TW201918310A - Laser processing device capable of cutting a part of a laser beam for processing, branching it into two optical paths and alleviating restrictions on the arrangement of optical components - Google Patents

Laser processing device capable of cutting a part of a laser beam for processing, branching it into two optical paths and alleviating restrictions on the arrangement of optical components Download PDF

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Publication number
TW201918310A
TW201918310A TW107124419A TW107124419A TW201918310A TW 201918310 A TW201918310 A TW 201918310A TW 107124419 A TW107124419 A TW 107124419A TW 107124419 A TW107124419 A TW 107124419A TW 201918310 A TW201918310 A TW 201918310A
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TW
Taiwan
Prior art keywords
laser beam
optical path
branching
polarization direction
laser
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Application number
TW107124419A
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Chinese (zh)
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TWI798238B (en
Inventor
山口友之
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日商住友重機械工業股份有限公司
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Publication of TWI798238B publication Critical patent/TWI798238B/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/286—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising for controlling or changing the state of polarisation, e.g. transforming one polarisation state into another
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/29—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the position or the direction of light beams, i.e. deflection
    • G02F1/33—Acousto-optical deflection devices

Abstract

This invention provides a laser processing device capable of cutting out a part of a laser beam for processing, branching it into two optical paths and alleviating restrictions on the arrangement of optical components disposed on the optical path after branching. The branching element branches the optical path on an incident side into an optical path on the exit side according to the polarization direction of the incident laser beam. A polarization direction adjusting mechanism disposed on the optical path closer to the upstream side than the branching element changes the polarization direction of the laser beam. A cutting mechanism disposed on the optical path closer the upstream side than the branching element cuts a part of the laser beam and directs it toward the branching element.

Description

雷射加工裝置Laser processing device

本申請主張基於2017年11月8日申請之日本專利申請第2017-215395號的優先權。該申請的所有內容藉由參閱援用於本說明書中。 　　本發明係有關一種雷射加工裝置。The present application claims priority based on Japanese Patent Application No. 2017-215395, filed on Nov. All contents of this application are incorporated herein by reference. The present invention relates to a laser processing apparatus.

已知有如下2軸雷射加工裝置：為了提高雷射加工的效率，從由雷射振盪器輸出之脈衝雷射光束中的1個脈衝切出2個脈衝而用2束雷射光束進行加工(例如，參閱下述專利文獻1)。在專利文獻1中所揭示之雷射加工裝置中，脈衝雷射光束中的1個脈衝藉由聲光元件在時間軸上分離成2個脈衝，並且2個脈衝分別在不同的光路中進行傳播。聲光元件具有從1個脈衝切出加工用脈衝之功能及將1條光路分支為2條光路之功能。 (先前技術文獻) (專利文獻) 　　專利文獻1：日本特開2013-071136號公報A two-axis laser processing apparatus is known: in order to improve the efficiency of laser processing, two pulses are cut out from one pulse of a laser beam output from a laser oscillator and processed by two laser beams. (For example, refer to Patent Document 1 below). In the laser processing apparatus disclosed in Patent Document 1, one pulse of the pulsed laser beam is separated into two pulses on the time axis by the acousto-optic element, and two pulses are respectively propagated in different optical paths. . The acousto-optic element has a function of cutting out a processing pulse from one pulse and a function of dividing one optical path into two optical paths. (Prior Art Document) (Patent Document) Patent Document 1: Japanese Patent Laid-Open Publication No. 2013-071136

(本發明所欲解決之課題) 　　藉由聲光元件所分支之2條光路所呈之角度較小。因此，應配置在分支後的2條光路上之光學組件在空間上容易相互干涉，配置光學組件之位置受到限制。 　　本發明的目的在於，提供一種如下雷射加工裝置：能夠從雷射光束切出用於加工之一部分，並分支為2個光路，並且緩和配置在分支後的光路上之光學組件的配置限制。 (用以解決課題之手段) 　　依本發明的一觀點，提供一種雷射加工裝置，其具有： 　　分支元件，根據入射之雷射光束的偏振方向，將入射側的光路分支成出射側的光路； 　　偏振方向調整機構，配置在比前述分支元件更靠上游側的光路上，並改變雷射光束的偏振方向；及 　　切出機構，配置在比前述分支元件更靠上游側的光路上，從雷射光束切出一部分並使其朝向前述分支元件。 (發明之效果) 　　藉由切出機構能夠從雷射光束切出用於加工之一部分。藉由使用根據入射之雷射光束的偏振方向將入射側的光路分支成2條出射側的光路之分支元件，與藉由聲光元件分支之構成相比，能夠增大分支後的2條光路所呈的角度。其結果，能夠緩和配置在分支後的光路上之光學組件的配置限制。(Problems to be Solved by the Invention) The angles formed by the two optical paths branched by the acousto-optic element are small. Therefore, the optical components disposed on the two optical paths after the branching are likely to interfere with each other spatially, and the position at which the optical components are disposed is limited. It is an object of the present invention to provide a laser processing apparatus capable of cutting out a portion for processing from a laser beam and branching into two optical paths, and alleviating the arrangement limitation of the optical components disposed on the optical path after the branching. According to one aspect of the present invention, a laser processing apparatus includes: a branching element that branches an optical path on an incident side into an optical path on an outgoing side according to a polarization direction of an incident laser beam; a polarization direction adjusting mechanism disposed on an optical path upstream of the branching element and changing a polarization direction of the laser beam; and a cutting mechanism disposed on an optical path upstream of the branching element from the laser The beam cuts a portion and directs it toward the aforementioned branching element. (Effect of the Invention) A part of the processing can be cut out from the laser beam by the cutting mechanism. By using a branching element that branches the optical path on the incident side into the optical path of the two outgoing sides according to the polarization direction of the incident laser beam, it is possible to increase the two optical paths after branching by the configuration of the branching of the acousto-optic element. The angle presented. As a result, it is possible to alleviate the arrangement restriction of the optical components disposed on the optical path after the branching.

參閱圖1～圖3，對基於實施例之雷射加工裝置進行說明。 　　圖1係基於實施例之雷射加工裝置的模式圖。雷射光源10輸出經直線偏振之脈衝雷射光束。作為雷射光源10，例如能夠使用碳酸氣體雷射振盪器。在從雷射光源10到加工對象物30的光路上配置有複數個光學元件。另外，在雷射光束的光路上除了圖1所示之光學元件以外，亦可以根據需要配置中繼透鏡、場透鏡、彎曲鏡等。 　　從雷射光源10輸出之脈衝雷射光束通過光圈11入射到切出機構12。光圈11遮蔽在光路中進行傳播之雷射光束的光束截面的一部分(周邊部)，並使剩餘(中心部)的雷射光束透過。 　　切出機構12包括：聲光元件13，配置在光路上；及驅動器14，向聲光元件13提供驅動訊號。聲光元件13從驅動器14接收驅動訊號，從入射於聲光元件13之脈衝雷射光束的雷射脈衝LP1切出一部分而使其繞射，並使其傳播到從輸入側的光路偏向之輸出側的光路。所切出之雷射脈衝LP2相當於入射於聲光元件13之雷射脈衝LP1在時間軸上之一部分。雷射脈衝LP1的剩餘部分直線穿過聲光元件13而入射於光束阻尼器。 　　藉由切出機構12切出之脈衝雷射光束入射於偏振方向調整機構15。偏振方向調整機構15將沿光路進行傳播之雷射光束的偏振方向改變與預設之角度相當的量。偏振方向調整機構15例如能夠由複數個反射鏡構成。 　　藉由偏振方向調整機構15改變了偏振方向之雷射光束入射於分支元件16。分支元件16根據入射之雷射光束的偏振方向，將入射側的光路分支成2條出射側的光路。作為分支元件16，例如能夠使用偏振光束分離器。偏振光束分離器使P偏振成分透過並反射S偏振成分。偏振方向調整機構15例如以使P偏振成分與S偏振成分的功率比變得相等的方式改變偏振方向。於是，在分支元件16的出射側的2條光路中進行傳播之脈衝雷射光束的雷射脈衝LP3、LP4各自的光強度成為分支前的脈衝雷射光束的雷射脈衝LP2的光強度的一半。 　　在分支後的2條光路中進行傳播之脈衝雷射光束分別經由光束掃描器17A、17B及聚光透鏡18A、18B而入射於載物台19所保持之加工對象物30上。光束掃描器17A、17B在二維方向上掃描脈衝雷射光束。作為光束掃描器17A、17B，例如能夠使用包括一對電流鏡之電流掃描器。聚光透鏡18A、18B分別使經掃描之脈衝雷射光束聚光在加工對象物30的表面。作為聚光透鏡18A、18B，例如能夠使用fθ透鏡。 　　載物台19具有使加工對象物30向與其被加工面平行的二維方向移動之功能。加工對象物30例如為開孔加工前的印刷基板。藉由向印刷基板的被加工點入射脈衝雷射光束來進行開孔加工。作為載物台19，例如能夠使用XY載物台。 　　控制裝置35控制雷射光源10、切出機構12、光束掃描器17A、17B及載物台19。 　　圖2係著眼於基於實施例之雷射加工裝置的水平面內方向之概略圖。在光學板20的上表面固定有雷射光源10、光圈11、聲光元件13、偏振方向調整機構15、分支元件16、光束阻尼器21及反射鏡22A、22B。從雷射光源10輸出之脈衝雷射光束的偏振方向PD平行於光學板20的上表面。透過光圈11而直線穿過聲光元件13之雷射光束入射於光束阻尼器21。 　　沿藉由聲光元件13偏向之光路進行傳播之雷射光束入射於偏振方向調整機構15。沿藉由聲光元件13偏向之光路進行傳播之雷射光束的偏振方向PD亦平行於光學板20的上表面。 　　沿藉由分支元件16分支之後的2條光路進行傳播之雷射光束分別被反射鏡22A、22B朝向下方反射。沿分支後的光路進行傳播之雷射光束的偏振方向PD例如相對於光學板20的上表面傾斜45度。透過分支元件16之雷射光束的偏振方向PD平行於光學板20的上表面。藉由分支元件16反射之雷射光束的偏振方向PD垂直於光學板20的上表面。 　　圖3係著眼於基於實施例之雷射加工裝置的高度方向之概略圖。在光學板20的上表面固定有雷射光源10、光圈11、聲光元件13、偏振方向調整機構15、分支元件16及反射鏡22A、22B。從雷射光源10到偏振方向調整機構15的光路平行於光學板20的上表面。在該光路中進行傳播之雷射光束的偏振方向PD平行於光學板20的上表面。 　　在偏振方向調整機構15的內部，藉由雷射光束被複數個反射鏡反射，以光學板20的上表面為基準之光路的高度發生變化。從偏振方向調整機構15到分支元件16的光路平行於光學板20的上表面。在該光路中進行傳播之雷射光束的偏振方向PD相對於光學板20的上表面傾斜45度。 　　直線穿過分支元件16並入射於反射鏡22A之雷射光束的偏振方向PD平行於光學板20的上表面。被分支元件16反射並入射於反射鏡22B之雷射光束的偏振方向PD(圖2)垂直於光學板20的上表面。 　　被反射鏡22A朝向下方反射之雷射光束通過設置在光學板20之開口，經由光束掃描器17A及聚光透鏡18A，入射於載物台19所保持之加工對象物30。同樣地，被反射鏡22B朝向下方反射之雷射光束通過設置於光學板20之開口，經由光束掃描器17B及聚光透鏡18B，入射於載物台19所保持之加工對象物30。 　　接著，對基於本實施例之雷射加工裝置所具有之優異的效果進行說明。 　　本實施例中，使用根據雷射光束的偏振方向使光路分支之分支元件16，例如使用偏振光束分離器。因此，與使用聲光元件使光路分支之情況相比，能夠增大分支後的2條光路所呈之角度，例如能夠設為90度。藉此，配置在分支後的2條光路上之光學組件在空間上難以相互干涉，能夠提高配置光學組件之位置的自由度。 　　並且，本實施例中，聲光元件13配置在比偏振方向調整機構15更靠上游側的光路上。在比偏振方向調整機構15更靠上游側的光路中進行傳播之雷射光束的偏振方向平行於光學板20的上表面(圖2、圖3)。通常，聲光元件設置在與入射之雷射光束的偏振面平行之面而使用。此時，繞射光向與設置有聲光元件之面平行的方向進行傳播。本實施例中，由於設置有聲光元件之面(光學板20的上表面)與入射於聲光元件之雷射光束的偏振面平行，因此藉由聲光元件13繞射之雷射光束的光路亦平行於光學板20的上表面(圖3)。因此，得到容易進行複數個光學組件的光軸調整之類的效果。 　　實施例中，光圈11(圖1)配置在比聲光元件13更靠上游側的光路上。藉由光圈11減弱入射於聲光元件13之雷射光束的功率，因此能夠抑制由聲光元件13的過熱引起之損傷。 　　並且，實施例中，雷射光束的功率藉由分支元件16(圖1)分支成2條光路。分支成2條光路後的脈衝雷射光束的雷射脈衝LP3、LP4(圖1)的波形相同。因此，能夠藉由在2條光路中進行傳播之脈衝雷射光束來進行均質的雷射加工。而且，能夠根據從雷射光源10輸出之雷射脈衝LP1(圖1)的波形，利用切出機構12(圖1)從雷射脈衝LP1切出最適於加工的部分。 　　接著，參閱圖4對基於另一實施例之雷射加工裝置進行說明。以下，對與圖1～圖3所示之基於實施例之雷射加工裝置共同的構成省略說明。 　　圖4係基於另一實施例之雷射加工裝置的模式圖。圖1所示之實施例中，聲光元件13配置在比偏振方向調整機構15更靠上游側的光路上，但在本實施例中，聲光元件13配置在比偏振方向調整機構15更靠下游側的光路上。 　　本實施例中，亦與圖1所示之實施例相同地，與使用聲光元件而使光路分支之情況相比，得到能夠增大分支後的2條光路所呈之角度之類的效果。 　　本實施例中，入射於聲光元件13之雷射光束的偏振方向PD相對於光學板的上表面傾斜45度。因此，基於聲光元件13之繞射光的光路相對於光學板的上表面傾斜。由此，在聲光元件13與分支元件16之間的光路上配置用於使光路平行於光學板的上表面之反射鏡為較佳。 　　接著，對圖1～圖4所示之實施例的變形例進行說明。圖1～圖4所示之實施例中，藉由將入射於分支元件16之雷射光束的偏振方向相對於分支元件16的入射面傾斜45度，使在分支後的2條光路中進行傳播之雷射光束的功率相等。分支後的2個雷射光束的功率中，可以具有不影響雷射加工的品質程度的偏差。例如，分支後的雷射光束的功率中，對於入射之雷射光束的功率的1/2，可以產生3%以下的偏離。入射於分支元件16之雷射光束的偏振方向相對於入射面之傾斜角度無需嚴格地為45度，可以產生與可容許之功率偏離對應程度的角度的偏離。 　　並且，無需使分支後的2條光路的雷射光束的功率一定相等。在利用2條光路進行加工之對象物的材料、加工之深度等不同的情況下，根據加工條件可以使雷射光束的功率的分支比不同。在該情況下，根據功率的分支比設定入射於分支元件16之雷射光束的偏振方向相對於入射面之傾斜角度即可。 　　上述各實施例係例示的，當然能夠進行不同的實施例中所示之構成的部分取代或組合。對於由複數個實施例的同樣的構成產生之同樣的作用效果，並不針對每個實施例逐次提及。而且，本發明並不限於上述實施例。例如，可進行各種變更、改良、組合等對於所屬技術領域中具有通常知識者來說係顯而易見的。A laser processing apparatus according to an embodiment will be described with reference to Figs. 1 to 3 . 1 is a schematic view of a laser processing apparatus based on an embodiment. The laser source 10 outputs a linearly polarized pulsed laser beam. As the laser light source 10, for example, a carbon dioxide gas laser oscillator can be used. A plurality of optical elements are disposed on the optical path from the laser light source 10 to the object 30 to be processed. Further, in addition to the optical element shown in FIG. 1 on the optical path of the laser beam, a relay lens, a field lens, a curved mirror, or the like may be disposed as needed. The pulsed laser beam output from the laser light source 10 is incident on the cutting mechanism 12 through the aperture 11. The aperture 11 shields a part (peripheral portion) of the beam cross section of the laser beam propagating in the optical path, and transmits the remaining (center portion) laser beam. The cutting mechanism 12 includes an acousto-optic element 13 disposed on the optical path, and a driver 14 that provides a driving signal to the acousto-optic element 13. The acousto-optic element 13 receives the driving signal from the driver 14, cuts a part of the laser pulse LP1 incident on the acousto-optic element 13 and diffracts it, and propagates it to the output of the optical path from the input side. Side of the light path. The cut laser pulse LP2 corresponds to a portion of the laser pulse LP1 incident on the acousto-optic element 13 on the time axis. The remaining portion of the laser pulse LP1 passes straight through the acousto-optic element 13 and is incident on the beam damper. The pulsed laser beam cut by the cutting mechanism 12 is incident on the polarization direction adjusting mechanism 15. The polarization direction adjustment mechanism 15 changes the polarization direction of the laser beam propagating along the optical path by an amount corresponding to a predetermined angle. The polarization direction adjustment mechanism 15 can be constituted by, for example, a plurality of mirrors. The laser beam whose polarization direction has been changed by the polarization direction adjustment mechanism 15 is incident on the branching element 16. The branching element 16 branches the optical path on the incident side into the optical paths of the two outgoing sides in accordance with the polarization direction of the incident laser beam. As the branching element 16, for example, a polarization beam splitter can be used. The polarizing beam splitter transmits the P-polarized component and reflects the S-polarized component. The polarization direction adjustment mechanism 15 changes the polarization direction so that the power ratio of the P-polarized component and the S-polarized component become equal, for example. Then, the light intensity of each of the laser pulses LP3 and LP4 of the pulsed laser beam propagating in the two optical paths on the exit side of the branching element 16 becomes half the light intensity of the laser pulse LP2 of the pulsed laser beam before the branching. . The pulsed laser beam propagating in the two optical paths after the branching is incident on the object 30 held by the stage 19 via the beam scanners 17A and 17B and the collecting lenses 18A and 18B, respectively. The beam scanners 17A, 17B scan the pulsed laser beam in a two-dimensional direction. As the beam scanners 17A, 17B, for example, a current scanner including a pair of current mirrors can be used. The condenser lenses 18A and 18B converge the scanned pulsed laser beam on the surface of the object 30, respectively. As the condensing lenses 18A and 18B, for example, an fθ lens can be used. The stage 19 has a function of moving the object 30 in a two-dimensional direction parallel to the surface to be processed. The object to be processed 30 is, for example, a printed circuit board before the hole drilling process. The drilling process is performed by injecting a pulsed laser beam into a processed point of the printed substrate. As the stage 19, for example, an XY stage can be used. The control device 35 controls the laser light source 10, the cutting mechanism 12, the beam scanners 17A, 17B, and the stage 19. Fig. 2 is a schematic view showing the direction in the horizontal plane of the laser processing apparatus according to the embodiment. A laser light source 10, a diaphragm 11, an acousto-optic element 13, a polarization direction adjusting mechanism 15, a branching element 16, a beam damper 21, and mirrors 22A and 22B are fixed to the upper surface of the optical plate 20. The polarization direction PD of the pulsed laser beam output from the laser light source 10 is parallel to the upper surface of the optical plate 20. A laser beam that has passed through the acousto-optic element 13 through the aperture 11 is incident on the beam damper 21. A laser beam propagating along the optical path deflected by the acousto-optic element 13 is incident on the polarization direction adjusting mechanism 15. The polarization direction PD of the laser beam propagating along the optical path deflected by the acousto-optic element 13 is also parallel to the upper surface of the optical plate 20. The laser beams propagating along the two optical paths branched by the branching elements 16 are reflected downward by the mirrors 22A and 22B, respectively. The polarization direction PD of the laser beam propagating along the branched optical path is, for example, inclined by 45 degrees with respect to the upper surface of the optical plate 20. The polarization direction PD of the laser beam transmitted through the branching element 16 is parallel to the upper surface of the optical plate 20. The polarization direction PD of the laser beam reflected by the branching element 16 is perpendicular to the upper surface of the optical plate 20. Fig. 3 is a schematic view showing a height direction of a laser processing apparatus according to an embodiment. A laser light source 10, a diaphragm 11, an acousto-optic element 13, a polarization direction adjusting mechanism 15, a branching element 16, and mirrors 22A and 22B are fixed to the upper surface of the optical plate 20. The optical path from the laser light source 10 to the polarization direction adjusting mechanism 15 is parallel to the upper surface of the optical plate 20. The polarization direction PD of the laser beam propagating in the optical path is parallel to the upper surface of the optical plate 20. Inside the polarization direction adjustment mechanism 15, the laser beam is reflected by a plurality of mirrors, and the height of the optical path based on the upper surface of the optical plate 20 changes. The optical path from the polarization direction adjusting mechanism 15 to the branching member 16 is parallel to the upper surface of the optical plate 20. The polarization direction PD of the laser beam propagating in the optical path is inclined by 45 degrees with respect to the upper surface of the optical plate 20. The polarization direction PD of the laser beam that passes straight through the branching element 16 and is incident on the mirror 22A is parallel to the upper surface of the optical plate 20. The polarization direction PD (Fig. 2) of the laser beam reflected by the branching element 16 and incident on the mirror 22B is perpendicular to the upper surface of the optical plate 20. The laser beam reflected downward by the mirror 22A passes through the opening provided in the optical plate 20, and enters the object 30 held by the stage 19 via the beam scanner 17A and the collecting lens 18A. In the same manner, the laser beam reflected downward by the mirror 22B passes through the opening provided in the optical plate 20, and enters the object 30 held by the stage 19 via the beam scanner 17B and the collecting lens 18B. Next, an excellent effect of the laser processing apparatus according to the present embodiment will be described. In the present embodiment, the branching element 16 that branches the optical path according to the polarization direction of the laser beam is used, for example, using a polarization beam splitter. Therefore, the angle between the two optical paths after the branching can be increased as compared with the case where the optical path is branched by the acousto-optic element, and for example, it can be set to 90 degrees. Thereby, the optical components disposed on the two optical paths after the branching are spatially difficult to interfere with each other, and the degree of freedom in arranging the position of the optical component can be improved. Further, in the present embodiment, the acousto-optic element 13 is disposed on the optical path on the upstream side of the polarization direction adjustment mechanism 15. The polarization direction of the laser beam propagating in the optical path on the upstream side of the polarization direction adjusting mechanism 15 is parallel to the upper surface of the optical plate 20 (FIGS. 2 and 3). Usually, the acousto-optic element is disposed on a plane parallel to the plane of polarization of the incident laser beam. At this time, the diffracted light propagates in a direction parallel to the surface on which the acousto-optic element is provided. In this embodiment, since the surface on which the acousto-optic element is disposed (the upper surface of the optical plate 20) is parallel to the plane of polarization of the laser beam incident on the acousto-optic element, the laser beam is diffracted by the acousto-optic element 13 The optical path is also parallel to the upper surface of the optical plate 20 (Fig. 3). Therefore, an effect of easily adjusting the optical axis of a plurality of optical components is obtained. In the embodiment, the diaphragm 11 (FIG. 1) is disposed on the optical path on the upstream side of the acousto-optic element 13. Since the power of the laser beam incident on the acousto-optic element 13 is weakened by the diaphragm 11, it is possible to suppress damage caused by overheating of the acousto-optic element 13. Also, in the embodiment, the power of the laser beam is branched into two optical paths by the branching element 16 (Fig. 1). The waveforms of the laser pulses LP3 and LP4 (Fig. 1) of the pulsed laser beam branched into two optical paths are the same. Therefore, homogeneous laser processing can be performed by a pulsed laser beam propagating in two optical paths. Further, the portion suitable for processing can be cut out from the laser pulse LP1 by the cutting mechanism 12 (Fig. 1) based on the waveform of the laser pulse LP1 (Fig. 1) output from the laser light source 10. Next, a laser processing apparatus according to another embodiment will be described with reference to FIG. Hereinafter, the description of the configuration common to the laser processing apparatus according to the embodiment shown in FIGS. 1 to 3 will be omitted. 4 is a schematic view of a laser processing apparatus based on another embodiment. In the embodiment shown in Fig. 1, the acousto-optic element 13 is disposed on the optical path on the upstream side of the polarization direction adjustment mechanism 15, but in the present embodiment, the acousto-optic element 13 is disposed further than the polarization direction adjustment mechanism 15. The optical path on the downstream side. Also in the present embodiment, as in the embodiment shown in Fig. 1, the effect of increasing the angle between the two optical paths after the branching is obtained as compared with the case of using the acousto-optic element to branch the optical path. In the present embodiment, the polarization direction PD of the laser beam incident on the acousto-optic element 13 is inclined by 45 degrees with respect to the upper surface of the optical plate. Therefore, the optical path of the diffracted light based on the acousto-optic element 13 is inclined with respect to the upper surface of the optical plate. Therefore, it is preferable to arrange a mirror for making the optical path parallel to the upper surface of the optical plate on the optical path between the acousto-optic element 13 and the branching element 16. Next, a modification of the embodiment shown in Figs. 1 to 4 will be described. In the embodiment shown in FIGS. 1 to 4, the polarization direction of the laser beam incident on the branching element 16 is inclined by 45 degrees with respect to the incident surface of the branching element 16 to propagate in the two optical paths after the branching. The power of the laser beam is equal. The power of the two laser beams after the branching may have a variation that does not affect the quality of the laser processing. For example, in the power of the branched laser beam, a deviation of 3% or less may be generated for 1/2 of the power of the incident laser beam. The inclination angle of the polarization direction of the laser beam incident on the branching element 16 with respect to the incident surface need not be strictly 45 degrees, and an angle deviation corresponding to the allowable power deviation can be generated. Further, it is not necessary to make the power of the laser beams of the two optical paths after the branch equal. When the material of the object to be processed by the two optical paths, the depth of processing, and the like are different, the branching ratio of the power of the laser beam can be made different depending on the processing conditions. In this case, the inclination angle of the laser beam incident on the branching element 16 with respect to the incident surface may be set according to the branching ratio of the power. The above embodiments are exemplified, and of course, partial replacement or combination of the configurations shown in the different embodiments can be performed. The same effects as those produced by the same constitution of the plural embodiments are not mentioned one by one for each embodiment. Moreover, the present invention is not limited to the above embodiments. For example, various changes, modifications, combinations, and the like may be made apparent to those of ordinary skill in the art.

10‧‧‧雷射光源10‧‧‧Laser light source

11‧‧‧光圈11‧‧‧ aperture

12‧‧‧切出機構12‧‧‧Cut out the institution

13‧‧‧聲光元件13‧‧‧Acousto-optic components

14‧‧‧驅動器14‧‧‧ Drive

15‧‧‧偏振方向調整機構15‧‧‧Polarization direction adjustment mechanism

16‧‧‧分支元件16‧‧‧Branch components

17A、17B‧‧‧光束掃描器17A, 17B‧‧‧ Beam Scanner

18A、18B‧‧‧聚光透鏡18A, 18B‧‧‧ concentrating lens

19‧‧‧載物台19‧‧‧stage

20‧‧‧光學板20‧‧‧Optical board

21‧‧‧光束阻尼器21‧‧‧ Beam damper

22A、22B‧‧‧反射鏡22A, 22B‧‧‧ mirror

30‧‧‧加工對象物30‧‧‧Processing objects

35‧‧‧控制裝置35‧‧‧Control device

LP1、LP2、LP3、LP4‧‧‧雷射脈衝LP1, LP2, LP3, LP4‧‧‧ laser pulses

圖1係基於實施例之雷射加工裝置的模式圖。 　　圖2係著眼於基於實施例之雷射加工裝置的水平面內方向之概略圖。 　　圖3係著眼於基於實施例之雷射加工裝置的高度方向之概略圖。 　　圖4係基於另一實施例之雷射加工裝置的模式圖。1 is a schematic view of a laser processing apparatus based on an embodiment. Fig. 2 is a schematic view showing the direction in the horizontal plane of the laser processing apparatus according to the embodiment. Fig. 3 is a schematic view showing a height direction of a laser processing apparatus according to an embodiment. 4 is a schematic view of a laser processing apparatus based on another embodiment.

Claims (5)

一種雷射加工裝置，其具有： 　　分支元件，根據入射之雷射光束的偏振方向，將入射側的光路分支成出射側的光路； 　　偏振方向調整機構，配置在比該分支元件更靠上游側的光路上，並改變雷射光束的偏振方向；及 　　切出機構，配置在比該分支元件更靠上游側的光路上，從雷射光束切出一部分並使其朝向該分支元件。A laser processing apparatus comprising: a branching element that branches an optical path on an incident side into an optical path on an outgoing side according to a polarization direction of an incident laser beam; and a polarization direction adjusting mechanism disposed on an upstream side of the branching element The optical path changes the polarization direction of the laser beam; and the cutting mechanism is disposed on the optical path on the upstream side of the branching element, and cuts a portion from the laser beam toward the branching element. 如申請專利範圍第1項所述之雷射加工裝置，其中 　　該切出機構包括聲光元件，該聲光元件藉由使入射之雷射光束繞射來切出一部分。The laser processing apparatus of claim 1, wherein the cutting mechanism comprises an acousto-optic element that cuts a portion by diffracting the incident laser beam. 如申請專利範圍第2項所述之雷射加工裝置，其中 　　該聲光元件配置在比該偏振方向調整機構更靠上游側的光路上。The laser processing apparatus according to claim 2, wherein the acousto-optic element is disposed on an optical path on an upstream side of the polarization direction adjusting mechanism. 如申請專利範圍第3項所述之雷射加工裝置，其還具有光圈， 　　該光圈配置在比該聲光元件更靠上游側的光路上，並遮蔽雷射光束的光束截面的一部分。The laser processing apparatus according to claim 3, further comprising an aperture disposed on an optical path on an upstream side of the acousto-optic element and shielding a part of a beam cross section of the laser beam. 如申請專利範圍第3或4項所述之雷射加工裝置，其中 　　該聲光元件、該分支元件及該偏振方向調整機構配置在共同的光學板上，該聲光元件的入射側及出射側的光路、該偏振方向調整機構的入射側及出射側的光路以及該分支元件的入射側的光路平行於該光學板。The laser processing apparatus of claim 3, wherein the acousto-optic element, the branching element, and the polarization direction adjusting mechanism are disposed on a common optical plate, and an incident side and an outgoing side of the acousto-optic element The optical path, the optical path on the incident side and the outgoing side of the polarization direction adjusting mechanism, and the optical path on the incident side of the branching element are parallel to the optical plate.
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Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003200279A (en) * 2001-10-24 2003-07-15 Seiko Epson Corp Method and apparatus for cutting electrical wiring on substrate, and method and apparatus for manufacturing electronic device
US6947454B2 (en) * 2003-06-30 2005-09-20 Electro Scientific Industries, Inc. Laser pulse picking employing controlled AOM loading
JP2005095936A (en) * 2003-09-25 2005-04-14 Matsushita Electric Ind Co Ltd Apparatus and method for laser machining
US7511247B2 (en) * 2004-03-22 2009-03-31 Panasonic Corporation Method of controlling hole shape during ultrafast laser machining by manipulating beam polarization
US7227098B2 (en) * 2004-08-06 2007-06-05 Electro Scientific Industries, Inc. Method and system for decreasing the effective pulse repetition frequency of a laser
DE112005003088T5 (en) * 2004-11-29 2007-10-18 Electro Scientific Industries, Inc., Portland Efficient micromachining device and method using multiple laser beams
US20060114948A1 (en) * 2004-11-29 2006-06-01 Lo Ho W Workpiece processing system using a common imaged optical assembly to shape the spatial distributions of light energy of multiple laser beams
JP2011180039A (en) * 2010-03-02 2011-09-15 Sigma Koki Kk Specimen damage analyzer
JP2013071136A (en) 2011-09-27 2013-04-22 Hitachi Via Mechanics Ltd Laser beam machining apparatus
JP6072301B2 (en) * 2013-12-10 2017-02-01 三菱電機株式会社 Laser radar equipment
JPWO2015118829A1 (en) 2014-02-05 2017-03-23 パナソニックＩｐマネジメント株式会社 Laser processing equipment
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CN204012178U (en) * 2014-07-07 2014-12-10 上海朗研光电科技有限公司 Optical fiber type pulse stretching and compression set based on polarization beam splitting
JP6430790B2 (en) * 2014-11-25 2018-11-28 株式会社ディスコ Laser processing equipment
CN204470782U (en) * 2015-02-10 2015-07-15 昆山乙盛机械工业有限公司 A kind of adjustable laser processing device
JP2017159317A (en) * 2016-03-09 2017-09-14 住友重機械工業株式会社 Laser beam machining device
CN107221830B (en) * 2017-07-27 2019-02-22 中国科学院长春光学精密机械与物理研究所 A kind of unsteady cavity single-frequency laser output device

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