TWI453945B - Method for manufacturing led package - Google Patents

Description

Method for forming light emitting diode package structure

The invention relates to a method for forming a light emitting diode package structure.

The cutting method of the conventional light-emitting diode package structure generally adopts laser cutting, but in order to reduce the cutting cost and simplify the process, most of the current light-emitting diode process uses a breaking method. The specific method is: pre-cutting a plurality of cutting lines on a package substrate for forming a plurality of package structures, and after completing the packaging process, separating the plurality of light emitting diode package structures along the cutting lines respectively, thereby obtaining a plurality of A separate light-emitting diode package structure. However, in order to maintain the overall structure of the package substrate, the package substrate is prevented from being broken during the pre-cutting or subsequent packaging process, and the cutting line cannot be cut too deeply, which results in the inability to remove the light-emitting diode package structure due to stress. The transfer to the cutting line is good, and the edge of the light-emitting diode package structure after peeling is easily irregular, thereby affecting the yield of the light-emitting diode package structure.

In view of the above, it is necessary to provide a method for forming a light-emitting diode package structure in which the edge of the light-emitting diode package structure is peeled off and the yield is high.

A method for forming a light emitting diode package structure, comprising the steps of: providing a light emitting diode package substrate, wherein a plurality of intersecting cutting lines are respectively formed on the upper surface and the lower surface, and the cutting line is The light emitting diode package substrate is uniform Dividing into a plurality of single pieces; opening a through hole penetrating the upper surface and the lower surface of the light emitting diode package substrate at an intersection of the cutting lines; and the inner wall of the through hole is adjacent to the light emitting diode package substrate a slit is formed along the cutting line on the upper surface and the lower surface of the lower surface; a plurality of light emitting diode crystal grains are respectively disposed on each of the single sheets; and the light emitting diode is covered by a cover plate On the body package substrate, the cover plate is provided with an opening corresponding to each of the single pieces; an encapsulation layer is formed on each of the single pieces by the opening of the cover plate; and respectively stripped along the cutting line Each of the individual pieces is formed to form a plurality of light emitting diode package structures.

In the method for forming a light-emitting diode package structure of the present invention, the light-emitting diode package substrate is pre-cut with cutting lines on the upper and lower surfaces, respectively, and slits are respectively formed along the cutting lines on the upper and lower surfaces. Therefore, in the stripping process, the transfer of stress is facilitated, and the peeling is easier. The edge of the light-emitting diode package structure after peeling is more regular, and the yield is relatively high.

100‧‧‧Light Emitting Diode Substrate

110‧‧‧ upper surface

120‧‧‧lower surface

130‧‧‧ cutting line

140‧‧‧one piece

141‧‧‧ Groove

142‧‧‧Upper electrode

143‧‧‧ lower electrode

150‧‧‧through hole

160‧‧‧ incision

200‧‧‧Light-emitting diode grains

300‧‧‧ Cover

310‧‧‧ openings

400‧‧‧Encapsulation layer

500‧‧‧Injection head

1 is a plan view of a light emitting diode package substrate in accordance with an embodiment of the present invention.

2 is a bottom view of a light emitting diode package substrate in accordance with an embodiment of the present invention.

3 is a cross-sectional view of the light emitting diode package substrate of FIG. 1 taken along III-III.

4 is a plan view showing the light emitting diode chip in the light emitting diode package substrate of FIG. Figure.

FIG. 5 is a schematic diagram of covering a light emitting diode package substrate with a cover plate and injecting the package colloid.

The invention will be further described in detail below with reference to the accompanying drawings.

The method for forming a light emitting diode package structure provided by the embodiment of the invention includes the following steps:

In the first step, referring to FIG. 1 to FIG. 3, a light emitting diode package substrate 100 is provided, which includes an upper surface 110 and a lower surface 120. The upper surface 110 and the lower surface 120 respectively form a plurality of pre-cuts. The intersecting transverse and longitudinal cutting lines 130 divide the light emitting diode package substrate 100 into a plurality of individual sheets 140. In order to maintain the overall structure of the LED package substrate 100 and prevent it from breaking, the depth of the cutting line 130 should not be too deep, and the specific depth should be determined depending on the material of the substrate. On the upper surface 110 of the LED package substrate 100, each of the individual pieces 140 is provided with a groove 141, and the upper electrode 142 is disposed in the groove 141. An electrode 143 corresponding to the upper electrode 142 is disposed on the lower surface 120 of the LED package substrate 100, and the upper electrode 142 and the lower electrode 143 are electrically connected to each other. In the embodiment, the LED package substrate 100 is a ceramic substrate.

Step 2, a through hole 150 penetrating the upper surface 110 and the lower surface 120 of the LED package substrate 100 is formed at an intersection of the horizontal and vertical cutting lines 130.

Step 3: The inner wall of the through hole 150 is adjacent to the upper surface 110 of the LED package substrate 100 and the upper and lower ends of the lower surface 120 are respectively opened along the cutting line 130. A slit 160. The slit 160 is in communication with the cutting line 130 and is deeper than the depth of the cutting line 130. In the present embodiment, the slit 160 has a "V" shape in a direction perpendicular to the LED package substrate 100.

Step 4, referring to FIG. 4, a plurality of LED dipoles 200 are respectively disposed in the recesses 141 of each of the individual sheets 140, and electrically connected to the upper electrodes 142 therein.

In step 5, referring to FIG. 5, the cover plate 300 is covered on the LED package substrate 100, and the cover plate 300 defines an opening 310 corresponding to the recess 141 of each of the single pieces 140.

In step six, the encapsulant is injected into the recess 141 of each of the single sheets 140 by the opening 310 of the cover 300 to form an encapsulation layer 400 covering the LED die 200. In the present embodiment, an encapsulant is injected into the recess 141 of each of the individual sheets 140 by the opening 310 of the cover 300 by means of a plastic injection head 500. The encapsulant may be composed of an epoxy resin, a resin, or a combination thereof. The encapsulant may further include a phosphor powder, and the phosphor powder may be a garnet structure compound, a niobate, a nitride, an oxynitride, a phosphide, a sulfide, or a combination thereof.

In step seven, each of the individual pieces 140 is peeled off along the cutting line 130, thereby forming a plurality of light emitting diode package structures.

During the stripping process, when the pressure on the upper surface 110 of the LED package substrate 100 is applied, a tensile stress is generated at the slit 160 of the upper surface 110, and the stress will be extended downward to find the light-emitting diode. The relatively fragile region of the polar package substrate 100 extends to the relatively deep slit 160 of the lower surface 120 to peel the light emitting diode package from the LED package substrate 100. Come down. Due to the upper surface 110 and the lower surface of the light emitting diode package substrate 100 The slits 160 deeper than the cutting line 130 are respectively opened, which is more favorable for the transfer of stress, and the peeling is easier. The edge of the light-emitting diode package structure after peeling is more regular and the yield is relatively high. In addition, since the cutting line 130 and the slit 160 are covered by the cover 300 during the injection molding of the light-emitting diode, the liquid packaging material does not flow into the cutting line 130 and the slit 160. Thus, there is no influence on the stress transmission at the cutting line 130 and the slit 160.

In the method for forming a light-emitting diode package structure of the present invention, the light-emitting diode package substrate is pre-cut with cutting lines on the upper and lower surfaces, respectively, and slits are respectively formed along the cutting lines on the upper and lower surfaces. Therefore, in the stripping process, the transfer of stress is facilitated, and the peeling is easier. The edge of the light-emitting diode package structure after peeling is more regular, and the yield is relatively high.

In addition, those skilled in the art can make other changes in the spirit of the present invention. Of course, the changes made in accordance with the spirit of the present invention should be included in the scope of the present invention.

100‧‧‧Light Emitting Diode Substrate

141‧‧‧ Groove

200‧‧‧Light-emitting diode grains

300‧‧‧ Cover

310‧‧‧ openings

400‧‧‧Encapsulation layer

500‧‧‧Injection head

Claims (7)

A method for forming a light emitting diode package structure, comprising the steps of: providing a light emitting diode package substrate, wherein a plurality of intersecting cutting lines are respectively formed on the upper surface and the lower surface, and the cutting line is The light emitting diode package substrate is evenly divided into a plurality of single pieces; a through hole penetrating the upper surface and the lower surface of the light emitting diode package substrate is formed at an intersection of the cutting lines; and the inner wall of the through hole is close to The upper surface of the upper surface and the lower surface of the lower surface of the light-emitting diode package substrate respectively have slits along the cutting line, and the slits are in communication with the cutting line and are deeper than the cutting line; The illuminating diode dies are respectively disposed on each of the single dies; the cover plate is covered on the illuminating diode package substrate by a cover plate, and the cover plate is provided with an opening corresponding to each of the single pieces; An encapsulation layer is formed on each of the individual sheets by the opening of the cover; each of the individual pieces is peeled off along the cutting line, thereby forming a plurality of light emitting diode package structures. The method for forming a light emitting diode package structure according to claim 1, wherein the substrate is a ceramic substrate. The method for forming a light emitting diode package structure according to claim 1, wherein each of the single pieces is provided with a groove, and the opening of the cover plate corresponds to the groove. The method for forming a light emitting diode package structure according to claim 3, wherein: the upper electrode is disposed in the groove, and the upper surface of the substrate is disposed on the lower surface of the substrate a lower electrode, the upper electrode and the lower electrode are electrically connected to each other, the light emitting diode The body grains are disposed in the recess and are electrically connected to the upper electrode. The method for forming a light emitting diode package structure according to claim 1, wherein the slit is in communication with the cutting line and is "V" in a direction perpendicular to the light emitting diode package substrate. Font type. The method for forming a light emitting diode package structure according to claim 1, wherein the encapsulant is composed of an epoxy resin, a enamel resin or a combination of the two. The method for forming a light-emitting diode package structure according to claim 1, wherein: the package colloid further comprises a phosphor powder, wherein the phosphor powder is a garnet structure compound, a niobate, and a nitrogen. a compound, an oxynitride, a phosphide, a sulfide or a combination of the foregoing.