TWI449095B - Cutting device, cutting device unit and cutting method - Google Patents

Cutting device, cutting device unit and cutting method Download PDF

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Publication number
TWI449095B
TWI449095B TW099108206A TW99108206A TWI449095B TW I449095 B TWI449095 B TW I449095B TW 099108206 A TW099108206 A TW 099108206A TW 99108206 A TW99108206 A TW 99108206A TW I449095 B TWI449095 B TW I449095B
Authority
TW
Taiwan
Prior art keywords
workpiece
cutting
cutting device
blade
spindle
Prior art date
Application number
TW099108206A
Other languages
English (en)
Chinese (zh)
Other versions
TW201044450A (en
Inventor
Yusuke Arai
Takashi Fujita
Masayuki Azuma
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of TW201044450A publication Critical patent/TW201044450A/zh
Application granted granted Critical
Publication of TWI449095B publication Critical patent/TWI449095B/zh

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Landscapes

  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
TW099108206A 2009-04-24 2010-03-19 Cutting device, cutting device unit and cutting method TWI449095B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009107128 2009-04-24
JP2010027799A JP5495832B2 (ja) 2009-04-24 2010-02-10 ダイシング装置、ダイシング装置ユニット及びダイシング方法

Publications (2)

Publication Number Publication Date
TW201044450A TW201044450A (en) 2010-12-16
TWI449095B true TWI449095B (zh) 2014-08-11

Family

ID=43420596

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099108206A TWI449095B (zh) 2009-04-24 2010-03-19 Cutting device, cutting device unit and cutting method

Country Status (2)

Country Link
JP (1) JP5495832B2 (ja)
TW (1) TWI449095B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5606838B2 (ja) * 2010-09-07 2014-10-15 株式会社ディスコ 切削ブレードを装着する回転スピンドルの取り付け状態確認治具および取り付け状態確認方法
JP2013021018A (ja) * 2011-07-07 2013-01-31 Disco Abrasive Syst Ltd 切削装置ユニット
JP2014083620A (ja) * 2012-10-22 2014-05-12 Mitsui Seiki Kogyo Co Ltd 工作機械
JP2015100896A (ja) * 2013-11-26 2015-06-04 株式会社ディスコ 研削装置およびウェーハ加工装置
JP2023148574A (ja) * 2022-03-30 2023-10-13 株式会社東京精密 ダイシング装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200911455A (en) * 2007-08-28 2009-03-16 Tokyo Seimitsu Co Ltd Dicing device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3765265B2 (ja) * 2001-11-28 2006-04-12 株式会社東京精密 ダイシング装置
JP2008112884A (ja) * 2006-10-31 2008-05-15 Disco Abrasive Syst Ltd ウエーハの加工方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200911455A (en) * 2007-08-28 2009-03-16 Tokyo Seimitsu Co Ltd Dicing device

Also Published As

Publication number Publication date
JP5495832B2 (ja) 2014-05-21
TW201044450A (en) 2010-12-16
JP2010272842A (ja) 2010-12-02

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