TWI452648B - Substrate transfer apparatus - Google Patents

Description

Substrate transfer device

The invention relates to a substrate transfer device, in particular to an electronic device which can support a side of the substrate in addition to the carrier substrate during the moving process.

In general, automated component assembly operations for flat panel displays (eg, liquid crystal panels) include soldering electronic components (eg, flexible circuit boards or soft and hard composite circuit boards) to corresponding locations on the sides of the glass substrate; During the assembly process, the substrate to be processed is transferred to a mounting position by a substrate transfer device for welding, or after the welding operation is completed, to the next working area.

For example, the Taiwan Patent No. I227535 refers to the substrate transfer device 1 as shown in the tenth and eleventh drawings for transporting the glass substrate 41 on which the electronic component 42 is mounted. The substrate transfer device 1 includes a rotatable moving mechanism 30, a support plate 10 disposed on the moving mechanism 30, and a component auxiliary frame 32 sleeved around the support plate 10. The support plate 10, together with the suction cup 12 thereon, is used to support and adsorb the glass substrate 41. The part auxiliary frame 32 is used to hold the electronic component 42 soldered around the glass substrate 41.

As shown in the twelfth and thirteenth drawings, the Taiwan Patent No. I227535 further mentions that the substrate transfer device 1 can be attached with a substrate auxiliary frame 20, which is sleeved around the support plate 10 to enlarge the substrate transfer. The bearing surface of the carrier device 1 supports a large glass substrate 41' which is larger than the above-mentioned glass substrate 41. However, in order to support the electronic component 42' around the large glass substrate 41', the above-mentioned component auxiliary frame 32 must also be replaced with a larger part auxiliary frame 32' to be sleeved on the periphery of the substrate auxiliary frame 20. .

The present invention provides a substrate transfer device different from the conventional structure to effectively carry the substrate and hold the electronic components soldered to the periphery of the substrate.

In general, the substrate transfer device of the present invention includes a moving mechanism, a support portion and a support bar. The support portion is disposed on the moving mechanism for horizontally supporting the substrate. The support bar is disposed on the support portion along the X direction, and is horizontally outwardly movable from the original position on the support portion in the X direction to a first support position on the support portion relative to the support portion. To support the electronic component on the side of the substrate. Preferably, the support bar is manually adjusted in the Y direction on the support portion to change position to switch to a position corresponding to the electronic component, so that the support effect is more stable.

Moreover, in order to maintain a good welding effect between the substrate and the electronic component after the welding operation is completed, the shape of the support bar is specially designed to gradually taper from the inner end to the outer end to slow the substrate transfer. The vibrations that may be generated by the device during transport of the substrate are conducted to the electronic component. Preferably, the brace is made of an elastic material (for example: steel plate or steel bar) to mitigate vibration conduction. In general, at the beginning of the soldering operation, the solder or conductive paste may not be completely hardened, so any vibration may reduce the bonding force just formed between the substrate and the electronic component, and even cause the electronic component to be loosened.

In addition, in order to respond to substrates of different sizes, the support portion of the substrate transfer device includes a main frame, an outer frame detachably disposed around the main frame, and a plurality of suction cups disposed on the main frame and the outer frame . The inner and outer frames collectively form a bearing surface for supporting and adsorbing a larger-sized substrate together with the suction cups. When the size of the substrate to be carried is small, the outer frame can be detached from the substrate transfer device in time. In any case, the support bar can also be relatively moved to the first support position corresponding to the different size of the substrate to support the electronic components on the side of the smaller substrate or to move outward to a second support. Support the position to support the electronic parts on the side of the larger substrate. Compared with the prior art, the support bar of the present invention is arranged to be movable relative to the main frame or the outer frame to a position for holding the electronic component, so that the peripheral frame of different sizes can be effectively responded without replacing the auxiliary frame. The need for electronic parts.

Other inventive aspects and more detailed technical and functional descriptions of the present invention are disclosed in the following description.

The first to seventh drawings show a preferred example of the substrate transfer device 100 of the present invention. The first figure indicates that the transfer device 100 is used to send a substrate 80 to a soldering location to solder an electronic component 81, and continue to transport the substrate 80 along with the soldered electronic component 81 to the next workstation. As shown in the second figure, the transfer device 100 mainly includes a moving mechanism 5, a support portion 6, and two rows of support bars 7 disposed opposite the support portion 6.

The support portion 6 includes a base 61, a plurality of X-direction guide rails 62 disposed on the base 61, at least one main frame 63, and a plurality of vacuum suction cups 64 positioned on the main frame 63. As shown in the first and third figures, the base 61 of the support portion 6 is disposed on the moving mechanism 5, and the main frame 63 is fixed on the base 61 and slightly above the X-direction guide rails 62. Above, the moving mechanism 5 is used to drive the support portion 6 to move in the X, Y and Z directions and to rotate around the Z axis.

In general, the main frame 62 and the suction cup 64 of the support portion 6 are mainly used to horizontally support and adsorb the substrate 80, and the support bars 7 are mainly used to support the electronic components 81 on the side of the substrate 80. . Specifically, each of the support bars 7 is disposed on the support portion 6 in the X direction, and can be horizontally aligned with respect to the support portion 6 by an original position (second or fourth figure) on the support portion 6 in the X direction. The ground is moved outward to a first support position (first or fifth figure) on the support portion 6 to support one of the electronic components 81 on the side of the substrate 80. Preferably, each of the support bars 7 is gradually tapered from the inner end to the outer end, and more preferably made of an elastic material to slow the transmission of vibration generated by the movement of the moving mechanism 5 to the support. Electronic part 81.

As shown in the second figure, the transfer device 100 further includes four sets of X-direction carrying devices. Each X-direction carrying device includes a socket 91 and a driving mechanism 92 (for example, a pneumatic cylinder) connected to the socket 91 to extend the supporting bars 7 from their original positions (fourth drawing) Transfer to the corresponding first support position (fifth figure). Each of the sockets 91 is slidably disposed vertically on the parallel two X-direction rails 62, and each driving mechanism 92 is disposed at the bottom of the base 62 for driving the socket 91 to move outward. The support bars 7 are arranged on a socket 91 in groups of two. In this manner, the driving mechanisms 92 are respectively driven to displace the plurality of sockets 91 along the X-direction guide rails 62 to transfer the support bars 7 from the original position thereof to the corresponding first support positions. , or move back to the original position.

In this embodiment, the socket 91 of each X-direction carrying device is a long strip body and is disposed along the Y direction, and the socket 91 defines a plurality of positioning slots 910 along the length direction thereof for the support rods. One end of 7 selects the local positioning. In this way, the support bars 7 can be manually adjusted to a position corresponding to the electronic component 81 according to the position of the corresponding electronic component 81 to enhance the supporting effect.

As shown in the sixth figure, the support portion 6 of the transfer device 100 can be provided with an outer frame 65 and a plurality of suction cups 66 disposed on the outer frame 65. The outer frame 65 is sleeved around the main frame 63 to form a bearing surface together with the main frame 63. As such, the main frame 63, the outer frame 65, and the suction cups 64, 66 can be used to carry and adsorb a larger substrate 82 than the substrate 80, as shown in the seventh figure.

In addition, in order to meet the needs of the large substrate 82, each X-direction carrying device moves the support bar 7 thereon along the X-direction guide rails 62 from the first support position (fifth figure). A second supporting position (seventh drawing) on the supporting portion 6 supports one of the electronic components 83 on the side of the large substrate 82. Compared with the prior art, the support bar of the present invention is arranged to be movable relative to the main frame or the outer frame to a position for holding the electronic component, so that the substrate can be effectively adapted to different sizes without replacing the auxiliary frame. The need for peripheral electronic components.

The eighth and ninth figures are used to show the actual operation of the transfer device 100. As shown in the eighth diagram, the transfer device 5 of the transfer device 100 has brought a substrate 80 to a soldering position of a heat pressing device 3 to mount an electronic component 81. The welding position is located between a thermal head 31 of the hot pressing device 3 and a support table 32. In the welding position, the substrate 80 and the electronic component 81 are respectively supported by the transfer device 100. The portion 6 and the lifting table 33 of the heat pressing device 3 are supported flat. After the substrate and the electronic component 81 are soldered, the thermal head 31 is first pulled back to its original position, and then the support portion 6 and the lifting platform 33 are simultaneously pushed up to a height, as shown in FIG. It is shown that the soldered substrate 80 and the electronic component 81 can be maintained in a flat state away from the support table 32. At this time, the support bar 7 of the transfer device 100 can extend the support portion 6 to the space beside the lifting platform 33 to support the newly soldered electronic component 81. Finally, the transfer device 5 further drives the support portion 6 to move in the X direction to lift the substrate 80 and the electronic component 81 on the support portion 6 away from the soldering position.

From the above description, it can be understood that the transfer device of the present invention not only can carry the substrate, but also can effectively support the electronic components soldered on the periphery of the substrate, and can adjust the size or electron of the substrate bearing surface according to the different size substrates. The range of support for the part.

In any event, anyone can obtain sufficient teaching from the description of the above examples, and it is understood that the present invention is indeed different from the prior art, and is industrially usable and progressive. It is the invention that has indeed met the patent requirements and has filed an application in accordance with the law.

100. . . Transfer device

3. . . Hot pressing device

31. . . Hot head

32. . . Support table

33. . . Lifts

5. . . Mobile agency

6. . . Support

61. . . Pedestal

62. . . X-direction rail

63. . . Main frame

64. . . Vacuum chuck

65. . . Outer frame

66. . . Suction cup

7. . . Support bar

80. . . Substrate

81. . . Electronic parts

82. . . Large substrate

91. . . Seat

910. . . Positioning slot

92. . . Drive mechanism

The first figure is a schematic view of a preferred embodiment of the transfer device of the present invention.

The second drawing is an exploded perspective view of the preferred embodiment.

The third drawing is a cross-sectional view of the preferred embodiment and a partial enlarged view thereof.

The fourth figure is a partial top view of the preferred embodiment showing its support strips in an original position.

The fifth figure, similar to the fourth figure, shows that the support strip is in a first support position.

Figure 6 is a schematic view showing the addition of an outer frame in the preferred embodiment.

The seventh figure is similar to the fifth figure, showing that the support strip is located at a second support position.

Figure 8 is a partial cross-sectional view showing the preferred embodiment and a heat pressing device.

Fig. 9 is a view showing a state in which the support portion of the preferred embodiment is raised in synchronization with the lifting table of the heat pressing device.

Figure 10 shows a top view of a conventional substrate transfer device.

Figure 11 is a cross-sectional view of a conventional substrate transfer device taken along line A-A of Figure 10.

Figure 12 is a top plan view showing the addition of a substrate auxiliary frame to a conventional substrate transfer device.

Figure 13 is a cross-sectional view of the conventional substrate transfer device taken along line B-B of Figure 12.

100. . . Transfer device

5. . . Mobile agency

6. . . Support

61. . . Pedestal

62. . . X-direction rail

63. . . Main frame

7. . . Support bar

80. . . Substrate

81. . . Electronic parts

91. . . Seat

Claims (10)

A transfer device for carrying a substrate and at least one electronic component on a side of the substrate; the transfer device includes: a moving mechanism; a support portion disposed on the moving mechanism for horizontally supporting the substrate; a support bar is disposed on the support portion along the X direction, and the support bar can be horizontally outwardly moved from the original position on the support portion to the support portion by an original position on the support portion The first support position is to hold the electronic component on the side of the substrate. The transfer device of claim 1, wherein the support strip is gradually tapered from an inner end to an outer end. The transfer device of claim 2, wherein the support bar is made of an elastic material. The transfer device of claim 1, further comprising an X-direction carrying device, wherein the supporting portion comprises a base and an X-direction guide rail; the base is disposed on the moving mechanism; The feeding device and the X-direction guide rail are both disposed on the base, and the X-direction carrying device is configured to displace the support bar on the X-direction rail, so that the support bar can be in the original position and the first Move between the support positions. The transfer device of claim 4, wherein the X-direction carrying device comprises at least one socket and a driving mechanism; the socket is slidably disposed on the X-direction rail, wherein the bearing system is a strip body disposed along the Y direction, and defining a plurality of positioning grooves along the length direction thereof; the support strip is selectively positioned in any of the positioning slots of the socket; and the driving mechanism is used to drive the socket together The support bar is displaced on the X-direction rail. The transfer device of claim 4, wherein the support portion further comprises a main frame disposed on the base and a plurality of suction cups disposed on the main frame; and the main frame and the plurality of A suction cup is used to carry and adsorb the substrate. The transfer device of claim 6, wherein the support portion further comprises an outer frame disposed on the base and a plurality of suction cups disposed on the outer frame; the outer frame is sleeved on the main The frame is coplanar with the main frame; and the main frame, the outer frame and the suction cups can be used to carry and adsorb one large substrate larger than the substrate. The transfer device of claim 7, wherein the X-direction carrying device is more capable of carrying the support bar on the X-direction rail and is moved outward from the first support position to the support portion. A second support position is used to support one of the electronic components on the side of the large substrate. The transfer device of claim 1, further comprising another support bar disposed on the support portion along the X direction; wherein the two support bars are respectively disposed on opposite sides of the support portion; A support bar can also be moved outward from an original position on the support portion to another position on the support portion relative to the support portion to support an electronic component on the other side of the substrate. The transfer device of claim 1 or 2, wherein the support portion comprises a main frame, an outer frame, and a plurality of suction cups disposed on the main frame and the outer frame; the main frame and the main frame thereof The suction cup is configured to horizontally support and adsorb the substrate; the outer frame and the suction cup thereon are detachably sleeved around the main frame, so that the outer frame is coplanar with the main frame for use with the main frame Together, it supports a large substrate larger than the substrate.