TWI455643B - 發光裝置及電子機器 - Google Patents
發光裝置及電子機器 Download PDFInfo
- Publication number
- TWI455643B TWI455643B TW097104609A TW97104609A TWI455643B TW I455643 B TWI455643 B TW I455643B TW 097104609 A TW097104609 A TW 097104609A TW 97104609 A TW97104609 A TW 97104609A TW I455643 B TWI455643 B TW I455643B
- Authority
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- Taiwan
- Prior art keywords
- electrode
- light
- range
- auxiliary electrode
- emitting device
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 77
- 230000002093 peripheral effect Effects 0.000 claims description 65
- 239000011159 matrix material Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 152
- 239000011229 interlayer Substances 0.000 description 57
- 239000000463 material Substances 0.000 description 40
- 238000005192 partition Methods 0.000 description 27
- 230000004048 modification Effects 0.000 description 17
- 238000012986 modification Methods 0.000 description 17
- 238000007789 sealing Methods 0.000 description 14
- 230000006866 deterioration Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 230000007246 mechanism Effects 0.000 description 9
- 239000003566 sealing material Substances 0.000 description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 230000035699 permeability Effects 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 239000011241 protective layer Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 229910010272 inorganic material Inorganic materials 0.000 description 4
- 239000011147 inorganic material Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 229910000420 cerium oxide Inorganic materials 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 229910052732 germanium Inorganic materials 0.000 description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 3
- 238000002513 implantation Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 3
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 3
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- 229910052684 Cerium Inorganic materials 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 2
- 239000002274 desiccant Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910021478 group 5 element Inorganic materials 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 108091008695 photoreceptors Proteins 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/824—Cathodes combined with auxiliary electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007028842 | 2007-02-08 | ||
JP2007319269A JP5401784B2 (ja) | 2007-02-08 | 2007-12-11 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200906219A TW200906219A (en) | 2009-02-01 |
TWI455643B true TWI455643B (zh) | 2014-10-01 |
Family
ID=39837024
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097104609A TWI455643B (zh) | 2007-02-08 | 2008-02-05 | 發光裝置及電子機器 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5401784B2 (ko) |
KR (1) | KR101469767B1 (ko) |
CN (1) | CN101242691B (ko) |
TW (1) | TWI455643B (ko) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5439837B2 (ja) | 2009-02-10 | 2014-03-12 | ソニー株式会社 | 表示装置 |
KR102012160B1 (ko) | 2009-05-02 | 2019-08-19 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 패널 |
KR20110019498A (ko) | 2009-08-20 | 2011-02-28 | 삼성모바일디스플레이주식회사 | 유기전계발광 표시장치 |
JP5799492B2 (ja) * | 2010-10-05 | 2015-10-28 | セイコーエプソン株式会社 | 照明装置 |
KR101407587B1 (ko) * | 2011-06-02 | 2014-06-13 | 삼성디스플레이 주식회사 | 유기 발광 표시장치 및 그 제조방법 |
KR101834277B1 (ko) | 2011-09-20 | 2018-03-07 | 주성엔지니어링(주) | 발광 장치 |
KR101829890B1 (ko) | 2011-12-23 | 2018-02-20 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법 |
KR102083983B1 (ko) * | 2013-05-29 | 2020-03-04 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법 |
KR102159267B1 (ko) * | 2013-09-06 | 2020-09-24 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
CN104576688B (zh) | 2013-10-10 | 2018-11-09 | 精工爱普生株式会社 | 发光装置以及电子设备 |
CN104733470A (zh) * | 2013-12-20 | 2015-06-24 | 昆山国显光电有限公司 | 一种平板显示装置及其制备方法 |
KR102272230B1 (ko) * | 2014-10-29 | 2021-07-05 | 삼성디스플레이 주식회사 | 음의 전원 전압을 보상하기 위한 디스플레이 패널, 이를 포함하는 디스플레이 모듈 및 모바일 장치 |
KR102351664B1 (ko) * | 2015-01-14 | 2022-01-14 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
KR102426691B1 (ko) * | 2015-02-05 | 2022-07-28 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
KR102483229B1 (ko) * | 2015-12-31 | 2022-12-29 | 엘지디스플레이 주식회사 | 유기발광 표시장치 |
KR102632616B1 (ko) * | 2016-06-27 | 2024-02-02 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
KR20180035979A (ko) * | 2016-09-29 | 2018-04-09 | 엘지디스플레이 주식회사 | 유기발광 표시장치 |
KR102636565B1 (ko) * | 2016-09-30 | 2024-02-16 | 엘지디스플레이 주식회사 | 유기발광 표시장치 |
KR102325171B1 (ko) | 2017-03-20 | 2021-11-10 | 삼성디스플레이 주식회사 | 표시 장치 |
KR102353726B1 (ko) * | 2017-03-31 | 2022-01-20 | 삼성디스플레이 주식회사 | 표시 장치 |
KR102527793B1 (ko) | 2017-10-16 | 2023-05-04 | 삼성디스플레이 주식회사 | 표시 장치 및 그 구동 방법 |
KR102523646B1 (ko) | 2017-11-01 | 2023-04-21 | 삼성디스플레이 주식회사 | 표시 장치 및 그 구동 방법 |
JP2019091642A (ja) * | 2017-11-15 | 2019-06-13 | 株式会社ジャパンディスプレイ | 表示装置 |
KR102410500B1 (ko) * | 2017-11-30 | 2022-06-16 | 엘지디스플레이 주식회사 | 전계 발광 표시장치 |
KR102546170B1 (ko) | 2018-01-19 | 2023-06-22 | 삼성디스플레이 주식회사 | 표시 장치 |
KR102480092B1 (ko) * | 2018-04-30 | 2022-12-23 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
US11963402B2 (en) | 2019-03-25 | 2024-04-16 | Sharp Kabushiki Kaisha | Display device having auxiliary wiring line electrically connected to metal nanowire |
CN110112178B (zh) * | 2019-04-04 | 2021-07-23 | 深圳市华星光电半导体显示技术有限公司 | 显示面板以及显示装置 |
KR20210053395A (ko) | 2019-11-01 | 2021-05-12 | 삼성디스플레이 주식회사 | 표시 장치 |
US11462608B2 (en) * | 2020-03-25 | 2022-10-04 | Apple Inc. | Large panel displays with reduced routing line resistance |
CN116229846A (zh) * | 2020-12-02 | 2023-06-06 | 湖北长江新型显示产业创新中心有限公司 | 显示面板和显示装置 |
CN113097263B (zh) * | 2021-03-25 | 2024-05-24 | 京东方科技集团股份有限公司 | 显示基板和显示装置 |
Citations (3)
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TW484238B (en) * | 2000-03-27 | 2002-04-21 | Semiconductor Energy Lab | Light emitting device and a method of manufacturing the same |
TW200302439A (en) * | 2002-01-24 | 2003-08-01 | Semiconductor Energy Lab | Light emitting device and method of manufacturing the same |
US6900470B2 (en) * | 2001-04-20 | 2005-05-31 | Kabushiki Kaisha Toshiba | Display device and method of manufacturing the same |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002352963A (ja) * | 2001-05-23 | 2002-12-06 | Sony Corp | 表示装置 |
JP2003059660A (ja) * | 2001-08-17 | 2003-02-28 | Toshiba Corp | 自己発光型表示装置の製造方法 |
JP4627966B2 (ja) * | 2002-01-24 | 2011-02-09 | 株式会社半導体エネルギー研究所 | 発光装置およびその作製方法 |
JP4183951B2 (ja) * | 2002-02-25 | 2008-11-19 | 株式会社半導体エネルギー研究所 | 発光装置 |
JP4545385B2 (ja) * | 2002-03-26 | 2010-09-15 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法 |
KR100941129B1 (ko) * | 2002-03-26 | 2010-02-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광장치 및 그의 제조방법 |
JP4216008B2 (ja) * | 2002-06-27 | 2009-01-28 | 株式会社半導体エネルギー研究所 | 発光装置およびその作製方法、ならびに前記発光装置を有するビデオカメラ、デジタルカメラ、ゴーグル型ディスプレイ、カーナビゲーション、パーソナルコンピュータ、dvdプレーヤー、電子遊技機器、または携帯情報端末 |
JP4089544B2 (ja) * | 2002-12-11 | 2008-05-28 | ソニー株式会社 | 表示装置及び表示装置の製造方法 |
JP4593179B2 (ja) * | 2003-06-17 | 2010-12-08 | 株式会社半導体エネルギー研究所 | 表示装置 |
JP5017851B2 (ja) * | 2005-12-05 | 2012-09-05 | セイコーエプソン株式会社 | 発光装置および電子機器 |
JP4742835B2 (ja) * | 2005-12-05 | 2011-08-10 | セイコーエプソン株式会社 | 発光装置および電子機器 |
JP5104274B2 (ja) * | 2007-02-08 | 2012-12-19 | セイコーエプソン株式会社 | 発光装置 |
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2007
- 2007-12-11 JP JP2007319269A patent/JP5401784B2/ja active Active
-
2008
- 2008-01-30 KR KR1020080009329A patent/KR101469767B1/ko active IP Right Grant
- 2008-02-05 TW TW097104609A patent/TWI455643B/zh active
- 2008-02-05 CN CN2008100058083A patent/CN101242691B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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TW484238B (en) * | 2000-03-27 | 2002-04-21 | Semiconductor Energy Lab | Light emitting device and a method of manufacturing the same |
US6900470B2 (en) * | 2001-04-20 | 2005-05-31 | Kabushiki Kaisha Toshiba | Display device and method of manufacturing the same |
TW200302439A (en) * | 2002-01-24 | 2003-08-01 | Semiconductor Energy Lab | Light emitting device and method of manufacturing the same |
US6781162B2 (en) * | 2002-01-24 | 2004-08-24 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and method of manufacturing the same |
TW200617822A (en) * | 2002-01-24 | 2006-06-01 | Semiconductor Energy Lab Co Ltd | Light emitting device and method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
CN101242691A (zh) | 2008-08-13 |
CN101242691B (zh) | 2011-06-15 |
JP2008216975A (ja) | 2008-09-18 |
TW200906219A (en) | 2009-02-01 |
KR20080074738A (ko) | 2008-08-13 |
KR101469767B1 (ko) | 2014-12-05 |
JP5401784B2 (ja) | 2014-01-29 |
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