the respective wiring patterns in the evaluation unit sheet substrate, the average value of the measured resistance values, that is, the average resistance value, and the calculated value of the measurement resistance value evaluation unit Evaluating at least one of a degree of deviation of the measured resistance values of the respective wiring patterns in the unit chip substrate, determining a determination reference value related to conductivity of each of the wiring patterns; and comparing the wiring patterns by comparing The measured resistance value and the determination reference value are used to determine whether or not the respective wiring patterns in the unit sheet substrate are judged.
又，本發明之基板檢查裝置的第7態樣，係於上述第1至6態樣中任一態樣之基板檢查裝置中，該量測電阻值評估部取該評估單位片狀基板內之該單位基板的該各配線圖案之該量測電阻值的平均值，將其結果得到之平均量測電阻值使用作為該基準電阻值。According to a seventh aspect of the present invention, in the substrate inspection apparatus of any one of the first to sixth aspects, the measurement resistance value evaluation unit takes the evaluation unit sheet substrate. The average value of the measured resistance values of the respective wiring patterns of the unit substrate is used as the reference resistance value.
又，本發明之基板檢查裝置的第8態樣，上述第7態樣之基板檢查裝置中，該量測電阻值評估部計算以該平均量測電阻值為基準的偏差、偏差值或標準偏差，以作為該量測電阻值之該偏離程度。According to an eighth aspect of the invention, in the substrate inspection device according to the seventh aspect of the invention, the measurement resistance value evaluation unit calculates a deviation, a deviation value, or a standard deviation based on the average resistance value. , as the degree of deviation of the measured resistance value.
又，本發明之基板檢查裝置的第9態樣，係於上述第1至6態樣中任一態樣之基板檢查裝置中，該量測電阻值評估部所使用之該基準電阻值，為該評估單位片狀基板內之該單位基板的該各配線圖案之電阻值的設計理論值。Further, in a ninth aspect of the substrate inspection device of the present invention, in the substrate inspection device according to any one of the first to sixth aspects, the reference resistance value used by the measurement resistance value evaluation unit is The evaluation design value of the resistance value of each of the wiring patterns of the unit substrate in the unit sheet substrate is evaluated.
又，本發明之基板檢查裝置的第10態樣，係於上述第1至7及第9態樣中任一態樣之基板檢查裝置中，該量測電阻值評估部計算該量測電阻值與該基準電阻值之差值，以作為該量測電阻值之該偏離程度。Further, in a tenth aspect of the substrate inspection apparatus of the present invention, in the substrate inspection apparatus according to any one of the first to seventh and ninth aspects, the measurement resistance value evaluation unit calculates the measurement resistance value. The difference from the reference resistance value as the degree of deviation of the measured resistance value.
又，本發明之基板檢查裝置的第11態樣，係於上述第1至10態樣中任一態樣之基板檢查裝置中，該探針單元之該探針係在該片狀基板內的至少一個該單位基板之該配線圖案上所設定的該各量測位置逐一設置2根，該2根探針中之一根係用來對該配線圖案供應檢查用之電流，另一根探針係用來量測該配線圖案之該量測位置間的電位差。Further, in the eleventh aspect of the substrate inspection device of the present invention, in the substrate inspection device according to any one of the first to tenth aspects, the probe of the probe unit is in the sheet substrate. One of the measurement positions set on the wiring pattern of the at least one unit substrate is provided one by one, and one of the two probes is used to supply a current for inspection of the wiring pattern, and the other probe It is used to measure the potential difference between the measurement positions of the wiring pattern.
又，本發明之基板檢查方法的第1態樣，係關於一種基板檢查方法，用以對於各自形成有多數配線圖案的多數單位基板相連接而形成的片狀基板，進行該片狀基板內之該單位基板的該配線圖案之導電性相關的評估；包含：量測階段，以一基板固持機構固持該片狀基板，對於被固持之該片狀基板內的至少一個該單位基板之該配線圖案上所設定的2個量測位置以探針接觸之，經由該探針量測該配線圖案之該量測位置間的電阻值；偏離程度計算階段，以既定之基準電阻值作為基準，計算在該量測階段所量測得的既定之評估單位片狀基板內之該各單位基板的該各配線圖案之量測電阻值的偏離程度。Further, a first aspect of the substrate inspection method of the present invention relates to a substrate inspection method for performing a sheet substrate formed by connecting a plurality of unit substrates each having a plurality of wiring patterns therebetween, and performing the sheet substrate in the sheet substrate. The electrical conductivity-related evaluation of the wiring pattern of the unit substrate includes: a measuring stage of holding the sheet substrate by a substrate holding mechanism, and the wiring pattern of at least one of the unit substrates in the held sheet substrate The two measurement positions set on the probe are contacted by the probe, and the resistance value between the measurement positions of the wiring pattern is measured through the probe; the deviation degree calculation phase is calculated based on the predetermined reference resistance value. The degree of deviation of the measured resistance values of the respective wiring patterns of the respective unit substrates in the predetermined evaluation unit sheet substrate measured by the measurement phase.
依基板檢查裝置及基板檢查方法的上述第1態樣，係以對於作為評估單位的評估單位片狀基板逐一設定的各配線圖案之基準電阻值為基準，計算量測得之評估單位片狀基板內各單位基板的各配線圖案之量測電阻值的偏離程度。因此，根據該量測電阻值之偏離程度，可適當地評估配線圖案之電阻值之變異等，而可決定配線圖案之導電檢查之適當的判定基準值。其結果，乃可執行確實之導電檢查。According to the first aspect of the substrate inspection apparatus and the substrate inspection method, the reference unit substrate of each of the wiring patterns set for each of the evaluation unit sheet substrates as the evaluation unit is calculated based on the reference unit value. The degree of deviation of the measured resistance value of each wiring pattern of each unit substrate. Therefore, based on the degree of deviation of the measured resistance value, the variation of the resistance value of the wiring pattern or the like can be appropriately evaluated, and an appropriate determination reference value for the conductivity inspection of the wiring pattern can be determined. As a result, a reliable conductive inspection can be performed.
又，因為能以評估單位片狀基板作為評估單位來評估配線圖案之量測電阻值的偏離程度，故而可對評估單位片狀基板內各位置的配線圖案之量測電阻值之偏離程度進行評估。其結果，乃能對於在片狀基板的一部分，配線圖案之厚度較設計值為薄而電阻值有增高傾向等片狀基板之製程上的特性，加以掌握或評估。Further, since the degree of deviation of the measured resistance value of the wiring pattern can be evaluated by using the evaluation unit sheet substrate as an evaluation unit, it is possible to evaluate the degree of deviation of the measured resistance value of the wiring pattern at each position in the unit sheet substrate. . As a result, it is possible to grasp or evaluate the characteristics of the process of the sheet substrate in which the thickness of the wiring pattern is thinner than the design value and the resistance value tends to increase in a part of the sheet substrate.
依基板檢查裝置之上述第2態樣，因為能檢測出評估單位片狀基板內各位置的配線圖案之量測電阻值之偏離程度，依該檢測結果，乃能對於在片狀基板的一部分，配線圖案之厚度較設計值為薄而電阻值有增高傾向等片狀基板之製程上的特性，加以掌握或評估。According to the second aspect of the substrate inspection apparatus, since the degree of deviation of the measured resistance value of the wiring pattern at each position in the evaluation unit sheet can be detected, according to the detection result, it is possible to apply to a part of the sheet substrate. The characteristics of the wiring pattern such as the thickness of the wiring pattern are thinner than the design value, and the resistance value is increased, and the characteristics of the sheet substrate are grasped or evaluated.
依基板檢查裝置之上述第3態樣，由於評估單位片狀基板內各位置的配線圖案之量測電阻值之偏離程度，能以和該評估單位片狀基板內之座標資訊相關連之方式檢測出，故在評估單位片狀基板內各位置的配線圖案之量測電阻值之偏離程度之掌握或評估能較容易且確實地進行。According to the third aspect of the substrate inspection apparatus, since the degree of deviation of the measured resistance value of the wiring pattern at each position in the unit sheet substrate is evaluated, it can be detected in association with the coordinate information in the evaluation unit sheet substrate. Therefore, the grasp or evaluation of the degree of deviation of the measured resistance value of the wiring pattern at each position in the unit sheet substrate can be easily and surely performed.
依基板檢查裝置之上述第4態樣，由於可計算該評估單位片狀基板內之該各單位基板內之該配線圖案之該量測電阻值之偏離 程度，使其與該單位基板之該評估單位片狀基板內之位置資訊相關連，故在評估單位片狀基板內各單位基板之位置的配線圖案之量測電阻值之偏離程度之掌握或評估能較容易且確實地進行。According to the fourth aspect of the substrate inspection apparatus, the deviation of the measured resistance value of the wiring pattern in the unit substrate in the evaluation unit sheet substrate can be calculated To the extent that it is related to the position information in the evaluation unit sheet substrate of the unit substrate, the degree of deviation of the measured resistance value of the wiring pattern at the position of each unit substrate in the unit sheet substrate is evaluated or evaluated. It can be done easily and surely.
依基板檢查裝置之上述第5態樣，由於在檢測出之評估單位片狀基板內各位置的配線圖案之量測電阻值之偏離程度可以圖解方式顯示於既定之顯示部，故藉由等高線顯示等顯示形式乃容易掌握在評估單位片狀基板各位置的量測電阻值之偏離程度、及偏離程度之分布之特性等。According to the fifth aspect of the substrate inspection apparatus, since the degree of deviation of the measured resistance value of the wiring pattern at each position in the detected unit sheet substrate can be graphically displayed on the predetermined display portion, it is displayed by the contour line. The display form is easy to grasp the degree of deviation of the measured resistance value at each position of the evaluation unit sheet substrate, and the distribution of the degree of deviation.
依基板檢查裝置之上述第6態樣，由於導電判定部根據電阻量測部所量測得之評估單位片狀基板內各配線圖案的量測電阻值、量測電阻值之平均值亦即平均電阻值、及量測電阻值評估部所計算得之評估單位片狀基板內各配線圖案的量測電阻值之偏離程度的至少其中之一，而決定與各配線圖案的導電性相關之判定基準值，並依該判定基準值進行各配線圖案之導電性相關的良否判定。因此，乃能決定相應於配線圖案的電阻值之變異度等的適當之導電檢查之判定基準值，而能進行確實之導電檢查。According to the sixth aspect of the substrate inspection apparatus, the conductivity determination unit estimates the average value of the measured resistance value and the measured resistance value of each wiring pattern in the unit-like substrate based on the measurement by the resistance measuring unit. The resistance value and the degree of deviation of the measured resistance value of each wiring pattern in the unit-like substrate calculated by the measurement resistance value evaluation unit are determined, and the determination criterion relating to the conductivity of each wiring pattern is determined. The value is determined based on the determination reference value for the conductivity of each wiring pattern. Therefore, it is possible to determine the appropriate reference value for the conductivity inspection in accordance with the variability of the resistance value of the wiring pattern, and the like, and to perform the accurate conductivity inspection.
依基板檢查裝置之上述第7態樣，能以評估單位片狀基板內各配線圖案之量測電阻值的平均值亦即平均電阻值作為基準電阻值，對於各配線圖案之量測電阻值之偏離程度進行評估。According to the seventh aspect of the substrate inspection apparatus, the average value of the resistance values of the respective wiring patterns in the evaluation unit unit, that is, the average resistance value can be used as the reference resistance value, and the resistance value of each wiring pattern can be measured. The degree of deviation is assessed.
依基板檢查裝置之上述第8態樣，可利用評估單位片狀基板內各配線圖案之量測電阻值之偏差、偏差值或標準偏差，對於各配線圖案之量測電阻值之偏離程度、或變異程度等進行評估。偏差或偏差值便於用來評估自各配線圖案之量測電阻值自平均電阻值的偏離程度等。標準偏差便於用來評估在評估單位片狀基板內之各單位基板之對應的(或同種類的)配線圖案之量測電阻值整體的變異程度等。According to the eighth aspect of the substrate inspection apparatus, the deviation, the deviation value, or the standard deviation of the measured resistance values of the respective wiring patterns in the unit substrate can be evaluated, and the degree of deviation of the measured resistance values of the respective wiring patterns, or The degree of variation, etc. is evaluated. The deviation or deviation value is convenient for evaluating the degree of deviation of the measured resistance value from each wiring pattern from the average resistance value. The standard deviation is convenient for evaluating the degree of variation of the measurement resistance value of the corresponding (or the same type) wiring pattern of each unit substrate in the evaluation unit unit substrate, and the like.
依基板檢查裝置之上述第9態樣，能以評估單位片狀基板內各配線圖案之電阻值的設計理論值作為基準電阻值，而評估各配線圖案之量測電阻值之偏離程度。According to the ninth aspect of the substrate inspection apparatus, the degree of deviation of the measured resistance values of the respective wiring patterns can be evaluated by evaluating the design theoretical value of the resistance value of each wiring pattern in the unit sheet substrate as the reference resistance value.
依基板檢查裝置之上述第10態樣，可藉由評估單位片狀基板內各配線圖案之基準電阻值與量測電阻值之差值，而評估各配線圖案之量測電阻值之偏離程度等。According to the tenth aspect of the substrate inspection apparatus, the degree of deviation of the measurement resistance values of the respective wiring patterns can be evaluated by evaluating the difference between the reference resistance value of each wiring pattern in the unit sheet substrate and the measured resistance value. .
依基板檢查裝置之上述第11態樣，藉由4端子量測法可正確地量測配線圖案的電阻值，且能正確地評估量測得的電阻值之以基準電阻值作為基準的偏離程度。其結果，乃能決定配線圖案之導電檢查之適當的判定基準值，而能進行確實之導電檢查。According to the eleventh aspect of the substrate inspection apparatus, the resistance value of the wiring pattern can be accurately measured by the 4-terminal measurement method, and the degree of deviation of the measured resistance value based on the reference resistance value can be accurately evaluated. . As a result, an appropriate determination reference value for the conductivity inspection of the wiring pattern can be determined, and a reliable conductivity inspection can be performed.
茲參照圖1及圖2，說明依本發明一實施態樣的基板檢查裝置1之構成。此一基板檢查裝置1係如圖1及圖2所示般，包含：控制部11、基板固持機構12、作為探針單元的第1與第2檢查夾具13、14、第1與第2檢查夾具升降機構15、16、電阻量測部17、顯示部18及操作部19。藉由此基板檢查裝置1，對於由各自形成有多數配線圖案2的多數單位基板3相連接而形成的片狀基板4，進行片狀基板4內之單位基板3的各配線圖案2之導電性相關的評估與檢查。A configuration of a substrate inspecting apparatus 1 according to an embodiment of the present invention will be described with reference to Figs. 1 and 2 . As shown in FIGS. 1 and 2, the substrate inspection apparatus 1 includes a control unit 11, a substrate holding mechanism 12, first and second inspection jigs 13, 14 as probe units, and first and second inspections. The jig lifting and lowering mechanism 15 and 16, the resistance measuring unit 17, the display unit 18, and the operation unit 19. By the substrate inspection apparatus 1 , the conductivity of each wiring pattern 2 of the unit substrate 3 in the sheet substrate 4 is performed on the sheet substrate 4 formed by connecting a plurality of unit substrates 3 each having a plurality of wiring patterns 2 formed thereon. Relevant assessments and inspections.
此處，圖3係顯示被分割前的片狀基板亦即大基板5之構成的圖式。由大基板5藉由分割方式得到多數(例如4片)片狀基板4。又，由此片狀基板4，如圖4所示般，以分割方式得到多數單位基板3。例如，在如圖4所圖示的片狀基板4，有25片之單位基板3連接成5行5列。形成於單位基板3的各配線圖案2之電阻值的 量測及導電檢查，係於多數單位基板3連接成片狀基板4(例如，圖4所示之片狀基板4)的狀態進行之。各單位基板3形成多數配線圖案2，具有彼此相同之構成。又，於本實施態樣中，各配線圖案2的電阻值之量測及導電檢查，雖係在將大基板5分割為多數而得到之片狀基板4的狀態進行之，但電阻值之量測及導電檢查亦可在分割前之大基板5的狀態進行之。Here, FIG. 3 is a view showing a configuration of a large substrate 5 which is a sheet substrate before being divided. A plurality of (for example, four) sheet substrates 4 are obtained by the large substrate 5 by division. Further, as shown in FIG. 4, the plurality of unit substrates 3 are obtained by dividing the sheet substrate 4 as shown in FIG. For example, in the sheet substrate 4 illustrated in FIG. 4, 25 unit substrates 3 are connected in 5 rows and 5 columns. Resistance values of the respective wiring patterns 2 formed on the unit substrate 3 The measurement and the conductive inspection are performed in a state in which a plurality of unit substrates 3 are connected to a sheet substrate 4 (for example, the sheet substrate 4 shown in FIG. 4). Each of the unit substrates 3 is formed with a plurality of wiring patterns 2, and has the same configuration. Further, in the present embodiment, the measurement of the electric resistance value and the electric conduction inspection of each of the wiring patterns 2 are performed in a state in which the large substrate 5 is divided into a plurality of sheet-like substrates 4, but the amount of the electric resistance value is obtained. The measurement and the conductivity inspection can also be performed in the state of the large substrate 5 before the division.
基板檢查裝置1之控制部11包含有CPU及記憶裝置等而構成，如圖1所示般，包含基板操縱處理部111、電阻量測處理部112、量測電阻值評估部113及導電判定部114。後面將說明控制部11的這些機能要素之功能及動作。The control unit 11 of the substrate inspection device 1 includes a CPU, a memory device, and the like, and includes a substrate manipulation processing unit 111, a resistance measurement processing unit 112, a measurement resistance value evaluation unit 113, and a conductive determination unit, as shown in Fig. 1 . 114. The function and operation of these functional elements of the control unit 11 will be described later.
基板固持機構12係如圖1及圖2所示般，具有基板固持部121及XY驅動機構122。基板固持部121用來固持片狀基板4。XY驅動機構122利用後述之控制部11的基板操縱處理部111之控制，而將基板固持部121朝X軸方向及Y軸方向驅動，藉以調整受固持之片狀基板4與後述之第1及第2檢查夾具13、14的位置關係。The substrate holding mechanism 12 has a substrate holding portion 121 and an XY driving mechanism 122 as shown in FIGS. 1 and 2 . The substrate holding portion 121 is for holding the sheet substrate 4. The XY drive mechanism 122 drives the substrate holding portion 121 in the X-axis direction and the Y-axis direction by the control of the substrate manipulation processing unit 111 of the control unit 11 to be described later, thereby adjusting the held sheet substrate 4 and the first and subsequent descriptions. The positional relationship of the second inspection jigs 13, 14.
第1及第2檢查夾具13、14包含有圖5所示之多數探針20、及用來固持探針20的夾具本體131、141。多數探針20係與設在片狀基板4內之1個或多數之單位基板3的配線圖案2上之各量測位置P1、P2(參照圖5)相對應而配置。探針20的前端由夾具本體131、141的與片狀基板4之相向面131a、141a伸出既定之伸出高度。因此，當藉由後述之第1及第2檢查夾具升降機構15、16使第1及第2檢查夾具13、14接近並抵接於片狀基板4時，第1及第2檢查夾具13、14的各探針20之前端抵接在片狀基板4內之單位基板3的對應之各配線圖案2上的既定位置而導電。第1檢查夾具13抵接在片狀基板4的頂面側，而第2檢查夾具14則抵接在片狀基板4的底面側。The first and second inspection jigs 13 and 14 include a plurality of probes 20 shown in FIG. 5 and clamp bodies 131 and 141 for holding the probes 20. The plurality of probes 20 are arranged corresponding to the respective measurement positions P1 and P2 (see FIG. 5) provided on the wiring pattern 2 of one or a plurality of unit substrates 3 in the sheet substrate 4. The tip end of the probe 20 is extended by a predetermined projecting height of the jig bodies 131 and 141 from the facing faces 131a and 141a of the sheet substrate 4. Therefore, when the first and second inspection jigs 13 and 14 are brought into close contact with the sheet substrate 4 by the first and second inspection jig lifting mechanisms 15 and 16, which will be described later, the first and second inspection jigs 13 and The front ends of the probes 20 of the 14 are electrically connected to a predetermined position on each of the corresponding wiring patterns 2 of the unit substrate 3 in the sheet substrate 4. The first inspection jig 13 abuts on the top surface side of the sheet substrate 4, and the second inspection jig 14 abuts on the bottom surface side of the sheet substrate 4.
在第1及2檢查夾具13、14對於片狀基板4的一次抵接動作無法涵蓋到片狀基板4內所有的單位基板3的情形時，利用基板固持機構12的XY驅動機構122使片狀基板4依序移動，藉由反複進行第1及第2檢查夾具13、14的抵接動作，而進行對於片狀基板4內全部單位基板3的配線圖案2之電阻值的量測及導電檢查。When the primary contact operation of the first and second inspection jigs 13 and 14 on the sheet substrate 4 cannot cover all of the unit substrates 3 in the sheet substrate 4, the XY drive mechanism 122 of the substrate holding mechanism 12 is used to form a sheet. The substrate 4 is sequentially moved, and the resistance of the wiring pattern 2 of all the unit substrates 3 in the sheet substrate 4 is measured and the conductive inspection is performed by repeating the abutting operation of the first and second inspection jigs 13 and 14. .
又，於本實施態樣中，因為是如圖5所示般，藉由4端子量測法來量測配線圖案2的電阻值，故於片狀基板4內的1個或多數單位基板3內之配線圖案2上所設定之2個量測位置P1、P2，各設置2根第1及第2檢查夾具13、14之探針20。而該2根探針20其中的一根探針20a用於對配線圖案2檢查用的電流之供應及電流值的量測，另一根探針20b用於配線圖案2的量測位置P1、P2間之電位差的量測。Further, in the present embodiment, since the resistance value of the wiring pattern 2 is measured by the 4-terminal measurement method as shown in FIG. 5, one or a plurality of unit substrates 3 in the sheet substrate 4 are used. The probes 20 of the two first and second inspection jigs 13 and 14 are provided for each of the two measurement positions P1 and P2 set in the wiring pattern 2 therein. One probe 20a of the two probes 20 is used for measuring the supply of current and current value for inspection of the wiring pattern 2, and the other probe 20b is used for the measurement position P1 of the wiring pattern 2. Measurement of the potential difference between P2.
第1及第2檢查夾具升降機構15、16，在由基板固持機構12所固持的片狀基板4之上側及下側，以可使第1及第2檢查夾具13、14各自如圖2之箭頭A1，A2所顯示般升降的方式固持著該第1及第2檢查夾具13、14，並藉由電阻量測處理部112的控制而朝上下升降驅動第1及第2檢查夾具13、14。The first and second inspection jig lifting mechanisms 15 and 16 are provided on the upper side and the lower side of the sheet substrate 4 held by the substrate holding mechanism 12 so that the first and second inspection jigs 13 and 14 can be each as shown in FIG. The first and second inspection jigs 13 and 14 are held by the elevation of the arrows A1 and A2, and the first and second inspection jigs 13 and 14 are driven up and down by the control of the resistance measurement processing unit 112. .
電阻量測部17包含電流供應量測部171、電位差量測部172及切換單元173。電流供應量測部171及電位差量測部172係如圖5所示般，可利用配線經由切換單元173與第1及第2檢查夾具13、14的各探針20電性連接。切換單元173包含未圖示的多數切換元件而構成，藉由電阻量測處理部112之控制，而進行電流供應量測部171及電位差量測部172與第1及第2檢查夾具13、14之各探針20的ON/OFF連接及連接關係之切換。The resistance measuring unit 17 includes a current supply amount measuring unit 171, a potential difference measuring unit 172, and a switching unit 173. The current supply amount measuring unit 171 and the potential difference measuring unit 172 are electrically connected to the probes 20 of the first and second inspection jigs 13 and 14 via the switching unit 173 as shown in FIG. 5 . The switching unit 173 includes a plurality of switching elements (not shown), and the current supply amount measuring unit 171 and the potential difference measuring unit 172 and the first and second inspection jigs 13 and 14 are controlled by the resistance measurement processing unit 112. The ON/OFF connection and the connection relationship of each probe 20 are switched.
電流供應量測部171藉由電阻量測處理部112的控制，經切換單元173及第1與第2檢查夾具13、14的探針20，將檢查用電流供應至片狀基板4內的1個或多數單位基板3內之各配線圖案2的量測位置P1、P2間，並量測其時各配線圖案2的量測位置P1、P2間流過的電流值。The current supply amount measuring unit 171 supplies the test current to the inside of the sheet substrate 4 via the switching unit 173 and the probes 20 of the first and second inspection jigs 13 and 14 under the control of the resistance measurement processing unit 112. Between the measurement positions P1 and P2 of the respective wiring patterns 2 in the plurality of unit substrates 3, the current values flowing between the measurement positions P1 and P2 of the respective wiring patterns 2 at that time are measured.
電位差量測部172藉由電阻量測處理部112的控制，利用切換單元173及第1與第2檢查夾具13、14的探針20，量測片狀基板4內的1個或多數單位基板3內之各配線圖案2的量測位置P1、P2間的電位差。The potential difference measuring unit 172 measures one or a plurality of unit substrates in the sheet substrate 4 by the switching unit 173 and the probes 20 of the first and second inspection jigs 13 and 14 under the control of the resistance measurement processing unit 112. The potential difference between the measurement positions P1 and P2 of each of the wiring patterns 2 in 3.
顯示部18藉由量測電阻值評估部113及導電判定部114的控制，而顯示各配線圖案2的電阻值之量測結果、各單位基板3的導電檢查之檢查結果等。操作部19接受對於此基板檢查裝置1的操作。The display unit 18 displays the measurement results of the resistance values of the respective wiring patterns 2, the inspection results of the conductivity inspection of each unit substrate 3, and the like by the control of the measurement resistance value evaluation unit 113 and the conductivity determination unit 114. The operation unit 19 accepts an operation on the substrate inspection apparatus 1.
控制部11之基板操縱處理部111控制基板固持機構12等，進行片狀基板4之移送、及配線圖案2之電阻值量測時之位置調節等。The substrate manipulation processing unit 111 of the control unit 11 controls the substrate holding mechanism 12 and the like, and performs transfer of the sheet substrate 4 and position adjustment when the resistance value of the wiring pattern 2 is measured.
電阻量測處理部122控制第1及第2檢查夾具升降機構15、16、和電阻量測部17之電流供應量測部171、電位差量測部172及切換單元173，並量測由基板固持機構12所固持的片狀基板4內之各單位基板3的各配線圖案2之量測位置P1、P2間之電阻值。電阻值之量測係根據電流供應量測部171與電位差量測部172各自量測得之各配線圖案2之量測位置P1、P2間流過的電流值及量測位置P1、P2間之電位差值，由電阻量測處理部113計算。具體而言，將量測得之電位差值除以量測得之電流值而計算電阻值。The resistance measurement processing unit 122 controls the first and second inspection jig lifting and lowering mechanisms 15 and 16 and the current supply amount measuring unit 171, the potential difference measuring unit 172, and the switching unit 173 of the resistance measuring unit 17, and measures the substrate holding The resistance values between the measurement positions P1 and P2 of the respective wiring patterns 2 of the unit substrates 3 in the sheet substrate 4 held by the mechanism 12 are measured. The measurement of the resistance value is based on the current value flowing between the measurement positions P1 and P2 of the respective wiring patterns 2 measured by the current supply amount measuring unit 171 and the potential difference measuring unit 172, and between the measurement positions P1 and P2. The potential difference value is calculated by the resistance measurement processing unit 113. Specifically, the resistance value is calculated by dividing the measured potential difference by the measured current value.
量測電阻值評估部113以對於成為評估單位的片狀基板4亦 即評估單位片狀基板4(例如，圖4之片狀基板4)內之各配線圖案2所設定的基準電阻值作為基準，而計算題電阻量測處理部122所量測得之片狀基板4內各單位基板3的各配線圖案2之量測電阻值之偏離程度。評估單位片狀基板4只要是由多數單位基板3相連成之片狀基板4即可，任意之片狀基板4均可加以設定。例如，在如本實施態樣般施行配線圖案2之電阻值之量測的片狀基板4，為以較大之片狀基板4分割而得到之情形，亦可將較大之片狀基板4(例如，圖3之大基板5)設定作為評估單位片狀基板4。於本實施態樣中，雖以由基板固持機構12所固持的片狀基板4作為評估單位片狀基板4，但亦可以較由基板固持機構12所固持的片狀基板4更大的片狀基板4(例如，大基板5)作為評估單位片狀基板4。The measured resistance value evaluation unit 113 also applies to the sheet substrate 4 which is the evaluation unit. In other words, the reference resistance value set by each of the wiring patterns 2 in the unit-like substrate 4 (for example, the sheet-like substrate 4 of FIG. 4) is used as a reference, and the sheet-like substrate measured by the title resistance measurement processing unit 122 is calculated. The degree of deviation of the measured resistance values of the respective wiring patterns 2 of the respective unit substrates 3 in FIG. The evaluation unit sheet substrate 4 may be any sheet substrate 4 connected by a plurality of unit substrates 3, and any of the sheet substrates 4 may be set. For example, in the case where the sheet substrate 4 in which the resistance value of the wiring pattern 2 is measured as in the present embodiment is obtained by dividing the large sheet substrate 4, the larger sheet substrate 4 may be used. (For example, the large substrate 5 of FIG. 3) is set as the evaluation unit sheet substrate 4. In the present embodiment, the sheet substrate 4 held by the substrate holding mechanism 12 is used as the evaluation unit sheet substrate 4, but may be larger than the sheet substrate 4 held by the substrate holding mechanism 12. The substrate 4 (for example, the large substrate 5) is used as the evaluation unit sheet substrate 4.
作為量測電阻值之偏離程度的計算基準之基準電阻值係對應於一個單位基板3內所設置之各配線圖案2而設定。又，在單位基板3內存在有多數具有相同設計形狀的相同種類之配線圖案2的情形時，亦可使相同種類之配線圖案2的基準電阻值共通化，而僅依單位基板3內設置之配線圖案2的種類之數量設定基準電阻值。亦即，基準電阻值的設定數量，僅限於對一個評估單位片狀基板4其單位基板3內所設的配線圖案2之數量(或者，單位基板3內所設置之配線圖案2的種類之量)。又，此種基準電阻值之群組可就各評估單位片狀基板4分別設定為不同群組，亦可對於多數評估單位片狀基板4設定為相同群組之基準電阻值。The reference resistance value which is a calculation reference for the degree of deviation of the measured resistance value is set corresponding to each wiring pattern 2 provided in one unit substrate 3. Further, when there are a plurality of wiring patterns 2 of the same type having the same design shape in the unit substrate 3, the reference resistance values of the wiring patterns 2 of the same type may be common, and only the unit substrate 3 may be provided. The reference resistance value is set by the number of types of the wiring patterns 2. In other words, the number of the reference resistance values is limited to the number of the wiring patterns 2 provided in the unit substrate 3 of one evaluation unit sheet substrate 4 (or the type of the wiring pattern 2 provided in the unit substrate 3). ). Further, such a group of reference resistance values may be set to different groups for each evaluation unit sheet substrate 4, or may be set to the same group reference resistance value for a plurality of evaluation unit sheet substrates 4.
於本實施態樣中，係將評估單位片狀基板4內之各單位基板3之彼此對應的配線圖案2之量測電阻值取其平均所得到之平均電阻值設定為基準電阻值。於各單位基板3內設有多數相同種類之配線圖案2的情形時，可將相同種類之配線圖案2之量測電阻值相加所得到之平均電阻值作為基準電阻值。於變化例中，亦可將評估單位片狀基板4內之單位基板3所設置的各配線圖案2之設 計上之理論電阻值亦即設計理論值設定設作為基準電阻值。In the present embodiment, the average resistance value obtained by averaging the measured resistance values of the wiring patterns 2 corresponding to the respective unit substrates 3 in the unit sheet substrate 4 is set as the reference resistance value. When a plurality of wiring patterns 2 of the same type are provided in each unit substrate 3, the average resistance value obtained by adding the measured resistance values of the wiring patterns 2 of the same type can be used as the reference resistance value. In the variation, the layout of each wiring pattern 2 provided on the unit substrate 3 in the unit sheet substrate 4 may be evaluated. The theoretical resistance value, that is, the design theoretical value setting, is set as the reference resistance value.
例如吾人可計算以評估單位片狀基板4內之平均量測電阻值或設計理論電阻值為基準的各配線圖案2之偏差、偏差值或標準偏差，來作為量測電阻值評估部113所計算之各配線圖案2之量測電阻值的偏離程度。各配線圖案2之偏差、偏差值或標準偏差之計算，採用對應之平均電阻值。偏差或偏差值便於用來評估自各配線圖案2之量測電阻值自平均電阻值或設計理論電阻值的偏離程度等。標準偏差便於用來評估在評估單位片狀基板4內之各單位基板2之對應的(或同種類的)配線圖案2之量測電阻值整體的變異程度等。又，於一變化例中，在將各配線圖案2之設計理論值設定為基準電阻值的情況，亦可計算設計理論值與量測電阻值之差值以作為各配線圖案2之量測電阻值之偏離程度。For example, the deviation, the deviation value, or the standard deviation of each wiring pattern 2 based on the average measured resistance value or the designed theoretical resistance value in the unit sheet substrate 4 can be calculated as the measurement resistance value evaluation unit 113. The degree of deviation of the measured resistance value of each of the wiring patterns 2 is determined. The calculation of the deviation, the deviation value or the standard deviation of each wiring pattern 2 is performed by using the corresponding average resistance value. The deviation or deviation value is convenient for evaluating the degree of deviation of the measured resistance value from each of the wiring patterns 2 from the average resistance value or the design theoretical resistance value. The standard deviation is convenient for evaluating the degree of variation of the measurement resistance value of the corresponding (or the same type) wiring pattern 2 of each unit substrate 2 in the evaluation unit sheet substrate 4, and the like. Moreover, in a variation, when the design theoretical value of each wiring pattern 2 is set to the reference resistance value, the difference between the design theoretical value and the measured resistance value can also be calculated as the measurement resistance of each wiring pattern 2. The degree of deviation of the value.
茲參照圖6具體說明之。在圖6所示之例子中，利用預先登記之基板識別資訊及配線識別資訊，來進行評估單位片狀基板4內之各單位基板3及配線圖案2之識別及位置之判定等。具體言之對評估單位片狀基板4內之各單位基板3賦予基板編號(例如，1、2、3、‧‧‧等)以作為基板識別編號，對於各單位基板3內之配線圖案2賦予線路編號(例如，1、2、3、‧‧‧等)以作為配線識別編號。又，在進行較大之片狀基板4(例如，大基板5)內的各單位基板3之識別及位置之判定等的情況時，可設定該大片狀基板4內的各單位基板3之基板識別資訊，或追加設定該大片狀基板4內所包含之各小片狀基板4的片狀基板識別資訊(例如，片狀基板編號等)。This will be specifically described with reference to FIG. 6. In the example shown in FIG. 6, the board identification information and the wiring identification information registered in advance are used to evaluate the identification and position of each unit substrate 3 and the wiring pattern 2 in the unit sheet substrate 4. Specifically, the substrate number (for example, 1, 2, 3, ‧ ‧ or the like) is given to each unit substrate 3 in the evaluation unit sheet substrate 4 as a substrate identification number, and the wiring pattern 2 in each unit substrate 3 is given. The line number (for example, 1, 2, 3, ‧ ‧ etc.) is used as the wiring identification number. Further, when the identification and position determination of each unit substrate 3 in the large sheet substrate 4 (for example, the large substrate 5) are performed, the unit substrates 3 in the large sheet substrate 4 can be set. The substrate identification information or the sheet-like substrate identification information (for example, a sheet-like substrate number or the like) of each of the small-sized substrate 4 included in the large-sized substrate 4 is additionally set.
又，作為評估基準的平均電阻值之計算，係藉由將評估單位片狀基板4內的各單位基板3之相同線路編號的全部配線圖案2之量測電阻值加總，再求其平均值而得到。於此情形時，平均電阻值僅設定為與單位基板3內之配線圖案2相同數量。或者，在 各單位基板3內存在有多數相同種類之配線圖案2的情形時，亦可將相同種類之配線圖案2之量測電阻值加總，再取其平均而計算出平均電阻值。於此情形時，平均電阻值僅設定為與單位基板3內之配線圖案2的種類相同數量。於圖6之例中，計算差分值以作為各配線圖案2之量測電阻值自基準電阻值之偏離程度。Further, the calculation of the average resistance value as the evaluation standard is performed by summing the measured resistance values of all the wiring patterns 2 of the same line number of each unit substrate 3 in the unit-like substrate 4, and then calculating the average value. And get it. In this case, the average resistance value is set only to the same number as the wiring pattern 2 in the unit substrate 3. Or, at When there are a plurality of wiring patterns 2 of the same type in each unit substrate 3, the measured resistance values of the wiring patterns 2 of the same type may be added together, and the average value may be calculated to calculate the average resistance value. In this case, the average resistance value is set only to be the same as the type of the wiring pattern 2 in the unit substrate 3. In the example of FIG. 6, the difference value is calculated as the degree of deviation of the measured resistance value of each wiring pattern 2 from the reference resistance value.
圖7係將設於評估單位片狀基板4內的各單位基板3的配線圖案2，按照電阻值的設計理論值由小而大逐漸增大的順序排序時的各配線圖案之量測電阻值，加以曲線化之圖式。圖7之曲線之横軸對應於配線圖案2在各單位基板3內的序號，縱軸對應於和各序號對應的配線圖案2之量測電阻值。又，圖7之曲線G1(實線之曲線)係關於評估單位片狀基板4內之基板編號1的配線圖案2，曲線G2(虛線之曲線)係關於評估單位片狀基板4內之基板編號2的配線圖案2。圖7中為求圖示之方便，而僅只顯示基板編號1、2的2個單位基板3之配線圖案2相關的曲線G1、G2，但事實上，將評估單位片狀基板4內之全部單位基板3的量測電阻值均加以曲線化。又，圖7中之箭頭A1顯示曲線G1中，量測電阻值為異常大的部分，吾人認為配線圖案2中存在有某些異常。量測電阻值評估部113亦可根據評估單位片狀基板4內之各單位基板3的各配線圖案2之量測電阻值，計算圖7所示之曲線G1、G2，將該曲線G1、G2顯示於顯示部18。FIG. 7 is a measurement resistance value of each wiring pattern when the wiring pattern 2 of each unit substrate 3 provided in the evaluation unit sheet substrate 4 is sorted in such a manner that the design value of the resistance value is gradually increased from small to large. , to curve the pattern. The horizontal axis of the graph of FIG. 7 corresponds to the serial number of the wiring pattern 2 in each unit substrate 3, and the vertical axis corresponds to the measured resistance value of the wiring pattern 2 corresponding to each serial number. Further, the curve G1 of FIG. 7 (curve of the solid line) relates to the wiring pattern 2 for evaluating the substrate number 1 in the unit sheet substrate 4, and the curve G2 (the curve of the broken line) relates to the evaluation of the substrate number in the unit sheet substrate 4. 2 wiring pattern 2. In FIG. 7, for the convenience of illustration, only the curves G1 and G2 related to the wiring pattern 2 of the two unit substrates 3 of the substrate numbers 1 and 2 are displayed, but in fact, all the units in the unit sheet substrate 4 will be evaluated. The measured resistance values of the substrate 3 are all curved. Further, the arrow A1 in Fig. 7 indicates that the measurement resistance value is abnormally large in the curve G1, and it is considered that there are some abnormalities in the wiring pattern 2. The measured resistance value evaluation unit 113 can also calculate the curves G1 and G2 shown in FIG. 7 based on the measured resistance values of the respective wiring patterns 2 of the unit substrates 3 in the evaluation unit sheet substrate 4, and the curves G1 and G2 can be calculated. Displayed on the display unit 18.
又，藉由進行如圖7般之曲線顯示，可瞭解評估單位片狀基板4內之單位基板3之位置的偏離程度。因此，藉由顯示評估單位片狀基板4內之全部單位基板3，可反應單位基板3之位置的偏離程度，而設定判定基準電阻值。Moreover, by performing the curve display as shown in FIG. 7, it is understood that the degree of deviation of the position of the unit substrate 3 in the unit sheet substrate 4 is evaluated. Therefore, by displaying all the unit substrates 3 in the evaluation unit sheet substrate 4, the degree of deviation of the position of the unit substrate 3 can be reflected, and the determination reference resistance value can be set.
又，量測電阻值評估部113根據上述各配線圖案2之量測電阻值的偏離程度之計算結果，將評估單位片狀基板4內之各位置的配線圖案2之量測電阻值之偏離程度(以平均電阻值為基準的偏 差或偏差值、或與設計理論值之差值)，以和評估單位片狀基板4上之位置資訊相關連之方式檢測出，並將該該檢測結果以圖解方式顯示於顯示部18。評估單位片狀基板4內之各位置之量測電阻值之偏離程度之檢測可採用各種形態。例如，亦可利用評估單位片狀基板4內各單位基板3之預先選定的1個或多數配線圖案2之量測電阻值自基準電阻值的偏離程度，檢測出評估單位片狀基板4內各位置之量測電阻值之偏離程度。或者，計算評估單位片狀基板4中各單位基板3內之預先設定的多數配線圖案2(或者，各單位基板3內之全部配線圖案2)之量測電阻值的偏離程度之平均值，利用對於各各單位基板3逐一獲得之偏離程度之平均值，檢測出評估單位片狀基板4內各位置之量測電阻值的偏離程度。評估單位片狀基板4內各配線圖案2之位置或各單位基板3之位置可根據上述配線識別資訊及基板識別資訊等獲得。Further, the measurement resistance value evaluation unit 113 estimates the degree of deviation of the measured resistance value of the wiring pattern 2 at each position in the unit-like substrate 4 based on the calculation result of the degree of deviation of the measured resistance values of the respective wiring patterns 2. (offset based on average resistance value) The difference or the deviation value or the difference from the design theoretical value is detected in association with the evaluation of the position information on the unit sheet substrate 4, and the detection result is graphically displayed on the display unit 18. The detection of the degree of deviation of the measured resistance values at each position in the evaluation unit sheet substrate 4 can be performed in various forms. For example, it is possible to detect the degree of deviation of the measured resistance value from the reference resistance value by one of the preselected one or a plurality of wiring patterns 2 of each unit substrate 3 in the unit substrate 4, and to evaluate each of the evaluation unit sheet substrates 4. The degree of deviation of the measured resistance value of the position. Alternatively, the average value of the degree of deviation of the measured resistance values of the plurality of predetermined wiring patterns 2 (or all the wiring patterns 2 in each unit substrate 3) in each of the unit substrates 3 in the unit substrate 4 is evaluated and used. The average degree of deviation of the respective unit substrates 3 obtained one by one is detected, and the degree of deviation of the measured resistance values at the respective positions in the unit sheet substrate 4 is detected. The position of each wiring pattern 2 in the evaluation unit sheet substrate 4 or the position of each unit substrate 3 can be obtained based on the wiring identification information, the substrate identification information, and the like.
量測電阻值評估部113所賦予關連之位置資訊，可利用評估單位片狀基板4上的位置資訊。此位置資訊可利用量測得之配線圖案2在評估單位片狀基板4上的XY座標資訊、或在評估單位片狀基板4上之單位基板的位置資訊。The position information given to the unit substrate 4 by the measurement resistance value evaluation unit 113 can be used. This position information can be used to evaluate the XY coordinate information on the unit-like substrate 4 of the wiring pattern 2 or the position information of the unit substrate on the unit-like substrate 4.
量測電阻值評估部113雖可將各配線圖案2之量測電阻值的偏離程度，以和位置資訊相關連之方式檢測出，但亦可以單位基板3為單位計算歸屬於該單位基板3內的配線圖案2之量測電阻值之偏離程度，使該計算得之偏離程度與單位基板3之位置資訊相關連。於此情形時，單位基板3之偏離程度，係計算此單位基板3之各配線圖案2之量測電阻值自基準電阻值的偏離程度，而計算得單位基板3的偏離程度(例如，偏離程度之平均值或偏差等)。又，此情形之位置資訊可利用評估單位片狀基板4內的單位基板3之位置資訊，例如可利用在評估單位片狀基板4上的縱横方向第幾個單位基板的位置資訊或評估單位片狀基板4上之XV座標資訊的位置資訊。The measured resistance value evaluation unit 113 can detect the degree of deviation of the measured resistance value of each of the wiring patterns 2 in association with the position information, but may be calculated in the unit substrate 3 as a unit. The degree of deviation of the measured resistance value of the wiring pattern 2 is such that the calculated degree of deviation is related to the position information of the unit substrate 3. In this case, the degree of deviation of the unit substrate 3 is calculated by calculating the degree of deviation of the measured resistance value of each wiring pattern 2 of the unit substrate 3 from the reference resistance value, and calculating the degree of deviation of the unit substrate 3 (for example, the degree of deviation) Average or deviation, etc.). Further, the positional information in this case can be used to evaluate the position information of the unit substrate 3 in the unit-like substrate 4, for example, the position information or the evaluation unit piece of the unit substrate in the longitudinal and lateral directions on the evaluation unit-like substrate 4 can be used. The position information of the XV coordinate information on the substrate 4.
又，關於評估單位片狀基板4內之各位置的量測電阻值之偏離程度的顯示形態，各種構成都可採用。例如，如圖8所示般，可採用在表示評估單位片狀基板4之範圍的影像領域181內，如地形圖之等高線般，將量測電阻值之偏離程度相同的地點以線(偏離程度之等高線)182~184連結的構成。或者，亦可將偏離程度之值的範圍分為幾個區域，各區域用不同顏色在影像領域181內分色顯示。或者，將評估單位片狀基板4內的位置以XY座標表示，將評估單位片狀基板4內之各位置的量測電阻值之偏離程度以Z座標表示，而形成圖示方式之顯示影像。Further, various configurations can be employed for the display form for evaluating the degree of deviation of the measured resistance values at the respective positions in the unit sheet substrate 4. For example, as shown in FIG. 8, in the image area 181 indicating the range of the evaluation unit sheet substrate 4, as in the contour line of the topographic map, the point at which the measurement resistance value is the same degree of deviation is taken as a line (degree of deviation). Contours) 182~184 links. Alternatively, the range of the degree of deviation may be divided into several regions, each of which is displayed in a different color in the image field 181. Alternatively, the position in the evaluation unit sheet substrate 4 is represented by an XY coordinate, and the degree of deviation of the measured resistance value at each position in the unit sheet substrate 4 is evaluated as a Z coordinate to form a display image of the drawing.
導電判定部114根據電阻量測部17所量測得之評估單位片狀基板4內之各配線圖案2的量測電阻值、量測電阻值評估部113所計算得之各配線圖案2的平均電阻值、及量測電阻值評估部113所計算得之評估單位片狀基板4內之各配線圖案2的量測電阻值之偏離程度中的至少其中之一，而決定與各配線圖案2的導電性相關之判定基準值。又，導電判定部114將各配線圖案2之量測電阻值與判定基準值相比較，而進行評估單位片狀基板4內之各配線圖案2的良否判定。例如，設一容許上限電阻值作為判定基準值，若為量測電阻值低於容許上限電阻值之配線圖案2則判定為良好，而若量測電阻值超過容許上限電阻值則判定配線圖案2及該配線圖案2所歸屬之單位基板3為不良。於一變化例中，亦可追加導入一容許下限電阻值作為判定基準值，對於電阻值低於容許下限電阻值的配線圖案2及該配線圖案2所歸屬之單位基板3，就將其判定為不良。The electric conduction determining unit 114 estimates the measured resistance value of each of the wiring patterns 2 in the unit-like substrate 4 and the average of the respective wiring patterns 2 calculated by the measured resistance value evaluating unit 113, based on the measurement by the resistance measuring unit 17. The resistance value and the degree of deviation of the measured resistance values of the respective wiring patterns 2 in the unit-like substrate 4 calculated by the measured resistance value evaluation unit 113 are determined, and the wiring pattern 2 is determined. Conduction-related judgment reference value. Moreover, the conductivity determination unit 114 compares the measured resistance value of each wiring pattern 2 with the determination reference value, and evaluates whether or not the wiring pattern 2 in the unit-like substrate 4 is good or not. For example, if the allowable upper limit resistance value is used as the determination reference value, the wiring pattern 2 whose measured resistance value is lower than the allowable upper limit resistance value is judged to be good, and if the measured resistance value exceeds the allowable upper limit resistance value, the wiring pattern 2 is determined. The unit substrate 3 to which the wiring pattern 2 belongs is defective. In a variation, the allowable lower limit resistance value may be additionally added as the determination reference value, and the wiring pattern 2 having the resistance value lower than the allowable lower limit resistance value and the unit substrate 3 to which the wiring pattern 2 belongs may be determined as bad.
上述判定基準值係針對例如評估單位片狀基板4中的各單位基板3內之各配線圖案2設置。於此情形時，係對於一個單位片狀基板4，設定與各單位基板3內之配線圖案2之數目相同數量的判定基準值。或者，於一變化例中，在各單位基板3內設置有多 數相同種類之配線圖案2的情形時，對於相同種類之配線圖案2其判定基準值亦可共通化。於此情形時，在一個單位片狀基板4中所設定之判定基準值的數量，與各單位基板3內之配線圖案2的種類之數目相同。The determination reference value is provided for each wiring pattern 2 in each unit substrate 3 in the evaluation unit sheet substrate 4, for example. In this case, the number of determination reference values equal to the number of the wiring patterns 2 in each unit substrate 3 is set for one unit sheet substrate 4. Or, in a variation, a plurality of units are provided in each unit substrate 3. In the case of the number of wiring patterns 2 of the same type, the determination reference values for the same type of wiring pattern 2 may be common. In this case, the number of determination reference values set in one unit sheet substrate 4 is the same as the number of types of wiring patterns 2 in each unit substrate 3.
又，關於判定基準值之具體的決定方法，例如，可將評估單位片狀基板4內之各配線圖案2的量測電阻值之平均值亦即平均電阻值，乘以既定之係數(例如，於容許上限電阻值之場合，此係數可取1.2或1.3；而於容許下限電阻值之場合，此係數可取0.8或0.7等)，而得到判定基準值。或者，亦可根據量測電阻值評估部113所計算出之各配線圖案2之量測電阻值的偏差值之分布，以偏差值對應於既定之閾值位準(例如，容許上限位準)的電阻值作為判定基準值(例如，容許上限電阻值)。或者，亦可根據電阻量測部17所量測得之各配線圖案2的量測電阻值設定判定基準值，使得評估單位片狀基板4內所含之全部配線圖案2(或單位基板3)中的既定比率之配線圖案2(或單位基板3)被判定為良好。In addition, for the specific determination method of the determination reference value, for example, the average resistance value of the measured resistance values of the respective wiring patterns 2 in the unit-like substrate 4 can be multiplied by a predetermined coefficient (for example, In the case where the upper limit resistance value is allowed, the coefficient may be 1.2 or 1.3; and in the case where the lower limit resistance value is allowed, the coefficient may be 0.8 or 0.7, etc.), and the determination reference value is obtained. Alternatively, the distribution of the deviation values of the measured resistance values of the respective wiring patterns 2 calculated by the measured resistance value evaluation unit 113 may be such that the deviation value corresponds to a predetermined threshold level (for example, the upper limit level is allowed). The resistance value is used as a determination reference value (for example, an allowable upper limit resistance value). Alternatively, the determination reference value may be set based on the measured resistance value of each of the wiring patterns 2 measured by the resistance measuring unit 17, so that all the wiring patterns 2 (or the unit substrate 3) included in the unit sheet substrate 4 are evaluated. The wiring pattern 2 (or the unit substrate 3) of a predetermined ratio is judged to be good.
特別是，本發明可依單位基板3之配線圖案2的量測電阻值之偏離程度，而計算在評估單位片狀基板4單位之由基準電阻值的偏離程度。因此，在對評估單位片狀基板4逐一進行檢查的情形時，一面依據形成於評估單位片狀基板4的單位基板3之位置資訊進行判定基準電阻值的修正，一面進行檢查。因此，在利用如4端子量測般之高精度的量測方法進行檢查的情形時，可修正判定基準電阻值而進行更正確的檢查。In particular, the present invention calculates the degree of deviation from the reference resistance value in units of the unit-like substrate 4 by the degree of deviation of the resistance value measured by the wiring pattern 2 of the unit substrate 3. Therefore, when the evaluation unit sheet substrate 4 is inspected one by one, the inspection is performed while determining the reference resistance value based on the position information of the unit substrate 3 formed on the evaluation unit sheet substrate 4. Therefore, when the inspection is performed by a high-accuracy measurement method such as 4-terminal measurement, the determination reference resistance value can be corrected to perform a more accurate inspection.
亦可將依上述方式決定之判定基準電阻值，作為用以決定該一判定基準電阻值的配線圖案2所歸屬的評估單位片狀基板4內之各單位基板3之良否判定的基準，而即時使用之。或者，亦可使用作為次一(或更後面的)評估單位片狀基板4內之各單位基板3的良否判定之基準。於前者之情形時，先進行作為檢查對象之評 估單位片狀基板4內的各單位基板3之各配線圖案2的電阻值之量測及該量測電阻值自基準電阻值的偏離程度之計算。其次，根據該一結果決定各配線圖案2之判定基準電阻值，依該決定出之各配線圖案2的判定基準電阻值與量測電阻值，而進行評估單位片狀基板4內之各單位基板3的配線圖案2之良否判定。The determination reference resistance value determined as described above may be used as a reference for determining the quality of each unit substrate 3 in the evaluation unit sheet substrate 4 to which the wiring pattern 2 for determining the determination reference resistance value belongs. Use it. Alternatively, a criterion for determining the quality of each unit substrate 3 in the sheet substrate 4 as the next (or later) evaluation unit may be used. In the case of the former, the first evaluation as the object of inspection The measurement of the resistance value of each wiring pattern 2 of each unit substrate 3 in the unit sheet substrate 4 and the calculation of the degree of deviation of the measurement resistance value from the reference resistance value are evaluated. Then, the determination reference resistance value of each wiring pattern 2 is determined based on the result, and each unit substrate in the unit-like substrate 4 is evaluated based on the determination reference resistance value and the measurement resistance value of each of the determined wiring patterns 2. The quality of the wiring pattern 2 of 3 is judged.
依本發明，可將預先初期設定的判定基準電阻值，以利用單位基板3之配線圖案2的實際量測得之量測值(偏離程度)計算出之新判定基準電阻值取代之，並利用該新判定基準電阻值進行良否判定。因此，可設定經過製程之影響的判定基準電阻值。又，此判定基準電阻值可依單位基板3之評估單位片狀基板4之位置而設定，故可設定更高精度的判定基準電阻值。According to the present invention, the determination reference resistance value set in advance may be replaced by a new determination reference resistance value calculated by the measured value (degree of deviation) measured by the actual amount of the wiring pattern 2 of the unit substrate 3, and used. The new determination reference resistance value is judged as good or bad. Therefore, the value of the determination reference resistance that is affected by the process can be set. Further, since the determination reference resistance value can be set in accordance with the position of the evaluation unit sheet substrate 4 of the unit substrate 3, it is possible to set a higher-precision determination reference resistance value.
其次，參照圖9說明基板檢查裝置1的操作順序。如圖8所示般，於步驟S1，進行將由未圖示的基板運送機構等送入之片狀基板4由基板固持機構12接受之等動作。於步驟S2，一面藉由基板固持機構12將片狀基板4內之量測對象部位朝向與第1及第2檢查夾具13、14相向的位置依序移動，一面藉由第1及第2檢查夾具升降機構15、16，使第1及第2檢查夾具13、14接觸或離開片狀基板4內之量測對象部位，而可量測片狀基板4內之各單位基板3的各配線圖案2之電阻值。Next, the operation sequence of the substrate inspection apparatus 1 will be described with reference to Fig. 9 . As shown in FIG. 8, in step S1, an operation of receiving the sheet substrate 4 fed by a substrate transport mechanism or the like (not shown) by the substrate holding mechanism 12 is performed. In the step S2, the first and second inspections are performed by sequentially moving the measurement target portion in the sheet substrate 4 toward the position facing the first and second inspection jigs 13 and 14 by the substrate holding mechanism 12. The jig lifting and lowering mechanisms 15 and 16 can contact the first and second inspection jigs 13 and 14 to or away from the measurement target portion in the sheet substrate 4, and can measure the respective wiring patterns of the unit substrates 3 in the sheet substrate 4. 2 resistance value.
於步驟S3，以對於評估單位的片狀基板4亦即評估單位片狀基板4(例如，圖4之片狀基板4)內之各配線圖案2所設定的基準電阻值作為基準，由量測電阻值評估部113，依上述方式計算出由電阻量測處理部122量測得之片狀基板4內各單位基板3的各配線圖案2之量測電阻值之偏離程度。於此步驟S3或其後的步驟中，亦可回應例如經由操作部19所輸入的顯示指令，在量測電阻值評估部113將片狀基板4內各單位基板3之各配線圖案2的量測電阻值之偏離程度以圖解方式顯示於顯示部18。In step S3, the reference resistance value set for each of the wiring patterns 2 in the evaluation unit unit sheet substrate 4, that is, the evaluation unit sheet substrate 4 (for example, the sheet substrate 4 in FIG. 4) is used as a reference. The resistance value evaluation unit 113 calculates the degree of deviation of the measured resistance values of the respective wiring patterns 2 of the unit substrates 3 in the sheet substrate 4 measured by the resistance measurement processing unit 122 as described above. In the step S3 or the subsequent steps, the amount of each wiring pattern 2 of each unit substrate 3 in the sheet substrate 4 may be measured by the measurement resistance value evaluation unit 113 in response to a display command input via the operation unit 19, for example. The degree of deviation of the measured resistance value is graphically displayed on the display portion 18.
於步驟S4，利用導電判定部114，依上述方式，決定評估單位片狀基板4內之各配線圖案2的導電性相關之判定基準值，藉由將各配線圖案2之量測電阻值與判定基準值加以比較，而進行評估單位片狀基板4內之各配線圖案2的良否判定。於步驟S5，藉由未圖示的基板運送機構等將片狀基板4送出到基板固持機構12外。In the above-described manner, the conductive determination unit 114 determines the determination reference value for evaluating the conductivity of each of the wiring patterns 2 in the unit-like substrate 4, and measures the resistance value and the determination of each wiring pattern 2. The reference values are compared, and the quality of each wiring pattern 2 in the unit sheet substrate 4 is evaluated. In step S5, the sheet substrate 4 is sent out of the substrate holding mechanism 12 by a substrate transfer mechanism or the like (not shown).
如上述，依本實施態樣的基板檢查裝置1，以針對作為評估單位的評估單位片狀基板4逐一設定的各配線圖案2之基準電阻值之群組為基準，可計算量測得之評估單位片狀基板4內各單位基板3之各配線圖案2的量測電阻值之偏離程度。因此，根據該量測電阻值之偏離程度，可適當地評估配線圖案2之電阻值之變異等，而可決定配線圖案2之導電檢查之適當的判定基準值。其結果，乃可執行確實之導電檢查。As described above, the substrate inspection apparatus 1 according to the present embodiment can calculate the measured value based on the group of the reference resistance values of the respective wiring patterns 2 set one by one for the evaluation unit sheet substrate 4 as the evaluation unit. The degree of deviation of the measured resistance values of the respective wiring patterns 2 of the unit substrates 3 in the unit sheet substrate 4. Therefore, based on the degree of deviation of the measured resistance value, the variation of the resistance value of the wiring pattern 2 or the like can be appropriately evaluated, and an appropriate determination reference value for the conductivity inspection of the wiring pattern 2 can be determined. As a result, a reliable conductive inspection can be performed.
又，由於能以評估單位片狀基板4為評估單位進行配線圖案之量測電阻值的偏離程度之評估，而可對評估單位片狀基板4內各位置的配線圖案2之量測電阻值之偏離程度進行評估。其結果，乃能對於在片狀基板4(例如，大基板5)的一部分，配線圖案2之厚度較設計值為薄而電阻值有增高傾向等片狀基板4之製程上的特性，加以掌握或修正。In addition, since the evaluation of the degree of deviation of the measured resistance value of the wiring pattern by the evaluation unit sheet substrate 4 as an evaluation unit can be performed, the measured resistance value of the wiring pattern 2 at each position in the unit sheet substrate 4 can be evaluated. The degree of deviation is assessed. As a result, it is possible to grasp the characteristics of the process of the sheet substrate 4 in which the thickness of the wiring pattern 2 is thinner than the design value and the resistance value tends to increase in a part of the sheet substrate 4 (for example, the large substrate 5). Or fix it.
又，由於檢測出之評估單位片狀基板4內各位置的配線圖案2之量測電阻值之偏離程度可以圖解方式顯示於顯示部18，故依據顯示內容乃容易掌握評估單位片狀基板4(例如，大基板5)各位置的量測電阻值之偏離程度、及偏離程度之分布之特性等。Further, since the degree of deviation of the measured resistance value of the wiring pattern 2 at each position in the evaluation unit sheet substrate 4 can be graphically displayed on the display portion 18, it is easy to grasp the evaluation unit sheet substrate 4 in accordance with the display content ( For example, the degree of deviation of the measured resistance value at each position of the large substrate 5), the characteristic of the distribution of the degree of deviation, and the like.
又，導電判定部114根據電阻量測部17所量測得之評估單位片狀基板4內之各配線圖案2的量測電阻值、量測電阻值評估部 113所計算得之各配線圖案2的量測電阻值之平均值亦即平均電阻值、及量測電阻值評估部113所計算得之評估單位片狀基板4內之各配線圖案2的量測電阻值之偏離程度中的至少其中之一，而決定與各配線圖案2的導電性相關之判定基準值，並依該判定基準值而進行各配線圖案2之導電性相關的良否判定。因此，乃能決定相應於配線圖案2的電阻值之變異度等的適當之導電檢查之判定基準值，而能進行確實之導電檢查。Further, the electric conduction determining unit 114 estimates the measured resistance value and the measured resistance value evaluation unit of each of the wiring patterns 2 in the unit-like substrate 4 based on the measured amount by the resistance measuring unit 17. The average value of the measured resistance values of the respective wiring patterns 2 calculated by 113, that is, the average resistance value, and the measurement of each wiring pattern 2 in the evaluation unit sheet substrate 4 calculated by the measurement resistance value evaluation unit 113 The determination reference value relating to the conductivity of each wiring pattern 2 is determined based on at least one of the degree of deviation of the resistance value, and the conductivity correlation of each wiring pattern 2 is determined based on the determination reference value. Therefore, the determination value of the appropriate conductivity inspection corresponding to the variability of the resistance value of the wiring pattern 2 can be determined, and the reliable conductivity inspection can be performed.
又，藉由4端子量測法可正確地量測配線圖案2的電阻值，且能正確地評估量測得的電阻值之以基準電阻值作為基準的偏離程度。其結果，乃能決定配線圖案2之導電檢查之適當的判定基準值，而能進行確實之導電檢查。Further, the resistance value of the wiring pattern 2 can be accurately measured by the 4-terminal measurement method, and the degree of deviation of the measured resistance value based on the reference resistance value can be accurately evaluated. As a result, it is possible to determine an appropriate determination reference value for the conductivity inspection of the wiring pattern 2, and to perform a reliable conductivity inspection.
1‧‧‧基板檢查裝置1‧‧‧Substrate inspection device
2‧‧‧配線圖案2‧‧‧Wiring pattern
3‧‧‧單位基板3‧‧‧unit substrate
4‧‧‧片狀基板4‧‧‧Sheet substrate
5‧‧‧大基板5‧‧‧ Large substrate
11‧‧‧控制部11‧‧‧Control Department
111‧‧‧基板操縱處理部111‧‧‧Substrate Control Processing Department
112‧‧‧電阻量測處理部112‧‧‧Resistive Measurement Processing Department
113‧‧‧量測電阻值評估部113‧‧‧Measured resistance value evaluation department
114‧‧‧導電判定部114‧‧‧Electrical Judgment Department
12‧‧‧基板固持機構12‧‧‧Substrate holding mechanism
121‧‧‧基板固持部121‧‧‧Substrate retention
122‧‧‧XY驅動機構122‧‧‧XY drive mechanism
13‧‧‧第1檢查夾具13‧‧‧1st inspection fixture
14‧‧‧第2檢查夾具14‧‧‧2nd inspection fixture
15‧‧‧第1檢查治升降機構15‧‧‧1st inspection and elevation mechanism
16‧‧‧第2檢查夾具升降機構16‧‧‧2nd inspection jig lifting mechanism
17‧‧‧電阻量測部17‧‧‧Resistive Measurement Department
171‧‧‧電流供應量測部171‧‧‧ Current Supply Measurement Department
172‧‧‧電位差量測部172‧‧‧potential difference measurement department
173‧‧‧切換單元173‧‧‧Switch unit
18‧‧‧顯示部18‧‧‧Display Department
19‧‧‧操作部19‧‧‧Operation Department
P1、P2‧‧‧量測位置P1, P2‧‧‧ measurement position
圖1係依本發明一實施態樣之基板檢查裝置的方塊圖。BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a block diagram of a substrate inspecting apparatus according to an embodiment of the present invention.
圖2係顯示圖1之基板檢查裝置的基板固持機構及第1與第2之檢查夾具等之構成的圖式。2 is a view showing a configuration of a substrate holding mechanism of the substrate inspecting apparatus of FIG. 1 and first and second inspection jigs and the like.
圖3係顯示被分割前的片狀基板亦即大基板之構成的圖式。Fig. 3 is a view showing a configuration of a large substrate which is a sheet substrate before being divided.
圖4係顯示圖3之大基板被分割成的片狀基板之構成的圖式。Fig. 4 is a view showing a configuration of a sheet substrate into which the large substrate of Fig. 3 is divided.
圖5係用以說明藉由圖1之基板檢查裝置量測配線圖案之電阻值時的電路構成之圖式。Fig. 5 is a view for explaining a circuit configuration when the resistance value of the wiring pattern is measured by the substrate inspecting apparatus of Fig. 1.
圖6係例示藉由圖1之基板檢查裝置所量測的評估單位片狀基板內的各配線圖案之量測電阻值、基準電阻值及量測電阻值的偏離程度(差分值)等之圖式。6 is a diagram for estimating the degree of deviation (difference value) of the measured resistance value, the reference resistance value, and the measured resistance value of each wiring pattern in the unit-chip substrate measured by the substrate inspection apparatus of FIG. 1 . formula.
圖7係將設於評估單位片狀基板內的各單位基板的配線圖案，按照電阻值的設計理論值由小而大逐漸增大的順序排序時的各配線圖案之量測電阻值，加以曲線化之圖式。FIG. 7 is a graph showing the measurement of the resistance pattern of each wiring pattern when the design values of the resistance values are sequentially increased from small to large, in accordance with the layout pattern of each unit substrate provided in the evaluation unit sheet substrate. The pattern of the transformation.
圖8係表示將在評估單位片狀基板內各位置的配線圖案之量 測電阻值的偏離程度，以圖形方式顯示於顯示部之顯示例的圖式。Figure 8 is a diagram showing the amount of wiring patterns to be evaluated at various positions in a unit sheet substrate. The degree of deviation of the resistance value is graphically displayed on the display of the display portion.
圖9係顯示圖1之基板檢查裝置的操作順序之圖式。Fig. 9 is a view showing the operational sequence of the substrate inspecting apparatus of Fig. 1.
1‧‧‧基板檢查裝置1‧‧‧Substrate inspection device
11‧‧‧控制部11‧‧‧Control Department
111‧‧‧基板操縱處理部111‧‧‧Substrate Control Processing Department
112‧‧‧電阻量測處理部112‧‧‧Resistive Measurement Processing Department
113‧‧‧量測電阻值評估部113‧‧‧Measured resistance value evaluation department
114‧‧‧導電判定部114‧‧‧Electrical Judgment Department
12‧‧‧基板固持機構12‧‧‧Substrate holding mechanism
122‧‧‧XY驅動機構122‧‧‧XY drive mechanism
13‧‧‧第1檢查夾具13‧‧‧1st inspection fixture
14‧‧‧第2檢查夾具14‧‧‧2nd inspection fixture
15‧‧‧第1檢查治升降機構15‧‧‧1st inspection and elevation mechanism
16‧‧‧第2檢查夾具升降機構16‧‧‧2nd inspection jig lifting mechanism
17‧‧‧電阻量測部17‧‧‧Resistive Measurement Department
18‧‧‧顯示部18‧‧‧Display Department
19‧‧‧操作部19‧‧‧Operation Department
171‧‧‧電流供應量測部171‧‧‧ Current Supply Measurement Department
172‧‧‧電位差量測部172‧‧‧potential difference measurement department
173‧‧‧切換單元173‧‧‧Switch unit
Claims (11)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011156447A JP2013024582A (en) | 2011-07-15 | 2011-07-15 | Substrate checkup device and substrate checkup method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201305572A TW201305572A (en) | 2013-02-01 |
| TWI465732B true TWI465732B (en) | 2014-12-21 |
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| TW101125340A TWI465732B (en) | 2011-07-15 | 2012-07-13 | Substrate inspecting apparatus and substrate inspecting method |
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| JP (1) | JP2013024582A (en) |
| KR (1) | KR101365092B1 (en) |
| CN (1) | CN102879646B (en) |
| TW (1) | TWI465732B (en) |
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| KR101474620B1 (en) * | 2012-12-27 | 2014-12-18 | 삼성전기주식회사 | Substrate Inspection Apparatus and Substrate Inspection Method |
| JP6421463B2 (en) * | 2014-06-02 | 2018-11-14 | 日本電産リード株式会社 | Substrate inspection apparatus and substrate inspection method |
| CN111527371B (en) * | 2017-12-28 | 2022-07-08 | 日本电产理德股份有限公司 | Inspection apparatus and inspection method |
| CN109459634B (en) * | 2018-11-07 | 2024-05-24 | 深圳振华富电子有限公司 | Chip component testing module |
| TWI834728B (en) * | 2018-11-09 | 2024-03-11 | 日商日本電產理德股份有限公司 | Inspection instruction information generation device, substrate inspection system, inspection instruction information generation method and inspection instruction information generation program |
| CN112614780A (en) * | 2020-12-16 | 2021-04-06 | 上海华力微电子有限公司 | Wafer spike annealing monitoring method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003215193A (en) * | 2002-01-29 | 2003-07-30 | Mitsubishi Electric Corp | Electrode inspecting method, inspecting device, program, and recording medium |
| US20060220667A1 (en) * | 2005-03-31 | 2006-10-05 | Fujitsu Limited | Testing device and testing method of a semiconductor device |
| TW200641366A (en) * | 2005-01-18 | 2006-12-01 | Nidec Read Corp | Apparatus, program, and method for substrate inspection |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101363884B (en) * | 2007-08-10 | 2010-10-06 | 富葵精密组件(深圳)有限公司 | Method for testing circuit board |
| JP5290697B2 (en) * | 2008-10-20 | 2013-09-18 | 日置電機株式会社 | Reference data creation method and circuit board inspection apparatus |
| JP5463714B2 (en) * | 2009-04-02 | 2014-04-09 | 日本電産リード株式会社 | Substrate inspection method and substrate inspection apparatus |
| JP4843071B2 (en) * | 2009-06-04 | 2011-12-21 | マイクロクラフト株式会社 | Inspection apparatus and inspection method for printed wiring board |
-
2011
- 2011-07-15 JP JP2011156447A patent/JP2013024582A/en not_active Ceased
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2012
- 2012-07-11 KR KR1020120075424A patent/KR101365092B1/en not_active IP Right Cessation
- 2012-07-13 CN CN201210242203.2A patent/CN102879646B/en not_active Expired - Fee Related
- 2012-07-13 TW TW101125340A patent/TWI465732B/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003215193A (en) * | 2002-01-29 | 2003-07-30 | Mitsubishi Electric Corp | Electrode inspecting method, inspecting device, program, and recording medium |
| TW200641366A (en) * | 2005-01-18 | 2006-12-01 | Nidec Read Corp | Apparatus, program, and method for substrate inspection |
| US20060220667A1 (en) * | 2005-03-31 | 2006-10-05 | Fujitsu Limited | Testing device and testing method of a semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101365092B1 (en) | 2014-02-19 |
| KR20130009646A (en) | 2013-01-23 |
| TW201305572A (en) | 2013-02-01 |
| CN102879646A (en) | 2013-01-16 |
| JP2013024582A (en) | 2013-02-04 |
| CN102879646B (en) | 2015-03-25 |
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