TWI455783B - 雷射加工方法及其所形成的加工件 - Google Patents
雷射加工方法及其所形成的加工件 Download PDFInfo
- Publication number
- TWI455783B TWI455783B TW101100095A TW101100095A TWI455783B TW I455783 B TWI455783 B TW I455783B TW 101100095 A TW101100095 A TW 101100095A TW 101100095 A TW101100095 A TW 101100095A TW I455783 B TWI455783 B TW I455783B
- Authority
- TW
- Taiwan
- Prior art keywords
- laser beam
- distribution
- overlap ratio
- depth
- region
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Planar Illumination Modules (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101100095A TWI455783B (zh) | 2012-01-02 | 2012-01-02 | 雷射加工方法及其所形成的加工件 |
JP2012137624A JP5738805B2 (ja) | 2012-01-02 | 2012-06-19 | レーザー加工方法及びそれにより形成された加工物 |
KR1020120066027A KR101501073B1 (ko) | 2012-01-02 | 2012-06-20 | 레이저 가공 방법 및 그것에 의해 형성된 가공물 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101100095A TWI455783B (zh) | 2012-01-02 | 2012-01-02 | 雷射加工方法及其所形成的加工件 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201328809A TW201328809A (zh) | 2013-07-16 |
TWI455783B true TWI455783B (zh) | 2014-10-11 |
Family
ID=48991916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101100095A TWI455783B (zh) | 2012-01-02 | 2012-01-02 | 雷射加工方法及其所形成的加工件 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5738805B2 (ko) |
KR (1) | KR101501073B1 (ko) |
TW (1) | TWI455783B (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI561325B (en) * | 2014-08-01 | 2016-12-11 | Au Optronics Corp | Display module manufacturing method and display module |
TWI677733B (zh) * | 2015-06-01 | 2019-11-21 | 凌暉科技股份有限公司 | 雙面顯示器 |
CN105738713A (zh) * | 2016-02-24 | 2016-07-06 | 江苏德大自动化设备有限公司 | 人体静电释放远程控制系统、装置及其使用的静电监测仪 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11320156A (ja) * | 1998-05-11 | 1999-11-24 | Ricoh Microelectronics Co Ltd | レーザによる加工方法及び装置 |
KR20020086131A (ko) * | 2001-05-11 | 2002-11-18 | 주식회사 엘에스텍 | 비대칭 도광패턴부를 가지는 면광원 장치 |
KR20080001775A (ko) * | 2006-06-30 | 2008-01-04 | 주식회사 한광옵토 | 도광판과 이를 이용한 백라이트 유닛 |
TW200903063A (en) * | 2007-06-26 | 2009-01-16 | Lumitex Inc | Transparent light emitting members and method of manufacture |
TW201019003A (en) * | 2008-11-03 | 2010-05-16 | Univ Nat Cheng Kung | Backlight module, light guide plate for backlight module and method for making the same |
US20100320179A1 (en) * | 2007-10-16 | 2010-12-23 | Hideki Morita | Method for Creating Trench in U Shape in Brittle Material Substrate, Method for Removing Process, Method for Hollowing Process and Chamfering Method Using Same |
TW201116902A (en) * | 2009-11-10 | 2011-05-16 | Hortek Crystal Co Ltd | Laser processing device |
JP2011233285A (ja) * | 2010-04-26 | 2011-11-17 | Toppan Printing Co Ltd | 導光板、バックライトユニット及び表示装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100938643B1 (ko) * | 2007-11-27 | 2010-01-28 | 주식회사 옵토메카 | 복합렌즈 성형장치 및 방법 |
JP2010103068A (ja) * | 2008-10-27 | 2010-05-06 | Kuroda Denki Kk | 導光板の製造方法、導光板及び光源装置 |
JP5424910B2 (ja) * | 2010-01-21 | 2014-02-26 | トリニティ工業株式会社 | 加飾部品の製造方法、部品の加飾方法 |
-
2012
- 2012-01-02 TW TW101100095A patent/TWI455783B/zh not_active IP Right Cessation
- 2012-06-19 JP JP2012137624A patent/JP5738805B2/ja not_active Expired - Fee Related
- 2012-06-20 KR KR1020120066027A patent/KR101501073B1/ko not_active IP Right Cessation
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11320156A (ja) * | 1998-05-11 | 1999-11-24 | Ricoh Microelectronics Co Ltd | レーザによる加工方法及び装置 |
KR20020086131A (ko) * | 2001-05-11 | 2002-11-18 | 주식회사 엘에스텍 | 비대칭 도광패턴부를 가지는 면광원 장치 |
KR20080001775A (ko) * | 2006-06-30 | 2008-01-04 | 주식회사 한광옵토 | 도광판과 이를 이용한 백라이트 유닛 |
TW200903063A (en) * | 2007-06-26 | 2009-01-16 | Lumitex Inc | Transparent light emitting members and method of manufacture |
US20100320179A1 (en) * | 2007-10-16 | 2010-12-23 | Hideki Morita | Method for Creating Trench in U Shape in Brittle Material Substrate, Method for Removing Process, Method for Hollowing Process and Chamfering Method Using Same |
TW201019003A (en) * | 2008-11-03 | 2010-05-16 | Univ Nat Cheng Kung | Backlight module, light guide plate for backlight module and method for making the same |
TW201116902A (en) * | 2009-11-10 | 2011-05-16 | Hortek Crystal Co Ltd | Laser processing device |
JP2011233285A (ja) * | 2010-04-26 | 2011-11-17 | Toppan Printing Co Ltd | 導光板、バックライトユニット及び表示装置 |
Also Published As
Publication number | Publication date |
---|---|
JP5738805B2 (ja) | 2015-06-24 |
JP2013139050A (ja) | 2013-07-18 |
KR101501073B1 (ko) | 2015-03-10 |
TW201328809A (zh) | 2013-07-16 |
KR20130079100A (ko) | 2013-07-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |