JP5738805B2 - レーザー加工方法及びそれにより形成された加工物 - Google Patents

レーザー加工方法及びそれにより形成された加工物 Download PDF

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Publication number
JP5738805B2
JP5738805B2 JP2012137624A JP2012137624A JP5738805B2 JP 5738805 B2 JP5738805 B2 JP 5738805B2 JP 2012137624 A JP2012137624 A JP 2012137624A JP 2012137624 A JP2012137624 A JP 2012137624A JP 5738805 B2 JP5738805 B2 JP 5738805B2
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Prior art keywords
laser beam
distribution
depth
range
specific
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Expired - Fee Related
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JP2012137624A
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English (en)
Japanese (ja)
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JP2013139050A (ja
Inventor
永祥 ▲ふぁん▼
永祥 ▲ふぁん▼
舜涵 楊
舜涵 楊
玉麟 李
玉麟 李
Original Assignee
豪晶科技股▲ふん▼有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Planar Illumination Modules (AREA)
JP2012137624A 2012-01-02 2012-06-19 レーザー加工方法及びそれにより形成された加工物 Expired - Fee Related JP5738805B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW101100095A TWI455783B (zh) 2012-01-02 2012-01-02 雷射加工方法及其所形成的加工件
TW101100095 2012-01-02

Publications (2)

Publication Number Publication Date
JP2013139050A JP2013139050A (ja) 2013-07-18
JP5738805B2 true JP5738805B2 (ja) 2015-06-24

Family

ID=48991916

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012137624A Expired - Fee Related JP5738805B2 (ja) 2012-01-02 2012-06-19 レーザー加工方法及びそれにより形成された加工物

Country Status (3)

Country Link
JP (1) JP5738805B2 (ko)
KR (1) KR101501073B1 (ko)
TW (1) TWI455783B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI561325B (en) * 2014-08-01 2016-12-11 Au Optronics Corp Display module manufacturing method and display module
TWI677733B (zh) * 2015-06-01 2019-11-21 凌暉科技股份有限公司 雙面顯示器
CN105738713A (zh) * 2016-02-24 2016-07-06 江苏德大自动化设备有限公司 人体静电释放远程控制系统、装置及其使用的静电监测仪

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11320156A (ja) * 1998-05-11 1999-11-24 Ricoh Microelectronics Co Ltd レーザによる加工方法及び装置
KR100423952B1 (ko) * 2001-05-11 2004-03-22 주식회사 엘에스텍 비대칭 도광패턴부를 가지는 면광원 장치
US20070248307A1 (en) * 2002-10-04 2007-10-25 Page David J Transparent light emitting members and method of manufacture
KR20080001775A (ko) * 2006-06-30 2008-01-04 주식회사 한광옵토 도광판과 이를 이용한 백라이트 유닛
WO2009050938A1 (ja) * 2007-10-16 2009-04-23 Mitsuboshi Diamond Industrial Co., Ltd. 脆性材料基板のｕ字状溝加工方法およびこれを用いた除去加工方法およびくり抜き加工方法および面取り方法
KR100938643B1 (ko) * 2007-11-27 2010-01-28 주식회사 옵토메카 복합렌즈 성형장치 및 방법
JP2010103068A (ja) * 2008-10-27 2010-05-06 Kuroda Denki Kk 導光板の製造方法、導光板及び光源装置
TWI413833B (zh) * 2008-11-03 2013-11-01 Univ Nat Cheng Kung 背光模組、用於背光模組之導光板及其製造方法
TWI428671B (zh) * 2009-11-10 2014-03-01 Hortek Crystal Co Ltd 雷射加工裝置
JP5424910B2 (ja) * 2010-01-21 2014-02-26 トリニティ工業株式会社 加飾部品の製造方法、部品の加飾方法
JP5750834B2 (ja) * 2010-04-26 2015-07-22 凸版印刷株式会社 導光板、バックライトユニット及び表示装置

Also Published As

Publication number Publication date
TWI455783B (zh) 2014-10-11
KR20130079100A (ko) 2013-07-10
JP2013139050A (ja) 2013-07-18
KR101501073B1 (ko) 2015-03-10
TW201328809A (zh) 2013-07-16

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