JP2012231068A - Light emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device which enhances the bonding strength with a conductive bonding part and with a conductive bonding material such as solder and improves the mounting accuracy.SOLUTION: A light emitting device includes: a light emitting element 50; a package body 30 housing the light emitting element 50; and a pair of leads 10, 20 respectively protruding from surfaces of the package body 30 which face each other. The pair of leads 10, 20 respectively has: first side surfaces 11, 21 disposed on the same plane surfaces as a side surface of the package body 30 and on which lead base materials are exposed; and second side surfaces 12, 22 serving as terminal surfaces of the lead 10, 20 and having surfaces coated by a metal layer. Recessed parts 14, 24, having surfaces coated by the metal layer, are respectively provided on the first side surfaces 11, 21.

Description

  The present invention relates to a light emitting device that can be used for a display device, a lighting fixture, a display, a backlight light source of a liquid crystal display, an illumination auxiliary light source, and the like.

  In recent years, various semiconductor devices have been proposed and put into practical use, and the performance required for them has been increased. Among semiconductor devices, light emitting devices such as light emitting diodes (LEDs) are required to have higher output (brightness) and improved reliability, while satisfying these characteristics. There is also a demand for stable supply at a low price.

  Conventionally, as a light emitting device, a package substrate having a resin part made of a thermosetting resin integrally formed with a printed wiring board having metal wiring, and an LED element accommodated in a recess provided on the upper surface side of the package substrate And a transparent sealing resin that fills the recess and covers the LED element has been proposed (see, for example, Patent Documents 1 and 2).

  FIG. 9A is a perspective view illustrating a method for manufacturing a conventional light emitting device, and FIG. 9B is a perspective view illustrating the conventional light emitting device. In this light emitting device, first, a matrix-like optical semiconductor element having a plurality of recesses is formed by injecting a light-reflective thermosetting resin composition onto a flat printed wiring board or lead frame, followed by heat and pressure molding. A mounting package substrate 401 is produced. Then, the optical semiconductor element mounting package substrate 401 is cut along the dicing line 402. As a result, the light emitting device 403 shown in FIG. 9B is obtained.

JP 2007-235085 A JP 2010-062272 A

  However, the light emitting device in which the leads are cut together with the resin on all the side surfaces at the time of singulation has a small exposed area of the leads, and the side surfaces of the leads, which are the cut surfaces, become unplated surfaces. In addition, an adhesive member such as solder is difficult to crawl on the side surface of the lead, and the bonding strength and mounting accuracy during mounting are not sufficient.

  The present invention has been made in view of such problems, and an object thereof is to provide a light emitting device capable of improving the bonding strength with an adhesive member and the mounting accuracy.

  The light-emitting device of the present invention includes a light-emitting element, a package main body that houses the light-emitting element, and a pair of leads that protrude from opposing surfaces of the package main body, and the pair of leads respectively includes a side surface of the package main body. A first side surface that is disposed on the same plane and from which the lead base material is exposed; and a second side surface that is a terminal end surface of the lead and whose surface is coated with a metal layer. Recesses covered with layers were provided.

In this light emitting device, the recess is preferably a step that is recessed from the bottom surface and the first side surface of the lead.
The lead preferably further has a third side surface that connects the first side surface and the second side surface and has a surface covered with a metal layer.
The recess is preferably a step that is recessed from the bottom surface, the first side surface, and the third side surface of the lead.
It is preferable that the recessed part is comprised by the curved surface.

  The light emitting device of the present invention can improve the bonding strength with a conductive adhesive member such as solder used for mounting the light emitting device, and can further improve the mounting accuracy.

It is the top view and side view which show the light-emitting device which concerns on the 1st Embodiment of this invention. It is sectional drawing which shows the light-emitting device which concerns on the 1st Embodiment of this invention. 1 is a perspective view showing a light emitting device according to a first embodiment of the present invention. It is sectional drawing which shows an example of the mounting form of the light-emitting device of this invention. It is the top view and side view which show the light-emitting device which concerns on the 2nd Embodiment of this invention. It is a perspective view which shows the light-emitting device which concerns on the 2nd Embodiment of this invention. It is a top view for demonstrating the manufacturing process of the light-emitting device which concerns on embodiment of this invention. It is a top view for demonstrating the manufacturing process of the light-emitting device which concerns on embodiment of this invention. It is a perspective view which shows the manufacturing process of the conventional light-emitting device, and a light-emitting device.

  Hereinafter, embodiments for implementing a light emitting device according to the present invention will be described in detail with reference to the drawings. In the present specification, the term “lead” and “package body” are used for the light emitting device after being singulated, and the terms “lead frame” and “resin molded body” are used before the singulation.

<First Embodiment>
The light emitting device according to the first embodiment will be described. FIG. 1A is a plan view showing the light emitting device 100 according to the first embodiment, and FIG. 1B is a side view showing the light emitting device 100 according to the first embodiment. FIG. 2 is a cross-sectional view showing the light emitting device 100 according to the first embodiment. 3A is a perspective view from above showing the light emitting device 100 according to the first embodiment, and FIG. 3B is a perspective view from below showing the light emitting device 100 according to the first embodiment. FIG.

  As shown in FIGS. 1 to 3, the light emitting device 100 includes a package main body 30, a pair of leads 10 and 20 protruding from opposing surfaces of the package main body 30, and a light emission stored in a cavity of the package main body 30. An element 50 and a translucent sealing member 40 that fills the cavity of the package body 30 and covers the light emitting element 50 are provided. The p electrode and the n electrode of the light emitting element 50 are electrically connected to the leads 10 and 20 via the metal wires 60, respectively.

  The lead 10 includes a first side surface 11 disposed on the same plane as the side surface of the package body 30 and a second side surface 12 that is a terminal surface of the lead 10. The first side surface 11 is provided with a recess 14. ing. Similarly, the lead 20 has a first side surface 21 and a second side surface 22, and the first side surface 21 is provided with a recess 24. Since the recesses 14 and 24 are provided as steps that are recessed from the bottom surfaces 15 and 25, they are indicated by broken lines in FIG. The leads 10 and 20 are members in which a metal layer is formed on a part of the lead base material. The regions covered with the metal layer on the surfaces of the leads 10 and 20 are shown in FIGS. In FIG. As shown in FIGS. 3A and 3B, the first side surfaces 11 and 21 arranged on the same plane as the package main body 30 have the lead base material exposed, the second side surfaces 12 and 22, the recesses 14, 24 is covered with a metal layer. The bottom surfaces 15 and 25 and the top surface are also covered with a metal layer.

  As will be described in detail in the second embodiment, the light emitting device 100 is formed by molding a resin molded body serving as a package body on a plate-like lead frame in which a metal layer is formed on the surface of a lead base material. The molded body is cut into single pieces and manufactured. By manufacturing in this way, a small light emitting device can be obtained at a low cost. On the other hand, the side surface of the lead that is cut together with the resin molded body becomes a surface on which the lead base material is exposed, and a metal layer is formed. The conductive adhesive member such as solder is more difficult to adhere than the applied surface. Therefore, in the light emitting device 100, the second side surfaces 12 and 22 are projected from the package body 30 to form a non-cut surface. Accordingly, the second side surfaces 12 and 22 can be surfaces coated with the metal layer, and the adhesion area with the adhesive member can be expanded.

  An example of a mounting form of the light emitting device 100 is shown in FIG. FIG. 4A corresponds to the cross-sectional view shown in FIG. As shown in FIG. 4A, when the light emitting device 100 is adhered to the mounting substrate 80 by the adhesive member 70, the adhesive member 70 crawls up on the second side surfaces 12 and 22 covered with a metal layer (not shown), A fillet-like scooping portion is formed, and the bonding strength is improved. Further, as shown by an arrow in FIG. 4A, such a scooping portion applies a force for pulling the light emitting device 100 in the left-right direction in the figure, so that the light emitting device 100 is mounted by pulling in two opposite directions. Deviation can be suppressed and mounting accuracy can be improved.

  The light emitting device 100 further includes recesses 14 and 24 covered with a metal layer on the first side surfaces 11 and 21 where the lead base material is exposed. Since the first side surfaces 11 and 21 are surfaces where the lead base material is exposed, the adhesive member hardly crawls up. However, the concave portions 14 and 24 are covered with a metal layer in the same manner as the second side surfaces 12 and 22, and are bonded. The member crawls well. As a result, the bonding strength can be further improved, and in addition to the horizontal direction in FIG. 1A, a pulling force in the vertical direction, which is the opening direction of the recesses 14 and 24, is applied, and light emission in the vertical and horizontal directions in the figure. The mounting deviation of the device 100 can be suppressed, and the mounting accuracy can be further improved. In addition, the up-down direction and the left-right direction in a figure shown here are directions which mutually intersect perpendicularly.

  An example of a mounting form of the light emitting device 100 is shown in FIG. FIG. 4B is a schematic view of a cross section traversing two recesses 14 arranged on both sides of the lead 10. As shown in FIG. 4B, it is difficult for the adhesive member 70 to scoop up on the first side surface 11 where the lead base material is exposed, but the adhesive member 70 can be scooped up in the recess 14 covered with the metal layer. it can. Furthermore, by forming the recess 14 in a stepped shape in this way, the adhesive member 70 can be crawled up also on the ceiling portion in the recess 14, and the bonding strength can be further improved.

  Hereinafter, each member will be described in detail.

(Lead)
The leads 10 and 20 are provided with a predetermined interval so as to form a pair of positive and negative. As described above, of the leads 10 and 20 protruding from the package main body 30, the first side surfaces 11 and 21 are surfaces where the lead base material is exposed, and the second side surfaces 12 and 22 and the recesses 14 and 24 are metal layers. It is a coated surface. The top surfaces of the leads 10 and 20 can also be covered with a metal layer, and the top surfaces of the leads 10 and 20 exposed at the inner bottom surface of the cavity are preferably also covered with a metal layer. The metal layer can be formed by plating. This plating process can be performed at an arbitrary timing before separation, and a lead frame that has been subjected to a plating process in advance can also be used.

  As the lead base material, for example, a metal plate of a good electrical conductor such as iron, phosphor bronze, copper alloy or the like is used. As the metal layer, a material having better adhesion to an adhesive member such as solder than the lead base material is used. When the metal layer is also formed on the mounting surface of the light emitting element, the outermost surface is made of silver, aluminum, copper, gold, or an alloy thereof in order to increase the reflectance of light from the light emitting element. Is preferred.

  The leads 10 and 20 preferably protrude from the package body 30 by 0.1 mm or more. As a result, when the light emitting device 100 is bonded to a mounting substrate or the like, the leads 10 and 20 protrude so that a fillet-like scooping up of the adhesive member can be easily formed, improving mounting accuracy and bonding strength. Can be planned. In order to reduce the size of the light emitting device 100, it is preferable that the protruding length of the leads 10 and 20 be at least smaller than the width of the leads 10 and 20, more preferably half or less, and further 20% or less. Is preferred. Preferably, the leads 10 and 20 are projected to the same extent as their thickness. The thicknesses of the leads 10 and 20 are not particularly limited, but are, for example, 0.1 mm or more and 1 mm or less.

  The leads 10 and 20 preferably protrude from the short side of the substantially rectangular package body 30. Thereby, the width of the second side surfaces 12 and 22 can be made narrower than when projecting from the long side, the contact area with the adhesive member on the second side surfaces 12 and 22, and the contact area of the adhesive member on the concave portions 14 and 24. This is because the difference can be reduced. By reducing the difference in contact area, it is possible to reduce the difference in tensile strength due to the creeping up of the adhesive member, so that it can be pulled in each direction with a relatively good balance, and the mounting accuracy can be further improved.

  Further, the side opposite to the protruding portion of the leads 10 and 20, that is, the side covered with the package body 30 is narrower than the protruding portion so that not only the upper surface of the leads 10 and 20 but also the side surface is covered with the package body 30. It is preferable that As a result, the adhesion between the leads 10 and 20 and the package body 30 can be improved, and stress due to thermal history during manufacturing can be relieved. Specifically, as shown in FIG. 3B, in a region where the upper surfaces of the leads 10 and 20 are covered with the package body 30, the side that is continuous with the protruding portion is a wide portion having the same width as the protruding portion. The package body 30 is covered with the side surface as a narrow portion narrower than the projecting portion on the inner side. The length of the wide portion is not particularly limited, but can be provided with a length that is the same as or shorter than the length of the protruding portion.

(Concave)
The recesses 14 and 24 are surfaces recessed from the first side surfaces 11 and 21 and are covered with a metal layer. By being a surface that is recessed from the first side surfaces 11 and 21 that are cut surfaces, it can be a non-cut surface and can be separated into pieces while being covered with a metal layer. As shown in FIGS. 1A and 1B, the recesses 14 and 24 are provided at positions separated from the second side surfaces 12 and 22. By forming the recesses 14 and 24 with curved surfaces, the adhesive member can be easily filled, and the contact area with the adhesive member can be increased. More preferably, it is a recess recessed in an arc shape when viewed from the bottom side of the light emitting device 100. The recesses 14 and 24 are preferably provided at the four corners of the light emitting device 100 with the same shape and size. The recesses 14 and 24 are provided in a shape opened in a direction different from the direction of the second side surfaces 12 and 22, that is, the normal direction of the second side surfaces 12 and 22, The shape is open in a direction perpendicular to the normal direction of 22.

  The recesses 14 and 24 shown in FIGS. 1 to 3 are steps that do not penetrate to the top surface of the lead. If the step shape is recessed from the bottom surface, it does not appear on the top surface of the lead. If the chip has a chip shape penetrating from the bottom surface to the top surface of the lead, the resin for molding is formed through the chip of the lead when the upper mold for molding the package body 30 is displaced if formed at a position close to the package body 30. Although there is a case of leakage, since the step shape does not penetrate to the upper surface of the lead as described above, no resin leakage occurs even if the upper mold is displaced, so that it can be formed in a position close to the package body 30. Thereby, an increase in the protruding length of the leads 10 and 20 can be suppressed, and the light emitting device 100 can be downsized.

  Moreover, since the amount of creeping up of the adhesive member is smaller than in the case of chipping, the amount of wraparound of the adhesive member in the opening direction of the recess is reduced, and the spread of the adhesive member can be expected. For example, with the light emitting device 100 according to the present embodiment, it is possible to suppress the spread of the adhesive member in the vertical direction in FIG. Such a light emitting device is particularly suitable for a bar-shaped light source in which a plurality of light emitting devices are arranged with the short sides facing each other. Furthermore, as described above, the step shape can crawl up the adhesive member also on the ceiling part of the step, and the contact area of the adhesive member can be expanded, so that both the suppression of the spread of the adhesive member and the improvement of the bonding strength are achieved. be able to. The height of the step is preferably about ¼ to 4/5 of the thickness of the leads 10 and 20, particularly preferably about half.

  Further, the recesses 14 and 24 can be chipped to penetrate to the upper surface of the lead. If it is a chipped shape, the bonding area with the adhesive member can be increased, and the bonding strength can be improved. When the recess has a chipped shape, it is disposed closer to the lead end surface (second side surfaces 12, 22) than the package body 30 in order to prevent resin leakage due to mold deviation when the package body 30 is molded. It is preferable.

(Package body)
As the package body 30, an insulating member capable of insulating the leads 10 and 20 is used. Further, it is preferable that the light emitting element 50 is made of a material having a high reflectance with respect to light emission. The light reflectance at a wavelength of 350 nm to 800 nm is preferably 70% or more, and the light reflectance at a wavelength of 420 nm to 520 nm is particularly preferably 80% or more. As such a material, a light-transmitting thermosetting resin filled with a light-reflecting substance can be used. As the light-transmitting resin, a thermosetting resin and a thermoplastic resin can be used, but it is preferable to use a thermosetting resin.

  The outer shape of the package main body 30 is preferably a shape having at least a pair of opposed surfaces as surfaces from which the leads 10 and 20 are projected. It is not limited to a substantially rectangular parallelepiped as shown in FIG. 1 and FIG. 2, but can be a substantially cube, a substantially hexagonal column, or an outer shape having another polygonal shape when viewed from the light emitting surface side. The height of the package body 30 is not particularly limited, but is preferably 0.1 mm or more.

  The package body 30 can be formed with a concave cavity having an inner bottom surface and an inner side surface. Leads 10 and 20 are disposed on the inner bottom surface of the cavity. The cavity can take various shapes such as a substantially circular shape, a substantially elliptical shape, a substantially rectangular shape, a substantially polygonal shape, and a combination thereof, as viewed from the light emitting surface side. The cavity preferably has a shape that expands in the opening direction, but may have a cylindrical shape.

(Sealing member)
The material of the sealing member 40 is, for example, a thermoplastic resin or a thermosetting resin. The sealing member 40 is preferably hard so as to protect the light emitting element. The sealing member 40 is preferably made of a resin excellent in heat resistance, weather resistance, and light resistance. The sealing member 40 may be mixed with at least one selected from the group consisting of a filler, a diffusing agent, a pigment, a phosphor, and a reflective substance in order to have a predetermined function. Further, for the purpose of cutting an undesired wavelength, the sealing member 40 can contain an organic or inorganic coloring dye or coloring pigment.

(Light emitting element)
The light emitting element 50 can use a face-up structure or a face-down structure. The size of the light emitting element 50 is not particularly limited. Further, a plurality of light emitting elements 10 can be used, and all of them may be of the same type, or may be of different types exhibiting red, green and blue light emission colors which are the three primary colors of light. As the light emitting element 50, one having an emission peak wavelength of 350 nm to 800 nm can be used. In particular, when the light-emitting element 50 made of a nitride semiconductor is used, it is preferable to use a light-emitting element having an emission peak wavelength in a short wavelength region of visible light of 420 nm to 550 nm. The light emitting element 50 is formed on the leads 10 and 20 with, for example, a resin such as epoxy or silicone, a solder such as Au—Sn eutectic, a conductive paste such as silver, gold, or palladium, or a brazing material such as a metal having a low melting point. Be joined.

<Second Embodiment>
A light emitting device according to a second embodiment will be described. FIG. 5A is a plan view showing the light emitting device 200 according to the first embodiment, and FIG. 5B is a side view showing the light emitting device 200 according to the first embodiment. 6A is a perspective view from the top showing the light emitting device 200 according to the first embodiment, and FIG. 6B is a perspective from the bottom showing the light emitting device 200 according to the first embodiment. FIG. The light emitting device according to the present embodiment can employ the same configuration as the light emitting device according to the first embodiment except that the shapes of the leads 210 and 220 are different. Also, members common to the light emitting device according to the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  As shown in FIGS. 5 and 6, the light emitting device 200 emits light by filling the package main body 30, a pair of leads 210 and 220 protruding from the opposing surfaces of the package main body 30, and the cavity of the package main body 30. And a translucent sealing member 40 covering the element. The leads 210 and 220 are used as a pair of positive and negative electrodes.

  The lead 210 includes a first side surface 211 that is disposed on the same plane as the side surface of the package body 30, a second side surface 212 that is a terminal surface of the lead 210, and a third side surface that connects the first side surface 211 and the second side surface 212. 213, and the first side surface 211 is provided with a recess 214. Similar to the first side surface 211 and the second side surface 212, the third side surface 213 is a surface that connects the top surface to the bottom surface of the lead 210. As illustrated in FIG. And a surface disposed at an angle different from both of the second side surface 212 and the second side surface 212. Preferably, the third side surface 213 is arranged so as to face a direction different from the opening direction of the recess 214. Similarly, the lead 220 has a first side 221, a second side 222, and a third side 223, and is provided with a recess 224. The recesses 214 and 224 are steps that are recessed from the bottom surfaces 215 and 225 and do not appear on the top surface, and therefore are indicated by broken lines in FIG. Moreover, the area | region which is coat | covered with the metal layer among the surfaces of lead | read | reed 210,220 is shown by the oblique line in Fig.6 (a) and (b). As shown in FIGS. 6A and 6B, the first side surfaces 211 and 221 arranged in the same plane as the package body 30 have the lead base material exposed, the second side surfaces 212 and 222, the recesses 214, 224 is covered with a metal layer. The bottom surfaces 215 and 225 and the top surface are also covered with a metal layer.

  By providing the third side surfaces 213 and 223 covered with the metal layer, an adhesive member such as a solder can be crawled up on the third side surfaces 213 and 223 as well. Thereby, the adhesive strength is further improved. Further, by providing third side surfaces 213 and 223 that face in directions different from the direction in which the second side surfaces 212 and 222 face and the opening direction of the recesses 214 and 224, the second side surfaces 212 and 222 are provided in the light emitting device 200. Further, since pulling in a direction different from the recesses 214 and 224 is applied, mounting displacement can be further suppressed and mounting accuracy can be improved.

  As shown in FIGS. 5 and 6, the recess 214 is preferably a step that is recessed from the bottom surface 215, the first side surface 211, and the third side surface 213. The same applies to the recess 224. As a result, both the recesses 214 and 224 and the third side surfaces 213 and 223 can be formed in a narrow range while ensuring the contact area of the third side surfaces 213 and 223 with the adhesive member. it can. Further, as will be described later, since the lead thickness at the position where the blade is cut during singulation can be reduced, it is easy to cut and the cutting time can be shortened. The third side surfaces 213 and 223 and the recesses 214 and 224 are preferably provided at the four corners of the light emitting device 200 with the same shape and size as shown in FIGS.

  As shown in FIGS. 5 and 6, through holes may be provided in the leads 210 and 220, and the package body 30 a may be filled in the through holes. As a result, the adhesion between the lead and the package body can be improved. As shown in FIG. 5 and FIG. 6, the through hole is formed so that a part thereof is disposed in the protruding portion of the leads 210 and 220, so that the portion 30 a of the package body is formed in the protruding portion of the leads 210 and 220. Is formed, and peeling between the lead and the package body can be suppressed.

  Further, as shown in FIGS. 5 and 6, the lead 210a may be exposed at a position which is the same plane as the first side surfaces 211 and 221 and is separated from them. The lead 210a is a portion connected to an adjacent light emitting device in the lead frame state before being singulated, and is a cut surface cut in the same manner as the first side surfaces 211 and 221 at the time of singulation.

(Method for manufacturing light emitting device)
The light-emitting device 200 shown in FIGS. 5 and 6 forms a resin molded body 94 that is continuous along the slit 91 of the lead frame 90 as shown in FIG. 8 and the step of preparing the lead frame 90 shown in FIG. The manufacturing method mainly includes a process and a process of cutting the lead frame 90 and the resin molded body 94 into individual pieces along a line connecting the hole portion 91a and the concave portion 92 of adjacent slits. preferable.

  First, the lead frame 90 will be described. The lead frame 90 is obtained by punching or etching a flat metal plate. In the lead frame 90 shown in FIG. 7, light emitting device portions that become light emitting devices after being singulated are arranged in a matrix, and linear slits 91 that separate the light emitting device portions for each row are formed. The linear slit 91 has a shape that is long in the column direction (left-right direction in the figure). Further, between the adjacent light emitting device portions, a hole portion 91a having a wide slit 91 and a concave portion 92 which is a step recessed from the bottom surface of the lead frame 90 at a position continuous with a part of the hole portion 91a are formed. ing. In addition, since the recessed part 92 is a level | step difference dented from the bottom face, it shows with a broken line in FIG. 7 which is a top view seen from the upper surface.

  In addition, the lead frame 90 includes a through hole 93a for separating a plurality of adjacent light emitting device parts, a through hole 93b for providing an insulating part in which the separated lead is a pair of positive and negative electrodes, a resin molded body, May be provided with a through-hole 93c for improving the adhesiveness. In a later step, these through holes 93a, 93b, 93c are filled with a resin molded body.

  Such through holes and steps are preferably formed by etching. For example, through holes and steps can be formed by etching from the top and bottom surfaces under conditions where about half the lead frame thickness is processed. At this time, the through hole can be formed by processing from both the top surface and the bottom surface, and the step can be formed by processing from only one of the surfaces. Such processing can be performed by using different mask patterns for the top and bottom surfaces. Further, since the processed surface by the etching process is a curved surface, the step formed by the curved surface can be easily obtained by forming the step by the etching process.

  Next, as shown in FIG. 8, a plurality of rows of resin molded bodies 94 integrated in the row direction (left and right direction in the drawing) of the lead frame 90 are formed. The resin molded body 94 is formed, for example, by sandwiching the lead frame 90 between an upper mold and a lower mold and transfer molding the resin. As shown in FIG. 8, the resin molded body 94 preferably has a shape in which long sides of a plurality of light emitting devices are connected.

  The plating treatment for forming the metal layer on the lead base material can be performed before the resin molded body 94 is formed, but is preferably performed after the resin molded body 94 is formed. Since the surface state of the lead frame is rougher before the plating process, the adhesion between the lead frame and the resin molded body can be improved by forming the resin molded body before the plating process.

  And it cut | disconnects along the division | segmentation scheduled line shown with a dashed-dotted line in FIG. The planned dividing line extends in the row direction (vertical direction in the drawing), and the lead frame 90 and the resin molded body 94 are collectively cut at this position to obtain the light emitting device 200 shown in FIGS. Can do. Note that the column direction and the row direction shown here are perpendicular to each other. At this time, since the step-shaped concave portion 92 is provided at the division position, the lead thickness at the position where the blade for cutting the piece is cut can be reduced, so that it is easy to cut and the cutting time can be shortened.

  Further, as shown in FIG. 8, since the plurality of light emitting device portions are separated for each row in advance by the slits 91, they can be completely separated by only cutting in the row direction, and the number of steps can be reduced. In addition, since the resin molded body 94 is separated for each row, stress to the lead frame 90 and the resin molded body 94 due to the thermal history during the manufacturing process is independently applied for each row, so that all resin moldings are performed. Compared with the case where the body is connected, the stress is relaxed, and the warping of the lead frame 90 is suppressed. Further, by forming the resin molded body 94 having a thermal expansion coefficient different from that of the lead frame 90 so as to cover not only the upper surface but also the side surface of the lead frame 90, the stress due to the thermal history can be further relaxed.

100, 200 Semiconductor device 10, 20, 210, 210a, 220 Lead 11, 21, 211, 221 First side surface 12, 22, 212, 222 Second side surface 213, 223 Third side surface 14, 24, 214, 224 Recessed portion 15 , 25, 215, 225 Bottom surface 30, 30a Package body 40 Sealing member 50 Light emitting element 60 Metal wire 70 Adhesive member 80 Mounting substrate 90 Lead frame 91 Slit 91a Hole 92 Recess 93A, 93b, 93c Through hole 94 Resin molded body

Claims (5)

A light emitting element;
A package body for housing the light emitting element;
A pair of leads each projecting from the opposing surface of the package body,
The pair of leads are a first side surface that is arranged in the same plane as the side surface of the package main body and the lead base material is exposed, and a second side surface that is a terminal end surface of the lead and whose surface is covered with a metal layer. And having
A light-emitting device, wherein the first side surface is provided with a recess whose surface is covered with a metal layer.   The light-emitting device according to claim 1, wherein the recess is a step that is recessed from a bottom surface of the lead and the first side surface.   3. The light emitting device according to claim 1, wherein the lead further includes a third side face that connects the first side face and the second side face and has a surface covered with a metal layer.   The light emitting device according to claim 3, wherein the recess is a step that is recessed from a bottom surface of the lead, the first side surface, and the third side surface.   The light-emitting device according to claim 1, wherein the concave portion is configured by a curved surface.

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