TWI464684B - 電子鑲嵌體結構及其製造方法 - Google Patents

電子鑲嵌體結構及其製造方法 Download PDF

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TWI464684B
TWI464684B TW97144246A TW97144246A TWI464684B TW I464684 B TWI464684 B TW I464684B TW 97144246 A TW97144246 A TW 97144246A TW 97144246 A TW97144246 A TW 97144246A TW I464684 B TWI464684 B TW I464684B
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sheet
sheets
mosaic structure
electronic
mesh material
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TW200943190A (en
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Guy Shafran
Oded Bashan
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Smartrac Ip Bv
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
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    • B29C66/45—Joining of substantially the whole surface of the articles
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    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
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    • B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
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Description

電子鑲嵌體結構及其製造方法
本發明係關於鑲嵌體結構之製造方法，如運用於電子識別產品之鑲嵌體結構，以及由該方法製成的鑲嵌體結構與電子識別產品。
據信，以下專利公開案代表當前之習知技術：7,278,580、7,271,039、7,269,021、7,243,840、7,240,847及7,204,427。
本發明試圖提供鑲嵌體結構製造之替代方法，如運用於電子識別產品之鑲嵌體結構以及由此製成的替代鑲嵌體結構與電子識別產品。
依照本發明之一較佳實施例，從而提供一電子鑲嵌體結構，其包含一嵌入式基板之第一與第二薄片，其大致被配置為側對側、平行間隔配置且其間具有一空隙；一撓性網狀材料，其經配置以覆蓋該空隙及與該空隙相鄰的鑲嵌體結構之該第一薄片與該第二薄片的邊緣之上；第三與第四薄片，其被配置為分別相配準於該第一薄片與該第二薄片，在該嵌入式基板之該第一薄片與該第二薄片之上及部分在該撓性網狀材料之上且被接合於其；電子電路，其與該第一、第二、第三與第四薄片之至少一個相聯結；及層壓件，其將該第一、第二、第三與第四薄片、該電子電路及該網狀材料封圍在一起以產生該鑲嵌體結構。
較佳地，該嵌入式基板材料選自由塗佈紙、TESLIN、PVC、聚碳酸酯、PET-G、PETF與ABS組成之組。
較佳地，該電子電路之至少部分位於該嵌入式基板之該第一、第二、第三與第四薄片之任意一個上。此外或另外，該電子電路包含至少一個無線通信天線，其至少部分嵌入在該第一、第二、第三與第四薄片之至少一個內。
較佳地，該電子電路包含一提供識別功能之智慧卡晶片。
依照本發明之另一較佳實施例，也可提供一種製造一電子鑲嵌體結構之方法，該方法包含大致將一嵌入式基板之第一與第二薄片配置為側對側、平行間隔配置且其間具有一空隙；將一撓性網狀材料配置為覆蓋該空隙及與該空隙相鄰的鑲嵌體結構之該第一薄片與該第二薄片的邊緣之上；將一嵌入式基板之第三與第四薄片配置為分別相配準於該第一薄片與該第二薄片，在該嵌入式基板之該第一薄片與該第二薄片之上及部分在該撓性網狀材料之上；將該第一與第三薄片接合在一起於其覆蓋該撓性網狀材料上之位置；將該第二與第四薄片接合在一起於其覆蓋該撓性網狀材料上之位置；薄片薄片使電子識別電路與該第一、第二、第三與第四薄片之至少一個相聯結；及將該第一、第二、第三與第四薄片、該電子電路及該網狀材料層壓在一起以產生該鑲嵌體結構。
較佳地，該嵌入式基板材料選自由塗佈紙、TESLIN、PVC、聚碳酸酯、PET-G、PETF與ABS組成之組。
結合繪圖，本發明將從以下詳述中被更充分地理解與瞭解。
現參照圖1-3，其闡釋依照本發明之一較佳實施例構造及操作之一鑲嵌體結構100，其運用於如一電子護照之一電子識別產品。參見圖1-3，該鑲嵌體結構100包括一嵌入式基板之第一薄片104與第二薄片106，如塗佈紙、TESLIN、PVC、聚碳酸酯、PET-G、PETF與ABS或任一其他合適基板，其大致被配置為側對側、平行間隔配置且其間具有一空隙108，其被一軸109一分為二。
一撓性網狀材料之條片120(舉例而言，如一PET基網狀條片)較佳地被置於薄片104與106之上，以便覆蓋在空隙108及與空隙108相鄰的該鑲嵌體結構之第一薄片104與第二薄片106的各個邊緣124與126之上。
一嵌入式基板之第三薄片204與第四薄片206(如塗佈紙、TESLIN、PVC、聚碳酸酯、PET-G、PETF與ABS或任一其他合適基板)較佳係以精確配準配置在各個薄片104與106之上且部分在條片120之上。
電子識別電路220被設置在第一薄片104與第三薄片204中間及/或在第二薄片106與第四薄片206之間。該電子識別電路220較佳地包含一無線天線240，其被電連接到一包含一智慧卡晶片之晶片模組242或任一其他合適電子電路。
現參照圖4，其闡釋圖1-3中的鑲嵌體結構100製造方法之一最初步驟，且參照圖5與6，其分別為相應於圖4之一平面圖及沿圖4之VI-VI直線截取之一截面視圖。應瞭解，雖然出於簡明與簡化的目的，一非自動製造方法被描述於下文，但是藉由合適的已知製造技術，圖1-3中的鑲嵌體結構100之製造可替代為自動的。
一大致為平面狀之裝配表面300較佳具有複數個直立定位銷302。參見圖4-6，一嵌入式基板之第一薄片104與第二薄片106，如塗佈紙、TESLIN、PVC、聚碳酸酯、PET-G、PETF與ABS或任一其他合適基板，大致被配置為側對側、平行間隔配置於裝配表面300，其間具有一空隙108，其被一軸109一分為二。該嵌入式基板之該等薄片104與106較佳被形成為具有穿孔310於相應於該等直立定位銷302之位置處，且被定位以致銷302可延伸通過相應的穿孔310，從而提供薄片104與106之精確位置。
現參照圖7，其為圖1-3中的鑲嵌體結構100製造方法之一進一步步驟之一簡化圖式，並參照圖8與9，其分別為相應於圖7之一平面圖及沿圖7之IX-IX直線截取之一截面視圖。參見圖7-9，一撓性網狀材料120之條片，舉例而言，如一PET基網狀條片，被置於薄片104與106之上以便覆蓋空隙108及與空隙108相鄰的該鑲嵌體結構之第一薄片104與第二薄片106的各個邊緣124與126之上。該撓性網狀材料120之條片較佳係保留於一理想位置，薄片104與106藉由與直立網狀材料定位銷328邊緣接合而被安裝於裝配表面300且被配置為與軸109等距，及相互間隔的定位突出330與332被形成於裝配表面300。
現參照圖10，其為圖1-3中的鑲嵌體結構100製造方法之又一步驟之一簡化圖式，並參照圖11與12，其分別為相應於圖10之一平面圖及沿圖10之XII-XII直線截取之一截面視圖。參見圖10-12，一定位桿340可被置於該撓性網狀材料120之條片上。定位桿340可被放置於相鄰的突出330與332之間的一空隙以沿軸109平躺。
現參照圖13，其為圖1-3中的鑲嵌體結構100製造方法之再一步驟之一簡化圖式，並參照圖14與15，其分別為相應於圖13之一平面圖及沿圖13之XV-XV直線截取之一截面視圖。參見圖13-15，電子識別電路220以任一合適的習知方式與該鑲嵌體結構100相聯結，如利用一技術將其至少部分印刷或嵌入薄片104及/或106，該技術相同或相似於以下美國專利第6,628,240號、第6,626,364號與第6,604,686號之任一描述。如上所述，電子識別電路220較佳地包含無線天線240，該無線天線240被電連接到一包含一智慧卡晶片之晶片模組242或任一其他合適電子電路。
現參照圖16，其為圖1-3中的鑲嵌體結構100製造方法之一額外步驟之一簡化圖式，並參照圖17與18，其分別為相應於圖16之一平面圖及沿圖16之XVIII-XVIII直線截取之一截面視圖。參見圖16-18，一嵌入式基板之第三薄片204與第四薄片206，如塗佈紙、TESLIN、PVC、聚碳酸酯、PET-G、PETF與ABS或任一其他合適基板，分別被配置為部分在撓性網狀材料120與電子識別電路220之上且在相應薄片104與106之上進行精確配準。該嵌入式基板之該等薄片204與206較佳地被形成為具有穿孔210於相應於該等直立定位銷302之位置處，且被定位以致銷302可延伸通過相應的穿孔210，從而提供薄片204與206分別與各個第一薄片104與第二薄片106之精確配準。
現參照圖19-21，其闡釋藉由利用一加熱元件420之點加熱熔接將該第一薄片104與該第三薄片204接合在一起於沿邊緣124之位置424，此處它們覆蓋該撓性網狀材料120之上，並將該第二薄片106與該第四薄片206相似地接合在一起於沿邊緣126之位置426，此處它們覆蓋該撓性網狀材料120之上。
按照圖19-21所示之步驟，該等接合的第一薄片104、第二薄片106、第三薄片204與第四薄片206及該撓性網狀材料120接著被層壓到一起以產生鑲嵌體結構100(圖1)。
依照圖22-30所示之本發明之一替代實施例，該電子識別電路220藉由印刷、嵌入或任一其他合適技術而被定位於薄片204與206之上，而非如在上文中連同參照圖13-15所述至少部分被嵌入薄片104及/或106。如上所述，電子識別電路220較佳地包含無線天線240，該無線天線240被電連接到一包含一智慧卡晶片之晶片模組242或任一其他合適電子電路。
在此替代實施例中，如圖4-12所示之步驟進行鑲嵌體結構100之製備。參見圖22-24，該程序接著繼續，藉由分別部分將一嵌入式基板之第三薄片204與第四薄片206(如塗佈紙、TESLIN、PVC、聚碳酸酯、PET-G、PETF與ABS或任一其他合適基板)配置在撓性網狀材料120之上且在相應薄片104與106之上進行精確配準。該嵌入式基板之該等薄片204與206較佳地被形成為具有穿孔210於相應於該等直立定位銷302之位置處，且被定位以致銷302可延伸通過相應的穿孔210，從而提供薄片204與206分別與各個第一薄片104與第二薄片106之精確配準。
參見圖25-27，該程序持續進行，藉由利用一加熱元件420之點加熱熔接，較佳地將該第一薄片104與該第三薄片204沿邊緣124之位置424接合在一起，此位置處係其覆蓋該撓性網狀材料120之上的位置，並將該第二薄片106與該第四薄片206同樣地沿邊緣126之位置426接合在一起，該位置處其係覆蓋該撓性網狀材料120之上的位置。
最後，參見28-30，電子識別電路220以任一合適的習知方式與該鑲嵌體結構相聯結，如利用一技術將其至少部分嵌入薄片204及/或206，該技術相同或相似於該等以下美國專利第6,628,240號、第6,626,364號與第6,604,686號之任一描述。如上所述，電子識別電路220較佳地包含無線天線240，其被電連接到一包含一智慧卡晶片之晶片模組242或任一其他合適電子電路。
按照圖28-30所示之步驟，該等接合的第一薄片104、第二薄片106、第三薄片204與第四薄片206及該撓性網狀材料120與該電子識別電路220接著被層壓到一起以產生鑲嵌體結構100(圖1)。
應瞭解，雖然該所闡釋實施例，特定參見圖13-15，顯示該電子識別電路220至鑲嵌體結構100之嵌入在網狀材料120之放置之後，但是電子識別電路220可在放置網狀材料120之前，如藉由印刷而被嵌入到薄片104及/或106或與之相聯結的其他者上。
熟習此項技術者應瞭解本發明並非局限於上文所特定顯示及描述之內容。更確切地，本發明之範圍同時包含上文所描述之各種特徵之組合及亞組合，及其修正與變化，其將為熟習此項技術者在閱讀以上所述後而瞭解且未在先前技術中。
100．．．鑲嵌體結構
104．．．第一薄片
106．．．第二薄片
108．．．空隙
109．．．軸
120．．．撓性網狀材料
124．．．邊緣
126．．．邊緣
204．．．第三薄片
206．．．第四薄片
210．．．穿孔
220．．．電子識別電路
240．．．無線天線
242．．．晶片模組
300．．．裝配表面
302．．．直立定位銷
310．．．穿孔
328．．．直立網狀材料定位銷
330．．．突出
332．．．突出
340．．．定位桿
420．．．加熱元件
424．．．位置
426．．．位置
圖1、2與3為一鑲嵌體結構之簡化分解圖、裝配圖及截面視圖，該鑲嵌體結構運用於依照本發明之一較佳實施例構造與操作之一電子識別產品；
圖4為圖1-3中的該鑲嵌體結構製造方法之一最初步驟之一簡化圖式；
圖5與6分別為相應於圖4之一平面圖及沿圖4之VI-VI直線截取之一截面視圖；
圖7為圖1-3中的該鑲嵌體結構製造方法之一進一步步驟之一簡化圖式；
圖8與9分別為相應於圖7之一平面圖及沿圖7之IX-IX直線截取之一截面視圖；
圖10為圖1-3中的該鑲嵌體結構製造方法之一進一步步驟之一簡化圖式；
圖11與12分別為相應於圖10之一平面圖及沿圖10之XII-XII直線截取之一截面視圖；
圖13為圖1-3中的該鑲嵌體結構製造方法之一再一步驟之一簡化圖式；
圖14與15分別為相應於圖13之一平面圖及沿圖13之XV-XV直線截取之一截面視圖；
圖16為圖1-3中的該鑲嵌體結構製造方法之一額外步驟之一簡化圖式；
圖17與18分別為相應於圖16之一平面圖及沿圖16之XVIII-XVIII直線截取之一截面視圖；
圖19為圖1-3中的該鑲嵌體結構製造方法之另一額外步驟之一簡化圖式；
圖20與21分別為相應於圖19之一平面圖及沿圖19之XXI-XXI直線截取之一截面視圖；
圖22為一鑲嵌體結構製造方法之一步驟之一簡化圖式，該鑲嵌體結構運用於依照本發明之另一較佳實施例構造與操作之一電子識別產品；
圖23與24分別為相應於圖22之一平面圖及沿圖22之XXIV-XXIV直線截取之一截面視圖；
圖25為圖22-24中的該鑲嵌體結構製造方法之一額外步驟之一簡化圖式；
圖26與27分別為相應於圖25之一平面圖及沿圖25之XXVII-XXVII直線截取之一截面視圖；
圖28為圖22-27中的該鑲嵌體結構製造方法之一最終步驟之一簡化圖式；及
圖29與30分別為相應於圖28之一平面圖及沿圖28之XXX-XXX直線截取之一截面視圖；
100．．．鑲嵌體結構
104．．．第一薄片
106．．．第二薄片
108．．．空隙
109．．．軸
120．．．撓性網狀材料
124．．．邊緣
126．．．邊緣
204．．．第三薄片
206．．．第四薄片
220．．．電子識別電路
240．．．無線天線
242．．．晶片模組

Claims (8)

  1. 一種電子鑲嵌體結構，其包含；一嵌入式基板之第一與第二薄片，其大致被配置為側對側、平行間隔配置且其間具有一空隙；一撓性網狀材料，其經配置以覆蓋該空隙及與該空隙相鄰的該鑲嵌體結構之該第一薄片與該第二薄片的邊緣之上；第三與第四薄片，其被配置為分別相配準於該第一薄片與該第二薄片，且位在該嵌入式基板之該第一薄片與該第二薄片之上及部分在該撓性網狀材料之上且與其等相接合；電子電路，其與該第一、第二、第三與第四薄片之至少一者相聯結；及層壓件，其將該第一、第二、第三與第四薄片、該電子電路及該網狀材料封圍在一起以產生該鑲嵌體結構。
  2. 如請求項1之電子鑲嵌體結構，其中該嵌入式基板材料係選自由塗佈紙、TESLIN、PVC、聚碳酸酯、PET-G、PETF與ABS組成之組。
  3. 如請求項1之電子鑲嵌體結構，其中該電子電路之至少部分位於該嵌入式基板之該第一、第二、第三與第四薄片之任一者上。
  4. 如請求項3之電子鑲嵌體結構，其中該電子電路包括至少一個無線通信天線，該無線通信天線至少部分嵌入在該第一、第二、第三與第四薄片之至少一者內。
  5. 如請求項1之電子鑲嵌體結構，其中該電子電路包括至少一個無線通信天線，該無線通信天線至少部分嵌入在該第一、第二、第三與第四薄片之至少一個內。
  6. 如請求項1之電子鑲嵌體結構，其中該電子電路包括一提供識別功能之智慧卡晶片。
  7. 一種電子鑲嵌體結構之製造方法，該方法包括：將一嵌入式基板之第一與第二薄片配置為大致側對側、平行間隔配置且其間具有一空隙；將一撓性網狀材料配置為覆蓋該空隙及與該空隙相鄰的該鑲嵌體結構之該第一薄片與該第二薄片的邊緣之上；將一嵌入式基板之第三與第四薄片配置為分別相配準於該第一薄片與該第二薄片，在該嵌入式基板之該第一薄片與該第二薄片之上及部分在該撓性網狀材料之上；將該第一薄片與該第三薄片於其覆蓋該撓性網狀材料之上的位置處接合在一起；將該第二薄片與該第四薄片於其覆蓋該撓性網狀材料之上的位置處接合在一起；使電子識別電路與該第一、第二、第三與第四薄片之至少一個相聯結；及將該第一、第二、第三與第四薄片、該電子電路及該網狀材料層壓在一起以產生該鑲嵌體結構。
  8. 如請求項7之製造方法，其中該嵌入式基板材料係選自由塗佈紙、TESLIN、PVC、聚碳酸酯、PET-G、PETF與ABS組成之組。
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WO2009063455A2 (en) 2009-05-22
EP2220585A4 (en) 2012-05-16
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US8028923B2 (en) 2011-10-04
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