TWI446596B - Led package and method for manufacturing same - Google Patents

Led package and method for manufacturing same Download PDF

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Publication number
TWI446596B
TWI446596B TW100101959A TW100101959A TWI446596B TW I446596 B TWI446596 B TW I446596B TW 100101959 A TW100101959 A TW 100101959A TW 100101959 A TW100101959 A TW 100101959A TW I446596 B TWI446596 B TW I446596B
Authority
TW
Taiwan
Prior art keywords
lead frame
led package
led
resin body
edge
Prior art date
Application number
TW100101959A
Other languages
Chinese (zh)
Other versions
TW201145616A (en
Inventor
Hidenori Egoshi
Hiroaki Oshio
Teruo Takeuchi
Kazuhiro Inoue
Iwao Matsumoto
Satoshi Shimizu
Original Assignee
Toshiba Kk
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Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of TW201145616A publication Critical patent/TW201145616A/en
Application granted granted Critical
Publication of TWI446596B publication Critical patent/TWI446596B/en

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    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Description

發光二極體(LED)封裝及其製造方法Light-emitting diode (LED) package and method of manufacturing same 相關申請案的參照Reference to relevant application

本案係根據2010年1月29日申請的日本專利申請案第2010-019782號及2010年8月23日申請的日本專利申請案第2010-186505號且主張其優先權，此二前案的整個內容藉著參考而結合於此。The present application is based on Japanese Patent Application No. 2010-019782, filed on Jan. 29, 2010, and Japanese Patent Application No. 2010-186505, filed on Aug. The content is incorporated herein by reference.

此處所述的本發明的實施例概括而言相關於LED(發光二極體)封裝及其製造方法。Embodiments of the invention described herein are broadly related to LED (light emitting diode) packages and methods of making the same.

傳統上，內部安裝有LED晶片的LED封裝向來是用以下的方式建構，以用來控制光分佈特性及增加從LED封裝擷取(extracting)光的效率。明確地說，由白色樹脂製成的杯形罩體(enclosure)被設置於LED封裝。然後，LED晶片被安裝在罩體的底部表面上。罩體的內部被充填以透明樹脂以用其來掩埋LED晶片。罩體在許多情況中(例如，參見JP-A 2004-274027(公開))是由熱塑性聚醯胺樹脂(thermoplastic polyamide resin)形成。Traditionally, LED packages in which LED chips are mounted have historically been constructed in such a manner as to control light distribution characteristics and increase the efficiency of extracting light from the LED package. Specifically, a cup-shaped enclosure made of white resin is provided in the LED package. The LED wafer is then mounted on the bottom surface of the cover. The inside of the cover is filled with a transparent resin to be used to bury the LED wafer. The cover is formed of a thermoplastic polyamide resin in many cases (for example, see JP-A 2004-274027 (published)).

然而，伴隨著LED封裝的漸增的應用範圍，近來的LED封裝被要求必須具有較高的耐用性。同時，伴隨著LED晶片的漸增的輸出，大量的光及熱從LED晶片輻射，而此促進用來密封此種LED晶片的樹脂部份的裂解(degradation)。另外，伴隨著LED封裝的漸增的應用範圍，成本也被要求必須進一步降低。However, with the increasing range of applications of LED packages, recent LED packages are required to have high durability. At the same time, with the increasing output of the LED wafer, a large amount of light and heat are radiated from the LED wafer, which promotes the degradation of the resin portion used to seal such LED wafers. In addition, with the increasing range of applications for LED packages, costs are also required to be further reduced.

概括而言，根據一個實施例，LED(發光二極體)封裝包含第一及第二引線框、LED晶片、及樹脂本體。第一及第二引線框彼此分開。LED晶片被設置在第一及第二引線框的上方，LED晶片包含含有至少銦(indium)、鎵(gallium)、及鋁(aluminum)的半導體層，且LED晶片的一個端子連接於第一引線框，而LED晶片的另一個端子連接於第二引線框。樹脂本體覆蓋LED晶片及第一及第二引線框的每一個的整個上表面、下表面的部份、及邊緣表面的部份，且樹脂本體曝露下表面的其餘部份及邊緣表面的其餘部份。並且，樹脂本體的外觀為LED封裝的外觀的部份。In summary, according to one embodiment, an LED (Light Emitting Diode) package includes first and second lead frames, an LED wafer, and a resin body. The first and second lead frames are separated from each other. The LED chip is disposed above the first and second lead frames, the LED chip includes a semiconductor layer containing at least indium, gallium, and aluminum, and one terminal of the LED chip is connected to the first lead The frame, and the other terminal of the LED chip is connected to the second lead frame. The resin body covers the entire upper surface, the lower surface portion, and the edge surface portion of each of the LED wafer and the first and second lead frames, and the resin body exposes the remaining portion of the lower surface and the remaining portion of the edge surface Share. Also, the appearance of the resin body is a part of the appearance of the LED package.

根據另一實施例，揭示一種LED封裝的製造方法。此方法包含將LED晶片安裝在引線框片料的元件區域的每一個上，將該LED晶片的一個端子連接於第一引線框，且將該LED晶片的另一個端子連接於第二引線框。該引線框片料包含以矩陣陣列配置的多個元件區域。基本圖型形成於該元件區域的每一個。該基本圖型包含彼此分開的該第一及第二引線框。並且，導電材料存留於在該元件區域之間的切塊區域的每一個，以將相鄰的元件區域連接在一起。該LED晶片包含含有至少銦、鎵、及鋁的半導體層。此方法也包含形成樹脂板件。此樹脂板件將該LED晶片掩埋在該樹脂板件中，且覆蓋該引線框片料的該元件區域的每一個的整個上表面及下表面的部份。此方法也包含藉著移除被置於該切塊區域的該引線框片料的部份及該樹脂板件的部份而切割被置於該元件區域的該引線框片料的部份及該樹脂板件的部份。並且，經切割的部份的外觀為該LED封裝的外觀的部份。According to another embodiment, a method of fabricating an LED package is disclosed. The method includes mounting an LED wafer on each of the component regions of the leadframe sheet, connecting one terminal of the LED wafer to the first leadframe, and connecting the other terminal of the LED wafer to the second leadframe. The leadframe sheet comprises a plurality of component regions arranged in a matrix array. A basic pattern is formed in each of the element regions. The basic pattern includes the first and second lead frames that are separated from each other. Also, a conductive material remains in each of the dicing regions between the element regions to connect adjacent component regions together. The LED wafer includes a semiconductor layer containing at least indium, gallium, and aluminum. This method also includes forming a resin sheet member. The resin sheet is buried in the resin sheet member and covers a portion of the entire upper surface and the lower surface of each of the element regions of the lead frame sheet. The method also includes cutting a portion of the lead frame sheet placed in the component region by removing a portion of the lead frame sheet placed in the dicing region and a portion of the resin sheet member Part of the resin sheet. Also, the appearance of the cut portion is part of the appearance of the LED package.

以下藉著參考圖式而提供對於實施例的敘述。The description of the embodiments is provided below by reference to the drawings.

首先，提供對於第一實施例的敘述。First, a description is given of the first embodiment.

圖1為顯示根據此實施例的LED封裝的立體圖。FIG. 1 is a perspective view showing an LED package according to this embodiment.

圖2A為顯示根據此實施例的LED封裝的剖面圖，且圖2B為顯示根據此實施例的引線框的平面圖。2A is a cross-sectional view showing an LED package according to this embodiment, and FIG. 2B is a plan view showing a lead frame according to this embodiment.

根據此實施例的LED封裝為藉著用由環氧樹脂(epoxy resin)、丙烯酸系樹脂(acrylic resin)、或胺基甲酸酯樹脂(urethane resin)製成的透明樹脂本體密封包含InGaAlP(銦鎵鋁磷)層的LED晶片而獲得的封裝。The LED package according to this embodiment is sealed by containing a transparent resin body made of an epoxy resin, an acrylic resin, or a urethane resin, and contains InGaAlP (indium). A package obtained from an LED wafer of a gallium aluminum phosphate layer.

如圖1至2B所示，根據此實施例的LED封裝1包含一對引線框11及12。引線框11及12各具有平面狀的形狀。引線框11及12被設置成彼此齊平但是彼此分開。引線框11及12是由相同的導電材料製成。引線框11及12是藉著例如將銀鍍層分別形成在銅板件的上表面及下表面上而製成。銀鍍層並未形成在引線框11及12的邊緣表面上。因此，銅板件曝露。As shown in FIGS. 1 to 2B, the LED package 1 according to this embodiment includes a pair of lead frames 11 and 12. The lead frames 11 and 12 each have a planar shape. The lead frames 11 and 12 are disposed to be flush with each other but separated from each other. The lead frames 11 and 12 are made of the same conductive material. The lead frames 11 and 12 are formed by, for example, forming silver plating layers on the upper surface and the lower surface of the copper plate member, respectively. Silver plating is not formed on the edge surfaces of the lead frames 11 and 12. Therefore, the copper plate is exposed.

以下為方便起見藉著使用直角XYZ座標系統以繼續敘述。在與引線框11及12的上表面平行的方向中，從引線框11至引線框12的方向被定義成為+X方向。在垂直於引線框11及12的上表面的方向中，向上的方向(亦即從引線框11至稍後會敘述的LED晶片14的方向)被定義成為+Z方向。與+X方向及+Z方向二者均正交的方向中的一個方向被定義成為+Y方向。注意與+X方向、+Y方向、及+Z方向相反的方向被分別定義成為-X方向、-Y方向、及-Z方向。另外，舉例而言，「+X方向」及「-X方向」可能會被上位式地只是稱為「X方向」。The following is for convenience to continue the description by using a right angle XYZ coordinate system. In the direction parallel to the upper surfaces of the lead frames 11 and 12, the direction from the lead frame 11 to the lead frame 12 is defined as the +X direction. In the direction perpendicular to the upper surfaces of the lead frames 11 and 12, the upward direction (i.e., the direction from the lead frame 11 to the LED wafer 14 to be described later) is defined as the +Z direction. One of the directions orthogonal to both the +X direction and the +Z direction is defined as the +Y direction. Note that the directions opposite to the +X direction, the +Y direction, and the +Z direction are defined as the -X direction, the -Y direction, and the -Z direction, respectively. In addition, for example, "+X direction" and "-X direction" may be referred to as "X direction" by the upper position.

引線框11設置有於Z方向觀看時為矩形的單一底座部份11a。四個延伸部份11b、11c、11d、11e從此底座部份11a延伸。延伸部份11b從底座部份11a的面向+Y方向且於+X方向延伸的邊緣的中心部份於+Y方向延伸。延伸部份11c從底座部份11a的面向-Y方向且於X方向延伸的邊緣的中心部份於-Y方向延伸。延伸部份11b至11e的每一個以此方式從底座部份11a的三個不同側邊中的相應的一個側邊延伸。延伸部份11b的位置與延伸部份11c的位置就X方向而言互相一致。延伸部份11d及11e分別從底座部份11a的面向-X方向的邊緣的兩個端部部份於-X方向延伸。The lead frame 11 is provided with a single base portion 11a which is rectangular when viewed in the Z direction. The four extending portions 11b, 11c, 11d, 11e extend from the base portion 11a. The extending portion 11b extends from the center portion of the edge of the base portion 11a facing the +Y direction and extending in the +X direction in the +Y direction. The extending portion 11c extends from the center portion of the edge of the base portion 11a facing the -Y direction and extending in the X direction in the -Y direction. Each of the extended portions 11b to 11e extends in this manner from a corresponding one of the three different sides of the base portion 11a. The position of the extended portion 11b and the position of the extended portion 11c coincide with each other in the X direction. The extending portions 11d and 11e respectively extend from the end portions of the edge of the base portion 11a facing the -X direction in the -X direction.

引線框12於X方向的長度比引線框11於X方向的長度短，並且引線框12於Y方向的長度等於引線框11於Y方向的長度。引線框12設置有於Z方向觀看時為矩形的單一底座部份12a。四個延伸部份12b、12c、12d、12e從此底座部份12a延伸。延伸部份12b從底座部份12a的面向+Y方向且於-X方向為最遠者的邊緣的端部部份於+Y方向延伸。延伸部份12c從底座部份12a的面向-Y方向且於-X方向為最遠者的邊緣的端部部份於-Y方向延伸。延伸部份12d及12e分別從底座部份12a的面向+X方向的邊緣的兩個端部部份於+X方向延伸。延伸部份12b至12e的每一個以此方式從底座部份12a的三個不同側邊中的相應的一個側邊延伸。另外，引線框11的延伸部份11d及11e的寬度可與引線框12的延伸部份12d及12e的寬度相等或不相等。在延伸部份11d及11e的寬度被設定為與延伸部份12d及12e的寬度不相等的情況中，陽極與陰極可容易地被彼此區分。The length of the lead frame 12 in the X direction is shorter than the length of the lead frame 11 in the X direction, and the length of the lead frame 12 in the Y direction is equal to the length of the lead frame 11 in the Y direction. The lead frame 12 is provided with a single base portion 12a which is rectangular when viewed in the Z direction. The four extended portions 12b, 12c, 12d, 12e extend from the base portion 12a. The extending portion 12b extends from the end portion of the base portion 12a facing the +Y direction and the edge which is the farthest in the -X direction in the +Y direction. The extending portion 12c extends from the end portion of the base portion 12a facing the -Y direction and the edge which is the farthest in the -X direction in the -Y direction. The extending portions 12d and 12e respectively extend from the two end portions of the edge of the base portion 12a facing the +X direction in the +X direction. Each of the extended portions 12b to 12e extends in a manner from a corresponding one of the three different sides of the base portion 12a. In addition, the widths of the extended portions 11d and 11e of the lead frame 11 may be equal or unequal to the widths of the extended portions 12d and 12e of the lead frame 12. In the case where the widths of the extended portions 11d and 11e are set to be not equal to the widths of the extended portions 12d and 12e, the anode and the cathode can be easily distinguished from each other.

突出部份11g形成於引線框11的下表面11f的相應於底座部份11a於X方向的中心部份的部份。因此，引線框11具有兩個厚度，其中底座部份11a於X方向的中心部份(亦即形成有突出部份11g的部份)為相對而言的厚板部份，而底座部份11a於X方向的兩個端部部份以及延伸部份11b至11e為相對而言的薄板部份。在圖2B中，底座部份11a不形成有突出部份11g的部份被顯示成為薄板部份11t。類似地，突出部份12g形成於引線框12的下表面12f的相應於底座部份12a於X方向的中心部份的部份。因此，引線框12也具有兩個厚度，其中底座部份12a於X方向的中心部份為相對而言的厚板部份，因為形成有突出部份12g，而底座部份12a於X方向的兩個端部部份以及延伸部份12b至12e為相對而言的薄板部份。在圖2B中，底座部份12a不形成有突出部份12g的部份被顯示成為薄板部份12t。換句話說，凹入部份形成於底座部份11a及12a的下表面於X方向的兩個端部部份。凹入部份沿著底座部份11a及12a的邊緣於Y方向延伸。注意在圖2B中，引線框11及12的每一個的相對而言較薄的部份(亦即薄板部份及延伸部份)是用虛線標示成為影線部份(hatched)。The protruding portion 11g is formed on a portion of the lower surface 11f of the lead frame 11 corresponding to the central portion of the base portion 11a in the X direction. Therefore, the lead frame 11 has two thicknesses, wherein the central portion of the base portion 11a in the X direction (that is, the portion where the protruding portion 11g is formed) is a relatively thick plate portion, and the base portion 11a The two end portions in the X direction and the extended portions 11b to 11e are relatively thin plate portions. In Fig. 2B, the portion of the base portion 11a where the protruding portion 11g is not formed is shown as the thin plate portion 11t. Similarly, the protruding portion 12g is formed on a portion of the lower surface 12f of the lead frame 12 corresponding to the central portion of the base portion 12a in the X direction. Therefore, the lead frame 12 also has two thicknesses, wherein the central portion of the base portion 12a in the X direction is a relatively thick plate portion because the protruding portion 12g is formed, and the base portion 12a is in the X direction. The two end portions and the extension portions 12b to 12e are relatively thin plate portions. In Fig. 2B, the portion of the base portion 12a where the protruding portion 12g is not formed is shown as the thin plate portion 12t. In other words, the concave portion is formed at both end portions of the lower surface of the base portions 11a and 12a in the X direction. The concave portion extends in the Y direction along the edges of the base portions 11a and 12a. Note that in FIG. 2B, the relatively thinner portions (i.e., the thin plate portions and the extended portions) of each of the lead frames 11 and 12 are indicated by broken lines as hatched portions.

引線框11的上表面11h與引線框12的上表面12h互相齊平。突出部份11g及12g係形成於引線框11及12的與引線框11及12的互相面對的邊緣隔開的區域。包含邊緣的區域為薄板部份11t及12t。引線框11的突出部份11g的下表面與引線框12的突出部份12g的下表面互相齊平。延伸部份的上表面的位置與引線框11及12的上表面的位置於Z方向一致。因此，所有的延伸部份均被設置在相同的XY座標平面上。The upper surface 11h of the lead frame 11 and the upper surface 12h of the lead frame 12 are flush with each other. The protruding portions 11g and 12g are formed in regions of the lead frames 11 and 12 which are spaced apart from the mutually facing edges of the lead frames 11 and 12. The area including the edges is the thin plate portions 11t and 12t. The lower surface of the protruding portion 11g of the lead frame 11 is flush with the lower surface of the protruding portion 12g of the lead frame 12. The position of the upper surface of the extended portion coincides with the position of the upper surface of the lead frames 11 and 12 in the Z direction. Therefore, all the extensions are placed on the same XY coordinate plane.

晶粒安裝材料13附著於引線框11的上表面11h的相應於底座部份11a的區域的一部份。在此實施例中，晶粒安裝材料13為導電性或絕緣性均可。在晶粒安裝材料13為導電性的情況中，晶粒安裝材料13是由例如銀糊(silver paste)、軟焊料(solder)、或共晶軟焊料(eutectic solder)製成。在晶粒安裝材料13為絕緣性的情況中，晶粒安裝材料13是由例如透明樹脂糊製成。The die attach material 13 is attached to a portion of the upper surface 11h of the lead frame 11 corresponding to the region of the base portion 11a. In this embodiment, the die attach material 13 may be either electrically conductive or insulative. In the case where the die attach material 13 is electrically conductive, the die attach material 13 is made of, for example, a silver paste, a solder, or a eutectic solder. In the case where the die attach material 13 is insulative, the die attach material 13 is made of, for example, a transparent resin paste.

LED晶片14被設置在晶粒安裝材料13上。換句話說，晶粒安裝材料將LED晶片14固定地黏結於引線框11。藉此，LED晶片14被安裝在引線框11上。LED晶片14包含含有銦(In)、鎵(Ga)、鋁(Al)、及磷(P)的半導體層。舉例而言，InGaAlP層形成在藍寶石(sapphire)基板上成為主動層(active layer)。此使LED晶片14發射在從綠至紅的波長範圍內的光。LED晶片14的形狀為例如長方體(cuboid)。端子14a及14b被設置在LED晶片14的上表面上。The LED wafer 14 is disposed on the die attach material 13. In other words, the die attach material fixedly bonds the LED wafer 14 to the lead frame 11. Thereby, the LED chip 14 is mounted on the lead frame 11. The LED wafer 14 includes a semiconductor layer containing indium (In), gallium (Ga), aluminum (Al), and phosphorus (P). For example, the InGaAlP layer is formed on a sapphire substrate to become an active layer. This causes the LED wafer 14 to emit light in the wavelength range from green to red. The shape of the LED wafer 14 is, for example, a cuboid. The terminals 14a and 14b are disposed on the upper surface of the LED wafer 14.

導線15的一端部被黏結於LED晶片14的端子14a。導線15從端子14a被引出於+Z方向(於直立方向)，且成曲線狀於在-X方向與-Z方向之間的方向。導線15的另一個端部被黏結於引線框11的上表面11h。藉此，端子14a經由導線15而連接於引線框11。另一方面，導線16的一端部被黏結於端子14b。導線16從端子14b被引出於+Z方向，且成曲線狀於在+X方向與-Z方向之間的方向。導線16的另一個端部被黏結於引線框12的上表面12h。藉此，端子14b經由導線16而連接於引線框12。導線15及16是由金屬例如金或鋁製成。One end of the wire 15 is bonded to the terminal 14a of the LED chip 14. The wire 15 is drawn from the terminal 14a in the +Z direction (in the upright direction) and curved in a direction between the -X direction and the -Z direction. The other end of the wire 15 is bonded to the upper surface 11h of the lead frame 11. Thereby, the terminal 14a is connected to the lead frame 11 via the wire 15. On the other hand, one end portion of the wire 16 is bonded to the terminal 14b. The wire 16 is drawn from the terminal 14b in the +Z direction and is curved in a direction between the +X direction and the -Z direction. The other end of the wire 16 is bonded to the upper surface 12h of the lead frame 12. Thereby, the terminal 14b is connected to the lead frame 12 via the wire 16. The wires 15 and 16 are made of a metal such as gold or aluminum.

LED封裝1另外包含透明樹脂本體17。透明樹脂本體17是由透明樹脂材料例如環氧樹脂、丙烯酸系樹脂、或胺基甲酸酯樹脂製成。否則，透明樹脂本體17可由從這些樹脂材料選擇的多種樹脂材料製成。注意，「透明(transparent)」涵蓋半透明(translucent)。透明樹脂本體17的外觀為長方體。透明樹脂本體17覆蓋引線框11及12、晶粒安裝材料13、LED晶片14、及導線15及16。透明樹脂本體17的外觀為LED封裝1的外觀的一部份。注意，LED封裝1的外觀的其他部份是由引線框11及12的突出部份形成。引線框11的部份及引線框12的部份曝露在透明樹脂本體17的下表面及側表面上。The LED package 1 additionally includes a transparent resin body 17. The transparent resin body 17 is made of a transparent resin material such as an epoxy resin, an acrylic resin, or a urethane resin. Otherwise, the transparent resin body 17 may be made of a plurality of resin materials selected from these resin materials. Note that "transparent" covers translucent. The appearance of the transparent resin body 17 is a rectangular parallelepiped. The transparent resin body 17 covers the lead frames 11 and 12, the die attach material 13, the LED chip 14, and the wires 15 and 16. The appearance of the transparent resin body 17 is a part of the appearance of the LED package 1. Note that other portions of the appearance of the LED package 1 are formed by the protruding portions of the lead frames 11 and 12. Portions of the lead frame 11 and portions of the lead frame 12 are exposed on the lower surface and the side surface of the transparent resin body 17.

更明確地說，成為引線框11的下表面11f的一部份的突出部份11g的下表面曝露在透明樹脂本體17的下表面上。另外，各別延伸部份11b至11e的尖端邊緣表面曝露在透明樹脂本體17的相應側表面上。另一方面，在引線框11中，整個上表面11h、突出部份11g的下表面以外的下表面11f、突出部份11g的側表面、及底座部份11a的邊緣表面均被透明樹脂本體17覆蓋。類似地，引線框12的突出部份12g的下表面曝露在透明樹脂本體17的下表面上。另外，各別延伸部份12b至12e的尖端邊緣表面曝露在透明樹脂本體17的相應側表面上。整個上表面12h、突出部份12g的下表面以外的下表面12f、突出部份12g的側表面、及底座部份12a的邊緣表面均被透明樹脂本體17覆蓋。在LED封裝1中，曝露在透明樹脂本體17的下表面上的突出部份11g及12g的下表面作用成為外部電極墊片(external electrode pad)。如上所述，透明樹脂本體17在從上方觀看時具有矩形形狀，並且各別引線框的多個延伸部份的尖端邊緣表面的每一個曝露在透明樹脂本體17的三個側表面上。注意在此說明書中，「覆蓋」的概念包含覆蓋者與被覆蓋者之間接觸的狀態以及覆蓋者與被覆蓋者之間分開的狀態二者。More specifically, the lower surface of the protruding portion 11g which becomes a part of the lower surface 11f of the lead frame 11 is exposed on the lower surface of the transparent resin body 17. Further, the tip edge surfaces of the respective extending portions 11b to 11e are exposed on the respective side surfaces of the transparent resin body 17. On the other hand, in the lead frame 11, the entire upper surface 11h, the lower surface 11f other than the lower surface of the protruding portion 11g, the side surface of the protruding portion 11g, and the edge surface of the base portion 11a are all covered with the transparent resin body 17 cover. Similarly, the lower surface of the protruding portion 12g of the lead frame 12 is exposed on the lower surface of the transparent resin body 17. Further, the tip edge surfaces of the respective extending portions 12b to 12e are exposed on the respective side surfaces of the transparent resin body 17. The entire upper surface 12h, the lower surface 12f other than the lower surface of the protruding portion 12g, the side surface of the protruding portion 12g, and the edge surface of the base portion 12a are covered by the transparent resin body 17. In the LED package 1, the lower surfaces of the protruding portions 11g and 12g exposed on the lower surface of the transparent resin body 17 function as external electrode pads. As described above, the transparent resin body 17 has a rectangular shape when viewed from above, and each of the tip edge surfaces of the plurality of extended portions of the respective lead frames is exposed on the three side surfaces of the transparent resin body 17. Note that in this specification, the concept of "coverage" includes both the state of contact between the coverr and the covered person and the state in which the coverr is separated from the covered person.

根據此實施例的LED封裝1係藉著將設置在主機板(未顯示)上的焊料球(solder ball)或類似者黏結於突出部份11g及12g而被安裝在主機板上。電力分別經由引線框11、12及導線15、16而被供應至LED晶片14的端子14a、14b。藉此，LED晶片14發射在從綠至紅的波長範圍內所包含的預定顏色的光。此光通過透明樹脂本體17的內部，且直接射出至LED封裝1之外。因此，射出至LED封裝1之外的光為由LED晶片14所發射的光，並且為在從綠至紅的波長範圍內所包含的可見光。The LED package 1 according to this embodiment is mounted on a main board by bonding a solder ball or the like provided on a main board (not shown) to the protruding portions 11g and 12g. Power is supplied to the terminals 14a, 14b of the LED chip 14 via the lead frames 11, 12 and the wires 15, 16 respectively. Thereby, the LED wafer 14 emits light of a predetermined color contained in a wavelength range from green to red. This light passes through the inside of the transparent resin body 17 and is directly emitted outside the LED package 1. Therefore, light emitted to the outside of the LED package 1 is light emitted by the LED wafer 14, and is visible light contained in a wavelength range from green to red.

其次，提供對於根據此實施例的LED封裝的製造方法的敘述。Next, a description is given of a manufacturing method of the LED package according to this embodiment.

圖3為顯示用來製造根據此實施例的LED封裝的方法的流程圖。FIG. 3 is a flow chart showing a method for manufacturing an LED package according to this embodiment.

圖4A至4D、圖5A至5C、及圖6A及6B為顯示製造根據此實施例的LED封裝的方法的製程剖面圖。4A to 4D, 5A to 5C, and 6A and 6B are process cross-sectional views showing a method of manufacturing an LED package according to this embodiment.

圖7A為顯示根據此實施例的引線框片料的平面圖。圖7B為顯示於此引線框片料的元件區域的部份放大平面圖。Fig. 7A is a plan view showing a lead frame sheet according to this embodiment. Fig. 7B is a partially enlarged plan view showing an area of an element of the lead frame sheet.

首先，如圖4A所示，由導電材料製成的導電片料21被製備。此導電片料21是藉著分別在條帶形的銅板件21a的上表面及下表面上形成銀鍍層21b而獲得。隨後，掩模22a及22b被分別形成在所獲致的此導電片料21的上表面及下表面上。開口部份22c被選擇性地形成於掩模22a及22b。掩模22a及22b可藉著例如印製(printing)而被形成。First, as shown in Fig. 4A, a conductive sheet 21 made of a conductive material is prepared. This conductive sheet 21 is obtained by forming a silver plating layer 21b on the upper surface and the lower surface of the strip-shaped copper plate member 21a, respectively. Subsequently, masks 22a and 22b are formed on the upper and lower surfaces of the obtained conductive sheet 21, respectively. The opening portion 22c is selectively formed in the masks 22a and 22b. The masks 22a and 22b can be formed by, for example, printing.

然後，附著有掩模22a及22b的導電片料21被沈浸於蝕刻流體內。藉此，導電片料21被濕蝕刻。因此，位在開口部份22c的內部的導電片料21的部份被選擇性地蝕刻。當導電片料21被濕蝕刻時，蝕刻量是例如藉著調整沈浸時間而被控制。藉此，蝕刻是在導電片料21被只從導電片料21的上表面或下表面蝕刻的任何開口部份單獨穿透之前終止。藉此方式，半蝕刻(half-etching)從導電片料21的上表面及下表面施加於導電片料21。然而，從導電片料21的上表面及下表面二者均被蝕刻的部份形成為穿透導電片料21。然後，掩模22a及22b被移除。Then, the conductive sheet 21 to which the masks 22a and 22b are attached is immersed in the etching fluid. Thereby, the conductive sheet 21 is wet etched. Therefore, a portion of the conductive sheet 21 located inside the opening portion 22c is selectively etched. When the conductive sheet 21 is wet etched, the amount of etching is controlled, for example, by adjusting the immersion time. Thereby, the etching is terminated before the conductive sheet 21 is individually penetrated by any opening portion etched only from the upper or lower surface of the conductive sheet 21. In this manner, half-etching is applied to the conductive sheet 21 from the upper and lower surfaces of the conductive sheet 21. However, a portion from which both the upper surface and the lower surface of the conductive sheet 21 are etched is formed to penetrate the conductive sheet 21. Masks 22a and 22b are then removed.

藉此，如圖3及4B所示，銅板件21a及銀鍍層21b從導電片料21被選擇性地移除。如此，形成引線框片料23。注意為顯示的方便起見，圖4B及後續圖式的每一個將銅板件21a及銀鍍層21b顯示成為單一的整個引線框片料23而非個別地顯示銅板件21a及銀鍍層21b。如圖7A所示，舉例而言，三個區塊B被設定於引線框片料23。另外，舉例而言，大約1000個元件區域P被設定於每一個區塊B。如圖7B所示，元件區域P以矩陣陣列的形式被配置，並且以晶格(lattice)的形式被配置的切塊區域(dicing area)D形成在元件區域P之間。包含互相隔離的引線框11、12的基本圖型形成於每一個元件區域P。形成導電片料21的導電材料的殘餘物(residue)以殘餘物連接相鄰的元件區域P的方式存留於每一個切塊區域D。Thereby, as shown in FIGS. 3 and 4B, the copper plate member 21a and the silver plating layer 21b are selectively removed from the conductive sheet 21. In this manner, the lead frame sheet 23 is formed. Note that for convenience of display, each of FIG. 4B and the subsequent drawings shows the copper plate member 21a and the silver plating layer 21b as a single entire lead frame sheet 23 instead of individually displaying the copper plate member 21a and the silver plating layer 21b. As shown in FIG. 7A, for example, three blocks B are set to the lead frame sheet 23. Further, for example, about 1000 element areas P are set for each block B. As shown in FIG. 7B, the element regions P are arranged in the form of a matrix array, and a dicing area D configured in the form of a lattice is formed between the element regions P. A basic pattern including the lead frames 11, 12 isolated from each other is formed in each of the element regions P. A residue of the conductive material forming the conductive sheet 21 is retained in each of the dicing regions D in such a manner that the residue connects the adjacent element regions P.

明確地說，雖然引線框11與引線框12在每一個元件區域P中彼此分開，但是屬於任何一個元件區域P的引線框11係連接於屬於在-X方向上位置相鄰於上述元件區域P的相鄰元件區域P的引線框12。面向+X方向且突出於+X方向的開口部份23a形成在此二個相鄰的引線框之間。分別屬於在Y方向上的兩個相鄰的元件區域P的引線框11係經由相應的橋接部23b而被連接在一起。類似地，分別屬於在Y方向上的兩個相鄰的元件區域P的引線框12係經由相應的橋接部23c而被連接在一起。藉此，四個連接部份從引線框11的底座部份11a及引線框12的底座部份12a的每一個於三個方向延伸。連接部份是由導電材料製成，並且從屬於一個元件區域P的引線框11或12的底座部份經由切塊區域D而延伸至屬於相鄰的元件區域P的引線框11或12的底座區域。另外，藉著使從引線框片料23的下表面的蝕刻達成為半蝕刻，突出部份11g及12g被分別形成在引線框11及12的下表面上(見圖2A及2B)。Specifically, although the lead frame 11 and the lead frame 12 are separated from each other in each element region P, the lead frame 11 belonging to any one of the element regions P is connected to be adjacent to the above-described element region P in the -X direction. The lead frame 12 of the adjacent element region P. An opening portion 23a facing the +X direction and protruding in the +X direction is formed between the two adjacent lead frames. The lead frames 11 respectively belonging to two adjacent element regions P in the Y direction are connected together via the respective bridge portions 23b. Similarly, the lead frames 12 respectively belonging to two adjacent element regions P in the Y direction are connected together via the respective bridge portions 23c. Thereby, the four connection portions extend from the base portion 11a of the lead frame 11 and the base portion 12a of the lead frame 12 in three directions. The connecting portion is made of a conductive material, and the base portion of the lead frame 11 or 12 subordinate to one element region P extends through the dicing region D to the base of the lead frame 11 or 12 belonging to the adjacent element region P region. Further, by achieving half etching from the etching of the lower surface of the lead frame sheet 23, the protruding portions 11g and 12g are formed on the lower surfaces of the lead frames 11 and 12, respectively (see Figs. 2A and 2B).

隨後，如圖3及4C所示，舉例而言，由聚亞胺(polyimide)製成的加強膠帶(reinforcing tape) 24被黏貼於引線框片料23的下表面。然後，晶粒安裝材料13被附著於屬於引線框片料23的每一個元件區域P的引線框11的頂部。此附著是例如藉著將糊狀的晶粒安裝材料13射出至引線框11的頂部或是藉著使用機械儀器而將晶粒安裝材料13轉移至引線框11的頂部而達成。然後，LED晶片14被安裝在晶粒安裝材料13的頂部上。之後，晶粒安裝材料13承受用來燒結晶粒安裝材料13的熱處理(安裝熟化(mount cure))。藉此，於引線框片料23的每一個元件區域P中，LED晶片14在晶粒安裝材料13被插置在LED晶片14與引線框11之間的情況下被安裝在引線框11上。Subsequently, as shown in FIGS. 3 and 4C, for example, a reinforcing tape 24 made of polyimide is adhered to the lower surface of the lead frame sheet 23. Then, the die attach material 13 is attached to the top of the lead frame 11 belonging to each of the element regions P of the lead frame sheet 23. This attachment is achieved, for example, by ejecting the paste-like die attach material 13 to the top of the lead frame 11 or by transferring the die attach material 13 to the top of the lead frame 11 by using a mechanical instrument. The LED wafer 14 is then mounted on top of the die attach material 13. Thereafter, the die attach material 13 is subjected to a heat treatment (mounting cure) for sintering the die mounting material 13. Thereby, in each of the element regions P of the lead frame sheet 23, the LED chips 14 are mounted on the lead frame 11 with the die attach material 13 interposed between the LED chips 14 and the lead frame 11.

然後，如圖3及4D所示，藉著例如超音波接合(ultrasonic bonding)，導線15的一個端部被黏結於LED晶片14的端子14a，並且導線15的另一個端部被黏結於引線框11的上表面11h。另外，導線16的一個端部被黏結於LED晶片14的端子14b，並且導線16的另一個端部被黏結於引線框12的上表面12h。藉此，端子14a經由導線15而被連接於引線框11，並且端子14b經由導線16而被連接於引線框12。Then, as shown in FIGS. 3 and 4D, one end of the wire 15 is bonded to the terminal 14a of the LED chip 14 by, for example, ultrasonic bonding, and the other end of the wire 15 is bonded to the lead frame. The upper surface 11h of 11. In addition, one end of the wire 16 is bonded to the terminal 14b of the LED chip 14, and the other end of the wire 16 is bonded to the upper surface 12h of the lead frame 12. Thereby, the terminal 14a is connected to the lead frame 11 via the wire 15, and the terminal 14b is connected to the lead frame 12 via the wire 16.

然後，如圖3及5A所示，下方模具101被製備。下方模具101與以下會敘述的上方模具102形成一對模具。長方體形的凹入部份101a形成於下方模具101的上表面。另一方面，製備液體或半液體的樹脂材料26，其係由透明樹脂例如環氧樹脂、丙烯酸系樹脂、或胺基甲酸酯樹脂製成。隨後，樹脂材料26藉著使用配送器103而被供應至下方模具101的凹入部份101a的內部。Then, as shown in FIGS. 3 and 5A, the lower mold 101 is prepared. The lower mold 101 forms a pair of molds with the upper mold 102 which will be described later. A rectangular parallelepiped concave portion 101a is formed on the upper surface of the lower mold 101. On the other hand, a liquid or semi-liquid resin material 26 which is made of a transparent resin such as an epoxy resin, an acrylic resin, or a urethane resin is prepared. Subsequently, the resin material 26 is supplied to the inside of the concave portion 101a of the lower mold 101 by using the dispenser 103.

然後，如圖3及5B所示，上面安裝有LED晶片14的引線框片料23以LED晶片14朝下的方式被設置於上方模具102的下表面。然後，上方模具102被壓抵於下方模具101。如此，二模具被夾緊在一起。藉此，引線框片料23被壓抵於樹脂材料26。此時，樹脂材料26覆蓋LED晶片14及導線15、16，並且另外也進入已經經由蝕刻過程而從引線框片料23被移除的部份。樹脂材料26以此方式被模製成形。所想要的是此模製過程應在真空氛圍中被實施。此防止否則會在含有樹脂材料26的螢光(fluorescent)材料中發生的空氣氣泡附著於引線框片料23的半蝕刻部份。Then, as shown in FIGS. 3 and 5B, the lead frame sheet 23 on which the LED wafer 14 is mounted is placed on the lower surface of the upper mold 102 with the LED wafer 14 facing downward. Then, the upper mold 102 is pressed against the lower mold 101. As such, the two molds are clamped together. Thereby, the lead frame sheet 23 is pressed against the resin material 26. At this time, the resin material 26 covers the LED wafer 14 and the wires 15, 16 and additionally enters a portion that has been removed from the lead frame sheet 23 via an etching process. The resin material 26 is molded in this manner. What is desired is that this molding process should be carried out in a vacuum atmosphere. This prevents air bubbles which would otherwise occur in the fluorescent material containing the resin material 26 from adhering to the half-etched portion of the lead frame sheet 23.

然後，如圖3及5C所示，樹脂材料26在引線框片料23的上表面被壓抵於樹脂材料26的情況下承受熱處理(模熟化(mold cure))。如此，樹脂材料26被熟化。隨後，如圖6A所示，上方模具102從下方模具101脫離。藉此，覆蓋引線框片料23的上表面的全部及下表面的部份並且掩埋LED晶片14等的透明樹脂板件29形成在引線框片料23上。然後，加強膠帶24從引線框片料23被剝除。藉此，引線框11及12的突出部份11g及12g的下表面(見圖2A及2B)曝露在透明樹脂板件29的表面上。Then, as shown in FIGS. 3 and 5C, the resin material 26 is subjected to heat treatment (mold cure) in the case where the upper surface of the lead frame sheet 23 is pressed against the resin material 26. Thus, the resin material 26 is cured. Subsequently, as shown in FIG. 6A, the upper mold 102 is detached from the lower mold 101. Thereby, a transparent resin sheet member 29 covering the entire and lower surface portions of the upper surface of the lead frame sheet 23 and burying the LED wafer 14 or the like is formed on the lead frame sheet 23. Then, the reinforcing tape 24 is peeled off from the lead frame sheet 23. Thereby, the lower surfaces (see Figs. 2A and 2B) of the protruding portions 11g and 12g of the lead frames 11 and 12 are exposed on the surface of the transparent resin sheet member 29.

然後，如圖3及6B所示，以刀片104從引線框片料23之側將包含引線框片料23及透明樹脂板件29的組合體切塊。換句話說，組合體是於+Z方向被切塊。藉此，被設置於切塊區域D中的引線框片料23及透明樹脂板件29的部份從引線框片料23及透明樹脂板件29被移除。結果，被設置於元件區域P中的引線框片料23及透明樹脂板件29的部份被切割成各別的立方體。如此，如圖1至2B所示的LED封裝1被製造成為各別的立方體。注意包含引線框片料23及透明樹脂板件29的組合體可從透明樹脂板件29之側被切塊。Then, as shown in FIGS. 3 and 6B, the assembly including the lead frame sheet 23 and the transparent resin sheet member 29 is diced from the side of the lead frame sheet 23 by the blade 104. In other words, the assembly is diced in the +Z direction. Thereby, the portions of the lead frame sheet 23 and the transparent resin sheet member 29 which are disposed in the dicing region D are removed from the lead frame sheet 23 and the transparent resin sheet member 29. As a result, the portions of the lead frame sheet 23 and the transparent resin sheet member 29 which are disposed in the element region P are cut into individual cubes. Thus, the LED package 1 shown in FIGS. 1 to 2B is fabricated into individual cubes. Note that the assembly including the lead frame sheet 23 and the transparent resin sheet member 29 can be diced from the side of the transparent resin sheet member 29.

在如此被切塊的LED封裝1的每一個中，引線框11及12從引線框片料23分離。另外，透明樹脂板件29被分段成各透明樹脂本體17。於Y方向延伸的切塊區域D的部份經過引線框片料23的開口部份23a，因而為每一個引線框11形成延伸部份11d、11e，且為每一個引線框12形成延伸部份12d、12e。另外，橋接部23b的二等分為每一個引線框11形成延伸部份11b及11c，且橋接部23c的二等分為每一個引線框12形成延伸部份12b及12c。延伸部份11b至11e及12b至12e的尖端邊緣表面曝露在透明樹脂本體17的相應側表面上。In each of the LED packages 1 thus diced, the lead frames 11 and 12 are separated from the lead frame sheets 23. Further, the transparent resin sheet member 29 is segmented into the respective transparent resin bodies 17. A portion of the dicing region D extending in the Y direction passes through the opening portion 23a of the lead frame sheet 23, thereby forming extension portions 11d, 11e for each lead frame 11, and forming an extension portion for each lead frame 12 12d, 12e. Further, the bridging portion 23b is halved into each of the lead frames 11 to form the extending portions 11b and 11c, and the bridging portion 23c is equally divided into the lead frames 12 to form the extending portions 12b and 12c. The tip edge surfaces of the extended portions 11b to 11e and 12b to 12e are exposed on the respective side surfaces of the transparent resin body 17.

然後，如圖3所示，對LED封裝1施加各種不同的測試。延伸部份11b至11e及12b至12e的尖端邊緣表面可被使用成為測試用的端子。Then, as shown in FIG. 3, various tests are applied to the LED package 1. The tip edge surfaces of the extended portions 11b to 11e and 12b to 12e can be used as terminals for testing.

以下敘述此實施例的功效。The efficacy of this embodiment is described below.

在根據此實施例的LED封裝1中，LED晶片14為包含有成為主動層的含有銦、鎵、鋁、及磷的半導體層的晶片，且發射在從綠至紅的波長範圍內的光。在從綠至紅的波長範圍內的光的能量位準比在從紫外至藍的波長範圍內的光的能量位準低。因此，在從綠至紅的波長範圍內的光對於樹脂材料的損害比在從紫外至藍的波長範圍內的光少。因此，透明樹脂本體17的劣化(deterioration)進展地較慢，並且根據此實施例的LED封裝1的耐用性較高。因此，根據此實施例的LED封裝1具有較長的壽命及較高的耐用性，且可被應用於較為廣泛的使用範圍。In the LED package 1 according to this embodiment, the LED wafer 14 is a wafer containing a semiconductor layer containing indium, gallium, aluminum, and phosphorus as an active layer, and emits light in a wavelength range from green to red. The energy level of light in the wavelength range from green to red is lower than the energy level of light in the wavelength range from ultraviolet to blue. Therefore, light in the wavelength range from green to red is less harmful to the resin material than light in the wavelength range from ultraviolet to blue. Therefore, the deterioration of the transparent resin body 17 progresses slowly, and the durability of the LED package 1 according to this embodiment is high. Therefore, the LED package 1 according to this embodiment has a long life and high durability, and can be applied to a wider range of use.

另外，在根據此實施例的LED封裝1中，從LED晶片14發射的光的能量的量較小。因此，透明樹脂本體17可由相對而言低成本的樹脂材料例如環氧樹脂、丙烯酸系樹脂、或胺基甲酸酯樹脂製成。因此，可不再需要使用具有較佳的耐光性(light resistance)但是成本較高的樹脂材料，例如矽酮(silicone)樹脂。因此，根據此實施例的LED封裝1的成本較低。In addition, in the LED package 1 according to this embodiment, the amount of energy of light emitted from the LED wafer 14 is small. Therefore, the transparent resin body 17 can be made of a relatively low-cost resin material such as an epoxy resin, an acrylic resin, or a urethane resin. Therefore, it is no longer necessary to use a resin material having a better light resistance but a higher cost, such as a silicone resin. Therefore, the cost of the LED package 1 according to this embodiment is low.

另外，根據此實施例的LED封裝1不包含任何由白色樹脂製成的罩體(enclosure)。因此，不會有罩體由於吸收由LED晶片14所產生的光及熱而劣化。特別是，在罩體是由熱塑性聚醯胺樹脂形成的情況中，此種罩體的劣化傾向於進展得較為快速。但是，此實施例完全不會有此問題。因此，此實施例的LED封裝1具有較高的耐用性。In addition, the LED package 1 according to this embodiment does not contain any enclosure made of white resin. Therefore, no cover is deteriorated by absorbing light and heat generated by the LED chip 14. In particular, in the case where the cover is formed of a thermoplastic polyamide resin, the deterioration of such a cover tends to progress relatively quickly. However, this embodiment does not have this problem at all. Therefore, the LED package 1 of this embodiment has high durability.

另外，根據此實施例的LED封裝1不包含任何覆蓋透明樹脂本體17的側表面的罩體。因此，根據此實施例的LED封裝1以寬廣的角度發射光。此使得根據此實施例的LED封裝1在LED封裝1必須被用來以較為寬廣的角度發射光時較為有利，例如當LED封裝1被用來照明或成為液晶電視的背光(backlight)時。In addition, the LED package 1 according to this embodiment does not include any cover covering the side surface of the transparent resin body 17. Therefore, the LED package 1 according to this embodiment emits light at a wide angle. This makes it advantageous for the LED package 1 according to this embodiment to be used when the LED package 1 has to be used to emit light at a wider angle, such as when the LED package 1 is used to illuminate or become a backlight of a liquid crystal television.

另外，在根據此實施例的LED封裝1中，引線框11及12的周邊部份是由覆蓋引線框11及12的下表面的部份及邊緣表面的大部份的透明樹脂本體17固持。因此，可增進引線框11及12的可固持性(holdability)的性能，而同時可藉著使引線框11及12的突出部份11g及12g的下表面從透明樹脂本體17曝露而形成外部電極墊片。換句話說，藉著分別於底座部份11a及12a的於X方向的中心部份形成突出部份11g及12g，可使凹入部份形成於底座部份11a及12a的下表面的於X方向的兩個端部部份。另外，透明樹脂本體17的部份進入每一個凹入部份。此使得引線框11及12可被透明樹脂本體17穩固地固持。藉此，引線框11及12在切塊時極不可能從透明樹脂本體17鬆脫，且因此可增進LED封裝1的產率。另外，此可在使用LED封裝1時防止引線框11及12由於溫度應力而從透明樹脂本體17脫離。Further, in the LED package 1 according to this embodiment, the peripheral portions of the lead frames 11 and 12 are held by a portion of the lower surface of the lead frames 11 and 12 and a portion of the transparent resin body 17 of the edge surface. Therefore, the performance of the holdability of the lead frames 11 and 12 can be improved, and at the same time, the external electrode can be formed by exposing the lower surfaces of the protruding portions 11g and 12g of the lead frames 11 and 12 from the transparent resin body 17. Gasket. In other words, by forming the protruding portions 11g and 12g at the central portions of the base portions 11a and 12a in the X direction, the concave portions can be formed on the lower surface of the base portions 11a and 12a. Both end portions of the direction. Further, a portion of the transparent resin body 17 enters each of the concave portions. This allows the lead frames 11 and 12 to be firmly held by the transparent resin body 17. Thereby, the lead frames 11 and 12 are extremely unlikely to be released from the transparent resin body 17 at the time of dicing, and thus the yield of the LED package 1 can be improved. In addition, this prevents the lead frames 11 and 12 from being detached from the transparent resin body 17 due to temperature stress when the LED package 1 is used.

另外，在根據此實施例的LED封裝1中，銀鍍層形成在引線框11及12的上表面及下表面上。銀鍍層具有較高的光反射率。此增進根據此實施例的LED封裝1的光擷取效率。Further, in the LED package 1 according to this embodiment, silver plating layers are formed on the upper and lower surfaces of the lead frames 11 and 12. Silver plating has a high light reflectivity. This enhances the light extraction efficiency of the LED package 1 according to this embodiment.

另外，在此實施例中，可從一個導電片料21一次同時製造大量的LED封裝1，例如數千個LED封裝1。此降低每個LED封裝1的製造成本。另外，從每一個LED封裝1排除罩體可減少LED封裝1所包含的零件數目以及製造過程的數目，且因此降低成本。Further, in this embodiment, a large number of LED packages 1, such as thousands of LED packages 1, can be simultaneously manufactured from one conductive sheet 21 at a time. This reduces the manufacturing cost of each LED package 1. In addition, the exclusion of the cover from each of the LED packages 1 can reduce the number of parts and the number of manufacturing processes included in the LED package 1, and thus reduce the cost.

另外，在此實施例中，引線框片料23是藉著濕蝕刻而形成。因此，每次當具有新佈局的LED封裝被製造時，所需要的是製備新掩模用的原始板件。因此，與藉著模壓製或類似者而製造引線框片料23的方法相比，此實施例保持較低的初始成本。Further, in this embodiment, the lead frame sheet 23 is formed by wet etching. Therefore, every time when an LED package having a new layout is manufactured, what is required is an original panel for preparing a new mask. Therefore, this embodiment maintains a lower initial cost than the method of manufacturing the lead frame sheet 23 by molding or the like.

另外，在根據此實施例的LED封裝1中，延伸部份從引線框11及12的底座部份11a及12a的每一個延伸。此防止各底座部份曝露在透明樹脂本體17的側表面上，且因此減小引線框11及12的每一個的曝露面積。另外，可使引線框11及12與透明樹脂本體17之間的接觸面積增大。結果，可防止引線框11及12從透明樹脂本體17脫離，且另外可抑制引線框11及12的侵蝕。Further, in the LED package 1 according to this embodiment, the extended portion extends from each of the base portions 11a and 12a of the lead frames 11 and 12. This prevents each of the base portions from being exposed on the side surface of the transparent resin body 17, and thus reduces the exposure area of each of the lead frames 11 and 12. Further, the contact area between the lead frames 11 and 12 and the transparent resin body 17 can be increased. As a result, the lead frames 11 and 12 can be prevented from being detached from the transparent resin body 17, and the erosion of the lead frames 11 and 12 can be suppressed.

當就製造方法而言考量功效時，如圖7B所示，藉著以開口部份23a及橋接部23b、23c存在於切塊區域D內的方式將開口部份23a及橋接部23b、23c形成於引線框片料23，可減少存在於切塊區域D內的金屬量。此使得易於將引線框片料23切塊，且因此可抑制切塊刀片的磨損。另外，在此實施例中，四個延伸部份從引線框11及12的每一個於三個方向延伸。藉此，在圖4C所示的安裝LED晶片14的過程期間，於任何元件區域P內的引線框11由屬於相鄰的元件區域P的引線框11及12於三個方向確實地支撐。因此，可安裝性(mountability)被增進。類似地，在圖4D所示的導線黏結過程期間，每一個導線黏結位置於三個方向被確實地支撐。此在例如施加超音波以進行超音波接合時使超音波的散逸較少。因此，每一個導線可在較佳的情況中被黏結於相應的引線框及LED晶片。When the effect is considered in terms of the manufacturing method, as shown in FIG. 7B, the opening portion 23a and the bridge portions 23b, 23c are formed in such a manner that the opening portion 23a and the bridge portions 23b, 23c are present in the dicing region D. In the lead frame sheet 23, the amount of metal present in the dicing region D can be reduced. This makes it easy to dicing the lead frame sheet 23, and thus the wear of the dicing blade can be suppressed. Further, in this embodiment, four extending portions extend from each of the lead frames 11 and 12 in three directions. Thereby, during the process of mounting the LED wafer 14 shown in FIG. 4C, the lead frame 11 in any of the element regions P is surely supported by the lead frames 11 and 12 belonging to the adjacent element regions P in three directions. Therefore, the mountability is improved. Similarly, during the wire bonding process shown in Figure 4D, each wire bond location is reliably supported in three directions. This results in less dissipation of the ultrasonic waves when, for example, ultrasonic waves are applied for ultrasonic engagement. Therefore, each of the wires can be bonded to the corresponding lead frame and LED chip in a preferred case.

另外，在此實施例中，於圖6B所示的切塊過程期間，切塊是從引線框片料23之側被實施。此切塊使得形成引線框11及12的被切割的端部部份的金屬材料在透明樹脂本體17的相應側表面上於+Z方向延伸。此避免金屬材料在透明樹脂本體17的相應側表面上於-Z方向延伸，且因此避免金屬材料從LED封裝1的下表面突出。因此，不會在切塊過程中產生任何毛邊。因此，此實施例可在安裝LED封裝1時避免否則會由於毛邊而發生的安裝失敗。Further, in this embodiment, during the dicing process shown in FIG. 6B, the dicing is performed from the side of the lead frame sheet 23. This dicing causes the metal materials forming the cut end portions of the lead frames 11 and 12 to extend in the +Z direction on the respective side surfaces of the transparent resin body 17. This prevents the metal material from extending in the -Z direction on the respective side surfaces of the transparent resin body 17, and thus the metal material is prevented from protruding from the lower surface of the LED package 1. Therefore, no burrs are generated during the dicing process. Therefore, this embodiment can avoid installation failure that would otherwise occur due to burrs when the LED package 1 is mounted.

其次，提供對於此實施例的變化的敘述。Next, a description of the changes to this embodiment is provided.

此變化為被引入用來形成引線框片料的方法的變化。This change is a variation of the method introduced to form the leadframe sheet.

明確地說，此變化與第一實施例的不同在於此變化不採用圖4A所示的用來形成引線框片料的方法。Specifically, this variation is different from that of the first embodiment in that the variation shown in Fig. 4A for forming a lead frame sheet is not employed.

圖8A至8H為顯示根據此變化的用來形成引線框片料的方法的製程剖面圖。8A to 8H are process cross-sectional views showing a method for forming a lead frame sheet according to this variation.

首先，如圖8A所示，銅板件21a被製備及清潔。隨後，如圖8B所示，銅板件21a的兩個表面均被塗覆以抗蝕劑(resist)，接著被乾燥。藉此，形成抗蝕劑膜111。然後，如圖8C所示，掩模圖型112被設置在各別抗蝕劑膜111上，並且藉著用紫外光照射所得的抗蝕劑膜111而使抗蝕劑膜111曝露於紫外光。藉此，每一個抗蝕劑膜111的曝露部份被熟化，並且因而形成抗蝕劑圖型111a。之後，如圖8D所示，抗蝕劑膜111被顯影，且因而每一個抗蝕劑膜111的未熟化部份被洗去。藉此，抗蝕劑圖型111a存留在銅板件21a的上表面及下表面上。然後，如圖8E所示，藉著使用抗蝕劑圖型111a成為掩模，使所得的銅板件21a承受蝕刻。如此，銅板件21a的曝露部份從銅板件21a的兩個表面被移除。此時，蝕刻深度被設定為幾乎等於銅板件21a的板件厚度的一半。只從一側被蝕刻的區域被半蝕刻，而從兩側均被蝕刻的銅板件21a的區域被穿透。隨後，如圖8F所示，抗蝕劑圖型111a被移去。然後，如圖8G所示，在銅板件21a的端部部份被掩模113覆蓋之下，對銅板件21a施加電鍍。藉此，銀鍍層21b形成在銅板件21a的除了其端部部份之外的其他各別表面上。之後，如圖8H所示，掩模113藉著清洗而被移除。然後，執行檢驗。以此方式，製成引線框片料23。除了以上剛剛敘述者之外，此變化的其他組態、製造方法、及操作/工作功效與第一實施例相同。First, as shown in Fig. 8A, the copper plate member 21a is prepared and cleaned. Subsequently, as shown in Fig. 8B, both surfaces of the copper plate member 21a are coated with a resist, followed by drying. Thereby, the resist film 111 is formed. Then, as shown in FIG. 8C, a mask pattern 112 is disposed on each of the resist films 111, and the resist film 111 is exposed to ultraviolet light by irradiating the obtained resist film 111 with ultraviolet light. . Thereby, the exposed portion of each of the resist films 111 is cured, and thus the resist pattern 111a is formed. Thereafter, as shown in FIG. 8D, the resist film 111 is developed, and thus the unmatured portion of each resist film 111 is washed away. Thereby, the resist pattern 111a remains on the upper surface and the lower surface of the copper plate member 21a. Then, as shown in FIG. 8E, the obtained copper plate member 21a is subjected to etching by using the resist pattern 111a as a mask. Thus, the exposed portion of the copper plate member 21a is removed from both surfaces of the copper plate member 21a. At this time, the etching depth is set to be almost equal to half the thickness of the plate member of the copper plate member 21a. The region etched only from one side is half-etched, and the region of the copper plate member 21a which is etched from both sides is penetrated. Subsequently, as shown in Fig. 8F, the resist pattern 111a is removed. Then, as shown in Fig. 8G, plating is applied to the copper plate member 21a while the end portion of the copper plate member 21a is covered by the mask 113. Thereby, the silver plating layer 21b is formed on the respective surfaces of the copper plate member 21a excluding the end portions thereof. Thereafter, as shown in FIG. 8H, the mask 113 is removed by cleaning. Then, perform the test. In this way, the lead frame sheet 23 is produced. Other configurations, manufacturing methods, and operational/operational efficiencies of this variation are the same as in the first embodiment, except as just described above.

其次，提供對於第二實施例的敘述。Next, a description will be given of the second embodiment.

圖9為顯示根據此實施例的LED封裝的立體圖。FIG. 9 is a perspective view showing an LED package according to this embodiment.

圖10為顯示根據此實施例的LED封裝的側視圖。FIG. 10 is a side view showing an LED package according to this embodiment.

如圖9及10所示，根據此實施例的LED封裝2與根據第一實施例的LED封裝1(見圖1)的不同在於引線框11(見圖1)於X方向被分割成為兩個引線框31及32。引線框32被設置在引線框31與引線框12之間。相應於引線框11的延伸部份11d及11e(見圖1)的延伸部份31d及31e形成於引線框31。另外，分別從底座部份31a於+Y方向及-Y方向延伸的延伸部份31b及31c形成引線框31。各別延伸部份31b及31c的位置就X方向而言彼此一致。另外，導線15被黏結於引線框31。另一方面，相應於引線框11的延伸部份11b及11c(見圖1)的延伸部份32b及32c形成於引線框32。LED晶片14在晶粒安裝材料13被插置在LED晶片14與引線框32之間的情況下被安裝在引線框32上。另外，相應於引線框11的突出部份11g的突出部份於引線框31形成為突出部份31g，且於引線框32形成為突出部份32g，而其形成方式係使得突出部份31g及32g彼此分開。As shown in FIGS. 9 and 10, the LED package 2 according to this embodiment is different from the LED package 1 (see FIG. 1) according to the first embodiment in that the lead frame 11 (see FIG. 1) is divided into two in the X direction. Lead frames 31 and 32. The lead frame 32 is disposed between the lead frame 31 and the lead frame 12. Extension portions 31d and 31e corresponding to the extended portions 11d and 11e (see FIG. 1) of the lead frame 11 are formed on the lead frame 31. Further, the lead frames 31 are formed from the extending portions 31b and 31c extending from the base portion 31a in the +Y direction and the -Y direction, respectively. The positions of the respective extended portions 31b and 31c coincide with each other in the X direction. In addition, the wire 15 is bonded to the lead frame 31. On the other hand, extension portions 32b and 32c corresponding to the extending portions 11b and 11c (see FIG. 1) of the lead frame 11 are formed on the lead frame 32. The LED chip 14 is mounted on the lead frame 32 with the die attach material 13 interposed between the LED chip 14 and the lead frame 32. In addition, a protruding portion corresponding to the protruding portion 11g of the lead frame 11 is formed as a protruding portion 31g in the lead frame 31, and is formed as a protruding portion 32g in the lead frame 32, and is formed in such a manner that the protruding portion 31g and 32g are separated from each other.

在此實施例中，電位從外部施加於各別引線框31及12。因此，引線框31及12作用成為外部電極。另一方面，沒有任何電位必須被施加於引線框32。引線框32可被使用成為專用於散熱座應用的引線框。因此，當多個LED封裝2被安裝在單一模組上時，這些LED封裝2的引線框32可被連接於共同的散熱座。注意接地電位可被施加於引線框32，或是引線框32可被置於電浮動(electrically floating)的情況。另外，在LED封裝2被安裝在主機板上的情況中，如果將焊料球黏結於每一個LED封裝2的各別引線框31、32、及12，則可抑制所謂的曼哈頓(Manhattan)現象。曼哈頓現象指的是當裝置或類似者在多個焊料球或類似者被插置在裝置與基板之間的情況下被安裝在基板上時，裝置或類似者會由於在軟熔爐(reflow furnace)內焊料球的熔融定時的不一致或是熔融的軟焊料的表面張力而被抬高的現象。曼哈頓現象造成安裝失敗。此實施例藉著在於X方向對稱的引線框佈局中將焊料球稠密地設置於X方向而使曼哈頓現象難以發生。In this embodiment, the potential is applied to the respective lead frames 31 and 12 from the outside. Therefore, the lead frames 31 and 12 function as external electrodes. On the other hand, no potential must be applied to the lead frame 32. Leadframe 32 can be used as a leadframe dedicated to heat sink applications. Therefore, when a plurality of LED packages 2 are mounted on a single module, the lead frames 32 of these LED packages 2 can be connected to a common heat sink. Note that the ground potential can be applied to the lead frame 32, or the lead frame 32 can be placed in an electrically floating condition. Further, in the case where the LED package 2 is mounted on the motherboard, if the solder balls are bonded to the respective lead frames 31, 32, and 12 of each of the LED packages 2, the so-called Manhattan phenomenon can be suppressed. The Manhattan phenomenon refers to when a device or the like is mounted on a substrate with a plurality of solder balls or the like interposed between the device and the substrate, the device or the like may be due to a reflow furnace. The inconsistency in the melting timing of the inner solder balls or the surface tension of the molten soft solder is raised. The Manhattan phenomenon caused the installation to fail. This embodiment makes it difficult for the Manhattan phenomenon to occur by densely placing the solder balls in the X direction in a lead frame layout that is symmetric in the X direction.

另外，在此實施例中，因為引線框31是由延伸部份31b至31e於三個方向支撐，所以導線15被良好地黏結。類似地，因為引線框12是由延伸部份12b至12e於三個方向支撐，所以導線16被良好地黏結。Further, in this embodiment, since the lead frame 31 is supported by the extending portions 31b to 31e in three directions, the wires 15 are well bonded. Similarly, since the lead frame 12 is supported by the extending portions 12b to 12e in three directions, the wires 16 are well bonded.

此種LED封裝2可以用與第一實施例中相同的方法被製造，除了在圖4A所示的製程中改變引線框片料23的元件區域P的基本圖型。換句話說，已與第一實施例相關聯地被敘述的製造方法可藉著改變掩模22a及22b的圖型而將LED封裝製成為具有各種不同的佈局。除了以上剛剛敘述者之外，此實施例的其他組態、製造方法、及操作/工作功效與第一實施例相同。Such an LED package 2 can be manufactured in the same manner as in the first embodiment except that the basic pattern of the element region P of the lead frame sheet 23 is changed in the process shown in Fig. 4A. In other words, the manufacturing method which has been described in association with the first embodiment can be made to have various layouts by changing the patterns of the masks 22a and 22b. Other configurations, manufacturing methods, and operational/operational efficiencies of this embodiment are the same as those of the first embodiment except as just described above.

其次，提供對於第三實施例的敘述。Next, a description will be given of the third embodiment.

圖11為顯示根據此實施例的LED封裝的立體圖。Fig. 11 is a perspective view showing an LED package according to this embodiment.

圖12為顯示根據此實施例的LED封裝的剖面圖。Fig. 12 is a cross-sectional view showing an LED package according to this embodiment.

如圖11及12所示，根據此實施例的LED封裝3除了根據第一實施例的LED封裝1的組態(見圖1)之外還包含齊納(Zener)二極體晶片36及類似者。齊納二極體晶片36被連接在引線框11與引線框12之間。明確地說，由導電材料例如軟焊料或銀糊製成的晶粒安裝材料37被附著於引線框12的上表面，並且齊納二極體晶片36被設置在晶粒安裝材料37上。藉此，齊納二極體晶片36在晶粒安裝材料37被插置在齊納二極體晶片36與引線框12之間的情況下被安裝在引線框12上，並且齊納二極體晶片36的下表面端子(未顯示)在晶粒安裝材料37被插置在下表面端子與引線框12之間的情況下被連接於引線框12。另外，齊納二極體晶片36的上表面端子36a經由導線38而連接於引線框11。明確地說，導線38的一個端部被連接於齊納二極體晶片36的上表面端子36a。導線38從上表面端子36a被引出於+Z方向且成曲線狀於在-Z方向與-X方向之間的方向。導線38的另一個端部被黏結於引線框11的上表面。As shown in FIGS. 11 and 12, the LED package 3 according to this embodiment includes a Zener diode chip 36 and the like in addition to the configuration of the LED package 1 according to the first embodiment (see FIG. 1). By. A Zener diode wafer 36 is connected between the lead frame 11 and the lead frame 12. Specifically, a die attach material 37 made of a conductive material such as soft solder or silver paste is attached to the upper surface of the lead frame 12, and a Zener diode wafer 36 is disposed on the die attach material 37. Thereby, the Zener diode wafer 36 is mounted on the lead frame 12 with the die attach material 37 interposed between the Zener diode wafer 36 and the lead frame 12, and the Zener diode The lower surface terminal (not shown) of the wafer 36 is connected to the lead frame 12 with the die attach material 37 interposed between the lower surface terminal and the lead frame 12. Further, the upper surface terminal 36a of the Zener diode wafer 36 is connected to the lead frame 11 via a wire 38. Specifically, one end of the wire 38 is connected to the upper surface terminal 36a of the Zener diode wafer 36. The wire 38 is drawn from the upper surface terminal 36a in the +Z direction and curved in a direction between the -Z direction and the -X direction. The other end of the wire 38 is bonded to the upper surface of the lead frame 11.

藉此，此實施例可將齊納二極體晶片36與LED晶片14並聯連接。結果，此實施例增進對於靜電放電(electrostatic discharge(ESD))的抵抗力。除了以上剛剛敘述者之外，此實施例的其他組態、製造方法、及操作/工作功效與第一實施例相同。Thereby, this embodiment can connect the Zener diode wafer 36 in parallel with the LED chip 14. As a result, this embodiment enhances resistance to electrostatic discharge (ESD). Other configurations, manufacturing methods, and operational/operational efficiencies of this embodiment are the same as those of the first embodiment except as just described above.

其次，提供對於第四實施例的敘述。Next, a description will be given of the fourth embodiment.

圖13為顯示根據此實施例的LED封裝的立體圖。FIG. 13 is a perspective view showing an LED package according to this embodiment.

圖14為顯示根據此實施例的LED封裝的剖面圖。Fig. 14 is a cross-sectional view showing an LED package according to this embodiment.

如圖13及14所示，根據此實施例的LED封裝4與根據第三實施例的LED封裝3(見圖11)的不同在於齊納二極體晶片36被安裝在引線框11上。在此情況中，齊納二極體晶片36的下表面端子在晶粒安裝材料37被插置在下表面端子與引線框11之間的情況下被連接於引線框11，並且上表面端子經由導線38而被連接於引線框12。除了以上剛剛敘述者之外，此實施例的其他組態、製造方法、及操作/工作功效與第三實施例相同。As shown in FIGS. 13 and 14, the LED package 4 according to this embodiment is different from the LED package 3 (see FIG. 11) according to the third embodiment in that a Zener diode wafer 36 is mounted on the lead frame 11. In this case, the lower surface terminal of the Zener diode wafer 36 is connected to the lead frame 11 with the die attach material 37 interposed between the lower surface terminal and the lead frame 11, and the upper surface terminal is via the wire 38 is connected to the lead frame 12. Other configurations, manufacturing methods, and operational/operational efficiencies of this embodiment are the same as those of the third embodiment except as just described above.

其次，提供對於第五實施例的敘述。Next, a description will be given of the fifth embodiment.

圖15為顯示根據此實施例的LED封裝的立體圖。Fig. 15 is a perspective view showing an LED package according to this embodiment.

圖16A為顯示根據此實施例的LED封裝的平面圖，且圖16B為其側視圖。Fig. 16A is a plan view showing an LED package according to this embodiment, and Fig. 16B is a side view thereof.

如圖15及圖16A及16B所示，根據此實施例的LED封裝5就引線框的形狀及LED晶片的類型而言與根據第一實施例的LED封裝1(見圖1)的不同。As shown in FIGS. 15 and 16A and 16B, the LED package 5 according to this embodiment is different from the LED package 1 (see FIG. 1) according to the first embodiment in terms of the shape of the lead frame and the type of the LED wafer.

明確地說，LED封裝5包含一對引線框41及42。引線框42被設置成於+X方向相鄰於引線框41。另外，引線框42於X方向的長度比引線框41於X方向的長度短。Specifically, the LED package 5 includes a pair of lead frames 41 and 42. The lead frame 42 is disposed adjacent to the lead frame 41 in the +X direction. Further, the length of the lead frame 42 in the X direction is shorter than the length of the lead frame 41 in the X direction.

於引線框41，六個延伸部份41b至41g從底座部份41a延伸。延伸部份41b及41c分別從底座部份41a的面向+Y方向的邊緣的兩個端部部份的附近於+Y方向延伸。延伸部份41d及41e分別從底座部份41a的面向-X方向的邊緣的兩個端部部份於-X方向延伸。延伸部份41f至41g分別從底座部份41a的面向-Y方向的邊緣的兩個端部部份的附近於-Y方向延伸。另外，突出部份41h形成於底座部份41a的下表面的於X方向的中心部份。另一方面，底座部份41a的未形成有突出部份41h的部份(亦即+X方向端部)為薄板部份41t。另外，於+X方向進入引線框41的開縫41i形成於引線框41的在延伸部份41d及41e之間的區域。開縫41i進入突出部份41h，且於Z方向穿透引線框41。因此，在從下方(-Z方向)觀看時，突出部份41h具有特定形狀。此特定形狀包含第一近似筆直線、第二近似筆直線、及第三近似筆直線，其中第一線與第二線大致平行，而第三線大致垂直於第一及第二線。第一線及第二線具有近似相同的長度。第三線的一個端部連接於第一線的一個端部，且第三線的另一個端部連接於第二線的一個端部。第一線及第二線位在第三線的相同側。亦即，於Z方向穿透的開縫41i形成於引線框41的下表面從透明樹脂本體17曝露的部份。In the lead frame 41, the six extended portions 41b to 41g extend from the base portion 41a. The extending portions 41b and 41c respectively extend from the vicinity of the two end portions of the edge of the base portion 41a facing the +Y direction in the +Y direction. The extending portions 41d and 41e respectively extend from the end portions of the edge of the base portion 41a facing the -X direction in the -X direction. The extending portions 41f to 41g respectively extend in the -Y direction from the vicinity of both end portions of the edge of the base portion 41a facing the -Y direction. Further, the protruding portion 41h is formed at a central portion of the lower surface of the base portion 41a in the X direction. On the other hand, the portion of the base portion 41a where the protruding portion 41h is not formed (i.e., the end portion in the +X direction) is the thin plate portion 41t. Further, a slit 41i which enters the lead frame 41 in the +X direction is formed in a region between the extending portions 41d and 41e of the lead frame 41. The slit 41i enters the protruding portion 41h and penetrates the lead frame 41 in the Z direction. Therefore, the protruding portion 41h has a specific shape when viewed from below (-Z direction). The particular shape includes a first approximating pen line, a second approximating pen line, and a third approximating pen line, wherein the first line is substantially parallel to the second line and the third line is substantially perpendicular to the first and second lines. The first line and the second line have approximately the same length. One end of the third line is connected to one end of the first line, and the other end of the third line is connected to one end of the second line. The first line and the second line are on the same side of the third line. That is, the slit 41i penetrating in the Z direction is formed in a portion where the lower surface of the lead frame 41 is exposed from the transparent resin body 17.

於引線框42，四個延伸部份42b至42e從底座部份42a延伸。延伸部份42b從底座部份42a的面向+Y方向的整個邊緣於+Y方向延伸。延伸部份42c從底座部份42a的面向-Y方向的整個邊緣於-Y方向延伸。延伸部份42d及42e分別從底座部份42a的面向+X方向的邊緣的兩個端部部份於+X方向延伸。另外，突出部份42h形成於底座部份42a的下表面的於X方向的中心部份。另一方面，底座部份42a的未形成有突出部份42h的部份(亦即-X方向端部)為薄板部份42t。另外，於-X方向進入引線框42的開縫42i形成於引線框42的在延伸部份42d及42e之間的區域。開縫42i進入突出部份42h，且於Z方向穿透引線框42。因此，當於-Z方向觀看時，突出部份42h具有上述的特定形狀。亦即，於Z方向穿透的開縫42i形成於引線框42的下表面從透明樹脂本體17曝露的部份。In the lead frame 42, four extending portions 42b to 42e extend from the base portion 42a. The extended portion 42b extends from the entire edge of the base portion 42a in the +Y direction in the +Y direction. The extended portion 42c extends from the entire edge of the base portion 42a facing the -Y direction in the -Y direction. The extending portions 42d and 42e respectively extend from the two end portions of the edge of the base portion 42a facing the +X direction in the +X direction. Further, the protruding portion 42h is formed at a central portion of the lower surface of the base portion 42a in the X direction. On the other hand, the portion of the base portion 42a where the protruding portion 42h is not formed (i.e., the end portion in the -X direction) is the thin plate portion 42t. Further, a slit 42i which enters the lead frame 42 in the -X direction is formed in a region of the lead frame 42 between the extended portions 42d and 42e. The slit 42i enters the protruding portion 42h and penetrates the lead frame 42 in the Z direction. Therefore, when viewed in the -Z direction, the protruding portion 42h has the specific shape described above. That is, the slit 42i penetrating in the Z direction is formed in a portion where the lower surface of the lead frame 42 is exposed from the transparent resin body 17.

從X方向的觀點，延伸部份41b的位置與延伸部份41g的位置彼此一致，延伸部份41c的位置與延伸部份41f的位置彼此一致，並且延伸部份42b的位置與延伸部份42c的位置彼此一致。另外，從Y方向的觀點，延伸部份41d的位置與延伸部份42e的位置彼此一致，延伸部份41e的位置與延伸部份42d的位置彼此一致，並且開縫41i的位置與開縫42i的位置彼此一致。From the viewpoint of the X direction, the position of the extended portion 41b and the position of the extended portion 41g coincide with each other, the position of the extended portion 41c and the position of the extended portion 41f coincide with each other, and the position and extension portion 42c of the extended portion 42b The positions are consistent with each other. Further, from the viewpoint of the Y direction, the position of the extended portion 41d and the position of the extended portion 42e coincide with each other, the position of the extended portion 41e and the position of the extended portion 42d coincide with each other, and the position of the slit 41i and the slit 42i The positions are consistent with each other.

導電性的晶粒安裝材料43被設置於引線框41的上表面41j上在延伸部份41b及41g之間的中間區域。LED晶片44被安裝在晶粒安裝材料43上。LED晶片44為直立導電式(vertically-conductive)晶片。下表面端子(未顯示)被設置於LED晶片44的下表面，且上表面端子44a被設置於LED晶片44的上表面。LED晶片44的下表面端子是在晶粒安裝材料43被插置在下表面端子與引線框41之間的情況下被連接於引線框41。另一方面，LED晶片44的上表面端子44a經由導線45而被連接於引線框42。明確地說，導線45的一個端部部份45a被黏結於LED晶片44的上表面端子44a，且另一端部部份45b被黏結於引線框42的上表面42j上在延伸部份42b及42c之間的中間區域。注意晶粒安裝材料43是由例如銀糊或金屬軟焊料製成，而導線45是由例如金製成。The conductive die attach material 43 is provided on the upper surface 41j of the lead frame 41 at an intermediate portion between the extended portions 41b and 41g. The LED wafer 44 is mounted on the die attach material 43. LED wafer 44 is a vertically-conductive wafer. A lower surface terminal (not shown) is provided on the lower surface of the LED wafer 44, and an upper surface terminal 44a is provided on the upper surface of the LED wafer 44. The lower surface terminal of the LED wafer 44 is connected to the lead frame 41 with the die attach material 43 interposed between the lower surface terminal and the lead frame 41. On the other hand, the upper surface terminal 44a of the LED wafer 44 is connected to the lead frame 42 via the wire 45. Specifically, one end portion 45a of the wire 45 is bonded to the upper surface terminal 44a of the LED chip 44, and the other end portion 45b is bonded to the upper surface 42j of the lead frame 42 at the extended portions 42b and 42c. The middle area between. Note that the die attach material 43 is made of, for example, silver paste or metal soft solder, and the wire 45 is made of, for example, gold.

導線45的端部部份45a從上表面端子44a被幾乎水平地(於+X方向)引出，且導線45的端部部份45b從上表面42j被幾乎垂直地(於+Z方向)引出。明確地說，引線框41的上表面41j(XY座標平面)與導線45從上表面端子44a被引出的方向(幾乎等於+X方向)之間的角度小於引線框42的上表面42j(XY座標平面)與導線45從引線框42被引出的方向(幾乎等於+Z方向)之間的角度。在此實施例中，導線45的黏結是藉著首先將端部部份45b黏結於引線框42的上表面42j，然後再將端部部份45a黏結於LED晶片44的上表面端子44a而達成。此實現上述的引出角度的大小關係。The end portion 45a of the wire 45 is drawn almost horizontally (in the +X direction) from the upper surface terminal 44a, and the end portion 45b of the wire 45 is drawn almost perpendicularly (in the +Z direction) from the upper surface 42j. Specifically, the angle between the upper surface 41j (XY coordinate plane) of the lead frame 41 and the direction in which the wire 45 is drawn from the upper surface terminal 44a (almost equal to the +X direction) is smaller than the upper surface 42j of the lead frame 42 (XY coordinates) The plane is at an angle to the direction in which the wire 45 is drawn from the lead frame 42 (almost equal to the +Z direction). In this embodiment, the bonding of the wires 45 is achieved by first bonding the end portions 45b to the upper surface 42j of the lead frame 42, and then bonding the end portions 45a to the upper surface terminals 44a of the LED chips 44. . This achieves the magnitude relationship of the above-mentioned extraction angles.

在此實施例中，也類似於上述的第一實施例，透明樹脂本體17覆蓋引線框41及42、晶粒安裝材料43、LED晶片44、及導線45，並且透明樹脂本體17的外觀形成LED封裝5的外觀的一部份。引線框41的突出部份41h的下表面及引線框42的突出部份42h的下表面曝露在透明樹脂本體17的下表面的互相分開的區域上，並且引線框41及42的每一個延伸部份的尖端邊緣表面曝露在透明樹脂本體17的側表面上。透明樹脂本體17進入開縫41i及42i的內部。In this embodiment, also similar to the first embodiment described above, the transparent resin body 17 covers the lead frames 41 and 42, the die attach material 43, the LED wafer 44, and the wires 45, and the appearance of the transparent resin body 17 forms an LED. A portion of the appearance of the package 5. The lower surface of the protruding portion 41h of the lead frame 41 and the lower surface of the protruding portion 42h of the lead frame 42 are exposed on mutually separated regions of the lower surface of the transparent resin body 17, and each of the lead frames 41 and 42 is extended. The tip edge surface of the portion is exposed on the side surface of the transparent resin body 17. The transparent resin body 17 enters the inside of the slits 41i and 42i.

其次，敘述此實施例的功效。Next, the efficacy of this embodiment will be described.

如圖16A及16B所示，根據此實施例的LED封裝5被安裝在待使用的安裝板120上。在安裝時，軟焊料片(solder fillet)125及126形成於安裝板120的安裝表面121的互相分開的兩個矩形區域內。其次，LED封裝5被放置在安裝表面121上。此處，引線框41的突出部份41h的下表面被放置成與軟焊料片125接觸，且引線框42的突出部份42h的下表面被放置成與軟焊料片126接觸。當於+Z方向觀看時，突出部份41h除開縫41i之外的外部邊緣與軟焊料片125的外部邊緣一致，且突出部份42h除開縫42i之外的外部邊緣與軟焊料片126的外部邊緣一致。其次，熱處理被實施，且軟焊料片125及126被同時熔化，並且隨後固化。此使得引線框41經由軟焊料片125而被黏結於安裝板120，且使得引線框42經由軟焊料片126而被黏結於安裝板120。因此，LED封裝5被安裝在安裝板120上。As shown in FIGS. 16A and 16B, the LED package 5 according to this embodiment is mounted on the mounting board 120 to be used. At the time of mounting, solder fillets 125 and 126 are formed in two rectangular regions separated from each other by the mounting surface 121 of the mounting board 120. Next, the LED package 5 is placed on the mounting surface 121. Here, the lower surface of the protruding portion 41h of the lead frame 41 is placed in contact with the soft solder piece 125, and the lower surface of the protruding portion 42h of the lead frame 42 is placed in contact with the soft solder piece 126. When viewed in the +Z direction, the outer edge of the protruding portion 41h other than the slit 41i coincides with the outer edge of the soft solder piece 125, and the outer edge of the protruding portion 42h except the slit 42i and the outer portion of the soft solder piece 126 The edges are consistent. Next, heat treatment is carried out, and the soft solder sheets 125 and 126 are simultaneously melted and then solidified. This causes the lead frame 41 to be bonded to the mounting board 120 via the soft solder sheet 125, and the lead frame 42 is bonded to the mounting board 120 via the soft solder sheet 126. Therefore, the LED package 5 is mounted on the mounting board 120.

在此實施例中，因為開縫41i形成於引線框41，所以藉著經由透明樹脂本體17及開縫41i於+Z方向觀察安裝表面121，可檢查軟焊料片125是否存在，甚至是在LED封裝5與安裝表面121接觸之後。類似地，因為開縫42i形成於引線框42，所以藉著經由透明樹脂本體17及開縫42i於+Z方向觀察安裝表面121，可檢查軟焊料片126是否存在，甚至是在LED封裝5與安裝表面121接觸之後。特別是，透明樹脂本體17是由透明樹脂製成且不含有磷，因此可見光透射率高，且易於實施觀察。透明樹脂本體17進入開縫41i及42i的內部，且因而使引線框41及42對透明樹脂本體17的黏著變得優異，並且LED封裝5的耐用性被增進。In this embodiment, since the slit 41i is formed in the lead frame 41, by observing the mounting surface 121 in the +Z direction via the transparent resin body 17 and the slit 41i, it is possible to check whether or not the soft solder piece 125 exists, even in the LED. After the package 5 is in contact with the mounting surface 121. Similarly, since the slit 42i is formed in the lead frame 42, the presence of the soft soldering piece 126 can be inspected by observing the mounting surface 121 in the +Z direction via the transparent resin body 17 and the slit 42i, even in the LED package 5 and After the mounting surface 121 is in contact. In particular, the transparent resin body 17 is made of a transparent resin and does not contain phosphorus, so that the visible light transmittance is high and observation is easy. The transparent resin body 17 enters the inside of the slits 41i and 42i, and thus the adhesion of the lead frames 41 and 42 to the transparent resin body 17 becomes excellent, and the durability of the LED package 5 is improved.

另外，在此實施例中，引線框41的上表面與導線45從上表面端子44a被引出的方向之間的角度被設定為小於引線框42的上表面與導線45從引線框42被引出的方向之間的角度。此使得可抑制導線54的迴路的高度，且因此使LED封裝5的整體厚度較薄。另外，採用直立導電式LED晶片44及只有單一導線確實地防止導線與任何其他導線接觸，並且同時簡化導線黏結過程。除了以上剛剛敘述者之外，此實施例的其他組態、製造方法、及操作/工作功效與第一實施例相同。Further, in this embodiment, the angle between the upper surface of the lead frame 41 and the direction in which the wire 45 is taken out from the upper surface terminal 44a is set to be smaller than the upper surface of the lead frame 42 and the wire 45 is taken out from the lead frame 42. The angle between the directions. This makes it possible to suppress the height of the loop of the wire 54, and thus to make the overall thickness of the LED package 5 thin. In addition, the use of upright conductive LED wafers 44 and only a single wire reliably prevents the wires from coming into contact with any other wires and at the same time simplifies the wire bonding process. Other configurations, manufacturing methods, and operational/operational efficiencies of this embodiment are the same as those of the first embodiment except as just described above.

此處，在此實施例中，以於引線框41及42分別形成開縫41i及42i成為例子，然而於Z方向穿透的窗口可被形成於每一個引線框的內部。藉此，可經由窗口檢查軟焊料片是否存在，且對透明樹脂本體的黏著被增進。Here, in this embodiment, the slits 41i and 42i are formed as an example for the lead frames 41 and 42, respectively, but a window penetrating in the Z direction may be formed inside each lead frame. Thereby, it is possible to check whether or not the soft solder piece is present via the window, and the adhesion to the transparent resin body is enhanced.

其次，提供對於第六實施例的敘述。Next, a description will be given of the sixth embodiment.

圖17為顯示根據此實施例的LED封裝的立體圖。Fig. 17 is a perspective view showing an LED package according to this embodiment.

如圖17所示，根據此實施例的LED封裝6就上面安裝有LED晶片的引線框的形狀而言與根據第五實施例的LED封裝5(見圖15)不同。As shown in FIG. 17, the LED package 6 according to this embodiment is different from the LED package 5 (see FIG. 15) according to the fifth embodiment in terms of the shape of the lead frame on which the LED wafer is mounted.

明確地說，根據此實施例的LED封裝6包含引線框51而非引線框41(見圖15)。於引線框51，上表面51j的相應於底座部份51a於X方向的中心部份的區域比上表面51j的其餘區域低。換句話說，凹入部份51k形成於引線框51的上表面51j的於X方向的中心部份，且LED晶片44被設置於凹入部份51k的內部。In particular, the LED package 6 according to this embodiment includes the lead frame 51 instead of the lead frame 41 (see FIG. 15). In the lead frame 51, the area of the upper surface 51j corresponding to the central portion of the base portion 51a in the X direction is lower than the remaining area of the upper surface 51j. In other words, the concave portion 51k is formed in the central portion of the upper surface 51j of the lead frame 51 in the X direction, and the LED wafer 44 is disposed inside the concave portion 51k.

因為凹入部份51k形成於引線框51，且LED晶片44被設置在凹入部份51k的內部，所以此實施例可進一步減小LED封裝的高度。除了以上剛剛敘述者之外，此實施例的其他組態、製造方法、及操作/工作功效與第五實施例相同。Since the recessed portion 51k is formed in the lead frame 51, and the LED wafer 44 is disposed inside the recessed portion 51k, this embodiment can further reduce the height of the LED package. Other configurations, manufacturing methods, and operational/operational efficiencies of this embodiment are the same as those of the fifth embodiment except as just described above.

其次，提供對於第七實施例的敘述。Next, a description will be given of the seventh embodiment.

圖18為顯示根據此實施例的LED封裝的立體圖。Fig. 18 is a perspective view showing an LED package according to this embodiment.

圖19A為顯示根據此實施例的LED封裝的平面圖，且圖19B為其側視圖。Fig. 19A is a plan view showing an LED package according to this embodiment, and Fig. 19B is a side view thereof.

如圖18及圖19A及19B所示，根據此實施例的LED封裝7就上面安裝有LED晶片的引線框的形狀而言與根據第五實施例的LED封裝5(見圖15)不同。As shown in FIGS. 18 and 19A and 19B, the LED package 7 according to this embodiment is different from the LED package 5 (see FIG. 15) according to the fifth embodiment in terms of the shape of the lead frame on which the LED wafer is mounted.

明確地說，從X方向的觀點，根據此實施例的LED封裝7中的上面安裝有LED晶片44的引線框61的長度比根據第五實施例的引線框41(見圖15)的長度長。另外，於X方向彼此隔離的兩個突出部份61m及61n形成在引線框61的下表面上。突出部份61m係位在於-X方向相鄰於突出部份61n之處。另外，從X方向的觀點，未安裝有LED晶片44的引線框62的長度也比根據第六實施例的引線框42的長度長。注意形成在引線框62的下表面上的突出部份62h的數目為一個。Specifically, from the viewpoint of the X direction, the length of the lead frame 61 on which the LED wafer 44 is mounted in the LED package 7 according to this embodiment is longer than the length of the lead frame 41 (see FIG. 15) according to the fifth embodiment. . Further, two protruding portions 61m and 61n which are isolated from each other in the X direction are formed on the lower surface of the lead frame 61. The protruding portion 61m is located where the -X direction is adjacent to the protruding portion 61n. Further, from the viewpoint of the X direction, the length of the lead frame 62 on which the LED wafer 44 is not mounted is also longer than the length of the lead frame 42 according to the sixth embodiment. Note that the number of the protruding portions 62h formed on the lower surface of the lead frame 62 is one.

於+X方向進入的開縫61i形成於在引線框61的延伸部份61d與延伸部份61e之間的區域。當於-Z方向觀看時，開縫61i的尖端邊緣位在突出部份61m的內部。類似地，於-X方向進入的開縫62i形成於在引線框62的延伸部份62d與延伸部份62e之間的區域。當於-Z方向觀看時，開縫62i的尖端邊緣位在突出部份62h的內部。因此，在從下方(-Z方向)觀看時，突出部份61m及62h具有先前所述的特定形狀。突出部份61m的形狀及尺寸與突出部份62h的形狀及尺寸相同，並且突出部份61m及62h均相對於YZ座標平面對稱。突出部份61m及62h作用成為LED封裝7的外部電極墊片。A slit 61i that enters in the +X direction is formed in a region between the extended portion 61d of the lead frame 61 and the extended portion 61e. When viewed in the -Z direction, the tip end edge of the slit 61i is located inside the protruding portion 61m. Similarly, the slit 62i entering in the -X direction is formed in a region between the extended portion 62d of the lead frame 62 and the extended portion 62e. When viewed in the -Z direction, the tip end edge of the slit 62i is located inside the protruding portion 62h. Therefore, the protruding portions 61m and 62h have the specific shapes previously described when viewed from below (-Z direction). The shape and size of the protruding portion 61m are the same as those of the protruding portion 62h, and the protruding portions 61m and 62h are both symmetrical with respect to the YZ coordinate plane. The protruding portions 61m and 62h function as external electrode pads of the LED package 7.

在此實施例中，被使用成為外部電極墊片的突出部份61m及62h的下表面就形狀及尺寸而言相同。因此，在將LED封裝7安裝在安裝板120上時，軟焊料片125的形狀及尺寸可與軟焊料片126的形狀及尺寸相同。此使得可防止曼哈頓現象。另外，類似於上述的第五實施例，在將LED封裝7安裝在安裝板120上時，可經由開縫61i及62i檢查軟焊料片125及126是否存在。另外，因為透明樹脂本體17進入開縫61i及62i，所以引線框61及62對透明樹脂本體17的黏著變得優異。除了以上剛剛敘述者之外，此實施例的其他組態、製造方法、及操作/工作功效與第五實施例相同。In this embodiment, the lower surfaces of the protruding portions 61m and 62h used as the external electrode pads are identical in shape and size. Therefore, when the LED package 7 is mounted on the mounting board 120, the shape and size of the soft solder sheet 125 can be the same as that of the soft solder sheet 126. This makes it possible to prevent the Manhattan phenomenon. Further, similarly to the fifth embodiment described above, when the LED package 7 is mounted on the mounting board 120, the presence or absence of the soft solder sheets 125 and 126 can be checked via the slits 61i and 62i. Further, since the transparent resin body 17 enters the slits 61i and 62i, the adhesion of the lead frames 61 and 62 to the transparent resin body 17 becomes excellent. Other configurations, manufacturing methods, and operational/operational efficiencies of this embodiment are the same as those of the fifth embodiment except as just described above.

其次，提供對於第八實施例的敘述。Next, a description will be given of the eighth embodiment.

圖20為顯示根據此實施例的LED封裝的立體圖。FIG. 20 is a perspective view showing an LED package according to this embodiment.

圖21為顯示根據此實施例的LED封裝的剖面圖。21 is a cross-sectional view showing an LED package according to this embodiment.

如圖20及21所示，根據此實施例的LED封裝8與根據第一實施例的LED封裝1(見圖1)的不同在於LED封裝8包含倒裝(flip)LED晶片66，而非具有上表面端子的型式的LED晶片14。明確地說，在根據此實施例的LED封裝8中，LED晶片66具有在其下表面上的兩個端子。另外，LED晶片66如同橋樑般地被設置成跨越引線框11與引線框12之間的間隙。LED晶片66的一個下表面端子被連接於引線框11，且LED晶片66的另一個下表面端子被連接於引線框12。As shown in FIGS. 20 and 21, the LED package 8 according to this embodiment differs from the LED package 1 (see FIG. 1) according to the first embodiment in that the LED package 8 includes a flip LED wafer 66 instead of having A type of LED wafer 14 having a top surface terminal. In particular, in the LED package 8 according to this embodiment, the LED wafer 66 has two terminals on its lower surface. In addition, the LED chip 66 is disposed like a bridge to span the gap between the lead frame 11 and the lead frame 12. One lower surface terminal of the LED wafer 66 is connected to the lead frame 11, and the other lower surface terminal of the LED chip 66 is connected to the lead frame 12.

在此實施例中，採用倒裝LED晶片66而去除導線，使得可增進向上的光擷取效率，且同時去除導線黏結過程。另外，此進一步減小LED封裝的高度，並且也可防止由於透明樹脂本體17的熱應力所造成的導線的破裂。除了以上剛剛敘述者之外，此實施例的其他組態、製造方法、及操作/工作功效與第一實施例相同。In this embodiment, the flip-chip LED wafer 66 is used to remove the wires so that the upward light extraction efficiency is enhanced and the wire bonding process is removed at the same time. In addition, this further reduces the height of the LED package, and also prevents cracking of the wire due to thermal stress of the transparent resin body 17. Other configurations, manufacturing methods, and operational/operational efficiencies of this embodiment are the same as those of the first embodiment except as just described above.

其次，提供對於第九實施例的敘述。Next, a description will be given of the ninth embodiment.

圖22為顯示根據此實施例的LED封裝的立體圖。Fig. 22 is a perspective view showing an LED package according to this embodiment.

如圖22所示，此實施例為第一實施例與第五實施例的組合。明確地說，根據此實施例的LED封裝9包含已經與第一實施例相關聯地敘述的引線框11及12(見圖1)。另外，已經與第五實施例相關聯地敘述的直立導電式LED晶片44(見圖15)被安裝在此引線框11上。LED晶片44的下表面端子在晶粒安裝材料43被插置在下表面端子與引線框11之間的情況下被連接於引線框11，並且LED晶片44的上表面端子44a經由導線45而被連接於引線框12。As shown in Fig. 22, this embodiment is a combination of the first embodiment and the fifth embodiment. In particular, the LED package 9 according to this embodiment includes the lead frames 11 and 12 (see FIG. 1) which have been described in association with the first embodiment. Further, an upright conductive type LED wafer 44 (see Fig. 15) which has been described in association with the fifth embodiment is mounted on this lead frame 11. The lower surface terminal of the LED wafer 44 is connected to the lead frame 11 with the die attach material 43 interposed between the lower surface terminal and the lead frame 11, and the upper surface terminal 44a of the LED wafer 44 is connected via the wire 45 In the lead frame 12.

另外，如同在第五實施例中，導線45的端部部份45a從上表面端子44a被幾乎水平地(於+X方向)引出，且導線45的端部部份45b從引線框12的上表面被幾乎垂直地(於+Z方向)引出。明確地說，引線框11的上表面(XY座標平面)與導線45從上表面端子44a被引出的方向(幾乎等於+X方向)之間的角度小於引線框12的上表面(XY座標平面)與導線45從引線框12被引出的方向(幾乎等於+Z方向)之間的角度。Further, as in the fifth embodiment, the end portion 45a of the wire 45 is drawn almost horizontally (in the +X direction) from the upper surface terminal 44a, and the end portion 45b of the wire 45 is taken from the lead frame 12 The surface is drawn almost vertically (in the +Z direction). Specifically, the angle between the upper surface (XY coordinate plane) of the lead frame 11 and the direction in which the wire 45 is drawn from the upper surface terminal 44a (almost equal to the +X direction) is smaller than the upper surface of the lead frame 12 (XY coordinate plane) The angle between the direction in which the wire 45 is drawn from the lead frame 12 (almost equal to the +Z direction).

如同第五實施例，此實施例也可抑制導線45的迴路的高度，且因此也可使LED封裝9的整體厚度較薄。另外，採用直立導電式LED晶片44及只有單一導線可確實地防止導線與任何其他導線接觸，且同時簡化導線黏結過程。除了以上剛剛敘述者之外，此實施例的其他組態、製造方法、及操作/工作功效與第一實施例相同。其次，提供對於第十實施例的敘述。As with the fifth embodiment, this embodiment can also suppress the height of the loop of the wire 45, and thus also the overall thickness of the LED package 9 can be made thin. In addition, the use of upright conductive LED wafers 44 and only a single wire can reliably prevent the wires from coming into contact with any other wires and at the same time simplify the wire bonding process. Other configurations, manufacturing methods, and operational/operational efficiencies of this embodiment are the same as those of the first embodiment except as just described above. Next, a description will be given of the tenth embodiment.

圖23為顯示根據此實施例的LED封裝的剖面圖。Figure 23 is a cross-sectional view showing an LED package according to this embodiment.

如圖23所示，在根據第五實施例的LED封裝5的組態(見圖15)之外，根據此實施例的LED封裝10還包含設置在透明樹脂本體17上的透鏡71。透鏡71是由透明樹脂製成，且為凸部(convexity)朝上的平凸(plano-convex)透鏡。舉例而言，透鏡71可藉著於下方模具101(見圖5A至5C)的底部表面形成凹入部份而與透明樹脂本體17成整體地形成。否則，可在透鏡71附著於事先已經形成的透明樹脂板件29(見圖6A及6B)之後，使透鏡71與透明樹脂本體17的每一個一起從透明樹脂板件29切塊形成。或者，透鏡71可被附著於從透明樹脂板件29切塊形成的透明樹脂本體17的每一個。此實施例可使從透明樹脂本體17射出的光被透鏡71會聚於直立方向(於+Z方向)，且因此增進定向(orientation)。除了以上剛剛敘述者之外，此實施例的其他組態、製造方法、及操作/工作功效與第五實施例相同。As shown in FIG. 23, in addition to the configuration of the LED package 5 according to the fifth embodiment (see FIG. 15), the LED package 10 according to this embodiment further includes a lens 71 provided on the transparent resin body 17. The lens 71 is made of a transparent resin and is a plano-convex lens with a convexity facing upward. For example, the lens 71 may be integrally formed with the transparent resin body 17 by forming a concave portion on the bottom surface of the lower mold 101 (see FIGS. 5A to 5C). Otherwise, the lens 71 may be formed by dicing the transparent resin sheet member 29 together with each of the transparent resin bodies 17 after the lens 71 is attached to the transparent resin sheet member 29 (see Figs. 6A and 6B) which has been formed in advance. Alternatively, the lens 71 may be attached to each of the transparent resin bodies 17 formed by dicing from the transparent resin sheet member 29. This embodiment allows the light emitted from the transparent resin body 17 to be concentrated by the lens 71 in the upright direction (in the +Z direction), and thus the orientation is enhanced. Other configurations, manufacturing methods, and operational/operational efficiencies of this embodiment are the same as those of the fifth embodiment except as just described above.

雖然已經敘述一些實施例，但是這些實施例只是以舉例說明的方式呈現，而非要限制本發明的範圍。的確，此處所述的新穎實施例可用各種不同的其他形式被實施。另外，可在不離開本發明的精神下對此處所述的實施例的形式進行各種不同的省略、取代、及改變。附隨的申請專利範圍及其等效物係要涵蓋此種落在本發明的範圍及精神內的形式或修改。Although a few embodiments have been described, these embodiments are presented by way of illustration only and not of limitation. Indeed, the novel embodiments described herein can be implemented in a variety of other forms. In addition, various abbreviations, substitutions, and changes may be made in the form of the embodiments described herein without departing from the spirit of the invention. The scope of the accompanying claims and the equivalents thereof are intended to cover such forms or modifications within the scope and spirit of the invention.

舉例而言，雖然藉著濕蝕刻來形成引線框片料23被顯示成為第一實施例的例子，但是本發明不限於此情況。引線框片料23可例如藉著機械儀器例如壓機(press)而形成。另外，雖然將一個LED晶片安裝在一個LED封裝中被顯示成為每一個上述的實施例的例子，但是本發明不限於此情況。多個LED晶片可被安裝在一個LED封裝上。另外，溝槽可在要形成晶粒安裝材料的區域與導線要被黏結的區域之間形成在引線框的上表面上。否則，凹入部份可形成於晶粒安裝材料要形成在引線框的上表面上的區域。藉此，不論是晶粒安裝材料的供應量及晶粒安裝材料的供應位置是否有偏差，均可防止晶粒安裝材料流動及到達導線要被黏結的區域，且因此可防止晶粒安裝材料阻礙導線黏結。另外，透明樹脂本體17可含有螢光材料。For example, although the formation of the lead frame sheet 23 by wet etching is shown as an example of the first embodiment, the present invention is not limited to this case. The lead frame sheet 23 can be formed, for example, by a mechanical instrument such as a press. In addition, although mounting one LED chip in one LED package is shown as an example of each of the above embodiments, the present invention is not limited to this case. A plurality of LED chips can be mounted on one LED package. In addition, a trench may be formed on the upper surface of the lead frame between a region where the die mounting material is to be formed and a region where the wire is to be bonded. Otherwise, the recessed portion may be formed in a region where the die attach material is to be formed on the upper surface of the lead frame. Thereby, whether the supply amount of the die mounting material and the supply position of the die mounting material are deviated, the flow of the die mounting material can be prevented and the area where the wire is to be bonded can be prevented, and thus the die mounting material can be prevented from being hindered. The wire is bonded. In addition, the transparent resin body 17 may contain a fluorescent material.

另外，雖然於每一個引線框中將銀鍍層分別形成在銅板件的上表面及下表面上被顯示成為第一實施例的例子，但是本發明不限於此情況。舉例而言，銠(Rh)鍍層可被形成在分別形成於銅板件的上表面及下表面上的銀鍍層中的至少一個上。另外，銅(Cu)鍍層可被形成在銅板件與每一個銀鍍層之間。否則，鎳(Ni)鍍層可被分別形成在銅板件的上表面及下表面上，接著在鎳鍍層的每一個上形成金-銀合金(Au-Ag合金)鍍層。Further, although the silver plating layers are respectively formed on the upper surface and the lower surface of the copper plate member in each lead frame as an example of the first embodiment, the present invention is not limited to this case. For example, a rhodium plating layer may be formed on at least one of the silver plating layers respectively formed on the upper and lower surfaces of the copper plate member. In addition, a copper (Cu) plating layer may be formed between the copper plate member and each of the silver plating layers. Otherwise, nickel (Ni) plating layers may be formed on the upper and lower surfaces of the copper plate member, respectively, and then a gold-silver alloy (Au-Ag alloy) plating layer is formed on each of the nickel plating layers.

另外，雖然每一個引線框的在從上方觀看時具有矩形形狀的底座部份被顯示成為每一個上述的實施例及變化的例子，但是底座部份可具有藉著從矩形切除至少一個角落部份而獲得的形狀。藉此，直角或銳角部份從LED封裝的角落部份及其附近被移除。因此，去角部份不再會提供樹脂開始剝落或破裂的起點。結果，就LED封裝整體而言，可抑制樹脂的剝落及破裂。In addition, although the base portion of each of the lead frames having a rectangular shape when viewed from above is shown as an example of each of the above embodiments and variations, the base portion may have at least one corner portion removed from the rectangle And the shape obtained. Thereby, the right angle or acute angle portion is removed from the corner portion of the LED package and its vicinity. Therefore, the chamfered portion no longer provides a starting point for the resin to begin to peel or crack. As a result, peeling and cracking of the resin can be suppressed as a whole of the LED package.

上述的實施例可提供成本低的高度耐用的LED封裝及其製造方法。The above embodiments can provide a highly durable LED package with low cost and a method of manufacturing the same.

1．．．LED封裝1. . . LED package

2．．．LED封裝2. . . LED package

3．．．LED封裝3. . . LED package

4．．．LED封裝4. . . LED package

5．．．LED封裝5. . . LED package

6．．．LED封裝6. . . LED package

7．．．LED封裝7. . . LED package

8．．．LED封裝8. . . LED package

9．．．LED封裝9. . . LED package

10．．．LED封裝10. . . LED package

11．．．引線框11. . . Lead frame

11a．．．底座部份11a. . . Base part

11b．．．延伸部份11b. . . Extended part

11c．．．延伸部份11c. . . Extended part

11d．．．延伸部份11d. . . Extended part

11e．．．延伸部份11e. . . Extended part

11f．．．下表面11f. . . lower surface

11g．．．突出部份11g. . . Prominent part

11h．．．上表面11h. . . Upper surface

11t．．．薄板部份11t. . . Thin plate part

12．．．引線框12. . . Lead frame

12a．．．底座部份12a. . . Base part

12b．．．延伸部份12b. . . Extended part

12c．．．延伸部份12c. . . Extended part

12d．．．延伸部份12d. . . Extended part

12e．．．延伸部份12e. . . Extended part

12f．．．下表面12f. . . lower surface

12g．．．突出部份12g. . . Prominent part

12h．．．上表面12h. . . Upper surface

12t．．．薄板部份12t. . . Thin plate part

13．．．晶粒安裝材料13. . . Die mounting material

14．．．LED晶片14. . . LED chip

14a．．．端子14a. . . Terminal

14b．．．端子14b. . . Terminal

15．．．導線15. . . wire

16．．．導線16. . . wire

17．．．透明樹脂本體17. . . Transparent resin body

21．．．導電片料twenty one. . . Conductive sheet

21a．．．銅板件21a. . . Copper plate

21b．．．銀鍍層21b. . . Silver plating

22a．．．掩模22a. . . Mask

22b．．．掩模22b. . . Mask

22c．．．開口部份22c. . . Opening part

23．．．引線框片料twenty three. . . Lead frame sheet

23a．．．開口部份23a. . . Opening part

23b．．．橋接部23b. . . Bridge

23c．．．橋接部23c. . . Bridge

24．．．加強膠帶twenty four. . . Strengthening tape

26．．．樹脂材料26. . . Resin material

29．．．透明樹脂板件29. . . Transparent resin plate

31．．．引線框31. . . Lead frame

31a．．．底座部份31a. . . Base part

31b．．．延伸部份31b. . . Extended part

31c．．．延伸部份31c. . . Extended part

31d．．．延伸部份31d. . . Extended part

31e．．．延伸部份31e. . . Extended part

31g．．．突出部份31g. . . Prominent part

32．．．引線框32. . . Lead frame

32b．．．延伸部份32b. . . Extended part

32c．．．延伸部份32c. . . Extended part

32g．．．突出部份32g. . . Prominent part

36．．．齊納二極體晶片36. . . Zener diode chip

36a．．．上表面端子36a. . . Upper surface terminal

37．．．晶粒安裝材料37. . . Die mounting material

38．．．導線38. . . wire

41．．．引線框41. . . Lead frame

41a．．．底座部份41a. . . Base part

41b．．．延伸部份41b. . . Extended part

41c．．．延伸部份41c. . . Extended part

41d．．．延伸部份41d. . . Extended part

41e．．．延伸部份41e. . . Extended part

41f．．．延伸部份41f. . . Extended part

41g．．．延伸部份41g. . . Extended part

41h．．．突出部份41h. . . Prominent part

41i．．．開縫41i. . . Slot

41j．．．上表面41j. . . Upper surface

41t．．．薄板部份41t. . . Thin plate part

42．．．引線框42. . . Lead frame

42a．．．底部部份42a. . . Bottom part

42b．．．延伸部份42b. . . Extended part

42c．．．延伸部份42c. . . Extended part

42d．．．延伸部份42d. . . Extended part

42e．．．延伸部份42e. . . Extended part

42h．．．突出部份42h. . . Prominent part

42i．．．開縫42i. . . Slot

42j．．．上表面42j. . . Upper surface

42t．．．薄板部份42t. . . Thin plate part

43．．．晶粒安裝材料43. . . Die mounting material

44．．．LED晶片44. . . LED chip

44a．．．上表面端子44a. . . Upper surface terminal

45．．．導線45. . . wire

45a．．．端部部份45a. . . End part

45b．．．端部部份45b. . . End part

51．．．引線框51. . . Lead frame

51a．．．底座部份51a. . . Base part

51j．．．上表面51j. . . Upper surface

51k．．．凹入部份51k. . . Concave part

61．．．引線框61. . . Lead frame

61d．．．延伸部份61d. . . Extended part

61e．．．延伸部份61e. . . Extended part

61i．．．開縫61i. . . Slot

61m．．．突出部份61m. . . Prominent part

61n．．．突出部份61n. . . Prominent part

62．．．引線框62. . . Lead frame

62d．．．延伸部份62d. . . Extended part

62e．．．延伸部份62e. . . Extended part

62h．．．突出部份62h. . . Prominent part

62i．．．開縫62i. . . Slot

66．．．倒裝LED晶片66. . . Flip LED chip

71．．．透鏡71. . . lens

101．．．下方模具101. . . Lower mold

101a．．．凹入部份101a. . . Concave part

102．．．上方模具102. . . Upper mold

103．．．配送器103. . . Dispenser

104．．．刀片104. . . blade

111．．．抗蝕劑膜111. . . Resist film

111a．．．抗蝕劑圖型111a. . . Resist pattern

112．．．掩模圖型112. . . Mask pattern

113．．．掩模113. . . Mask

120．．．安裝板120. . . Mounting plate

121．．．安裝表面121. . . Mounting surface

125．．．軟焊料片125. . . Soft solder sheet

126．．．軟焊料片126. . . Soft solder sheet

B．．．區塊B. . . Block

D．．．切塊區域D. . . Cut area

P．．．元件區域P. . . Component area

圖1為顯示根據第一實施例的LED封裝的立體圖。FIG. 1 is a perspective view showing an LED package according to a first embodiment.

圖2A為顯示根據第一實施例的LED封裝的剖面圖，且圖2B為顯示根據第一實施例的引線框的平面圖。2A is a cross-sectional view showing an LED package according to a first embodiment, and FIG. 2B is a plan view showing a lead frame according to the first embodiment.

圖3為顯示用來製造根據第一實施例的LED封裝的方法的流程圖。FIG. 3 is a flow chart showing a method for manufacturing the LED package according to the first embodiment.

圖4A至6B為顯示用來製造根據第一實施例的LED封裝的方法的製程剖面圖。4A to 6B are process cross-sectional views showing a method for manufacturing the LED package according to the first embodiment.

圖7A為顯示根據第一實施例的引線框片料的平面圖，且圖7B為顯示於此引線框片料的元件區域的部份放大平面圖。Fig. 7A is a plan view showing a lead frame sheet according to the first embodiment, and Fig. 7B is a partially enlarged plan view showing an element region of the lead frame sheet.

圖8A至8H為顯示根據第一實施例的變化的用來形成引線框片料的方法的製程剖面圖。8A to 8H are process cross-sectional views showing a method for forming a lead frame sheet according to a variation of the first embodiment.

圖9為顯示根據第二實施例的LED封裝的立體圖。Fig. 9 is a perspective view showing an LED package according to a second embodiment.

圖10為顯示根據第二實施例的LED封裝的側視圖。Fig. 10 is a side view showing an LED package according to a second embodiment.

圖11為顯示根據第三實施例的LED封裝的立體圖。Fig. 11 is a perspective view showing an LED package according to a third embodiment.

圖12為顯示根據第三實施例的LED封裝的剖面圖。Figure 12 is a cross-sectional view showing an LED package in accordance with a third embodiment.

圖13為顯示根據第四實施例的LED封裝的立體圖。Fig. 13 is a perspective view showing an LED package according to a fourth embodiment.

圖14為顯示根據第四實施例的LED封裝的剖面圖。Figure 14 is a cross-sectional view showing an LED package according to a fourth embodiment.

圖15為顯示根據第五實施例的LED封裝的立體圖。Fig. 15 is a perspective view showing an LED package according to a fifth embodiment.

圖16A為顯示根據第五實施例的LED封裝的平面圖，且圖16B為其側視圖。Fig. 16A is a plan view showing an LED package according to a fifth embodiment, and Fig. 16B is a side view thereof.

圖17為顯示根據第六實施例的LED封裝的立體圖。Fig. 17 is a perspective view showing an LED package according to a sixth embodiment.

圖18為顯示根據第七實施例的LED封裝的立體圖。Fig. 18 is a perspective view showing an LED package according to a seventh embodiment.

圖19A為顯示根據第七實施例的LED封裝的平面圖，且圖19B為其側視圖。Fig. 19A is a plan view showing an LED package according to a seventh embodiment, and Fig. 19B is a side view thereof.

圖20為顯示根據第八實施例的LED封裝的立體圖。Fig. 20 is a perspective view showing an LED package according to an eighth embodiment.

圖21為顯示根據第八實施例的LED封裝的剖面圖。Figure 21 is a cross-sectional view showing an LED package according to an eighth embodiment.

圖22為顯示根據第九實施例的LED封裝的立體圖。Fig. 22 is a perspective view showing an LED package according to a ninth embodiment.

圖23為顯示根據第十實施例的LED封裝的剖面圖。Figure 23 is a cross-sectional view showing an LED package in accordance with a tenth embodiment.

1．．．LED封裝1. . . LED package

11．．．引線框11. . . Lead frame

11a．．．底座部份11a. . . Base part

11b．．．延伸部份11b. . . Extended part

11c．．．延伸部份11c. . . Extended part

11d．．．延伸部份11d. . . Extended part

11e．．．延伸部份11e. . . Extended part

11g．．．突出部份11g. . . Prominent part

11h．．．上表面11h. . . Upper surface

12．．．引線框12. . . Lead frame

12a．．．底座部份12a. . . Base part

12b．．．延伸部份12b. . . Extended part

12c．．．延伸部份12c. . . Extended part

12d．．．延伸部份12d. . . Extended part

12e．．．延伸部份12e. . . Extended part

12g．．．突出部份12g. . . Prominent part

12h．．．上表面12h. . . Upper surface

13．．．晶粒安裝材料13. . . Die mounting material

14．．．LED晶片14. . . LED chip

14a．．．端子14a. . . Terminal

14b．．．端子14b. . . Terminal

15．．．導線15. . . wire

16．．．導線16. . . wire

17．．．透明樹脂本體17. . . Transparent resin body

Claims (16)

一種LED封裝，包含：第一引線框及第二引線框，二者彼此分開；LED晶片，其被設置在該第一及第二引線框的上方，該LED晶片包含含有至少銦、鎵、及鋁的半導體層、被連接於該第一引線框的一個端子、及被連接於該第二引線框的另一個端子；及樹脂本體，其覆蓋該LED晶片及該第一及第二引線框的每一個的整個上表面、下表面的部份、及邊緣表面的部份，且曝露該下表面的其餘部份及該邊緣表面的其餘部份，其中，該樹脂本體的外觀為該LED封裝的外觀的部份，凹入部份形成於該第一引線框的該上表面，且該LED晶片被安裝在該凹入部份的內部。 An LED package comprising: a first lead frame and a second lead frame separated from each other; an LED chip disposed above the first and second lead frames, the LED chip comprising at least indium, gallium, and a semiconductor layer of aluminum, one terminal connected to the first lead frame, and another terminal connected to the second lead frame; and a resin body covering the LED chip and the first and second lead frames An entire upper surface, a portion of the lower surface, and a portion of the edge surface, and exposing the remaining portion of the lower surface and the remaining portion of the edge surface, wherein the appearance of the resin body is the LED package The concave portion is formed on the upper surface of the first lead frame, and the LED chip is mounted inside the concave portion. 如申請專利範圍第1項所述的LED封裝，其中該樹脂本體是由選擇自由環氧樹脂(epoxy resin)、丙烯酸系樹脂(acrylic resin)、及胺基甲酸酯樹脂(urethane resin)所組成的群類中的一種樹脂製成。 The LED package of claim 1, wherein the resin body is composed of an epoxy resin, an acrylic resin, and a urethane resin. Made of a resin in the group. 如申請專利範圍第1項所述的LED封裝，其中該樹脂本體為透明的。 The LED package of claim 1, wherein the resin body is transparent. 如申請專利範圍第1項所述的LED封裝，其中第一突出部份形成在該第一引線框的該下表面上，並且第二突出部份形成在該第二引線框的該下表面上，且 該第一突出部份的下表面及該第二突出部份的下表面曝露在該樹脂本體的下表面上，並且該第一突出部份的側表面及該第二突出部份的側表面被該樹脂本體覆蓋。 The LED package of claim 1, wherein a first protruding portion is formed on the lower surface of the first lead frame, and a second protruding portion is formed on the lower surface of the second lead frame And a lower surface of the first protruding portion and a lower surface of the second protruding portion are exposed on a lower surface of the resin body, and a side surface of the first protruding portion and a side surface of the second protruding portion are The resin body is covered. 如申請專利範圍第4項所述的LED封裝，其中該第一突出部份的該下表面具有與該第二突出部份的該下表面的形狀相等的形狀。 The LED package of claim 4, wherein the lower surface of the first protruding portion has a shape equal to a shape of the lower surface of the second protruding portion. 如申請專利範圍第4項所述的LED封裝，其中該第一引線框具有第一邊緣，且該第二引線框具有第二邊緣，該第一邊緣與該第二邊緣面向彼此，該第一突出部份形成於與該第一邊緣分開的區域，且該第二突出部份形成於與該第二邊緣分開的區域。 The LED package of claim 4, wherein the first lead frame has a first edge, and the second lead frame has a second edge, the first edge and the second edge facing each other, the first The protruding portion is formed in a region separated from the first edge, and the second protruding portion is formed in a region separated from the second edge. 如申請專利範圍第1項所述的LED封裝，其中該LED晶片被安裝在該第一引線框上，該一個端子被設置在該LED晶片的下表面上，且該另一個端子被設置在該LED晶片的上表面上，該LED封裝另外包含：晶粒安裝材料，其由導電材料製成，該晶粒安裝材料將該LED晶片黏著於該第一引線框，且將該一個端子連接於該第一引線框；及導線，其將該另一個端子連接於該第二引線框。 The LED package of claim 1, wherein the LED chip is mounted on the first lead frame, the one terminal is disposed on a lower surface of the LED chip, and the other terminal is disposed on the On the upper surface of the LED chip, the LED package further comprises: a die mounting material made of a conductive material, the die mounting material bonding the LED chip to the first lead frame, and connecting the one terminal to the a first lead frame; and a wire connecting the other terminal to the second lead frame. 如申請專利範圍第7項所述的LED封裝，其中該第一引線框的該上表面與該導線從該另一個端子被引出的方向之間的角度被設定為小於該第二引線框的該上表面與該導線從該第二引線框被引出的方向之間的角度。 The LED package of claim 7, wherein an angle between the upper surface of the first lead frame and a direction in which the wire is led out from the other terminal is set to be smaller than the second lead frame The angle between the upper surface and the direction in which the wire is drawn from the second lead frame. 如申請專利範圍第1項所述的LED封裝，另外包含設置在該樹脂本體上的透鏡。 The LED package of claim 1, further comprising a lens disposed on the resin body. 如申請專利範圍第1項所述的LED封裝，其中該第一引線框及該第二引線框中的一個包含：底座部份；及多個延伸部份，其從該底座部份於不同的方向延伸，且具有被該樹脂本體覆蓋的下表面、及曝露在該樹脂本體的側表面上的邊緣表面，且該底座部份的邊緣表面被該樹脂本體覆蓋。 The LED package of claim 1, wherein the first lead frame and the second lead frame comprise: a base portion; and a plurality of extending portions from which the base portion is different The direction extends and has a lower surface covered by the resin body and an edge surface exposed on a side surface of the resin body, and an edge surface of the base portion is covered by the resin body. 如申請專利範圍第1項所述的LED封裝，其中該樹脂本體在從上方觀看時具有矩形形狀，且該第一引線框及該第二引線框中的至少一個包含：底座部份，其具有被該樹脂本體覆蓋的邊緣表面；及多個延伸部份，其從該底座部份延伸，且具有被該樹脂本體覆蓋的下表面、及曝露在該樹脂本體的三個不同的側表面上的邊緣表面。 The LED package of claim 1, wherein the resin body has a rectangular shape when viewed from above, and at least one of the first lead frame and the second lead frame comprises: a base portion having An edge surface covered by the resin body; and a plurality of extension portions extending from the base portion and having a lower surface covered by the resin body and exposed on three different side surfaces of the resin body Edge surface. 如申請專利範圍第1項所述的LED封裝，其中該第一引線框及該第二引線框各包括：底座部份，該底座部份的邊緣表面係被該樹脂本體覆蓋；及多個延伸部份，其從該底座部份於不同方向延伸，且具有被該樹脂本體覆蓋的下表面、及曝露在該樹脂本體的側表面上的尖端邊緣表面； 該第一引線框具有第一邊緣且該第二引線框具有第二邊緣，該第一邊緣及該第二邊緣面向彼此；該第一引線框的該底座部份包括：第一突出部份，形成於與該第一邊緣分開的區域，該第一突出部份的下表面曝露在該樹脂本體的下表面，且該第一突出部份的側表面被該樹脂本體覆蓋；以及第一薄板部份，包括該第一邊緣，該第一薄板部份較該第一突出部份為薄，該第一薄板部份的下表面被該樹脂本體覆蓋；該第二引線框的該底座部份包括：第二突出部份，形成於與該第二邊緣分開的區域，該第二突出部份的下表面曝露在該樹脂本體的下表面，且該第二突出部份的側表面被該樹脂本體覆蓋；以及第二薄板部份，包括該第二邊緣，該第二薄板部份較該第二突出部份為薄，該第二薄板部份的下表面被該樹脂本體覆蓋；以及更包括：第一開縫，形成在該第一突出部份中且介於該等延伸部份之中的兩個之間，該第一開縫朝向從該第一引線框往第二引線框的方向，且垂直地穿透該第一引線框的該第一突出部份，該第一突出部份的該下表面的形狀為U形的；以及第二開縫，形成在該第二突出部份中且介於該等延伸部份之中的兩個之間，該第二開縫朝向從該第二引線 框往第一引線框的方向，且垂直地穿透該第二引線框的該第二突出部份，該第二突出部份的該下表面的形狀為U形的。 The LED package of claim 1, wherein the first lead frame and the second lead frame each comprise: a base portion, the edge surface of the base portion is covered by the resin body; and a plurality of extensions a portion extending from the base portion in different directions and having a lower surface covered by the resin body and a tip edge surface exposed on a side surface of the resin body; The first lead frame has a first edge and the second lead frame has a second edge, the first edge and the second edge face each other; the base portion of the first lead frame includes: a first protruding portion, Formed in a region separated from the first edge, a lower surface of the first protruding portion is exposed on a lower surface of the resin body, and a side surface of the first protruding portion is covered by the resin body; and a first thin plate portion And including the first edge, the first thin plate portion is thinner than the first protruding portion, the lower surface of the first thin plate portion is covered by the resin body; the base portion of the second lead frame includes a second protruding portion formed in a region separated from the second edge, a lower surface of the second protruding portion being exposed on a lower surface of the resin body, and a side surface of the second protruding portion being the resin body And a second thin plate portion including the second edge, the second thin plate portion being thinner than the second protruding portion, the lower surface of the second thin plate portion being covered by the resin body; and further comprising: First slit, formed at the first Between the two of the extending portions, the first slit is oriented from the first lead frame to the second lead frame, and vertically penetrates the first lead frame The first protruding portion, the lower surface of the first protruding portion is U-shaped; and the second slit is formed in the second protruding portion and is located in the extending portion Between the two, the second slit is oriented from the second lead The frame is oriented in the direction of the first lead frame and vertically penetrates the second protruding portion of the second lead frame, and the lower surface of the second protruding portion is U-shaped. 一種LED封裝的製造方法，包含：將LED晶片安裝在引線框片料的元件區域的每一個上，將該LED晶片的一個端子連接於第一引線框，且將該LED晶片的另一個端子連接於第二引線框，該引線框片料包含以矩陣陣列配置的多個元件區域、形成於該元件區域的每一個的基本圖型，該基本圖型包含彼此分開的該第一及第二引線框、及存留於在該元件區域之間的切塊區域的每一個以將相鄰的該元件區域連接在一起的導電材料，該LED晶片包含含有至少銦、鎵、及鋁的半導體層；形成樹脂板件以將該LED晶片掩埋在該樹脂板件中而覆蓋該引線框片料的該元件區域的每一個的整個上表面及下表面的部份；及藉著移除被置於該切塊區域的該引線框片料的部份及該樹脂板件的部份而切割被置於該元件區域的該引線框片料的部份及該樹脂板件的部份，經切割的該部份的外觀為該LED封裝的外觀的部份。 A method of manufacturing an LED package, comprising: mounting an LED chip on each of an element region of a lead frame sheet, connecting one terminal of the LED chip to the first lead frame, and connecting the other terminal of the LED chip In a second lead frame, the lead frame sheet comprises a plurality of element regions arranged in a matrix array, a basic pattern formed in each of the element regions, the basic pattern comprising the first and second leads separated from each other a frame, and a conductive material remaining in each of the dicing regions between the component regions to connect adjacent component regions, the LED wafer comprising a semiconductor layer comprising at least indium, gallium, and aluminum; a resin sheet member for burying the LED wafer in the resin sheet member to cover a portion of the entire upper surface and the lower surface of each of the element regions of the lead frame sheet; and being placed by the removal by the removal Cutting a portion of the lead frame sheet and a portion of the resin sheet member in the block region to cut a portion of the lead frame sheet placed in the component region and a portion of the resin sheet member, the portion to be cut The appearance of the part is the L The part of the appearance of the ED package. 如申請專利範圍第13項所述的LED封裝的製造方法，其中該樹脂板件是由選擇自由環氧樹脂(epoxy resin)、丙烯酸系樹脂(acrylic resin)、及胺基甲酸酯樹脂(urethane resin)所組成的群類中的一種樹脂形成。 The method of manufacturing an LED package according to claim 13, wherein the resin sheet member is selected from the group consisting of an epoxy resin, an acrylic resin, and a urethane resin. Resin formed from a group of resins. 如申請專利範圍第13項所述的LED封裝的製造方法，其中該樹脂板件是由透明樹脂形成。 The method of manufacturing an LED package according to claim 13, wherein the resin sheet member is formed of a transparent resin. 如申請專利範圍第13項所述的LED封裝的製造方法，其中將該LED晶片的一個端子連接於第一引線框且將該LED晶片的另一個端子連接於第二引線框包含：將該LED晶片黏結於該第一引線框的上表面；將導線的一個端部黏結於該第二引線框的上表面；及在將該導線的該一個端部黏結於該第二引線框的該上表面之後，將該導線的另一個端部黏結於該另一個端子。The method of manufacturing the LED package of claim 13, wherein connecting one terminal of the LED chip to the first lead frame and connecting the other terminal of the LED chip to the second lead frame comprises: the LED Bonding the wafer to the upper surface of the first lead frame; bonding one end of the wire to the upper surface of the second lead frame; and bonding the one end of the wire to the upper surface of the second lead frame Thereafter, the other end of the wire is bonded to the other terminal.
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