TWI455783B - Laser process method and workpiece formed by laser process method thereof - Google Patents

Laser process method and workpiece formed by laser process method thereof Download PDF

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Publication number
TWI455783B
TWI455783B TW101100095A TW101100095A TWI455783B TW I455783 B TWI455783 B TW I455783B TW 101100095 A TW101100095 A TW 101100095A TW 101100095 A TW101100095 A TW 101100095A TW I455783 B TWI455783 B TW I455783B
Authority
TW
Taiwan
Prior art keywords
laser beam
distribution
overlap ratio
depth
region
Prior art date
Application number
TW101100095A
Other languages
Chinese (zh)
Other versions
TW201328809A (en
Inventor
Yung Hsiang Huang
Shun Han Yang
Yu Lin Lee
Original Assignee
Hortek Crystal Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hortek Crystal Co Ltd filed Critical Hortek Crystal Co Ltd
Priority to TW101100095A priority Critical patent/TWI455783B/en
Priority to JP2012137624A priority patent/JP5738805B2/en
Priority to KR1020120066027A priority patent/KR101501073B1/en
Publication of TW201328809A publication Critical patent/TW201328809A/en
Application granted granted Critical
Publication of TWI455783B publication Critical patent/TWI455783B/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Planar Illumination Modules (AREA)

Claims (3)

一種雷射加工方法，包含下列步驟：提供一加工件，該加工件具有一第一局部區域；以及施加一第一雷射光束至該第一局部區域，以在該第一局部區域中形成一第一網點，其中該第一雷射光束的複數雷射脈衝在該第一局部區域中具有一第一特定重疊率分佈以使該第一網點具有一特定深度分佈，該第一局部區域包括一高重疊率分佈區域以及一低重疊率分佈區域，該第一特定重疊率分佈包括一第一脈衝重疊率以及一第二脈衝重疊率，該第一雷射光束以該第一脈衝重疊率在該高重疊率分佈區域加工，且以該第二脈衝重疊率在該低重疊率分佈區域加工，其中該第一脈衝重疊率大於該第二脈衝重疊率。 A laser processing method comprising the steps of: providing a workpiece having a first partial area; and applying a first laser beam to the first partial area to form a first partial area a first mesh point, wherein the plurality of laser pulses of the first laser beam have a first specific overlap ratio distribution in the first partial region such that the first mesh point has a specific depth distribution, and the first partial region includes a first a high overlap rate distribution region and a low overlap rate distribution region, the first specific overlap ratio distribution including a first pulse overlap ratio and a second pulse overlap ratio, the first laser beam at the first pulse overlap ratio The high overlap rate distribution region is processed and processed at the low overlap rate distribution region at the second pulse overlap ratio, wherein the first pulse overlap ratio is greater than the second pulse overlap ratio. 如申請專利範圍第1項所述的方法，其中該第一局部區域包含一第一位置以及一第二位置，該加工件更具有一第二局部區域，該第二局部區域包含一第三位置以及一第四位置，該方法更包含下列步驟：施加該第一雷射光束於該第一位置；移動該第一雷射光束至該第二位置，其中該第一雷射光束施加到該第一局部區域的該第一特定重疊率分佈係由緊密到稀疏；停止該第一雷射光束，以形成該第一網點；施加一第二雷射光束於該第三位置；移動該第二雷射光束至該第四位置，其中該第二雷射光束施加到該第二局部區域的一第二特定重疊率分佈係由緊密到稀疏；以及停止該第二雷射光束，以形成一第二網點。 The method of claim 1, wherein the first partial region comprises a first location and a second location, the processing component further has a second partial region, the second partial region comprising a third location And a fourth position, the method further comprising the steps of: applying the first laser beam to the first position; moving the first laser beam to the second position, wherein the first laser beam is applied to the first The first specific overlap ratio distribution of a partial region is from tight to sparse; stopping the first laser beam to form the first mesh point; applying a second laser beam to the third position; moving the second mine Shooting a beam to the fourth position, wherein a second specific overlap ratio distribution of the second laser beam applied to the second partial region is from tight to sparse; and stopping the second laser beam to form a second Outlets. 如申請專利範圍第1項所述的方法，其中： 該加工件為一鋼模、模仁、以及導光板的其中之一；該特定深度分佈是對稱深度分佈和非對稱深度分佈的其中之一；該第一雷射光束在高重疊率分佈區域中造成該特定深度分佈具有一第一最大深度，且在該低重疊率分佈區域中造成該特定深度分佈具有一第一深度，其中該第一最大深度大於該第一深度；該雷射光束每秒所輸出的能量是固定的；以及該雷射光束與該加工件的一平面垂直。 The method of claim 1, wherein: The workpiece is one of a steel mold, a mold core, and a light guide plate; the specific depth distribution is one of a symmetric depth distribution and an asymmetric depth distribution; the first laser beam is in a high overlap ratio distribution region Causing the particular depth profile to have a first maximum depth, and causing the particular depth profile to have a first depth in the low overlap rate distribution region, wherein the first maximum depth is greater than the first depth; the laser beam is per second The output energy is fixed; and the laser beam is perpendicular to a plane of the workpiece.
TW101100095A 2012-01-02 2012-01-02 Laser process method and workpiece formed by laser process method thereof TWI455783B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW101100095A TWI455783B (en) 2012-01-02 2012-01-02 Laser process method and workpiece formed by laser process method thereof
JP2012137624A JP5738805B2 (en) 2012-01-02 2012-06-19 Laser processing method and workpiece formed thereby
KR1020120066027A KR101501073B1 (en) 2012-01-02 2012-06-20 Laser process method and workpiece formed by laser process method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101100095A TWI455783B (en) 2012-01-02 2012-01-02 Laser process method and workpiece formed by laser process method thereof

Publications (2)

Publication Number Publication Date
TW201328809A TW201328809A (en) 2013-07-16
TWI455783B true TWI455783B (en) 2014-10-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW101100095A TWI455783B (en) 2012-01-02 2012-01-02 Laser process method and workpiece formed by laser process method thereof

Country Status (3)

Country Link
JP (1) JP5738805B2 (en)
KR (1) KR101501073B1 (en)
TW (1) TWI455783B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI561325B (en) * 2014-08-01 2016-12-11 Au Optronics Corp Display module manufacturing method and display module
TWI677733B (en) * 2015-06-01 2019-11-21 凌暉科技股份有限公司 Double-sided display
CN105738713A (en) * 2016-02-24 2016-07-06 江苏德大自动化设备有限公司 Human body electrostatic discharge remote control system and device and electrostatic monitor thereof

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11320156A (en) * 1998-05-11 1999-11-24 Ricoh Microelectronics Co Ltd Method and device for processing by laser
KR20020086131A (en) * 2001-05-11 2002-11-18 주식회사 엘에스텍 back light unit having asymmetric light guide pattern
KR20080001775A (en) * 2006-06-30 2008-01-04 주식회사 한광옵토 Light guide panel, back light unit using the same and method for manufacturing the same
TW200903063A (en) * 2007-06-26 2009-01-16 Lumitex Inc Transparent light emitting members and method of manufacture
TW201019003A (en) * 2008-11-03 2010-05-16 Univ Nat Cheng Kung Backlight module, light guide plate for backlight module and method for making the same
US20100320179A1 (en) * 2007-10-16 2010-12-23 Hideki Morita Method for Creating Trench in U Shape in Brittle Material Substrate, Method for Removing Process, Method for Hollowing Process and Chamfering Method Using Same
TW201116902A (en) * 2009-11-10 2011-05-16 Hortek Crystal Co Ltd Laser processing device
JP2011233285A (en) * 2010-04-26 2011-11-17 Toppan Printing Co Ltd Light guide plate, backlight unit, and display device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100938643B1 (en) * 2007-11-27 2010-01-28 주식회사 옵토메카 Device and method for fabricating compound lens
JP2010103068A (en) * 2008-10-27 2010-05-06 Kuroda Denki Kk Method of manufacturing light guide plate, light guide plate, and light source device
JP5424910B2 (en) * 2010-01-21 2014-02-26 トリニティ工業株式会社 Manufacturing method of decorative parts, decorative method of parts

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11320156A (en) * 1998-05-11 1999-11-24 Ricoh Microelectronics Co Ltd Method and device for processing by laser
KR20020086131A (en) * 2001-05-11 2002-11-18 주식회사 엘에스텍 back light unit having asymmetric light guide pattern
KR20080001775A (en) * 2006-06-30 2008-01-04 주식회사 한광옵토 Light guide panel, back light unit using the same and method for manufacturing the same
TW200903063A (en) * 2007-06-26 2009-01-16 Lumitex Inc Transparent light emitting members and method of manufacture
US20100320179A1 (en) * 2007-10-16 2010-12-23 Hideki Morita Method for Creating Trench in U Shape in Brittle Material Substrate, Method for Removing Process, Method for Hollowing Process and Chamfering Method Using Same
TW201019003A (en) * 2008-11-03 2010-05-16 Univ Nat Cheng Kung Backlight module, light guide plate for backlight module and method for making the same
TW201116902A (en) * 2009-11-10 2011-05-16 Hortek Crystal Co Ltd Laser processing device
JP2011233285A (en) * 2010-04-26 2011-11-17 Toppan Printing Co Ltd Light guide plate, backlight unit, and display device

Also Published As

Publication number Publication date
TW201328809A (en) 2013-07-16
JP5738805B2 (en) 2015-06-24
KR101501073B1 (en) 2015-03-10
JP2013139050A (en) 2013-07-18
KR20130079100A (en) 2013-07-10

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