JP2018160673A - Method for manufacturing package, method for manufacturing package intermediate, and method for manufacturing light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thin type package, a package intermediate and a light-emitting device.SOLUTION: A package 100 comprises: a first electrode 10; a second electrode 20; and a first resin body 30 for holding the first electrode 10 and the second electrode 20. The package has a bottom part 101, and a wall part 31 including a plurality of outer faces 31a, 31b, 31c, 31d surrounding a placement region on the bottom part 101. The first electrode 10 and the second electrode 20 each have an outer lead part 11 extending outwardly from two opposing outer faces 31a, 31c of the wall part 31. The first resin body 30 includes: the wall part 31; and collar parts 32c provided to extend outwardly from the outer faces 31a, 31c of the wall part 31, where the respective outer lead parts 11 are disposed. The outer lead parts 11 are provided so as to extend to outside leading ends of the respective collar parts 32c in plan view.SELECTED DRAWING: Figure 1

Description

  The present disclosure relates to a package, a package intermediate, a light emitting device, and a method for manufacturing the same.

Conventionally, a package including a lead is manufactured by injecting a thermoplastic resin from the lower surface side (see, for example, Patent Documents 1 and 2). Then, after curing the resin, the lead is bent to form a light emitting device.
In addition, it is known that a package is formed by injecting a resin into a cavity corresponding to a package shape in a molding die and curing it, and molding a resin body integrally with a lead (for example, Patent Documents). 3).

JP 2010-186896 A JP 2013-051296 A JP 2013-077783 A

  In the light emitting devices described in Patent Document 1 and Patent Document 2, since the resin is injected from the lower surface side of the leads, the thickness of the package is increased. In addition, the thickness of a light emitting device using such a package is also increased.

  Thus, embodiments according to the present disclosure provide a thin package, a package intermediate, and a light emitting device. In addition, a simple manufacturing method of a package, a package intermediate, and a light emitting device is provided.

  A manufacturing method of a package according to an embodiment of the present disclosure includes a frame, a first electrode, a second electrode, a first connection unit that connects the frame and the first electrode, the frame, and the frame A second connecting portion that connects the second electrode, and further includes a first through hole between the first electrode and the first connecting portion, and the second electrode. And a step of preparing a lead frame having a second through-hole between the first connecting portion and the second connecting portion; and from an injection port adjacent to the first electrode in a mold in which the lead frame is disposed. A step of injecting a first resin, a step of curing or solidifying the injected first resin, and after curing or solidifying the first resin, the first electrode is next to the first electrode. Cutting the resin injection trace, and cutting the first connecting portion and the second connecting portion. And a step of singulating Kkeji, the.

  A method of manufacturing a package according to an embodiment of the present disclosure includes a step of preparing a lead frame having a first electrode and a second electrode having a polarity different from that of the first electrode in a region where the package is to be formed. A step of sandwiching the first electrode and the second electrode between an upper mold and a lower mold of a vertically divided mold, and sandwiching the first electrode and the second electrode A step of injecting a first resin into the mold from the injection port formed next to the first electrode outside the region where the package of the mold is to be formed; and the injected first A step of curing or solidifying the first resin, a step of removing the trace of the first resin injection from the side of the first electrode after the first resin is cured or solidified, and cutting the lead frame To separate the package into individual pieces.

  A package intermediate according to an embodiment of the present disclosure includes a frame, a first electrode, a second electrode, a first connection unit that connects the frame and the first electrode, the frame, and the first electrode. A second connecting portion that connects the two electrodes, and further includes a first through-hole between the first electrode and the first connecting portion, and the second electrode A lead frame having a second through-hole between the second connection portion and the first resin body holding the first electrode and the second electrode; a bottom portion; An intermediate body of a package having a wall portion having a plurality of outer surfaces surrounding a mounting region on the bottom portion, wherein the first electrode and the second electrode are disposed on the bottom portion, and The resin body includes the wall portion and a holding portion that holds the first electrode and the second electrode at the bottom portion, The holding portion includes a flange portion that extends outward from the outer surface of the wall portion, and the first connection portion and the second connection portion are located outside the tip of the flange portion in plan view. Has been placed.

  A package according to an embodiment of the present disclosure includes a first electrode, a second electrode, and a first resin body that holds the first electrode and the second electrode, and a bottom portion. A package having a plurality of outer surfaces surrounding the mounting region on the bottom, wherein the first electrode and the second electrode are formed from two opposing outer surfaces of the wall. Outer lead portions each extending outward, the first resin body, the wall portion, and a flange portion extending outward from the outer surface of the wall portion where the outer lead portion is disposed, The outer lead portion is extended to the outside of the tip of the collar portion in plan view.

  A method for manufacturing a package intermediate according to an embodiment of the present disclosure includes a frame, a first electrode, a second electrode, a first connection unit that connects the frame and the first electrode, and the frame. And a second connecting portion that connects the second electrode, and further includes a first through hole between the first electrode and the first connecting portion, and the second connecting portion. Preparing a lead frame having a second through-hole between the electrode and the second connecting portion; and in the mold in which the lead frame is disposed, next to the first electrode or the second A step of injecting a first resin from an injection port adjacent to one connecting portion, a step of curing or solidifying the injected first resin, and after curing or solidifying the first resin, Removing the injection trace of the first resin from next to the first electrode or next to the first connection portion. That.

  Embodiments according to the present disclosure can provide a thin package and a light emitting device. In addition, a simple method for manufacturing a package and a light-emitting device can be provided.

It is a figure which shows the outline of the light-emitting device which concerns on embodiment, and is a perspective view which shows the whole light-emitting device. It is a figure which shows the outline of the package which concerns on embodiment, and is a top view of a package. It is a figure which shows the outline of the package which concerns on embodiment, and is the III-III cross section arrow directional view of FIG. It is a figure which shows the outline of the package which concerns on embodiment, and is a bottom view of a package. It is a figure which shows the outline of the manufacturing process of the package which concerns on embodiment, and is a top view of a lead frame. FIG. 9 is a view schematically showing a manufacturing process of the package according to the embodiment, and is a cross-sectional view schematically showing the arrangement of the lead frame and the mold at a position corresponding to the line IX-IX in FIG. 8. FIG. 9 is a view schematically showing a manufacturing process of the package according to the embodiment, and is a cross-sectional view schematically showing the arrangement of the lead frame and the mold at a position corresponding to the line XX in FIG. 8. It is a figure which shows the outline of the manufacturing process of the package which concerns on embodiment, and is a top view of the lead frame pinched | interposed with the upper metal mold | die and the lower metal mold | die. It is a figure which shows the outline of the manufacturing process of the package which concerns on embodiment, and is the IX-IX cross-sectional arrow view of FIG. 8 after 1st resin injection | pouring. It is a figure which shows the outline of the manufacturing process of the package which concerns on embodiment, and is XX sectional arrow directional view of FIG. 8 after 1st resin injection | pouring. It is a figure which shows the outline of the manufacturing process of the package which concerns on embodiment, and is a schematic plan view of the resin molding before excising an injection trace. It is a figure which shows the outline of the manufacturing process of the package which concerns on embodiment, and is a schematic plan view of the resin molding after excising an injection trace.

  Hereinafter, a package, a light emitting device, and a method for manufacturing the same according to an embodiment will be described. Note that the drawings referred to in the following description schematically show the present embodiment, and therefore, the scale, interval, positional relationship, etc. of each member are exaggerated, or some of the members are not shown. There may be. Moreover, in the following description, the same name and code | symbol indicate the same or the same member in principle, and detailed description is abbreviate | omitted suitably.

<Configuration of Light Emitting Device 1>
This will be described with reference to the drawings. FIG. 1 is a diagram schematically illustrating a light emitting device according to an embodiment, and is a perspective view illustrating the entire light emitting device. FIG. 2 is a diagram schematically illustrating the package according to the embodiment, and is a plan view of the package. FIG. 3 is a diagram schematically illustrating the package according to the embodiment, and is a cross-sectional view taken along the line III-III in FIG. FIG. 4 is a diagram schematically illustrating the package according to the embodiment, and is a bottom view of the package.
The light emitting device 1 includes a package 100 including a first resin body 30, a light emitting element 200, a wire 250, and a sealing member 300 made of a second resin.

<Outline of package 100>
The package 100 includes a first resin body 30, a first electrode 10, and a second electrode 20, and includes a bottom portion 101 and a wall portion 31 that surrounds the placement region 110 a on the bottom portion 101. doing.
In the package 100, a recess portion 110 opened upward is formed by a bottom portion 101 and a wall portion 31, and a bottom surface of the recess portion 110 serves as a semiconductor element mounting region 110a. The recess 110 has a shape that expands in the opening direction.
The first electrode 10, the second electrode 20, and the first resin body 30 are disposed on the bottom 101 of the package 100.

The first resin body 30 includes a wall portion 31 that forms the side wall of the recess 110 and a holding portion 32 that fixes the first electrode 10 and the second electrode 20.
The holding part 32 is disposed on the bottom part 101 of the package 100.
The holding part 32 includes a central part 32a provided between the first electrode 10 and the second electrode 20, and a peripheral part 32b surrounding the central part 32a, the first electrode 10 and the second electrode 20. It has.
The peripheral portion 32b includes a flange portion 32c extending outward from the wall portion 31 in plan view.
The first electrode 10 extends from the outer surface 31a of the wall 31 to the outside of the tip of the flange 32c in plan view, and similarly, the second electrode 20 is formed on the wall 31 in plan view. It extends from the outer side surface 31c to the outside of the tip of the flange portion 32c.

<Details of Package 100>
The first electrode 10 includes a first outer lead portion 11 and a first inner lead portion 12. The first outer lead portion 11 refers to a lead portion located on the outer side from the outer side surface 31 a of the wall portion 31. The first inner lead portion 12 is a lead portion located below the bottom surface of the recess 110 and the wall portion 31.

The second electrode 20 includes a second outer lead portion 21 and a second inner lead portion 22. The second outer lead portion 21 is a lead portion located outside the outer surface 31 c of the wall portion 31. The second inner lead portion 22 is a lead portion located below the bottom surface of the recess 110 and the wall portion 31.
The shape of the first inner lead portion 22 and the second inner lead portion 22 is substantially rectangular in plan view, but the shape is not limited to this, and may be partially cutout, recessed, or provided with a through hole. .

The first electrode 10 and the second electrode 20 are formed so as to be exposed on the lower surface of the package 100. The lower surface of the package 100 is a surface on the side mounted on an external substrate. On the lower surface, the first electrode 10 and the second electrode 20 are not arranged on the outer surface 31b, 31d side of the wall portion 31, so that when the package 100 is soldered to an external substrate, for example, the outer surface Solder leakage to the 31b and 31d sides can be reduced.
The first electrode 10 and the second electrode 20 are spaced apart from each other, and a central portion 32 a is interposed between the first electrode 10 and the second electrode 20. When used as a light-emitting device, the first electrode 10 and the second electrode 20 correspond to an anode electrode and a cathode electrode, respectively, meaning that the conductivity is different.

The first outer lead portion 11 and the second outer lead portion 21 have a second recessed portion 50 at the tip. The second recessed portion 50 is recessed in the depth direction when the package 100 is viewed from the side. Thereby, when the package 100 is solder-bonded to an external mounting substrate, for example, a solder fillet can be formed in the second recess 50.
In the package 100, only one of the electrodes may have the second recessed portion 50, or only one of the electrodes may have the outer lead portion.

  The material of the first electrode 10 and the second electrode 20 is preferably, for example, copper or a copper alloy, and the outermost surface thereof is plated with, for example, silver, aluminum, copper, or gold.

  For example, the first outer lead portion 11 includes a plating layer on the surface thereof except for the end surfaces 43 and 44 that are farthest from the outer surface of the wall portion 31. As will be described later, the end surfaces 43 and 44 are cut surfaces that appear when the package 100 is separated into pieces after the plating process, and thus are not provided with a plating layer. On the other hand, the side surface 51 of the second recessed portion 50 and the side surfaces 45 and 46 of the first outer lead portion 11 are surfaces that have been cut before the plating process, and thus include a plating layer. As for the 1st outer lead part 11, the upper surface 41, the lower surface 42, the side surfaces 45 and 46, and the side surface 51 of the 2nd recessed part 50 are plated. The same applies to the second outer lead portion 21.

  In the package 100, since the first inner lead portion 12 and the second inner lead portion 22 are plated, the bonding strength with a conductive member such as solder increases, and the package 100 When a light-emitting device is configured by mounting a light-emitting element in the recess 110, the reflectance of light from the light-emitting element can be increased.

As for the 1st resin body 30, the outer edge shape of the wall part 31 is a rectangle in planar view.
The collar portion 32 c extends outward from the outer surface 31 a of the wall portion 31 and is provided in contact with the first outer lead portion 11. The first outer lead portion 11 is formed flush with the flange portion 32c on both the upper surface 41 and the lower surface 42. The first outer lead portion 11 has a flange portion 32c on both sides in plan view, and extends to the outside of the tip end of the flange portion 32c.
The collar portion 32 c has the same thickness T as that of the first outer lead portion 11. The flange portion 32 c is not provided in the second recess portion 50 of the first outer lead portion 11.
Further, the flange portion 32 c extends outward from the outer surface 31 c of the wall portion 31, and is similarly provided in contact with the second outer lead portion 21.

  In plan view, the length W1 from the outer surface 31c of the wall portion 31 to the tip of the flange portion 32c is preferably at least 5 μm, and in order to form the second recessed portion 50, for example, about 20 μm. It is particularly preferred. In plan view, the length from the outer surface 31a of the wall portion 31 to the tip of the collar portion 32c may be the same as or different from the length W1.

  For each outer surface of the wall portion 31, the length from the outer surface of the wall portion 31 to the tip of the flange portion 32 c in plan view is constant along the outer surface. For example, when paying attention to the outer surface 31a, the length from the outer surface 31a to the tip of the flange portion 32c is constant along the outer surface 31a except for the portion where the first outer lead portion 11 is provided. It is set and the collar part 32c is not a burr. Further, for example, when focusing on the outer surface 31c, the length from the outer surface 31c to the tip of the flange portion 32c is constant along the outer surface 31c except for the portion where the second outer lead portion 21 is provided. Is set to

  In the plan view, the outer edge shape of the wall portion 31 is rectangular. The collar portion 32c may be disposed on at least one outer surface different from the outer surfaces 31a and 31c where the first electrode 10 and the second electrode 20 are disposed. Here, the collar portion 32c is also arranged on the outer side surfaces 31b and 31d of the wall portion 31.

  In plan view, the length W2 from the outer surface 31d of the wall portion 31 to the tip of the flange portion 32c is preferably at least 5 μm. In order to prevent the outer surface 31d from being damaged during manufacture, for example, 10 μm The above is preferable, and it is particularly preferable that the thickness is 20 μm or more. The length from the outer side surface 31b of the wall part 31 to the front-end | tip of the collar part 32c in planar view may be the same as the length W2, and may differ. The length W2 may be the same as or different from the length W1.

  The first resin body 30 includes a chamfered portion 120 on the wall portion 31. The chamfered portion 120 refers to a portion in which a part of a corner portion is cut out, formed into a cutout shape, or formed into a recessed shape. The chamfered portion 120 represents the polarity of the first electrode 10 and is used as a cathode mark or an anode mark. The shape and size of the chamfered portion 120 are arbitrary. Here, the chamfered portion 120 has an inverted triangular shape, for example, and is formed across the outer surface 31 a and the outer surface 31 b of the wall portion 31.

  The wall part 31 and the collar part 32c may be formed separately, and may be integrally formed with the same material. For example, integral molding is preferable because the strength of the wall portion 31 and the flange portion 32c can be increased.

Hereinafter, the resin constituting the first resin body 30 is referred to as a first resin.
Examples of the first resin include a thermoplastic resin and a thermosetting resin.
In the case of a thermoplastic resin, for example, polyphthalamide resin, liquid crystal polymer, polybutylene terephthalate (PBT), unsaturated polyester, or the like can be used. The thermoplastic resin is solidified by heating and cooling.
In the case of a thermosetting resin, for example, an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, or the like can be used. It is cured by heating the thermosetting resin.
In order to efficiently reflect light on the inner peripheral surface of the wall portion 31 of the first resin body 30, the first resin body 30 may include a light reflecting member. Examples of light reflecting members include titanium oxide, zinc oxide, zirconium oxide, aluminum oxide, silicon oxide, glass filler, silica, magnesium oxide, antimony oxide, aluminum hydroxide, barium sulfate, magnesium carbonate, and barium carbonate. It is preferable because it is relatively stable and has a high refractive index and excellent thermal conductivity.

The light emitting element 200 is placed on at least one of the first electrode 10 and the second electrode 20 of the package 100. Here, the light emitting element 200 is fixed on the second electrode 20 in the mounting region 110 a and is electrically connected to the first inner lead portion 22 and the second inner lead portion 22 through the wire 250, respectively. doing. As the luminescent color of the light emitting element 200, one having an arbitrary wavelength can be selected according to the application. For example, as a blue light emitting element (light having a wavelength of 430 to 490 nm), a nitride semiconductor In _X Al _Y Ga _1- XYN (0 ≦ X ≦ 1, 0 ≦ Y ≦ 1, X + Y ≦ 1) A GaN system or an InGaN system represented by the above can be used. The light emitting element 200 can use a face-up structure or a face-down structure. In addition, you may mount a protective element in the inner lead part which has not mounted the light emitting element.

  The wire 250 is a conductive wiring for electrically connecting the electronic components such as the light emitting element 200 and the protection element to the first electrode 10 and the second electrode 20. Examples of the material of the wire 250 include those using metals such as Au (gold), Ag (silver), Cu (copper), Pt (platinum), and Al (aluminum), and alloys thereof. It is preferable to use Au.

  The sealing member 300 covers the light emitting element 200 and the like mounted on the placement region 110a of the package 100. The sealing member 300 is provided to protect the light emitting element 200 and the like from external force, dust, moisture, and the like, and to improve the heat resistance, weather resistance, and light resistance of the light emitting element 200 and the like. Hereinafter, the resin constituting the sealing member 300 is referred to as a second resin. Examples of the second resin include a transparent material such as a thermosetting resin, for example, a silicone resin, an epoxy resin, or a urea resin. In addition to such a material, a filler such as a phosphor or a light diffusing substance can be contained in order to have a predetermined function.

The second resin can facilitate the color tone adjustment of the light emitting device 1 by mixing phosphors, for example. As the filler to be contained in the second resin, for example, a material having high light reflectance such as SiO ₂ , TiO ₂ , Al ₂ O ₃ , ZrO ₂ , MgO can be suitably used. For the purpose of cutting undesired wavelengths, for example, organic or inorganic coloring dyes or coloring pigments can be used.

<Method for Manufacturing Package 100>
Next, a method for manufacturing the package 100 will be described with reference to FIGS. FIG. 5 is a view schematically showing a manufacturing process of the package according to the embodiment, and is a plan view of the lead frame. FIG. 6 is a diagram schematically showing the manufacturing process of the package according to the embodiment, and is a cross-sectional view schematically showing the arrangement of the lead frame and the mold at a position corresponding to the line IX-IX in FIG. FIG. 7 is a view schematically showing the manufacturing process of the package according to the embodiment, and is a cross-sectional view schematically showing the arrangement of the lead frame and the mold at a position corresponding to the line XX in FIG. FIG. 8 is a view schematically showing the manufacturing process of the package according to the embodiment, and is a plan view of a lead frame sandwiched between an upper mold and a lower mold. FIG. 9 is a diagram illustrating an outline of a manufacturing process of the package according to the embodiment, and is a cross-sectional view taken along the line IX-IX in FIG. 8 after the first resin injection. FIG. 10 is a diagram illustrating an outline of a manufacturing process of the package according to the embodiment, and is a cross-sectional view taken along the line XX of FIG. 8 after the first resin injection. FIG. 11 is a diagram illustrating an outline of a manufacturing process of the package according to the embodiment, and is a schematic plan view of the first resin body before the injection trace is cut off. FIG. 12 is a diagram illustrating an outline of the manufacturing process of the package according to the embodiment, and is a schematic plan view of the first resin body after the injection mark is cut out.

  The package manufacturing method includes a step of preparing a package intermediate and a step of dividing the package into individual pieces. The step of preparing the package intermediate includes the step of preparing the lead frame, the step of injecting the first resin, the step of curing or solidifying the injected first resin, and the removal of the injection trace of the first resin. And a step of performing.

  The lead frame 705 is formed using, for example, a good electrical conductor such as copper or a copper alloy, and a flat metal plate can be used, but a metal plate provided with a step or unevenness can also be used. The lead frame 705 is obtained by punching or etching a flat metal plate.

  The lead frame 705 includes a first electrode 10 and a second electrode 20 having a polarity different from that of the first electrode 10 in a package formation planned region 600. Here, the package formation planned region 600 is a region which is separated from the lead frame 705 and becomes the outer periphery of the bottom 101 of the package 100 after molding. Further, the first electrode 10 in the lead frame 705 means a portion corresponding to the molded first electrode 10.

  Similarly, the second electrode 20 in the lead frame 705 means a portion corresponding to the second electrode 20 after molding. For the sake of simplicity, the lead frame 705 is described as including one package formation planned region 600, but a plurality of lead frames 705 may be provided.

  The lead frame 705 is a plate-like member, has a predetermined-shaped gap around the first electrode 10 and the second electrode 20, and the first electrode 10 and the second electrode 20 face each other. The parts are separated. The lead frame 705 includes a frame 707 that surrounds the first electrode 10 and the second electrode 20, a first connection portion 708 that connects the frame 707 and the first electrode 10, and the frame 707 and the second electrode 20. 2nd connection part 709 which connects.

  The first connection portion 708 and the second connection portion 709 are arranged so that the first intermediate electrode 10 and the second connection portion 709 are arranged so that the package intermediate body does not fall off when the package intermediate body before separating the package is distributed. The electrode 20 is connected to the frame 707. Here, to divide the package into pieces means to cut a part of the lead frame 705 and to detach the package from the lead frame 705.

  In the lead frame 705, a portion of the first electrode 10 corresponding to the first outer lead portion 11 after molding is connected to the frame 707 by the first connecting portion 708. Next to the first electrode 10, a first space 706a and a second space 706b are formed as a gap. Here, the next to the first electrode 10 means the vicinity of the package formation scheduled region 600 next to the first connection portion 708. Here, next to the first electrode 10 is not at the side of the first electrode 10 but at a diagonally upper or lower position in the lead frame 705 in plan view. In the present embodiment, the first resin is injected from the first space 706a.

In the second electrode 20, a portion corresponding to the second outer lead portion 21 after molding is connected to the frame 707 by a second connection portion 709. Next to the second electrode 20, a third space 706c and a fourth space 706d are formed as a gap. Here, the next to the second electrode 20 means the vicinity of the package formation scheduled region 600 next to the second connection portion 709. Here, next to the second electrode 20 is not on the side of the second electrode 20 but on the diagonally upper or lower side in the lead frame 705 in plan view.
In the lead frame 705, the first space 706a, the second space 706b, the third space 706c, and the fourth space 706d communicate with gaps around the first electrode 10 and the second electrode 20. Yes.

  The lead frame 705 has a through hole at a position straddling the outer edge of the package formation scheduled region 600 in at least one of the first electrode 10 and the second electrode 20. Specifically, the lead frame 705 has a first through hole 713 between the first electrode 10 and the first connection portion 708, and the second electrode 20 and the second connection portion 709 are connected to each other. A second through hole 714 is provided therebetween. The through holes 713 and 714 are independent and do not communicate with the first space 706a or the like. The through holes 713 and 714 can be circular, elliptical, T-shaped, I-shaped, cross-shaped, or the like.

The package formation scheduled region 600 is substantially rectangular in plan view, and has a first edge 601, a second edge 602, a third edge 603, and a fourth edge 604.
The second edge portion 602 and the fourth edge portion 604 are linear and coincide with the edge of the gap portion of the lead frame 705.
A distance V1 between the second edge portion 602 and the fourth edge portion 604 is set in advance so as to be the width of the holding portion 32 of the package after molding.
A distance H1 between the first edge 601 and the third edge 603 is set in advance to be the length of the holding part 32 of the package after molding.
The first edge 601 has a portion protruding toward the first connection portion 708 so as to cross the first through-hole 713, and the third edge 603 is partially a second through-hole. A portion protruding to the second connection portion 709 side so as to cross 714 is provided.

  In the step of preparing the lead frame, the lead frame 705 is placed in the mold. Specifically, the first electrode 10 and the second electrode 20 of the lead frame 705 are sandwiched between the upper mold 550 and the lower mold 560 of the mold 500 that are divided vertically. For convenience of explanation, the lower surface of the lead frame 705 and the lower mold 560 are shown separated from each other, but the lead frame 705 is fixed to the upper surface of the lower mold 560.

  The upper mold 550 has a first recess 501 corresponding to the wall 31 of the first resin body 30 and injects the first resin into the first recess 501. In plan view, the first recess 501 is connected in an annular shape, and the outer edge 502 of the first recess 501 has a rectangular outer shape. The upper mold 550 has a flat portion adjacent to the inner peripheral side of the first recess 501 and a flat portion adjacent to the outer peripheral side. The first recess 501 also has a recess corresponding to the chamfered portion 120.

  The lead frame 705 is disposed such that the package formation planned region 600 is positioned below the first recess 501 of the upper mold 550 and the through holes 713 and 714 are positioned outside the first recess 501. . Further, the upper mold 550 is provided with a space 503 so as to communicate with a position where the first space 706a is provided outside the package formation planned region 600 when aligned with the lead frame 705. That is, the mold 500 is provided with a space 503 outside the first recess 501 in a plan view.

  The shape of the first recess 501 corresponds to the shape of the side wall of the recess 110 of the package after molding. An inclined surface corresponding to the inclination of the outer surface of the side wall portion of the recess 110 is formed in the first recess 501.

  In plan view, the maximum length H2 (see FIG. 8) of the first recess 501 is set in advance so as to be the length of the wall portion 31 of the molded package, and is larger than the distance H1 (see FIG. 5). Slightly short. Here, the difference between H2 and H1 is twice the length W1 (see FIG. 2) from the outer side surfaces 31a and 31c to the tip of the flange portion 32c.

  In plan view, the maximum width V2 (see FIG. 8) of the first recess 501 is set in advance so as to be the width of the wall 31 of the package after molding, and from the distance V1 (see FIG. 5). Is slightly shorter. Here, the difference between V2 and V1 is twice the length W2 (see FIG. 2) from the outer side surfaces 31b and 31d to the tip of the flange portion 32c.

  As shown in FIGS. 5 and 8, in this embodiment, the size of the package formation planned region 600 is slightly larger than the size of the first recess 501 of the mold 500 in a plan view, and after molding, A lead frame 705 was prepared in which the arrangement and size of the gaps were adjusted so that the flange 32c could be formed on the entire outer periphery of the package.

  Then, as described above, the flat portion adjacent to the outer peripheral side of the first recess 501 of the upper mold 550 is connected to at least a part of the frame 707, the first connection portion 708, and the second connection portion 709. And it is made to contact | abut to the part corresponded to the 1st and 2nd outer lead parts 11 and 21 after shaping | molding. At this time, the first resin is firmly sandwiched between the lead frame 705 and the upper mold 550 and the lower mold 560 so that the first resin does not enter. In the upper mold 550, the first resin is injected into the space 503 from the gate 555 that serves as an inlet to the space 503.

A known molding method such as injection molding or transfer molding can be used for the first resin injection step.
In this step, the gate 555 adjacent to the first electrode 10 (first outer lead portion 11) in a plan view in the mold 500 in which the lead frame 705 is sandwiched between the upper mold 550 and the lower mold 560. The first resin is injected. Here, next to the first electrode 10 is a position where the first space 706a of the lead frame 705 is provided. The gate 555 provided in the upper mold 550 is an inlet to the space 503 of the upper mold 550. When the mold 500 and the lead frame 705 are aligned, the space 503 of the upper mold 550 communicates with the position where the first space 706a of the lead frame 705 is provided. In this case, the gate 555 included in the upper mold 550 is disposed next to the first electrode 10 in plan view.

  A light reflecting member such as titanium oxide is mixed in advance with the first resin. The first resin passes through the first space 706 a of the lead frame 705 and is injected into the first recess 501 of the upper mold 550. The first resin is injected into the second space 706b, the third space 706c, and the fourth space 706d that communicate with the first space 706a. At this time, the first resin does not enter the through holes 713 and 714 of the lead frame 705.

  Thereby, the wall part 31 of the 1st resin body 30 is formed with the 1st resin with which the 1st dent part 501 was filled. Further, the holding portion 32 of the first resin body 30 is formed by the first resin filled in the gap portions other than the through holes 713 and 714 of the lead frame 705. At this time, it is adjacent to both sides of the portion corresponding to the first and second outer lead portions 11 and 21 after molding, has the same thickness as the first and second outer lead portions 11 and 21, and has a thickness after molding. A portion corresponding to the portion 32c is formed. At this time, the flange 32c continues to the gate 555.

When the first resin is a thermosetting resin, by curing the first resin, and when the first resin is a thermoplastic resin, by solidifying the first resin, A first resin body 30 is formed.
After the first resin is cured or solidified, the injection trace of the first resin is excised from the side of the first electrode 10 or the side of the first connection portion 708. In this step, an excess resin body filled in the first space 706a and the like of the lead frame 705 is separated and removed by a punch. Thereby, as shown in FIG. 12, no injection mark remains on the surface of the package intermediate 400.

  At this time, only the excess resin body may be removed, but if a part 716a to 716d (see FIG. 11) of the lead frame 705 is cut together with the gate mark (injection mark) 155, the lead frame to be cut in the next process. This is preferable because the area of 705 can be reduced. When the lead frames 716a to 716d, which are part of the lead frame 705, are cut away, the first electrode 10 and the first connection portion 708, and the second electrode 20 and the second connection portion 709 can be kept connected. If it is.

  In the package intermediate 400, it is preferable to further plate the portion where the lead frame 705 is exposed. Specifically, for example, Ag is attached to the lead frame 705 by electrolytic plating. As a result, the first electrode 10 and the second electrode 20 are plated, and the inner peripheral surfaces of the through holes 713 and 714 are also plated.

  The process of dividing the package into pieces is a process of cutting a part of the lead frame 705 in the package intermediate 400 to obtain a package of pieces. In the process of dividing the package into pieces, it is sufficient to cut only the lead frame 705 without cutting the resin body.

  Specifically, the first connection portion 708 is cut along the cutting line L1, and the second connection portion 709 is cut along the cutting line L2. Here, the cutting line L1 corresponds to a protruding portion of the first edge 601 of the package formation planned region 600, and the cutting line L2 corresponds to a protruding portion of the third edge 603. The cutting line L1 crosses the first through hole 713, and the cutting line L2 crosses the second through hole 713. Therefore, in the process of dividing the package into pieces, the lead frame 705 is cut at a position passing through the through holes 713 and 714 using, for example, a lead cutter.

  By cutting, the through holes 713 and 714 of the lead frame 705 are cut, and the second recessed portions 50 are formed in the first and second outer lead portions 11 and 21. Thereby, the package 100 can be manufactured.

<Method for manufacturing light emitting device>
In the method for manufacturing the light emitting device, the light emitting element 200 is mounted in the package 100 before, for example, the step of separating the package described above among the steps of manufacturing the package 100. That is, the light emitting element 200 is mounted on the second electrode 20 of the package 100 that is not separated from the lead frame 705.

  The light emitting element 200 is an element having a single-sided electrode structure in which a pair of n electrodes and p electrodes are formed on an upper surface. In this case, a die bond resin is applied to the mounting region 110a of the package 100 to mount the light emitting element 200, and then heat treatment is performed in an oven in order to cure the die bond resin. Subsequently, using the wire bonding apparatus, one electrode of the light emitting element 200 is connected to the first electrode 10 and the other electrode of the light emitting element 200 is connected to the second electrode 20 with the wire 250.

  Subsequently, a second resin is applied in the recess 110 of the package 100 using, for example, a resin coating device, and the light emitting element 200 is sealed. In addition to the thermosetting resin, the second resin can contain at least one of a phosphor, an inorganic filler, and an organic filler. Following application, heat treatment is performed in an oven to cure the second resin. Thereby, the sealing member 300 is formed. The light emitting device 1 can be manufactured through the above steps. Note that the step of dividing the package into pieces may be performed before the light emitting element is mounted. In other words, the light emitting device 200 may be manufactured by mounting the light emitting element 200 on the separated package.

  As described above, the package intermediate 400 before the package is separated into pieces is connected to the frame 707 by the first connection portion 708 and the second connection portion 709 of the lead frame 705, and the lead frame 705 It can be distributed without falling off. Further, since the lead frame 705 includes the first connection portion 708 and the second connection portion 709, there is no need to provide a holding portion that supports the resin portion of the package from both sides. When the holding portion is provided in the lead frame, a trace of the holding portion is formed in the package. If the bottom portion of the package has a dent in the trace of the holding portion, resin burrs are easily formed on the bottom portion of the package, and the appearance is also deteriorated. In addition, when such a package is solder-mounted on an external substrate, for example, burr becomes an obstacle. On the other hand, since the package 100 cannot be recessed in the holding portion 32 of the bottom portion 101, it is difficult to form a resin burr on the bottom portion 101, the appearance is improved, and it is easy to mount.

  In the package intermediate 400, the lead frame 705 is plated. In the process of dividing the package into pieces, the second recess 50 is formed by cutting the lead frame 705 at a position passing through the through holes 713 and 714 in the package intermediate 400. For this reason, since the end faces 43 and 44 which appear by cutting the lead frame 705 are not plated, a conductive member such as solder does not adhere and does not contribute to joining. On the other hand, since the side surfaces 45 and 46 of the first outer lead portion 11 and the second outer lead portion 21 and the side surface 51 of the second recessed portion 50 are plated, a conductive member such as solder adheres. And contribute to bonding. Therefore, the package 100 can increase the bonding strength of a conductive member such as solder as compared with the case where the second recess 50 is not provided.

  Further, since the package 100 is plated with the side surfaces 45 and 46 of the first outer lead portion 11 and the second outer lead portion 21 and the side surface 51 of the second recessed portion 50, the package 100 is mounted on an external mounting substrate. For example, when soldering, a solder fillet can be formed on the side surfaces 45 and 46 and the second recess 50. Further, in the package 100, the first outer lead portion 11 and the second outer lead portion 21 are plated on the upper surface 41 and the lower surface 42, so that conductive members such as solder are used for the side surfaces 45 and 46 and the second outer lead portion 21. The castellation electrode can be formed by joining from the upper surface 41 to the lower surface 42 through the side surface 51 of the recess 50.

  In the conventional method, the resin is injected from the lower surface side of the package. However, according to the package manufacturing method of this embodiment, the resin is injected from the vicinity of the first electrode 10 and outside the package formation planned region 600. Inject resin. As described above, the first resin injection port is provided in the vicinity of the first electrode 10 which is an unnecessary position after the first resin is cured or solidified, and the first resin is injected to be cured or solidified. After that, the gate mark 155 is removed, so that the package 100 and the light emitting device 1 can be made thinner than the conventional one. In particular, the thickness of the bottom 101 of the package 100 can be made thinner than before. For this reason, the heat dissipation at the time of operation | movement of the light emitting element etc. which are mounted in the package 100 can be improved. Further, when the gate mark 155 is removed, the collar portion 32 c remains next to the first electrode 10.

  In the present embodiment, the package 100 prevents the damage of the package surface when the package is removed from the lead frame 705 because the flange portion 32c extends outward from the outer surfaces 31b and 31d of the wall portion 31. There is an effect to. In other words, in a state before being singulated, the flange portion 32c disposed below the outer side surfaces 31b and 31d of the wall portion 31 is in contact with the lead frame 705, and the first connection portion 708 and the second connection portion are connected. When the portion 709 is cut, the package can be removed without the outer surfaces 31b and 31d of the wall portion 31 disposed above the flange portion 32c contacting the lead frame 705.

  As described above, the package and the light emitting device according to the embodiments of the present disclosure have been specifically described. However, the gist of the present invention is not limited to these descriptions, and is widely interpreted based on the descriptions of the claims. There must be. Needless to say, various changes and modifications based on these descriptions are also included in the spirit of the present invention.

  For example, in the upper mold 550 of the mold 500 shown in FIG. 8, it is assumed that one gate 555 is formed, but when the lead frame 705 is disposed in the mold 500, the first electrode 10 is adjacent. Alternatively, gates may be formed at two locations, and the first resin may be injected from these two gates. In addition, when the lead frame 705 is disposed in the mold 500, a gate is provided not only adjacent to the first electrode 10 but also adjacent to the second electrode 20, and the first resin is provided. It can also be injected. Further, a gate can be provided in the lower mold 560 instead of the upper mold 550, and the first resin can be injected from the lower mold 560 side.

An example will be described with reference to the package according to the embodiment, but the invention is not limited to this example. The example size includes an error of ± 10%.
The size of the package 100 according to the embodiment is about 2.2 mm long × about 1.4 mm wide × about 0.7 mm high. This size includes the first electrode 10 and the second electrode 20. The distance (vertical) between the outer surfaces 31a and 31c of the opposing wall portion 31 is about 2.0 mm, and the width of the outer lead portion 11 of the first electrode 10 and the outer lead portion 21 of the second electrode 20 is the wall. It is about 0.1 mm from the part 31. The width W1 of the collar portion 32c located next to the first electrode 10 and the second electrode 20 is 0.05 mm. The tips of the outer lead portion 11 of the first electrode 10 and the outer lead portion 21 of the second electrode 20 extend to the outside of about 0.05 mm from the tip of the flange portion 32c. The second recess 50 enters about 0.05 mm inside from the tip. The thicknesses of the first electrode 10 and the second electrode are about 0.2 mm. The distance of the inner surface of the wall portion 31 is a substantially quadrangular shape having roundness at corners of about 1.65 mm in length and 1.1 mm in width.
The first electrode 10 and the second electrode 20 have copper as a base material, and silver plating is applied to a portion exposed from the first resin body 30. The first resin body 30 uses a polyamide resin containing a light reflecting member, and uses titanium oxide as the light reflecting member. The sealing member 300 uses a silicone resin. The light emitting element 200 uses a sapphire substrate in which a nitride semiconductor is stacked. As the wire 250 for electrically connecting the light-emitting element 200 to the first electrode 10 and the second electrode 20, a wire containing gold as a main component is used.

  The light emitting device of the embodiment according to the present invention can be used for an illumination device, an in-vehicle light emitting device, and the like.

DESCRIPTION OF SYMBOLS 1 Light-emitting device 10 1st electrode 20 2nd electrode 30 1st resin body 31 Wall part 32 Holding | maintenance part 32c Edge 43 End surface of 1st outer lead part 50 2nd recessed part 100 Package 101 Bottom part 110a Mounting area 155 Gate trace (injection trace)
200 Light-Emitting Element 300 Sealing Member 400 Package Intermediate 500 Mold 501 First Recess 503 Space 555 Gate (Injection Port)
600 Package formation region 705 Lead frame 706a First space 707 Frame 708 First connection portion 709 Second connection portion 713 First through hole 714 Second through hole

The present disclosure relates to a package manufacturing method, a package intermediate manufacturing method, and a light emitting device manufacturing method .

Accordingly, embodiments of the present invention that, packages during body thin, provides a simple method for producing a package manufacturing method and a light-emitting device.

Embodiments according to the present disclosure can provide a thin package and a light emitting device. In addition, a simple manufacturing method of the package, the package intermediate, and the light emitting device can be provided.

Claims (32)

A frame, a first electrode, a second electrode, a first connection portion connecting the frame and the first electrode, and a second connection portion connecting the frame and the second electrode. In addition, a first through hole is provided between the first electrode and the first connection portion, and a second is provided between the second electrode and the second connection portion. Preparing a lead frame having through-holes of
Injecting a first resin from an inlet adjacent to the first electrode into a mold in which the lead frame is disposed;
Curing or solidifying the injected first resin;
After curing or solidifying the first resin, a step of cutting the injection trace of the first resin from next to the first electrode;
And a step of separating the package by cutting the first connection portion and the second connection portion. Preparing a lead frame having a first electrode and a second electrode having a polarity different from that of the first electrode in a region where a package is to be formed;
Sandwiching the first electrode and the second electrode between an upper mold and a lower mold, which are vertically divided, and
In the mold in which the first electrode and the second electrode are sandwiched, the first electrode and the second electrode are formed outside the region where the package of the mold is to be formed and next to the first electrode. Injecting one resin,
Curing or solidifying the injected first resin;
After curing or solidifying the first resin, a step of cutting the injection trace of the first resin from next to the first electrode;
And a step of cutting the lead frame to separate the package into individual pieces.   The method for manufacturing a package according to claim 1, wherein in the step of dividing the package into pieces, only the lead frame is cut.   4. The method of manufacturing a package according to claim 1, wherein in the step of cutting out the injection trace, a part of the lead frame is also cut out together with the injection trace.   The prepared lead frame has a first space formed next to the first electrode, and the first resin is injected from the first space. A method for manufacturing a package according to claim 1.   The package manufacturing method according to claim 1, wherein the prepared lead frame has the first electrode and the second electrode separated from each other.   The mold has a first recess corresponding to a wall formed on the first electrode and the second electrode, and the first resin is injected into the first recess. The manufacturing method of the package as described in any one of Claim 1 thru | or 6.   The method for manufacturing a package according to claim 7, wherein the mold has a space provided outside the first recess, and the first resin is injected into the space in a plan view. The first resin body made of the first resin molded using the mold is
A holding portion for holding the first electrode and the second electrode;
A wall portion that surrounds the placement region on the holding portion, and the holding portion has a flange portion that extends outward from the outer surface of the wall portion in plan view,
The said 1st electrode and the said 2nd electrode are extended in the planar view from the outer surface of the said wall part to the outer side rather than the front-end | tip of the said collar part. Package manufacturing method.   The method for manufacturing a package according to any one of claims 1 to 9, wherein the step of injecting the first resin is transfer molding.   The method for manufacturing a package according to any one of claims 1 to 10, wherein a light reflecting member is mixed in the first resin. The prepared lead frame has a through hole at a position straddling an outer edge of a region where the package is to be formed in at least one of the first electrode and the second electrode.
The package manufacturing method according to claim 2, wherein in the step of dividing the package into pieces, the lead frame is cut at an outer edge of a region where the package is to be formed.   The package manufacturing method according to claim 12, further comprising a step of plating the lead frame after the first resin is cured or solidified and before the step of dividing the package into individual pieces. All the steps in the manufacturing method of the package according to any one of claims 1 to 13,
A step of mounting a light emitting element on the first electrode or the second electrode at any timing after the first resin is cured or solidified and before or after the step of removing the injection trace. A method for manufacturing a light emitting device.   The method for manufacturing a light-emitting device according to claim 14, further comprising a step of applying a second resin and sealing the light-emitting element after the step of mounting the light-emitting element. A frame, a first electrode, a second electrode, a first connection portion connecting the frame and the first electrode, and a second connection portion connecting the frame and the second electrode. In addition, a first through hole is provided between the first electrode and the first connection portion, and a second is provided between the second electrode and the second connection portion. A lead frame having through-holes of
A first resin body that holds the first electrode and the second electrode,
An intermediate of a package having a bottom, and a wall having a plurality of outer surfaces surrounding a mounting region on the bottom,
The first electrode and the second electrode are disposed on the bottom;
The first resin body includes the wall portion and a holding portion that holds the first electrode and the second electrode at the bottom portion,
The holding portion includes a collar portion extending outward from the outer surface of the wall portion,
The intermediate body of the package, wherein the first connection portion and the second connection portion are disposed outside the front end of the flange portion in a plan view. A first electrode;
A second electrode;
A first resin body that holds the first electrode and the second electrode, and a bottom portion and a wall portion that surrounds a mounting region on the bottom portion and includes a plurality of outer surfaces. Because
The first electrode and the second electrode each include an outer lead portion extending outward from two opposing outer surfaces of the wall portion,
The first resin body includes the wall portion and a flange portion extending outward from an outer surface of the wall portion on which the outer lead portion is disposed, and the outer lead portion is seen in a plan view The package is extended to the outside of the tip of the collar portion.   The outer edge shape of the said wall part is a rectangle in planar view, The said collar part is arrange | positioned in the at least 1 outer surface different from the outer surface where the said 1st electrode and the said 2nd electrode are arrange | positioned. The package according to 17.   19. The package according to claim 18, wherein the flanges are respectively disposed on two outer surfaces different from the outer surfaces on which the first electrode and the second electrode are disposed.   20. The length from the outer surface of the wall portion to the tip of the flange portion in a plan view is constant along the outer surface for each outer surface of the wall portion. The package according to one item.   21. The package according to claim 17, wherein the flange portion is provided in contact with the first electrode and the second electrode.   The package according to any one of claims 17 to 21, wherein the flange has the same thickness as the first electrode and the second electrode.   The package according to any one of claims 17 to 22, wherein a length from an outer surface of the wall portion to a tip end of the flange portion in a plan view is at least 5 µm.   The package according to any one of claims 17 to 23, wherein the package has a second recessed portion at a tip of the outer lead portion in a plan view.   The package according to claim 24, wherein the flange is not provided in the second recess.   The package according to any one of claims 17 to 25, wherein the outer lead portion includes a plating layer on a surface thereof except for an end surface most distant from an outer surface of the wall portion.   The package according to any one of claims 17 to 26, wherein the outer lead portion has the flange portion on both sides in a plan view.   The package according to any one of claims 17 to 27, wherein the wall portion and the flange portion are integrally formed of the same material. A package according to any one of claims 17 to 28;
And a light emitting device mounted on at least one of the first electrode and the second electrode of the package.   30. The light emitting device according to claim 29, wherein the light emitting element is sealed with a second resin. A frame, a first electrode, a second electrode, a first connection portion connecting the frame and the first electrode, and a second connection portion connecting the frame and the second electrode. In addition, a first through hole is provided between the first electrode and the first connection portion, and a second is provided between the second electrode and the second connection portion. Preparing a lead frame having through-holes of
Injecting a first resin from an injection port adjacent to the first electrode or the first connecting portion into the mold in which the lead frame is disposed;
A step of curing or solidifying the injected first resin; and after curing or solidifying the first resin, the first resin from next to the first electrode or next to the first connection portion. Removing the injection mark of
A method for producing a package intermediate comprising: Preparing the package intermediate produced by the production method according to claim 31;
Cutting the first connection portion and the second connection portion of the lead frame in the package intermediate to divide the package into individual pieces.

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