TWI457601B - Polarization azimuth adjustment device and laser processing apparatus - Google Patents

Description

Polarized azimuth adjusting device and laser processing device

The present invention relates to a polarization azimuth adjustment device and a laser processing apparatus for adjusting a polarization azimuth of laser light for laser processing.

As a method for improving the productivity of a laser processing apparatus for performing a hole processing on a workpiece such as a printed substrate, a laser beam generated by a laser oscillator is divided into a plurality of stripes, and at the same time A method in which holes are opened. In this method, when the energy of each of the divided laser beams is not uniform, the processing quality such as the processing aperture is deviated.

Therefore, in the method described in Patent Document 1, a polarizing azimuth adjusting polarizer having a rotation adjusting mechanism centered on the optical axis is provided upstream of the optical path of the spectroscopic polarizer. The energy is equally divided by adjusting the polarization azimuth of the P wave that is penetrated. When the energy is divided, the laser beam having the P-wave component in the polarization direction and the S-wave component in the polarization direction is incident on the beam splitting polarizer, whereby the light penetrating the spectroscopic polarizer can be equally divided into P-wave components. And the S wave component reflected by the beam splitter.

(Patent Literature)

(Patent Document 1) International Publication No. 2003/082510

However, in the above-described conventional technique, the P wave component of the polarizing member for penetrating polarization azimuth adjustment is propagated toward the downstream of the optical path. Therefore, when the power of the laser light incident on the polarizer is high, the thermal lens effect of the substrate material of the polarizer causes the beam diameter of the laser light to change, which does not occur. In the case of the thermal lens effect, the energy intensity of the laser light penetrating through the mask may vary. Therefore, there is a problem that the processing quality of the workpiece is deteriorated or unstable. Further, when the polarizing element is rotated and adjusted when the polarization azimuth is adjusted, there is a problem that the processing quality of the workpiece is deteriorated due to a slight shift from the refraction of the light to the center of the optical axis.

The present invention has been developed in view of the above problems, and an object thereof is to obtain a polarization azimuth adjusting device and a laser processing device which can easily perform stable laser processing on a workpiece.

In order to solve the above problems and achieve the object, the present invention is characterized in that an optical unit includes an element that penetrates a P-wave polarized light component of incident laser light and reflects the S-wave polarized light component of the laser light. And a polarizing member that reflects the S-wave polarizing component of the laser light reflected by the polarizing member and guides it to at least two reflective optical elements on a downstream side of the optical path, and absorbs the P-wave polarizing component and causes the aforementioned S The polarization light component is emitted toward the downstream side of the light path, and the optical unit is configured to arrange the polarizer and the reflective optical element such that the incident optical axis of the laser light toward the optical unit and the laser light from the optical unit The emission optical axis is coaxial, and the optical axis direction of the incident optical axis and the emission optical axis can be maintained when the optical unit is rotated about the incident optical axis.

According to the present invention, since the S-wave polarized component reflected by the polarizer is emitted from the optical unit coaxial with the incident optical axis of the laser light and the optical axis of the emitted light, it is possible to achieve an effect of facilitating stable laser processing on the workpiece.

Hereinafter, the polarization azimuth adjusting device and the laser processing device according to the embodiment of the present invention will be described in detail with reference to the drawings. Further, the invention is not limited by the embodiment.

Implementation form

Fig. 1 is a schematic block diagram showing a laser processing apparatus according to an embodiment of the present invention. The laser processing apparatus 100 splits a laser beam 2 into two laser lights 8A, 8B by using a polarizing beam splitter 7, and simultaneously scans two laser lights 8A, 8B independently for two The workpieces 13A and 13B are subjected to drilling processing. In the laser processing apparatus 100 of the present embodiment, a polarization azimuth angle adjusting device 30 including a polarizer and a mirror (reflecting optical element) is disposed upstream of the optical path of the polarization beam splitter 7 (a device for adjusting the polarization azimuth) . Thereafter, the S-wave polarized light component (S-wave polarized light component S1 described later) reflected by the polarizer of the polarization azimuth adjusting device 30 is guided downstream of the optical path, thereby guiding the laser light 2 to the polarization beam splitter 7.

The laser processing apparatus 100 includes: a laser oscillator 1; a polarization azimuth adjusting device (optical unit) 30; a mask (beam mask) 4; a beam variable portion 5; a mirror 6; a polarizing beam splitter (Spectral section) 7; galvanometer scanners 10Ax, 10Ay, 10Bx, 10By; fθ lenses 11A, 11B; and XY tables 12A, 12B.

The laser oscillator 1 is a device that emits linearly polarized laser light 2 as a pulse wave. The laser light 2 emitted from the laser oscillator 1 is guided to the polarization azimuth adjusting device 30 via the mirror 6. The mirror 6 is a lens that reflects the laser light 2 or the laser light 8A, 8B and directs it downstream of the light path. The mirror 6 can be disposed at various locations on the light path within the laser processing apparatus 100.

The polarization azimuth adjusting device 30 is a device that adjusts the polarization azimuth. The laser beam 2 having the polarization azimuth (polarization direction) 2a is incident on the polarization azimuth adjusting device 30, and the laser beam 2 having the polarization azimuth angle 2b is emitted by the polarization azimuth adjusting device 30. The polarization azimuth adjusting device 30 emits the laser light 2 in a direction coaxial with the incident laser light 2.

In the present embodiment, the polarization azimuth adjusting device 30 emits the S-wave polarized component S1 of the laser light reflected by the polarizer 14 and absorbs the P-wave polarized component P1 that is transmitted through the polarizer 14. Further, the polarizer, the mirror, and the like in the polarization azimuth adjusting device 30 are configured in advance by one optical unit, and the optical unit is rotated around the optical axis (incident optical axis and outgoing optical axis) of the laser light 2 The manner of installation is within the laser processing apparatus 100. The laser light 2 emitted from the polarization azimuth adjusting device 30 is guided to the beam variable portion 5 via the mirror 6.

The beam variable portion 5 is a device that can change the laser light 2 to a desired beam diameter. The laser light 2 obtained by changing the beam of light to the variable portion 5 is guided to the mask 4. The mask 4 is a portion of the laser light 2 that is cut out from the incident laser light 2 in order to process the machined hole into a desired size and shape. The laser light 2 whose shape is adjusted by the mask 4 is guided to the polarization beam splitter 7 via the mirror 6.

The polarizing beam splitter (polarizing beam splitter) 7 is a polarizer that splits one beam of laser light into two beams of laser light 8A, 8B. The polarization beam splitter 7 has a property of penetrating the P wave component of the laser light 2 and reflecting the S wave component.

One of the laser light 8A penetrating the polarization beam splitter 7 is laser light that is guided to the workpiece 13A on the XY table 12A as the laser light 8A of the polarization azimuth angle 9A. Further, the other laser light 8B reflected by the polarization beam splitter 7 is laser light that is guided to the workpiece 13B on the XY table 12B as the laser light 8B of the polarization azimuth angle 9B. The laser light 8A split by the polarization beam splitter 7 is guided to the galvanometer scanners 10Ax, 10Ay via the mirror 6. Further, the laser light 8B split by the polarization beam splitter 7 is guided to the galvanometer scanners 10Bx and 10By via the mirror 6.

The galvanometer scanner 10Ax moves the irradiation position of the workpiece 13A by the laser light 8A in the X direction, and the galvanometer scanner 10Ay moves the irradiation position of the laser light 8A to the workpiece 13A in the Y direction. Further, the galvanometer scanner 10Bx moves the irradiation position of the laser light 8B to the workpiece 13B in the X direction, and the galvanometer scanner 10By moves the irradiation position of the laser light 8B to the workpiece 13B in the Y direction. The laser light 8A scanned in the two-axis direction by the galvanometer scanner 10Ax and the galvanometer scanner 10Ay is guided to the fθ lens 11A. Further, the laser light 8B scanned in the two-axis direction by the galvanometer scanner 10Bx and the galvanometer scanner 10By is guided to the fθ lens 11B.

The fθ lenses 11A and 11B are lenses for concentrating the laser light 8A and 8B on the workpieces 13A and 13B placed on the XY tables 12A and 12B, respectively. The XY tables 12A and 12B are placed on workpieces 13A and 13B such as workpieces, and are moved in the X-axis direction in the X direction and the Y direction.

Next, the polarization azimuth adjusting device 30 will be described. Fig. 2 is a schematic block diagram showing a polarization azimuth angle adjusting device according to an embodiment. Moreover, Fig. 3 is a view for explaining the relationship between the polarizer and the azimuth angle of polarization. Fig. 3 is a cross-sectional view showing the polarizer 14. The polarization azimuth adjusting device 30 includes a polarizer 14 and a plurality of mirrors (in the case where the mirror 15 is two in the figure) and a damper 16, and these members are housed in the casing 35.

The polarizer 14 has a property of penetrating a component (P-wave polarizing component) of the polarization azimuth angle 2c of the incident laser light 2 and reflecting a component (S-wave polarizing component) of the polarization azimuth angle 2b. Therefore, if the polarization azimuth of the laser light 2 incident on the polarizer 14 is equal to the polarization azimuth angle 2b, the laser light 2 can be totally reflected, and the polarization azimuth of the laser light incident on the polarizer 14 is equal to the polarization azimuth angle 2c. If they are equal, the laser light 2 can be completely penetrated.

The laser light 2 having the linearly polarized light having the polarization azimuth angle 2a is incident on the polarizer 14 by the laser oscillator 1. The polarizer 14 reflects the S-wave polarized component S1 of the laser light 2 and guides it to the downstream side of the optical path. Further, the polarizer 14 penetrates the P-wave polarized component P1 of the laser light 2 and guides it to the shutter 16. The polarization azimuth adjusting device 30 causes the S-wave polarized component S1 reflected by the polarizer 14 to propagate downstream of the optical path of the laser processing apparatus 100.

The mirror 15 is a lens that reflects the S-wave polarization component S1 of the laser light 2 reflected by the polarizer 14 and guides it to the emission side of the polarization azimuth adjusting device 30. The mirror 15 is disposed such that the optical axis of the laser light 2 incident on the polarization azimuth adjusting device 30 and the optical axis of the laser light 2 emitted from the polarization azimuth adjusting device 30 are coaxial. The baffle 16 blocks the P-wave polarizing component P1 of the laser light 2 that penetrates the polarizer 14. Further, as the optical unit, the housing 35 can be rotatably attached to the laser processing apparatus 100, and can rotate around the optical axis of the laser light 2 (the incident axis and the emission axis of the laser processing apparatus 100).

Next, the operation processing procedure of the laser processing apparatus 100 will be described. The S-wave polarization component S1 of the laser light 2 of the polarization azimuth 2a guided by the laser oscillator 1 is reflected by the polarizer 14, and the polarization azimuth angle is changed to a polarization azimuth angle 2b different from the polarization azimuth angle 2a. Guide it to the mask 4. Further, the P-wave polarization component P1 of the laser light 2 is absorbed by the shutter 16 after passing through the polarizer 14.

The mask 4 adjusts the laser light 2 to a beam mode shape suitable for laser processing by penetrating only a desired portion of the laser light 2. The laser light 2 whose shape is adjusted by the mask 4 is reflected by one to a plurality of mirrors 6 and guided to the polarization beam splitter 7.

The polarization beam splitter 7 causes the P-wave polarization component of the laser light 2 to pass through the polarization beam splitter 7 to be emitted as the laser beam 8A, and causes the S-wave polarization component of the laser beam 2 to be reflected by the polarization beam splitter 7 to be emitted as the laser beam 8B. In order to prevent variations in the quality of the processed holes of the two workpieces 13A and 13B, it is necessary to make the energy of the laser light 8A equal to the energy of the laser light 8B.

Therefore, in the present embodiment, the polarization azimuth adjusting device 30 is rotationally adjusted in the optical axis direction so that the polarization azimuth angle 2b of the laser light 2 emitted from the polarization azimuth adjusting device 30 is 45 with respect to the polarization beam splitter 7. The azimuthal azimuth of °. In other words, the deflection angle 2b of the laser light 2 is adjusted by the polarization azimuth adjusting device 30 so that the S-wave polarization component of the laser light 2 incident on the polarization beam splitter 7 is equal to the magnitude of the P-wave polarization component. Thereby, the energy of the laser light 8A can be made equal to the energy of the laser light 8B.

Further, in the present embodiment, the P-wave polarized component P1 penetrating the polarizer 14 is not guided downstream of the optical path, but the S-wave polarized component S1 reflected by the polarizer 14 is guided to the downstream of the optical path. Therefore, stable processing quality can be provided under the influence of the thermal lens effect of the penetration heat caused by the substrate material of the polarizing member 14. When the thermal lens effect is such that the high-power laser light penetrates the inside of the substrate material (for example, the ZnSe substrate) of the polarizer 14, the refractive index distribution of the polarizer 14 is generated due to the temperature of the substrate material locally rising, thereby causing the polarizer 14 to function. The phenomenon of the action of the lens.

Fig. 4 is a view for explaining a phenomenon of a thermal lens when a P wave component penetrating the polarizer is guided to the downstream of the light path. (a) in Fig. 4 shows a laser beam intensity distribution when a thermal lens phenomenon does not occur. Further, (b) in Fig. 4 shows the intensity distribution of the laser beam when the thermal lens phenomenon occurs.

When the thermal lens phenomenon does not occur, the laser light emitted from the laser oscillator 1 has a laser beam intensity distribution A1. Further, when the thermal lens phenomenon occurs, the laser light emitted from the laser oscillator 1 has a laser beam intensity distribution B1. The laser beam intensity distribution B1 is laser light having the same intensity distribution as the laser beam intensity distribution A1.

Thereafter, in the laser light from the laser oscillator 1, the P-wave polarization component P1 of the laser light passes through the polarizer 17. Here, the polarizer 17 is disposed at, for example, the same position as the polarization azimuth adjusting device 30. At this time, if the thermal lens phenomenon does not occur, the laser light of the laser beam intensity distribution A1 becomes the laser light of the laser beam intensity distribution A2 by penetrating the polarizer 17. Further, when the thermal lens phenomenon occurs, the laser light of the laser beam intensity distribution B1 becomes laser light of the laser beam intensity distribution B2 which is different from the laser beam intensity distribution A2 by penetrating the polarizer 17.

As shown in (b) of FIG. 4, in the case where the thermal lens phenomenon occurs in the polarizing member 17, the case where the thermal lens phenomenon does not occur in the polarizing member 17 as shown in (a) of Fig. 4 The beam diameter of the laser light in the mask 4 changes. The degree of the thermal lens phenomenon depends on the power of the laser light incident on the polarizer 17, so that the beam energy of the laser beam penetrating through the mask 4 changes in the case where the thermal lens phenomenon occurs and the case where the thermal lens phenomenon does not occur. Therefore, in the case where the thermal lens phenomenon occurs and the case where it does not occur, the energy of the laser light reaching the workpiece may vary. Specifically, in the case where the thermal lens phenomenon does not occur, the laser light of the laser beam intensity distribution A3 is guided to the downstream of the optical path. Further, in the case where the thermal lens phenomenon occurs, the laser light of the laser beam intensity distribution B3 which is different from the laser beam intensity distribution A3 is guided to the downstream of the optical path. As a result, in the case where the thermal lens phenomenon occurs and the case where the thermal lens phenomenon does not occur, the quality of the processed hole of the workpiece is varied.

On the other hand, in the present embodiment, since the S-wave polarized component S1 reflected by the polarizer 14 is guided downstream of the optical path, it is not affected by the thermal lens phenomenon of the polarizer 14 (substrate material). Processed holes having stable processing quality are formed in the workpieces 13A and 13B.

In the polarization azimuth adjusting device 30, the P-wave polarization component P1 penetrating through the polarizer 14 among the incident laser light 2 is absorbed by the shutter 16, so that the P-wave polarization component P1 causes energy loss. The polarization azimuth angle 2b of the polarization azimuth adjusting device 30 is the same as the polarization azimuth angle 2a of the laser light 2 incident on the polarization azimuth adjusting device 30, so that the laser light 8A emitted from the polarization beam splitter 7 is When the energy of the laser light 8B is equal, the laser light 2 is totally reflected by the polarizer 14 without being absorbed by the baffle, so that the laser light 2 can be guided downstream of the optical path without energy loss. Therefore, energy loss can be suppressed by arranging one to a plurality of mirrors 6 upstream of the optical path than the polarization azimuth adjusting device 30 so that the polarization azimuth angle 2a and the polarization azimuth angle 2b are substantially equal. Therefore, the polarization azimuth adjusting device 30 can be rotated in advance to emit the laser light 2 at a polarization azimuth angle 2b of the same magnitude as the S-wave polarization component of the laser light 2 incident on the polarization beam splitter 7 and arranged. The mirror 6 upstream of the light path is further moved than the polarization azimuth adjusting device 30 such that the polarization azimuth angle 2a approaches the polarization azimuth angle 2b.

In the polarization azimuth adjusting device 30, the polarizing light 2 incident on the polarization azimuth adjusting device 30 and the laser light 2 emitted from the polarization azimuth adjusting device 30 are arranged coaxially. 14 and mirror 15. In other words, when the polarization azimuth adjusting device 30 (optical unit) is rotated about the incident optical axis, the polarizing member is disposed such that the optical axis directions of the incident optical axis and the outgoing optical axis are maintained before the rotation. 14 and mirror 15. Thereby, even when the polarization azimuth adjusting device 30 is rotationally adjusted, the optical axis does not shift, and the processing quality does not deteriorate.

In this manner, since the S-wave polarized component S1 reflected by the polarizer 14 among the laser light 2 incident on the polarization azimuth adjusting device 30 is propagated downstream of the optical path, it can be prevented from being affected by the thermal lens phenomenon of the polarizer 14. Perform stable laser processing. Further, since one polarizer 14 and at least two optical elements (mirror 15) are configured to be optically aligned with the incident optical axis of the polarization azimuth adjusting device 30 and the optical axis of the output, even at the optical axis center Rotate the adjustment optics unit to adjust the azimuth of the polarization, and the optical axis will not shift. Therefore, stable laser processing can be performed.

Further, in the present embodiment, a case where the laser processing apparatus 100 is applied will be described. However, the polarization azimuth adjusting device 30 may be applied to a laser processing apparatus having another configuration in which the laser processing apparatus 100 is attached. The polarization azimuth adjusting device 30 splits the laser light 2 into two, and simultaneously processes the two workpieces 13A, 13B on the two XY tables 12A, 12B.

For example, a case where the laser light 2 is split into two and the two workpieces 13A and 13B are simultaneously processed on the two XY tables 12A and 12B will be described, but the embodiment is not limited to this configuration.

For example, the polarizing azimuth adjusting device 30 may be applied to a laser processing apparatus that performs laser processing on three or more workpieces by simultaneously splitting the laser light into three or more laser beams on three or more XY stages. .

Further, the polarized azimuth adjusting device 30 may be applied to a laser processing apparatus that mounts a plurality of workpieces on one XY table and splits the laser light into a plurality of strips while performing laser processing on each workpiece. .

Moreover, the polarizing azimuth adjusting device 30 can also be applied to mount a plurality of XY tables in one driving system, and split the laser light into a plurality of strips, and simultaneously perform the workpieces placed on the XY tables. Laser processing equipment for laser processing.

Moreover, the polarizing azimuth adjusting device 30 can also be applied to mount a workpiece on an XY table, and split the laser light into a plurality of beams, and simultaneously use a plurality of laser beams to simultaneously cover a plurality of portions of the workpiece. Laser processing equipment for laser processing.

In the present embodiment, the components (the polarizer 14, the mirror 15, and the shutter 16) of the polarization azimuth adjusting device 30 are housed in the casing 35, but the polarization azimuth adjusting device 30 is used. Each component does not have to be housed in the casing 35. In other words, it is convenient to store the components of the polarization azimuth adjusting device 30 in the casing 35, or to form the optical unit by connecting the respective components. Further, the optical unit is mounted in the laser processing apparatus 100 so as to be rotatable about the optical axis of the laser light 2.

Further, in the present embodiment, a case where two mirrors 15 are disposed in the polarization azimuth adjusting device 30 will be described, but the number of the mirrors 15 disposed in the polarization azimuth adjusting device 30 may be three or more. . At this time, the mirror 15 is disposed such that the laser light incident on the polarization azimuth adjusting device 30 and the laser light 2 emitted from the polarization azimuth adjusting device 30 are coaxial. Further, the polarization azimuth adjusting device 30 is not limited to the position shown in the first figure, and may be disposed at any position as long as it is closer to the front stage (upstream side of the optical path) than the polarization beam splitter 7.

Further, in the present embodiment, the case where the polarizing element 14 and the mirror 15 are rotated by the associated optical unit will be described, but the polarizer 14 and the mirror 15 may be independently rotated. At this time, the polarizer 14 and the mirror 15 are also rotated such that the incident optical axis of the polarization azimuth adjusting device 30 facing the rotary polarizer 14 and the mirror 15 is coaxial with the optical axis of the outgoing optical axis.

Further, in the present embodiment, the S-wave polarized component reflected by the polarizer 14 is emitted from the polarization azimuth adjusting device 30, but the penetration can be made without the influence of the polarizing member penetrating the thermal lens. The P-wave polarized component of the polarizer 14 is emitted. Fig. 5 is a schematic block diagram showing a polarization azimuth angle adjusting device that emits a P-wave polarized light component that penetrates the polarizer. In the components of the fifth embodiment, the same components as those of the polarization azimuth adjusting device 30 shown in FIG. 2 are denoted by the same reference numerals, and the description thereof will not be repeated.

The polarization azimuth adjusting device 31 includes a polarizer 14 and a plurality of mirrors (the two mirrors 15 are shown in FIG. 5) and a baffle 16, and these members are housed in the casing 35.

The polarizer 14 reflects the S-wave polarized component S2 of the laser light 2 and guides it to the shutter 16. Further, the polarizer 14 penetrates the P-wave polarized component P2 of the laser light 2 and guides it to the downstream side of the optical path. The mirror 15 reflects the P-wave polarization component P2 of the laser light 2 that has passed through the polarizer 14, and guides it to the emission side of the polarization azimuth adjusting device 31. The mirror 15 is disposed such that the optical axis of the laser light 2 incident on the polarization azimuth adjusting device 31 and the optical axis of the laser light 2 emitted from the polarization azimuth adjusting device 31 are coaxial. The baffle 16 blocks the S-wave polarized component S2 of the laser light 2 reflected by the polarizer 14. With this configuration, the polarization azimuth adjusting device 31 emits the laser light 2 so that the energy of the laser light 8A is equal to the energy of the laser light 8B, similarly to the polarization azimuth adjusting device 30. Thereby, when the P-wave polarized component P2 is emitted from the polarization azimuth adjusting device 31, even if the optical unit is rotated at the center of the optical axis to adjust the polarization azimuth, the optical axis does not shift.

As described above, according to the embodiment, since the S-wave polarized light component S1 of the laser light 2 is guided to the downstream of the light path by the polarization azimuth adjusting device 30, it can be performed without being affected by the thermal lens phenomenon of the polarizer 14. Laser processing. Further, since the polarization azimuth adjusting device 30 is constituted by one optical unit and is rotatably mounted in the optical axis direction of the laser light, the polarization direction can be adjusted without changing the optical axis direction of the laser light 2. angle. Therefore, stable laser processing can be easily performed on the workpieces 13A and 13B.

[Industrial availability]

As described above, the polarization azimuth adjusting device and the laser processing device of the present invention are suitable for adjusting the polarization azimuth of the laser light for laser processing.

1. . . Laser oscillator

2, 8A, 8B. . . laser

2a, 2b, 2c, 9A, 9B. . . Polarized azimuth

4. . . Mask (beam mask)

5. . . Beam variable part

6. . . Reflector

7. . . Polarized beam splitter (split section)

10Ax, 10Ay, 10Bx, 10By. . . Galvanometer scanner

11A, 11B. . . Fθ lens

12A, 12B. . . XY table

13A, 13B. . . Processed object

14,17. . . Polarizer

15. . . Reflector

16. . . Baffle

30, 31. . . Polarized azimuth adjustment device (optical unit)

35. . . framework

100. . . Laser processing device

A1, A2, A3, B1, B2, B3. . . Laser beam intensity distribution

S1, S2. . . S wave polarized component

P1, P2. . . P wave polarized component

Fig. 1 is a schematic block diagram showing a laser processing apparatus according to an embodiment of the present invention.

Fig. 2 is a schematic block diagram showing a polarization azimuth angle adjusting device of the embodiment.

Fig. 3 is a view for explaining the relationship between the polarizer and the azimuth of polarization.

(a) and (b) in Fig. 4 are diagrams for explaining a thermal lens phenomenon when laser light passes through the polarizer.

Fig. 5 is a schematic block diagram showing a polarization azimuth adjusting device for emitting a P-wave polarized component.

2. . . laser

2a, 2b. . . Polarized azimuth

14. . . Polarizer

15. . . Reflector

16. . . Baffle

30. . . Polarized azimuth adjustment device

35. . . framework

S1. . . S wave polarized component

P1. . . P wave polarized component

Claims (4)

A polarizing azimuth adjusting device comprising: an optical unit having: a polarizing member that penetrates a P-wave polarized light component of incident laser light and reflects an S-wave polarized component of the laser light, and a reflection An S-wave polarized component of the laser light reflected by the polarizer and guiding the S-wave polarized component to at least two reflective optical elements on a downstream side of the optical path, wherein the optical unit absorbs the P-wave polarized component and causes the S-wave The polarizing component is emitted toward the downstream side of the optical path, and the optical unit is configured to dispose the polarizer and the reflective optical element such that an incident optical axis of the laser light toward the optical unit and the laser light from the optical unit are The emission optical axis is coaxial, and the optical axis direction of the incident optical axis and the emission optical axis is maintained when the optical unit is rotated about the incident optical axis. A laser processing apparatus that emits laser light and laser-processes a workpiece, wherein the laser light is irradiated from a light source that emits the laser light to the workpiece to adjust the laser light a polarizing azimuth angle, and an optical unit that absorbs the P-wave polarizing component and emits the S-wave polarizing component toward a downstream side of the optical path; and the optical unit has a P-wave polarizing component that penetrates the incident laser light and penetrates a polarizer that reflects an S-wave polarized component of the laser light, and an S-wave polarized component that reflects the S-wave polarized component of the laser light reflected by the polarizer and guides it to at least two reflective optical elements on a downstream side of the optical path; Having the polarizing element and the reflective optical element disposed such that an incident optical axis of the laser light toward the optical unit is coaxial with an outgoing optical axis of the laser light from the optical unit, and the optical unit is caused to have the incident light When the axis rotates at the center, the optical axis direction of the incident optical axis and the outgoing optical axis can be maintained. The laser processing apparatus according to claim 2, further comprising: a light splitting portion that splits the laser light into two laser beams, in the optical path from the optical unit to the workpiece, the optical The unit rotates around the incident optical axis such that the deflection angle of the laser light emitted from the optical unit is a polarization azimuth angle of 45° with respect to the spectroscopic portion. A polarizing azimuth adjusting device comprising: an optical unit having: a polarizing member that penetrates a P-wave polarized light component of incident laser light and reflects an S-wave polarized component of the laser light, and a P-wave polarized component of the laser light that has penetrated the polarizer is reflected and guided to at least two reflective optical elements on a downstream side of the optical path, the optical unit absorbing the S-wave polarized component and causing the P-wave The polarizing component is emitted toward the downstream side of the optical path, and the optical unit is configured to dispose the polarizer and the reflective optical element such that an incident optical axis of the laser light toward the optical unit and the laser light from the optical unit are The emission optical axis is coaxial, and the optical axis direction of the incident optical axis and the emission optical axis is maintained when the optical unit is rotated about the incident optical axis.