1326633 九、發明說明： 【發明所屬之技術領域】 且特別 具及其 本發明是有關於一種承載治具及其操作方法， 是有關於一種置放基板以供進行研磨製程之承载治 操作方法。 【先前技術】 -般在液晶顯示器的製造過程中，通常會將液晶顯示 器中的玻璃基板先進行研磨製程的處理，以避免後續的製 程受到玻璃基板應力集中的影響…般常見心置放玻璃 基板的承載治# ’均是藉由一冑盤（stage)承载一定尺寸的 玻璃基板來進行研磨製程。然而，由於定盤為固定尺寸， 此時若有不同尺寸的基板需進行研磨製程，則必須更換相 對應的定盤，如此一來便需增加額外的定盤費用。此外， 由於定盤需要藉由手動更換，不但會浪費許多時間，而且 也有可能在更換之後造成其水平度不佳的情形，使得研磨 的精準度偏移太多。 因此，有必要提出一種承載治具，可藉以節省定盤更 換的時間及費用，並減少定盤在更換之後可能造成水平度 偏移的情形發生，讓操作者在更換不同尺寸的基板進行研 磨製程時’可更有效率且方便地操作。 【發明内容】 本發明之目的是在提供—種承載治具，可依基扳的尺 5 1326633 寸調整寬度，並可依製程需求旋轉基板β 本發明之一技術樣態係關於一種承載治具，其供置放 一承載物，並包含一t央平台、一第一托盤以及一第二托 盤。第一托盤以及第二托盤均用以辅助支撐承載物，並分 別設置於t央平台之二側，且各自於鄰近中央平台之一側 呈相對應之互補結構’亦藉由相對地移動調整以輔助支撐 承載物。 本發明之另一技術樣態係關於一種研磨機台，其包含 一承載治具以及二研磨砂輪。承載治具供置放一基板，並— 包含一中央平台以及二托盤，其中二粍盤係用以辅助支撐 基板，並为別a史置於中央平台之二側，且各自於鄰近中央 平台之一側呈相對應之互補結構，亦藉由相對地移動調整 以辅助支撐基板。而二研磨砂輪則是分別設置於承載治具 之二側。 本發明之另一技術樣態係關於一種如上述承載治具之 操作方法，其包含下列步驟：移動調整第一托盤以及第二 托盤至一第一支撐寬度，使得第一托盤以及第二托盤各別 輔助支撐承載物之一第一邊；升上中央平台以抬高承載 物；旋轉中央平台以改變承載物之置放方向；移動調整第 一托盤以及第二托盤至一第二支撐寬度；以及降下中央平 台以放低承載物，使得第一托盤以及第二托盤各別輔助支 撐承載物之一第二邊。 根據本發明之技術内容，應用前述承載治具及其操作 方法可減少習知定盤更換的費用及時間，並更有彈性地對 1326633 不同尺寸的基板進行研磨製程。 【實施方式】1326633 IX. Description of the Invention: [Technical Field of the Invention] In particular, and the present invention relates to a bearing jig and an operating method thereof, and relates to a carrying and treating operation method for placing a substrate for performing a polishing process. [Prior Art] Generally, in the manufacturing process of a liquid crystal display, the glass substrate in the liquid crystal display is usually subjected to a polishing process to prevent the subsequent process from being affected by the stress concentration of the glass substrate. The load-bearing treatments are used to carry out the grinding process by carrying a glass substrate of a certain size on a stage. However, since the fixing plate is of a fixed size, if a different size substrate is required to be subjected to the grinding process, the corresponding fixing plate must be replaced, so that an additional fixing cost is required. In addition, since the fixing needs to be manually replaced, not only a lot of time is wasted, but also the level of poorness after the replacement is made, so that the precision of the grinding is shifted too much. Therefore, it is necessary to propose a carrying fixture, which can save the time and cost of the fixing replacement, and reduce the situation in which the fixing plate may cause a horizontal offset after the replacement, so that the operator can change the substrate of different sizes for the grinding process. Time can be operated more efficiently and conveniently. SUMMARY OF THE INVENTION The object of the present invention is to provide a carrier fixture, which can adjust the width according to the ruler 5 1326633 inch, and can rotate the substrate according to the process requirements. One technical aspect of the invention relates to a bearing fixture. The utility model is provided with a carrier and includes a t-platform platform, a first tray and a second tray. The first tray and the second tray are both used to assist the support carrier, and are respectively disposed on two sides of the t-stage, and each of the adjacent complementary structures on one side adjacent to the central platform is also adjusted by relative movement. Auxiliary support carrier. Another aspect of the invention relates to a grinder table comprising a load bearing fixture and two grinding wheels. Carrying a fixture for placing a substrate, and including a central platform and two trays, wherein the two trays are used to assist the supporting substrate, and are placed on the two sides of the central platform, and each adjacent to the central platform One side has a corresponding complementary structure and is also adjusted to assist in supporting the substrate by relatively moving. The two grinding wheels are respectively disposed on the two sides of the carrying fixture. Another technical aspect of the present invention relates to a method for operating a carrying fixture as described above, comprising the steps of: moving and adjusting a first tray and a second tray to a first support width such that the first tray and the second tray are each Not assisting one of the first sides of the support; lifting the central platform to raise the load; rotating the central platform to change the placement direction of the load; moving the first tray and the second tray to a second support width; The central platform is lowered to lower the load such that the first tray and the second tray each assist the second side of one of the supports. According to the technical content of the present invention, the application of the foregoing bearing fixture and the operation method thereof can reduce the cost and time of the conventional fixing replacement, and more elastically grind the 1326633 substrates of different sizes. [Embodiment]
第1A圖係鳍'示本發明之一種研磨機台實施例的俯視 圖。研磨機台100包含一承載治具丨02以及兩組研磨砂輪 104。承載治具102係用以置放承載物丨〇6，例如液晶顯示 器中的玻璃基板’以供進行研磨製程，並包含中央平台 108、第一托盤110以及第二托盤112。中央平台1〇8係用 以對承載物106進行升降以及旋轉的動作。在本實施例中， 中央平台108係呈一圓形結構，而在另一實施例中，中央 平台108則是呈一「十」字形結構。第一托盤11〇以及第 二托盤112分別設置於中央平台1〇8的二側，用以辅助支 撐承載物106’並各自於鄰近中央平台1〇8的一側呈現相對 應的互補結構，且可藉由相對地移動調整來輔助支撐承載 物106。兩組研磨砂輪1〇4則是分別設置於承載治具ι〇2 的二側，用以對承載物106進行研磨的動作。第iB圖係繪 示如第1A圖所示之研磨機台的側視圖。第丨c圖係繪示本 發明之另一種研磨機台實施例的俯視圖。相較於第1A圖而 吕’中央平台108a係呈現「十」字形結構。 另外，研磨機台100亦可包含二電荷耦合裝置（Charge Coupled Device，CCD) 122，分別設置於承載治具1〇2的二 側，用以偵測承載物1〇6的置放方向是否發生偏移的情形。 當承載物106的置放方向發生偏移的情形時，可將中央平 台108稍微地旋轉，以修正承載物1〇6的置放方向。若是 7 1326633 無任何偏移的情形發生，則可進行承載物106的研磨製程。Fig. 1A is a plan view showing an embodiment of a polishing machine of the present invention. The grinder table 100 includes a bearing fixture 丨02 and two sets of grinding wheels 104. The carrier jig 102 is for placing a carrier 6, such as a glass substrate in a liquid crystal display, for performing a polishing process, and includes a center platform 108, a first tray 110, and a second tray 112. The center platform 1 8 is used to lift and rotate the carrier 106. In the present embodiment, the central platform 108 has a circular structure, and in another embodiment, the central platform 108 has a "ten" shape. The first tray 11 〇 and the second tray 112 are respectively disposed on two sides of the central platform 1 〇 8 to assist the support carriers 106 ′ and each of which presents a corresponding complementary structure on a side adjacent to the central platform 1 〇 8 , and The support carrier 106 can be assisted by relatively moving adjustments. The two sets of grinding wheels 1〇4 are respectively disposed on the two sides of the carrying jig 2 for grinding the carrier 106. The iB diagram shows a side view of the polishing machine shown in Fig. 1A. Figure c is a plan view of another embodiment of a polishing machine of the present invention. Compared with Fig. 1A, Lu's central platform 108a exhibits a "ten" shape. In addition, the polishing machine 100 can also include two Charge Coupled Devices (CCDs) 122, which are respectively disposed on the two sides of the bearing fixtures 1〇2, for detecting whether the placement direction of the carriers 1〇6 occurs. The case of offset. When the placement direction of the carrier 106 is shifted, the center platform 108 can be slightly rotated to correct the placement direction of the carrier 1〇6. If 7 1326633 occurs without any offset, the grinding process of the carrier 106 can be performed.
此外’第一托盤110以及第二托盤112在對應中央平 台1〇8(或l〇8a)之處各具有一缺口部114,其中此缺口部U4 的設計係相對於第一托盤11〇或第二托盤112其它用以輔 助支樓承載物106的部分來得短小，類似一凹陷的結構， 藉以避免當兩托盤在進行相對地移動調整時干涉中央平台 1〇8(或l〇8a)。第一托盤110以及第二托盤112的表面均可 密佈真空孔洞116’用以吸著固定承載物X06的邊緣部分， 並可藉由電磁閥的分段控制來決定承載物1〇6的邊緣部分 受吸附的範圍。 如第1A圖所示，在本實施例中，第一托盤丨丨〇以及第 二托盤112所呈現之相對應的互補結構係分別為一齒狀結 構’且兩托盤的齒狀結構包含複數個凸緣118以及形成於 每二凸緣118間之凹槽120,且第一托盤11〇齒狀結構之複 數個凸緣118對應於第二托盤112齒狀結構之複數個凹槽 120’藉以在相對地移動調整後使得各自呈現的齒狀結構相 互配合’進而輔助支撐承載物106。此種具延伸平面的齒狀 結構也使得兩托盤在相對地移動調整後，與中央平台1〇8 之間不會有懸空支撐承載物106的情形發生，如此一來， 承載物106便不會受應力影響而產生彎曲的問題。 第2A圖係繪示如第1A圖所示之研磨機台中，中央平 台上升及旋轉且兩托盤相對地移動調整後的俯視圖。第2B 圖係繪示如第2A圖所示之研磨機台的側視圖。請參照第 1A圖及第2A圖，在第1A圖中，第一托盤11〇以及第二托 8 1326633 盤112係藉由相對地移動調整至一支撐寬度，以各別輔助 支撐承載物106的短邊，使得承載物106的短邊可供兩組 研磨砂輪104進行研磨的動作。在第2A圖中，當承載物 106的長邊需進行研磨的動作時，此時先將中央平台 升至一定高度並旋轉，使得承載物106的置放方向旋轉9〇 度角，而第一托盤110以及第二托盤112則係藉由相對地 移動調整至另一支撐寬度，以各別辅助支撐承載物1〇6的 長邊，使得承載物106的長邊可供兩組研磨砂輪丨再進 行研磨的動作。另外，請參照第2C圖，其繪示如第2B圖 所示研磨機台其中央平台下降後的側視圖。此時，在第— 托盤110以及第二托盤112相對地移動調整之後，便可將 中央平台108降下，使得承載物1〇6可恰好置放於中央平 台108、第一托盤no以及第二托盤112之上，而後便可藉 由兩組研磨砂輪104對承載物1〇6的長邊進行研磨的動作。 第3圖係繪示如第ία圖所示之研磨機台進行研磨時承 載/台具的操作流程圖。首先’將第一托盤1 1 〇以及第二把 盤112移動調整至第一支撐寬度（步驟300)，使得第一托盤 110以及第二托盤112可各別輔助支撐承載物1〇6之第一 邊，例如承載物106的短邊。接著，置放欲進行研磨的承 載物106於中央平台1〇8、第一托盤11〇以及第二托盤m 之上（步驟302)’使得承載物106的第一邊可藉由第一把盤 110以及第二托盤112各別辅助支撐’並供兩組研磨砂輪 104進行研磨（如第ία圖）。 在完成研磨承載物106的第一邊之後，接著將中央平 I326633 台108升上一定高度以抬高承載物1〇6(步驟3〇4)，然後再 將中央平台108旋轉（步驟306)，藉以改變承載物1〇6的置 玫方向（如第2B圖）。以本實施例而言，中央平台係被旋轉 9〇度角。而後，將第一托盤11〇以及第二托盤112移動調 整至一第二支撐寬度（步驟308):使得第一托盤11()以及第 二托盤112可各別輔助支撐承載物i 〇6之第二邊，例如承 載物106的長邊（如第2A圖）。然後，再將中央平台1 〇8降 下以放低承載物1〇6(步驟310)，使得承載物106的第二邊 可藉由第一托盤110以及第二托盤112各別輔助支撐，並 供兩組研磨砂輪104進行研磨。在另一實施例中，操作者 亦可先對承載物106的長邊進行研磨，然後再依相同的方 法操作承載治具，而後對承載物丨〇6的短邊進行研磨。 此外’操作者更可藉由電荷耦合裝置（Charge c〇upled Device ’ CCD)偵測判別承載物i〇6的置放方向是否發生偏 移。當承載物106的置放方向發生偏移的情形時，則可猶 微方疋轉中央平台108以修正承載物的置放方向。若是 無任何偏移的情形發生，則可接續研磨承載物1〇6的步驟。 由上述本發明之實施例可知，應用此研磨機台、其承 載治具以及承載治具的操作方法可節省定盤更換的費用及 時間’並更有彈性地對不同尺寸的基板進行研磨製程。此 種設計亦可減少定盤在更換之後可能造成其水平基準面差 異過大’不易調整的問題。此外，藉由拖盤之相對應互補 的結構’可使得拖盤與中央平台之間不會有懸空支揮承載 物的情形發生，如此一來，承載物便不會受應力影響而產 1326633 生彎曲的問題。 雖然本發明已以實施例揭露如上，麸i 太旅nn , t β ......並非用以限定 2明，任何所屬技術領域中具有通常知識者，在不脫離 :發明之精神和範圍内，當可作各種之更動與潤飾，因此 本發明之保護範圍當視後附之中請專利範圍所界定者為 準。 Φ 【圖式簡單說明】 第1Α圖係繪示依照本發明實施例之一種研磨機台的 俯視圖。 第1Β圖絲示如第1Α圖所示之研磨機台的側視圖。 第1C圖係繪示本發明之另一種研磨機台實施例的俯 視圖。 第2Α圖係繪示如第1Α圖所示之研磨機台中，中央平 台上升及旋轉且兩托盤相對地移動調整後的俯視圖。 • 第2Β圖係繪示如第2Α圖所示之研磨機台的侧視圖。 第2C圖係續'示如第2Β圖所示之研磨機台其中央平Α • 下降後的側視圖。 - 第3圖係繪示如第1Α圖所示之研磨機台中承載治具之 操作方法的流程圖。 【主要元件符號說明】 1〇〇 :研磨機台 112 :第二托盤 11 1326633 102 ： 承載治具 114 ： 104 ： 研磨砂輪 116 ： 106 : 承載物 118 ： 108、 108a :中央平台 120 : 110 ： 第一托盤 122 ： 300- 缺口部 真空孔洞 凸緣 凹槽 電荷耦合裝置 312 :步驟In addition, the first tray 110 and the second tray 112 each have a notch portion 114 at a position corresponding to the central platform 1〇8 (or 10a), wherein the design of the notch portion U4 is relative to the first tray 11 or The other portions of the two trays 112 that are used to assist the deck load 106 are short, similar to a recessed configuration, to avoid interference with the center platform 1〇8 (or l8a) when the two trays are relatively moved. The surface of the first tray 110 and the second tray 112 may be densely covered with a vacuum hole 116' for absorbing the edge portion of the fixed carrier X06, and the edge portion of the carrier 1〇6 may be determined by segmentation control of the solenoid valve. The range of adsorption. As shown in FIG. 1A, in the present embodiment, the corresponding complementary structures presented by the first tray 丨丨〇 and the second tray 112 are respectively a tooth-shaped structure and the tooth structures of the two trays comprise a plurality of a flange 118 and a groove 120 formed between each of the two flanges 118, and the plurality of flanges 118 of the first tray 11 having a serrated structure corresponding to the plurality of grooves 120' of the tooth structure of the second tray 112 are thereby The relative movements are adjusted such that the respective presented toothed structures cooperate with each other to assist the support carrier 106. The toothed structure with the extended plane also makes it impossible for the two trays to be suspended between the central platform 1 and 8 after the relative movement of the two trays is adjusted, so that the carrier 106 does not The problem of bending due to stress. Fig. 2A is a plan view showing the center of the polishing machine shown in Fig. 1A with the center platform raised and rotated and the two trays moved relative to each other. Fig. 2B is a side view showing the polishing machine shown in Fig. 2A. Referring to FIGS. 1A and 2A, in FIG. 1A, the first tray 11〇 and the second tray 8 1326633 are adjusted to a support width by relative movement to individually support the carrier 106. The short sides allow the short sides of the carrier 106 to be used for the grinding of the two sets of grinding wheels 104. In FIG. 2A, when the long side of the carrier 106 needs to be ground, the center platform is first raised to a certain height and rotated, so that the placement direction of the carrier 106 is rotated by 9 degrees, and the first The tray 110 and the second tray 112 are adjusted to the other support width by relative movement to individually support the long sides of the carrier 1〇6, so that the long side of the carrier 106 can be used for two sets of grinding wheels. Perform the grinding action. In addition, please refer to FIG. 2C, which is a side view of the polishing machine shown in FIG. 2B with the center platform lowered. At this time, after the first tray 110 and the second tray 112 are relatively moved and adjusted, the center platform 108 can be lowered, so that the carrier 1〇6 can be placed on the center platform 108, the first tray no, and the second tray. Above 112, the long sides of the carrier 1〇6 can be polished by the two sets of grinding wheels 104. Fig. 3 is a flow chart showing the operation of the load/table when the grinding machine shown in Fig. 355 is ground. Firstly, the first tray 1 1 〇 and the second tray 112 are moved and adjusted to the first support width (step 300), so that the first tray 110 and the second tray 112 can respectively support the first support carrier 1〇6. The edge, for example, the short side of the carrier 106. Next, the carrier 106 to be ground is placed on the central platform 1〇8, the first tray 11〇 and the second tray m (step 302)′ such that the first side of the carrier 106 can be used by the first tray 110 and the second tray 112 are each assisted in support ' and are ground for two sets of grinding wheels 104 (eg, FIG. After the first side of the abrasive carrier 106 is completed, the central flat I326633 table 108 is then raised to a certain height to raise the carrier 1〇6 (step 3〇4), and then the central platform 108 is rotated (step 306). In order to change the direction of the bearing 1〇6 (as shown in Figure 2B). In the present embodiment, the central platform is rotated by a 9 degree angle. Then, the first tray 11 〇 and the second tray 112 are moved and adjusted to a second support width (step 308): the first tray 11 () and the second tray 112 can respectively support the support carrier i 〇 6 Two sides, such as the long side of the carrier 106 (as in Figure 2A). Then, the central platform 1 〇 8 is lowered to lower the carrier 1 〇 6 (step 310), so that the second side of the carrier 106 can be supported by the first tray 110 and the second tray 112 respectively. The two sets of grinding wheels 104 are ground. In another embodiment, the operator may first grind the long side of the carrier 106, then operate the carrier in the same manner, and then grind the short side of the carrier 丨〇6. In addition, the operator can detect whether the placement direction of the carrier i〇6 is offset by a Charge Coupled Device (CCD). When the placement direction of the carrier 106 is shifted, the center platform 108 can be rotated to correct the placement direction of the carrier. If there is no offset, the step of grinding the carrier 1〇6 can be continued. According to the embodiment of the present invention described above, the use of the grinding machine, the supporting jig thereof, and the operation method of the carrying jig can save the cost and time of the fixing of the fixing plate and more elastically grind the substrates of different sizes. This design also reduces the problem that the fixed plate may cause an excessively large difference in its horizontal datum after replacement. In addition, by the corresponding complementary structure of the tray, there can be no suspended support between the tray and the central platform, so that the carrier will not be affected by the stress and the production is 1326633. The problem of bending. Although the present invention has been disclosed in the above embodiments by way of example, the bran i is not limited to, and is not limited to any one of ordinary skill in the art, without departing from the spirit and scope of the invention. The scope of protection of the present invention is defined by the scope of the patent application. Φ [Simple Description of the Drawings] Fig. 1 is a plan view showing a grinding machine table according to an embodiment of the present invention. The first drawing shows a side view of the grinding machine shown in Fig. 1. Figure 1C is a top plan view of another embodiment of a polishing machine of the present invention. The second drawing shows a plan view of the polishing machine shown in Fig. 1 in which the center platform is raised and rotated and the two trays are relatively moved. • Figure 2 is a side view of the grinding machine shown in Figure 2. Figure 2C is a continuation of the side view of the grinding machine shown in Figure 2, with the center flat. - Fig. 3 is a flow chart showing the operation method of carrying the jig in the grinder table as shown in Fig. 1. [Main component symbol description] 1〇〇: Grinding table 112: Second tray 11 1326633 102: Bearing jig 114: 104: Grinding wheel 116: 106: Carrier 118: 108, 108a: Central platform 120: 110: One tray 122: 300- notched vacuum hole flange groove charge coupling device 312: steps
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