TWI798238B - Laser processing device - Google Patents

Laser processing device Download PDF

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Publication number
TWI798238B
TWI798238B TW107124419A TW107124419A TWI798238B TW I798238 B TWI798238 B TW I798238B TW 107124419 A TW107124419 A TW 107124419A TW 107124419 A TW107124419 A TW 107124419A TW I798238 B TWI798238 B TW I798238B
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TW
Taiwan
Prior art keywords
laser beam
laser
polarization direction
acousto
optical path
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Application number
TW107124419A
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Chinese (zh)
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TW201918310A (en
Inventor
山口友之
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日商住友重機械工業股份有限公司
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Publication of TWI798238B publication Critical patent/TWI798238B/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/286—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising for controlling or changing the state of polarisation, e.g. transforming one polarisation state into another
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/29—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the position or the direction of light beams, i.e. deflection
    • G02F1/33—Acousto-optical deflection devices

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Laser Beam Processing (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Laser Surgery Devices (AREA)

Abstract

本發明提供一種雷射加工裝置，其能夠從雷射光束切出用於加工之一部分，並分支成2個光路，並且緩和配置在分支後的光路上之光學組件的配置限制。分支元件根據入射之雷射光束的偏振方向將入射側的光路分支成出射側的光路。配置在比分支元件更靠上游側的光路上之偏振方向調整機構改變雷射光束的偏振方向。配置在比分支元件更靠上游側的光路上之切出機構從雷射光束切出一部分並使其朝向分支元件。The present invention provides a laser processing device capable of cutting out a portion of a laser beam for processing, branching into two optical paths, and relieving the restriction on the arrangement of optical components arranged on the branched optical paths. The branching element branches the optical path on the incident side into the optical path on the outgoing side according to the polarization direction of the incident laser beam. The polarization direction adjustment mechanism disposed on the optical path upstream of the branching element changes the polarization direction of the laser beam. The cutting mechanism disposed on the optical path upstream of the branching element cuts out a part of the laser beam and directs it toward the branching element.

Description

雷射加工裝置Laser processing device

本申請主張基於2017年11月8日申請之日本專利申請第2017-215395號的優先權。該申請的所有內容藉由參閱援用於本說明書中。 　　本發明係有關一種雷射加工裝置。This application claims priority based on Japanese Patent Application No. 2017-215395 filed on November 8, 2017. The entire content of this application is incorporated by reference in this specification. The present invention relates to a laser processing device.

已知有如下2軸雷射加工裝置：為了提高雷射加工的效率，從由雷射振盪器輸出之脈衝雷射光束中的1個脈衝切出2個脈衝而用2束雷射光束進行加工(例如，參閱下述專利文獻1)。在專利文獻1中所揭示之雷射加工裝置中，脈衝雷射光束中的1個脈衝藉由聲光元件在時間軸上分離成2個脈衝，並且2個脈衝分別在不同的光路中進行傳播。聲光元件具有從1個脈衝切出加工用脈衝之功能及將1條光路分支為2條光路之功能。 (先前技術文獻) (專利文獻) 　　專利文獻1：日本特開2013-071136號公報There is known a 2-axis laser processing device that cuts out 2 pulses from 1 pulse of a pulsed laser beam output from a laser oscillator and performs processing with 2 laser beams in order to improve the efficiency of laser processing (For example, refer to the following Patent Document 1). In the laser processing device disclosed in Patent Document 1, one pulse in the pulsed laser beam is separated into two pulses on the time axis by an acousto-optic element, and the two pulses propagate in different optical paths. . The acousto-optic element has the function of cutting out the pulse for processing from one pulse and the function of branching one optical path into two optical paths. (Prior Art Document) (Patent Document) Patent Document 1: Japanese Patent Application Laid-Open No. 2013-071136

(本發明所欲解決之課題) 　　藉由聲光元件所分支之2條光路所呈之角度較小。因此，應配置在分支後的2條光路上之光學組件在空間上容易相互干涉，配置光學組件之位置受到限制。 　　本發明的目的在於，提供一種如下雷射加工裝置：能夠從雷射光束切出用於加工之一部分，並分支為2個光路，並且緩和配置在分支後的光路上之光學組件的配置限制。 (用以解決課題之手段) 　　依本發明的一觀點，提供一種雷射加工裝置，其具有： 　　分支元件，根據入射之雷射光束的偏振方向，將入射側的光路分支成出射側的光路； 　　偏振方向調整機構，配置在比前述分支元件更靠上游側的光路上，並改變雷射光束的偏振方向；及 　　切出機構，配置在比前述分支元件更靠上游側的光路上，從雷射光束切出一部分並使其朝向前述分支元件。 (發明之效果) 　　藉由切出機構能夠從雷射光束切出用於加工之一部分。藉由使用根據入射之雷射光束的偏振方向將入射側的光路分支成2條出射側的光路之分支元件，與藉由聲光元件分支之構成相比，能夠增大分支後的2條光路所呈的角度。其結果，能夠緩和配置在分支後的光路上之光學組件的配置限制。(The problem to be solved by the present invention) The angle formed by the two light paths branched by the acousto-optic element is relatively small. Therefore, the optical components that should be placed on the two branched optical paths tend to interfere with each other spatially, and the positions where the optical components are placed are limited. The object of the present invention is to provide a laser processing device capable of cutting out a portion of a laser beam for processing and branching it into two optical paths, and relieving the restriction on the arrangement of optical components arranged on the branched optical path. (Means for solving the problem) According to an aspect of the present invention, a laser processing device is provided, which has: a branching element, which branches the optical path on the incident side into the optical path on the outgoing side according to the polarization direction of the incident laser beam; The polarization direction adjustment mechanism is arranged on the optical path more upstream than the aforementioned branching element, and changes the polarization direction of the laser beam; and the cutting mechanism is arranged on the optical path more upstream than the aforementioned branching element, from the laser The beam cuts off a portion and directs it towards the aforementioned branching element. (Effects of the Invention) A part for processing can be cut out from the laser beam by the cutting mechanism. By using a branching element that branches the optical path on the incident side into two optical paths on the outgoing side according to the polarization direction of the incident laser beam, the number of branched two optical paths can be increased compared to the configuration of branching by an acousto-optic element The angle assumed. As a result, it is possible to relax restrictions on the arrangement of optical components arranged on the branched optical path.

參閱圖1～圖3，對基於實施例之雷射加工裝置進行說明。 　　圖1係基於實施例之雷射加工裝置的模式圖。雷射光源10輸出經直線偏振之脈衝雷射光束。作為雷射光源10，例如能夠使用碳酸氣體雷射振盪器。在從雷射光源10到加工對象物30的光路上配置有複數個光學元件。另外，在雷射光束的光路上除了圖1所示之光學元件以外，亦可以根據需要配置中繼透鏡、場透鏡、彎曲鏡等。 　　從雷射光源10輸出之脈衝雷射光束通過光圈11入射到切出機構12。光圈11遮蔽在光路中進行傳播之雷射光束的光束截面的一部分(周邊部)，並使剩餘(中心部)的雷射光束透過。 　　切出機構12包括：聲光元件13，配置在光路上；及驅動器14，向聲光元件13提供驅動訊號。聲光元件13從驅動器14接收驅動訊號，從入射於聲光元件13之脈衝雷射光束的雷射脈衝LP1切出一部分而使其繞射，並使其傳播到從輸入側的光路偏向之輸出側的光路。所切出之雷射脈衝LP2相當於入射於聲光元件13之雷射脈衝LP1在時間軸上之一部分。雷射脈衝LP1的剩餘部分直線穿過聲光元件13而入射於光束阻尼器。 　　藉由切出機構12切出之脈衝雷射光束入射於偏振方向調整機構15。偏振方向調整機構15將沿光路進行傳播之雷射光束的偏振方向改變與預設之角度相當的量。偏振方向調整機構15例如能夠由複數個反射鏡構成。 　　藉由偏振方向調整機構15改變了偏振方向之雷射光束入射於分支元件16。分支元件16根據入射之雷射光束的偏振方向，將入射側的光路分支成2條出射側的光路。作為分支元件16，例如能夠使用偏振光束分離器。偏振光束分離器使P偏振成分透過並反射S偏振成分。偏振方向調整機構15例如以使P偏振成分與S偏振成分的功率比變得相等的方式改變偏振方向。於是，在分支元件16的出射側的2條光路中進行傳播之脈衝雷射光束的雷射脈衝LP3、LP4各自的光強度成為分支前的脈衝雷射光束的雷射脈衝LP2的光強度的一半。 　　在分支後的2條光路中進行傳播之脈衝雷射光束分別經由光束掃描器17A、17B及聚光透鏡18A、18B而入射於載物台19所保持之加工對象物30上。光束掃描器17A、17B在二維方向上掃描脈衝雷射光束。作為光束掃描器17A、17B，例如能夠使用包括一對電流鏡之電流掃描器。聚光透鏡18A、18B分別使經掃描之脈衝雷射光束聚光在加工對象物30的表面。作為聚光透鏡18A、18B，例如能夠使用fθ透鏡。 　　載物台19具有使加工對象物30向與其被加工面平行的二維方向移動之功能。加工對象物30例如為開孔加工前的印刷基板。藉由向印刷基板的被加工點入射脈衝雷射光束來進行開孔加工。作為載物台19，例如能夠使用XY載物台。 　　控制裝置35控制雷射光源10、切出機構12、光束掃描器17A、17B及載物台19。 　　圖2係著眼於基於實施例之雷射加工裝置的水平面內方向之概略圖。在光學板20的上表面固定有雷射光源10、光圈11、聲光元件13、偏振方向調整機構15、分支元件16、光束阻尼器21及反射鏡22A、22B。從雷射光源10輸出之脈衝雷射光束的偏振方向PD平行於光學板20的上表面。透過光圈11而直線穿過聲光元件13之雷射光束入射於光束阻尼器21。 　　沿藉由聲光元件13偏向之光路進行傳播之雷射光束入射於偏振方向調整機構15。沿藉由聲光元件13偏向之光路進行傳播之雷射光束的偏振方向PD亦平行於光學板20的上表面。 　　沿藉由分支元件16分支之後的2條光路進行傳播之雷射光束分別被反射鏡22A、22B朝向下方反射。沿分支後的光路進行傳播之雷射光束的偏振方向PD例如相對於光學板20的上表面傾斜45度。透過分支元件16之雷射光束的偏振方向PD平行於光學板20的上表面。藉由分支元件16反射之雷射光束的偏振方向PD垂直於光學板20的上表面。 　　圖3係著眼於基於實施例之雷射加工裝置的高度方向之概略圖。在光學板20的上表面固定有雷射光源10、光圈11、聲光元件13、偏振方向調整機構15、分支元件16及反射鏡22A、22B。從雷射光源10到偏振方向調整機構15的光路平行於光學板20的上表面。在該光路中進行傳播之雷射光束的偏振方向PD平行於光學板20的上表面。 　　在偏振方向調整機構15的內部，藉由雷射光束被複數個反射鏡反射，以光學板20的上表面為基準之光路的高度發生變化。從偏振方向調整機構15到分支元件16的光路平行於光學板20的上表面。在該光路中進行傳播之雷射光束的偏振方向PD相對於光學板20的上表面傾斜45度。 　　直線穿過分支元件16並入射於反射鏡22A之雷射光束的偏振方向PD平行於光學板20的上表面。被分支元件16反射並入射於反射鏡22B之雷射光束的偏振方向PD(圖2)垂直於光學板20的上表面。 　　被反射鏡22A朝向下方反射之雷射光束通過設置在光學板20之開口，經由光束掃描器17A及聚光透鏡18A，入射於載物台19所保持之加工對象物30。同樣地，被反射鏡22B朝向下方反射之雷射光束通過設置於光學板20之開口，經由光束掃描器17B及聚光透鏡18B，入射於載物台19所保持之加工對象物30。 　　接著，對基於本實施例之雷射加工裝置所具有之優異的效果進行說明。 　　本實施例中，使用根據雷射光束的偏振方向使光路分支之分支元件16，例如使用偏振光束分離器。因此，與使用聲光元件使光路分支之情況相比，能夠增大分支後的2條光路所呈之角度，例如能夠設為90度。藉此，配置在分支後的2條光路上之光學組件在空間上難以相互干涉，能夠提高配置光學組件之位置的自由度。 　　並且，本實施例中，聲光元件13配置在比偏振方向調整機構15更靠上游側的光路上。在比偏振方向調整機構15更靠上游側的光路中進行傳播之雷射光束的偏振方向平行於光學板20的上表面(圖2、圖3)。通常，聲光元件設置在與入射之雷射光束的偏振面平行之面而使用。此時，繞射光向與設置有聲光元件之面平行的方向進行傳播。本實施例中，由於設置有聲光元件之面(光學板20的上表面)與入射於聲光元件之雷射光束的偏振面平行，因此藉由聲光元件13繞射之雷射光束的光路亦平行於光學板20的上表面(圖3)。因此，得到容易進行複數個光學組件的光軸調整之類的效果。 　　實施例中，光圈11(圖1)配置在比聲光元件13更靠上游側的光路上。藉由光圈11減弱入射於聲光元件13之雷射光束的功率，因此能夠抑制由聲光元件13的過熱引起之損傷。 　　並且，實施例中，雷射光束的功率藉由分支元件16(圖1)分支成2條光路。分支成2條光路後的脈衝雷射光束的雷射脈衝LP3、LP4(圖1)的波形相同。因此，能夠藉由在2條光路中進行傳播之脈衝雷射光束來進行均質的雷射加工。而且，能夠根據從雷射光源10輸出之雷射脈衝LP1(圖1)的波形，利用切出機構12(圖1)從雷射脈衝LP1切出最適於加工的部分。 　　接著，參閱圖4對基於另一實施例之雷射加工裝置進行說明。以下，對與圖1～圖3所示之基於實施例之雷射加工裝置共同的構成省略說明。 　　圖4係基於另一實施例之雷射加工裝置的模式圖。圖1所示之實施例中，聲光元件13配置在比偏振方向調整機構15更靠上游側的光路上，但在本實施例中，聲光元件13配置在比偏振方向調整機構15更靠下游側的光路上。 　　本實施例中，亦與圖1所示之實施例相同地，與使用聲光元件而使光路分支之情況相比，得到能夠增大分支後的2條光路所呈之角度之類的效果。 　　本實施例中，入射於聲光元件13之雷射光束的偏振方向PD相對於光學板的上表面傾斜45度。因此，基於聲光元件13之繞射光的光路相對於光學板的上表面傾斜。由此，在聲光元件13與分支元件16之間的光路上配置用於使光路平行於光學板的上表面之反射鏡為較佳。 　　接著，對圖1～圖4所示之實施例的變形例進行說明。圖1～圖4所示之實施例中，藉由將入射於分支元件16之雷射光束的偏振方向相對於分支元件16的入射面傾斜45度，使在分支後的2條光路中進行傳播之雷射光束的功率相等。分支後的2個雷射光束的功率中，可以具有不影響雷射加工的品質程度的偏差。例如，分支後的雷射光束的功率中，對於入射之雷射光束的功率的1/2，可以產生3%以下的偏離。入射於分支元件16之雷射光束的偏振方向相對於入射面之傾斜角度無需嚴格地為45度，可以產生與可容許之功率偏離對應程度的角度的偏離。 　　並且，無需使分支後的2條光路的雷射光束的功率一定相等。在利用2條光路進行加工之對象物的材料、加工之深度等不同的情況下，根據加工條件可以使雷射光束的功率的分支比不同。在該情況下，根據功率的分支比設定入射於分支元件16之雷射光束的偏振方向相對於入射面之傾斜角度即可。 　　上述各實施例係例示的，當然能夠進行不同的實施例中所示之構成的部分取代或組合。對於由複數個實施例的同樣的構成產生之同樣的作用效果，並不針對每個實施例逐次提及。而且，本發明並不限於上述實施例。例如，可進行各種變更、改良、組合等對於所屬技術領域中具有通常知識者來說係顯而易見的。Referring to FIGS. 1 to 3 , a laser processing device based on the embodiment will be described. Fig. 1 is a schematic diagram of a laser processing device based on an embodiment. The laser light source 10 outputs a linearly polarized pulsed laser beam. As the laser light source 10, for example, a carbon dioxide laser oscillator can be used. A plurality of optical elements are arranged on the optical path from the laser light source 10 to the object 30 to be processed. In addition, on the optical path of the laser beam, in addition to the optical elements shown in FIG. 1 , relay lenses, field lenses, bending mirrors, etc. can also be arranged as required. The pulsed laser beam output from the laser light source 10 enters the cutting mechanism 12 through the aperture 11. The aperture 11 blocks a part (peripheral portion) of the beam cross section of the laser beam propagating along the optical path, and transmits the remaining (central portion) of the laser beam. The cutting mechanism 12 includes: an acousto-optic element 13 arranged on the optical path; and a driver 14 which provides a drive signal to the acousto-optic element 13. The acousto-optic element 13 receives the driving signal from the driver 14, cuts out a part of the laser pulse LP1 of the pulsed laser beam incident on the acousto-optic element 13 to diffract it, and propagates it to the output of the optical path deflection from the input side side light path. The cut-out laser pulse LP2 corresponds to a portion of the laser pulse LP1 incident on the acousto-optic element 13 on the time axis. The remaining part of the laser pulse LP1 passes straight through the acousto-optic element 13 and is incident on the beam damper. The pulsed laser beam cut out by the cutout mechanism 12 is incident on the polarization direction adjustment mechanism 15. The polarization direction adjusting mechanism 15 changes the polarization direction of the laser beam propagating along the optical path by an amount equivalent to a preset angle. The polarization direction adjusting mechanism 15 can be constituted by, for example, a plurality of mirrors. The laser beam whose polarization direction has been changed by the polarization direction adjusting mechanism 15 is incident on the branching element 16. The branching element 16 branches the light path on the incident side into two light paths on the exit side according to the polarization direction of the incident laser beam. As the branching element 16, for example, a polarization beam splitter can be used. The polarization beam splitter transmits the P polarization component and reflects the S polarization component. The polarization direction adjusting mechanism 15 changes the polarization direction so that the power ratios of the P polarization component and the S polarization component become equal, for example. Then, the respective light intensities of the laser pulses LP3 and LP4 of the pulsed laser beam propagating in the two optical paths on the exit side of the branching element 16 become half of the light intensity of the laser pulse LP2 of the pulsed laser beam before branching. . The pulsed laser beams propagating in the two branched optical paths are incident on the object 30 held by the stage 19 via the beam scanners 17A, 17B and the condenser lenses 18A, 18B, respectively. The beam scanners 17A, 17B scan the pulsed laser beam in two-dimensional directions. As the beam scanners 17A, 17B, for example, a galvano scanner including a pair of galvano mirrors can be used. The condensing lenses 18A and 18B respectively condense the scanned pulsed laser beams on the surface of the object 30 to be processed. As the condenser lenses 18A and 18B, for example, fθ lenses can be used. The stage 19 has the function of moving the object 30 to be processed in a two-dimensional direction parallel to the surface to be processed. The object to be processed 30 is, for example, a printed circuit board before drilling. Drilling is performed by irradiating a pulsed laser beam to a point to be processed on a printed circuit board. As the stage 19, for example, an XY stage can be used. The control device 35 controls the laser light source 10, the cutting mechanism 12, the beam scanners 17A, 17B and the stage 19. Fig. 2 is a schematic diagram focusing on the in-plane direction of the laser processing device based on the embodiment. On the upper surface of the optical plate 20 are fixed a laser light source 10 , an aperture 11 , an acousto-optic element 13 , a polarization direction adjusting mechanism 15 , a branch element 16 , a beam damper 21 and mirrors 22A, 22B. The polarization direction PD of the pulsed laser beam output from the laser light source 10 is parallel to the upper surface of the optical plate 20 . The laser beam passing through the aperture 11 and straightly passing through the acousto-optic element 13 is incident on the beam damper 21 . The laser beam propagating along the optical path deflected by the acousto-optic element 13 is incident on the polarization direction adjustment mechanism 15. The polarization direction PD of the laser beam propagating along the optical path deflected by the acousto-optic element 13 is also parallel to the upper surface of the optical plate 20 . The laser beams propagating along the two optical paths branched by the branching element 16 are respectively reflected downward by the mirrors 22A and 22B. The polarization direction PD of the laser beam propagating along the branched optical path is, for example, inclined by 45 degrees with respect to the upper surface of the optical plate 20 . The polarization direction PD of the laser beam passing through the branching element 16 is parallel to the upper surface of the optical plate 20 . The polarization direction PD of the laser beam reflected by the branching element 16 is perpendicular to the upper surface of the optical plate 20 . Fig. 3 is a schematic diagram focusing on the height direction of the laser processing device based on the embodiment. On the upper surface of the optical plate 20 are fixed a laser light source 10 , an aperture 11 , an acousto-optic element 13 , a polarization direction adjustment mechanism 15 , a branch element 16 , and mirrors 22A and 22B. The optical path from the laser light source 10 to the polarization direction adjusting mechanism 15 is parallel to the upper surface of the optical plate 20 . The polarization direction PD of the laser beam propagating in the optical path is parallel to the upper surface of the optical plate 20 . Inside the polarization direction adjustment mechanism 15, the height of the optical path based on the upper surface of the optical plate 20 changes as the laser beam is reflected by a plurality of mirrors. The optical path from the polarization direction adjusting mechanism 15 to the branching element 16 is parallel to the upper surface of the optical plate 20 . The polarization direction PD of the laser beam propagating in the optical path is inclined by 45 degrees with respect to the upper surface of the optical plate 20 . The polarization direction PD of the laser beam passing straight through the branching element 16 and incident on the mirror 22A is parallel to the upper surface of the optical plate 20. The polarization direction PD ( FIG. 2 ) of the laser beam reflected by the branching element 16 and incident on the mirror 22B is perpendicular to the upper surface of the optical plate 20 . The laser beam reflected downward by the mirror 22A passes through the opening provided on the optical plate 20, passes through the beam scanner 17A and the condenser lens 18A, and enters the object 30 held on the stage 19. Similarly, the laser beam reflected downward by the mirror 22B passes through the opening provided in the optical plate 20 , passes through the beam scanner 17B and the condenser lens 18B, and enters the object 30 held on the stage 19 . Next, the excellent effects of the laser processing device according to this embodiment will be described. In this embodiment, a branching element 16 that branches the optical path according to the polarization direction of the laser beam is used, for example, a polarization beam splitter is used. Therefore, compared with the case where the optical path is branched using an acousto-optic element, the angle formed by the two branched optical paths can be increased, for example, to 90 degrees. Thereby, the optical components arranged on the two branched optical paths are less likely to interfere with each other spatially, and the degree of freedom in the position where the optical components are arranged can be improved. Furthermore, in this embodiment, the acousto-optic element 13 is arranged on the optical path on the upstream side of the polarization direction adjusting mechanism 15. The polarization direction of the laser beam propagating on the optical path upstream of the polarization direction adjustment mechanism 15 is parallel to the upper surface of the optical plate 20 ( FIGS. 2 and 3 ). Usually, the acousto-optic element is used on a plane parallel to the polarization plane of the incident laser beam. At this time, the diffracted light propagates in a direction parallel to the surface on which the acousto-optic element is installed. In this embodiment, since the surface on which the acousto-optic element is arranged (the upper surface of the optical plate 20) is parallel to the polarization plane of the laser beam incident on the acousto-optic element, the laser beam diffracted by the acousto-optic element 13 The optical path is also parallel to the upper surface of the optical plate 20 ( FIG. 3 ). Therefore, the effect that adjustment of the optical axes of a plurality of optical components is facilitated is obtained. In the embodiment, the aperture 11 ( FIG. 1 ) is arranged on the optical path on the upstream side of the acousto-optic element 13 . The power of the laser beam incident on the acousto-optic element 13 is weakened by the aperture 11 , so damage caused by overheating of the acousto-optic element 13 can be suppressed. And, in the embodiment, the power of the laser beam is branched into two optical paths by the branching element 16 (FIG. 1). The waveforms of laser pulses LP3 and LP4 ( FIG. 1 ) of the pulsed laser beam branched into two optical paths are the same. Therefore, homogeneous laser processing can be performed by the pulsed laser beam propagating in two optical paths. Furthermore, according to the waveform of the laser pulse LP1 ( FIG. 1 ) output from the laser light source 10 , the portion most suitable for processing can be cut out from the laser pulse LP1 by the cutting mechanism 12 ( FIG. 1 ). Next, a laser processing device based on another embodiment will be described with reference to FIG. 4 . Hereinafter, the description of the configuration common to the laser processing apparatus according to the embodiment shown in FIGS. 1 to 3 will be omitted. Fig. 4 is a schematic diagram of a laser processing device based on another embodiment. In the embodiment shown in Fig. 1, the acousto-optic element 13 is disposed on the optical path more upstream than the polarization direction adjustment mechanism 15, but in this embodiment, the acousto-optic element 13 is disposed on the optical path closer to the polarization direction adjustment mechanism 15. on the optical path on the downstream side. In this embodiment, as in the embodiment shown in FIG. 1 , compared with the case where the optical path is branched using an acousto-optic element, the effect of being able to increase the angle formed by the two branched optical paths is obtained. In this embodiment, the polarization direction PD of the laser beam incident on the acousto-optic element 13 is inclined at 45 degrees relative to the upper surface of the optical plate. Therefore, the optical path of the diffracted light by the acousto-optic element 13 is inclined with respect to the upper surface of the optical plate. Therefore, it is preferable to arrange a reflection mirror on the optical path between the acousto-optic element 13 and the branch element 16 to make the optical path parallel to the upper surface of the optical plate. Next, modifications of the embodiment shown in FIGS. 1 to 4 will be described. In the embodiment shown in FIGS. 1 to 4 , by inclining the polarization direction of the laser beam incident on the branching element 16 at 45 degrees relative to the incident plane of the branching element 16, the laser beam propagates in the two optical paths after branching. The power of the laser beam is equal. The power of the two branched laser beams may vary to such an extent that it does not affect the quality of laser processing. For example, in the power of the branched laser beam, a deviation of 3% or less may occur with respect to 1/2 of the power of the incident laser beam. The inclination angle of the polarization direction of the laser beam incident on the branching element 16 with respect to the incident plane does not need to be strictly 45 degrees, and an angle deviation corresponding to the allowable power deviation can occur. In addition, it is not necessary to make the power of the laser beams of the two branched optical paths equal. When the material of the object to be processed by the two optical paths, the depth of processing, etc. are different, the branching ratio of the power of the laser beam can be made different according to the processing conditions. In this case, the inclination angle of the polarization direction of the laser beam incident on the branching element 16 with respect to the incident plane may be set according to the power branching ratio. The above-mentioned embodiments are illustrative, and it is of course possible to partially replace or combine the configurations shown in different embodiments. The same function and effect produced by the same configuration of a plurality of embodiments is not mentioned for each embodiment. Also, the present invention is not limited to the above-described embodiments. For example, it is obvious to those skilled in the art that various changes, improvements, combinations, etc. can be made.

10‧‧‧雷射光源11‧‧‧光圈12‧‧‧切出機構13‧‧‧聲光元件14‧‧‧驅動器15‧‧‧偏振方向調整機構16‧‧‧分支元件17A、17B‧‧‧光束掃描器18A、18B‧‧‧聚光透鏡19‧‧‧載物台20‧‧‧光學板21‧‧‧光束阻尼器22A、22B‧‧‧反射鏡30‧‧‧加工對象物35‧‧‧控制裝置LP1、LP2、LP3、LP4‧‧‧雷射脈衝10‧‧‧laser light source 11‧‧‧aperture 12‧‧‧cut-out mechanism 13‧‧‧acousto-optic element 14‧‧‧driver 15‧‧‧polarization direction adjustment mechanism 16‧‧‧branch element 17A, 17B‧‧ ‧Beam scanner 18A, 18B ‧‧‧condensing lens 19‧‧‧stage 20‧‧‧optical plate 21‧‧‧beam damper 22A, 22B‧‧reflector 30‧‧‧object 35‧ ‧‧Control device LP1, LP2, LP3, LP4‧‧‧Laser pulse

圖1係基於實施例之雷射加工裝置的模式圖。 　　圖2係著眼於基於實施例之雷射加工裝置的水平面內方向之概略圖。 　　圖3係著眼於基於實施例之雷射加工裝置的高度方向之概略圖。 　　圖4係基於另一實施例之雷射加工裝置的模式圖。FIG. 1 is a schematic diagram of a laser processing device based on an embodiment. Fig. 2 is a schematic diagram focusing on the in-plane direction of the laser processing device based on the embodiment. Fig. 3 is a schematic diagram focusing on the height direction of the laser processing device based on the embodiment. Fig. 4 is a schematic diagram of a laser processing device based on another embodiment.

10‧‧‧雷射光源 10‧‧‧Laser light source

11‧‧‧光圈 11‧‧‧aperture

12‧‧‧切出機構 12‧‧‧Cut out mechanism

13‧‧‧聲光元件 13‧‧‧Acousto-optic components

14‧‧‧驅動器 14‧‧‧Driver

15‧‧‧偏振方向調整機構 15‧‧‧Polarization direction adjustment mechanism

16‧‧‧分支元件 16‧‧‧Branch components

17A‧‧‧光束掃描器 17A‧‧‧Beam Scanner

17B‧‧‧光束掃描器 17B‧‧‧Beam Scanner

18A‧‧‧聚光透鏡 18A‧‧‧condensing lens

18B‧‧‧聚光透鏡 18B‧‧‧condensing lens

19‧‧‧載物台 19‧‧‧stage

30‧‧‧加工對象物 30‧‧‧Processing object

35‧‧‧控制裝置 35‧‧‧Control device

LP1‧‧‧雷射脈衝 LP1‧‧‧Laser Pulse

LP2‧‧‧雷射脈衝 LP2‧‧‧Laser Pulse

LP3‧‧‧雷射脈衝 LP3‧‧‧Laser Pulse

LP4‧‧‧雷射脈衝 LP4‧‧‧Laser Pulse

Claims (4)

一種雷射加工裝置，係從脈衝雷射光束中的1個雷射光束切出2個雷射光束並利用該2個雷射光束進行加工的2軸雷射加工裝置，其特徵為具有：分支元件，根據入射之雷射光束的偏振方向，將入射側的光路分支成出射側的2個光路；偏振方向調整機構，配置在比該分支元件更靠上游側的光路上，並改變該雷射光束的偏振方向；及切出機構，配置在比該分支元件更靠上游側的光路上，從該雷射光束切出一部分並使其朝向該分支元件；該切出機構包括聲光元件，該聲光元件藉由使入射之該雷射光束繞射來切出最適合加工的部分的雷射光束。 A laser processing device, which is a 2-axis laser processing device that cuts two laser beams from one of the pulsed laser beams and performs processing using the two laser beams, is characterized in that it has: branches According to the polarization direction of the incident laser beam, the optical path on the incident side is branched into two optical paths on the outgoing side; the polarization direction adjustment mechanism is arranged on the optical path more upstream than the branching element, and changes the laser beam. The polarization direction of the beam; and the cutting mechanism, which is arranged on the optical path more upstream than the branching element, cuts off a part of the laser beam and makes it face the branching element; the cutting mechanism includes an acousto-optic element, the The acousto-optic device cuts out the most suitable part of the laser beam for processing by diffracting the incident laser beam. 如申請專利範圍第1項所述之雷射加工裝置，其中該聲光元件配置在比該偏振方向調整機構更靠上游側的光路上。 The laser processing device as described in claim 1, wherein the acousto-optic element is disposed on the optical path upstream of the polarization direction adjustment mechanism. 如申請專利範圍第2項所述之雷射加工裝置，其還具有光圈，該光圈配置在比該聲光元件更靠上游側的光路上，並遮蔽該雷射光束的光束截面的一部分。 The laser processing device according to claim 2, further comprising an aperture arranged on the optical path upstream of the acousto-optic element and shielding a part of the beam cross section of the laser beam. 如申請專利範圍第2或3項所述之雷射加工裝置，其 中該聲光元件、該分支元件及該偏振方向調整機構配置在共同的光學板上，該聲光元件的入射側及出射側的光路、該偏振方向調整機構的入射側及出射側的光路以及該分支元件的入射側的光路平行於該光學板。 The laser processing device described in item 2 or 3 of the scope of patent application, which The acousto-optic element, the branching element, and the polarization direction adjustment mechanism are arranged on a common optical plate, the light path of the incident side and the exit side of the acousto-optic element, the light path of the incident side and the exit side of the polarization direction adjustment mechanism, and The light path of the incident side of the branching element is parallel to the optical plate.
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