TWI457601B - 偏光方位角調整裝置及雷射加工裝置 - Google Patents

偏光方位角調整裝置及雷射加工裝置 Download PDF

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Publication number
TWI457601B
TWI457601B TW100117726A TW100117726A TWI457601B TW I457601 B TWI457601 B TW I457601B TW 100117726 A TW100117726 A TW 100117726A TW 100117726 A TW100117726 A TW 100117726A TW I457601 B TWI457601 B TW I457601B
Authority
TW
Taiwan
Prior art keywords
laser light
optical
optical axis
wave
laser
Prior art date
Application number
TW100117726A
Other languages
English (en)
Chinese (zh)
Other versions
TW201207428A (en
Inventor
Yasuhiro Takigawa
Masashi Naruse
Yoshitaka Iwashita
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of TW201207428A publication Critical patent/TW201207428A/zh
Application granted granted Critical
Publication of TWI457601B publication Critical patent/TWI457601B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125—Weld quality monitoring
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/286—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising for controlling or changing the state of polarisation, e.g. transforming one polarisation state into another
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
    • G02B7/182—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/10061—Polarization control

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Quality & Reliability (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
TW100117726A 2010-06-01 2011-05-20 偏光方位角調整裝置及雷射加工裝置 TWI457601B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010126156A JP5349406B2 (ja) 2010-06-01 2010-06-01 偏光方位角調整装置およびレーザ加工装置

Publications (2)

Publication Number Publication Date
TW201207428A TW201207428A (en) 2012-02-16
TWI457601B true TWI457601B (zh) 2014-10-21

Family

ID=45049574

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100117726A TWI457601B (zh) 2010-06-01 2011-05-20 偏光方位角調整裝置及雷射加工裝置

Country Status (4)

Country Link
JP (1) JP5349406B2 (ko)
KR (1) KR101265843B1 (ko)
CN (1) CN102267010B (ko)
TW (1) TWI457601B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5940906B2 (ja) * 2012-06-19 2016-06-29 株式会社ディスコ レーザー加工装置
KR101416411B1 (ko) * 2012-12-28 2014-08-08 현대자동차 주식회사 레이저 용접기
CN108475895B (zh) * 2016-01-18 2021-07-02 三菱电机株式会社 用于激光的功率平衡装置、激光加工装置
JP6925778B2 (ja) * 2016-01-28 2021-08-25 浜松ホトニクス株式会社 レーザ出力装置及びレーザ加工装置
CN115210623A (zh) 2020-03-16 2022-10-18 住友重机械工业株式会社 光束分支装置及分支比调整方法
KR102406398B1 (ko) * 2022-03-16 2022-06-09 (주)세우인코퍼레이션 오픈 마스크 시트의 개구홀 가공장치 및 이를 이용한 오픈 마스크 시트의 개구홀 가공방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW555612B (en) * 2001-11-15 2003-10-01 Mitsubishi Electric Corp Laser machining apparatus
US20040104208A1 (en) * 2002-03-28 2004-06-03 Kenichi Ijima Laser machining apparatus
TWI305739B (en) * 2002-12-26 2009-02-01 Hitachi Via Mechanics Ltd Multibeam laser drilling apparatus

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH079181A (ja) * 1993-06-24 1995-01-13 Hitachi Ltd レーザ加工光学装置
JP3667705B2 (ja) * 2002-03-26 2005-07-06 住友重機械工業株式会社 レーザ加工装置及び加工方法
TWI275439B (en) * 2003-05-19 2007-03-11 Mitsubishi Electric Corp Laser processing apparatus
JP4539652B2 (ja) * 2004-06-01 2010-09-08 三菱電機株式会社 レーザ加工装置
JP2006122988A (ja) * 2004-10-29 2006-05-18 Mitsubishi Electric Corp レーザ加工機
DE102005047328B3 (de) * 2005-06-28 2006-12-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung zum Bohren und für den Materialabtrag mittels Laserstrahl
JP2007021509A (ja) 2005-07-12 2007-02-01 Mitsubishi Electric Corp レーザ加工機
JP2007275908A (ja) 2006-04-03 2007-10-25 Nippon Sharyo Seizo Kaisha Ltd レーザ加工装置
JP2008145605A (ja) * 2006-12-07 2008-06-26 Sumitomo Heavy Ind Ltd レーザ照射装置及び加工方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW555612B (en) * 2001-11-15 2003-10-01 Mitsubishi Electric Corp Laser machining apparatus
US20040104208A1 (en) * 2002-03-28 2004-06-03 Kenichi Ijima Laser machining apparatus
TWI305739B (en) * 2002-12-26 2009-02-01 Hitachi Via Mechanics Ltd Multibeam laser drilling apparatus

Also Published As

Publication number Publication date
CN102267010B (zh) 2014-04-23
JP5349406B2 (ja) 2013-11-20
KR101265843B1 (ko) 2013-05-20
KR20110132249A (ko) 2011-12-07
TW201207428A (en) 2012-02-16
CN102267010A (zh) 2011-12-07
JP2011251306A (ja) 2011-12-15

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