TWI445929B - A light emission measuring device, a light emission measuring method, a control program, and a readable recording medium - Google Patents

Description

Luminescence measuring device, luminescence measuring method, control program, readable recording medium

The present invention relates to a light-emitting measuring device and a light-emitting measuring method for inspecting light emission of an optical element such as a light-emitting diode (hereinafter referred to as "LED"), a control program for causing a computer to execute the light-emitting measuring method, and a control program for storing the control program Record media.

In recent years, from the viewpoint of global environmental protection, as a small-sized, long-life, non-hazardous material and other energy-saving lighting parts, the need for low-cost LEDs is also very high in the need to recognize LEDs.

In the previous LED measurement, the LED and the light-receiving sensor (photodiode) were arranged in a one-to-one pair (opposite), and the light-receiving amount of the LED was measured by converting the light into electric power by each light-receiving sensor. The reason is that in the case where a plurality of LEDs are simultaneously illuminated, if each of the light-receiving sensors converts the optical signal into an electrical signal in units of light-receiving surfaces, it is impossible to simultaneously emit light of the plurality of LEDs on the respective light-receiving sensors. Distinguish the amount of luminescence of each LED.

Thus, if the same number of light-receiving sensors are provided for a plurality of LEDs and they are paired and aligned (opposite), a plurality of LEDs can be simultaneously measured. However, this may increase the price of the device, or the size of the device becomes larger, or the measurement accuracy may be problematic due to the uneven sensitivity of the light sensor. Currently, such a form is not adopted, and the measurement is performed by one light sensor. .

Fig. 10 is a schematic view for explaining an example of a configuration of a main part of a conventional luminescence measuring apparatus.

In FIG. 10, a plurality of semiconductor wafers 102 provided with LEDs as light-emitting elements are arranged in a matrix on the wafer 101. The conventional luminescence measuring device 100 can apply a power supply voltage to the probe pin contact, that is, the pad 103, by the probe pin 104 to cause the LED to emit light, thereby inspecting each of the semiconductor wafers 102. The amount of light emitted by the LED can be measured by the PD method or the on-axis measuring machine 105 using the integrating sphere, and it is checked whether or not the measured amount of light is defective. In this manner, the amount of light emitted by the LEDs is measured sequentially for each semiconductor wafer 102.

As described above, in the conventional luminescence measuring apparatus 100, since the amount of luminescence of the LEDs is sequentially measured for each of the semiconductor wafers 102, it takes a lot of time to measure the amount of luminescence of the LEDs of all the wafers. In order to solve this problem, Patent Document 1 in which the amount of light emission of a plurality of LEDs is simultaneously measured to shorten the measurement time is proposed.

In Patent Document 1, in order to measure the amount of light emission of a plurality of LEDs at the same time, a circuit for generating an ID signal is incorporated in each of the LED measurement circuits, thereby generating a signal for synthesizing an LED of the LED as an ID signal indicating an identification signal of which LED. . The composite signal is a method of measuring the amount of luminescence while determining the signal of the LED by distinguishing the LED signal and the dedicated software of the illuminating signal when the illuminating signal is converted into a power amount by the photosensor side.

Fig. 11 is a block diagram showing an example of the configuration of a main part of a conventional LED simultaneous measuring device disclosed in Patent Document 1. In addition, in FIG. 11, although the case where two LEDs are simultaneously measured is shown for convenience of description, you may measure the number of LEDs corresponding to the number simultaneously by adding the same circuit.

As shown in FIG. 11, the previous LED simultaneous measuring device 200 can be divided into two parts: a signal source for causing the LEDs 201, 202 to emit light to the light-emitting bias applying portion A of the LEDs 201, 202 (above the center dotted line of FIG. 11), and light amount detection. The portion B (the lower portion of the central dotted line in Fig. 11) is measured.

First, the description will be made from the operation of the light-emitting bias application portion A.

The ACB is an AC basic signal generator that generates a sinusoidal AC fundamental signal of a certain amplitude and a certain frequency (frequency fb). A part of the signal is supplied to the bias modulator BM201b. Here, by the identification signal (frequency f1) of the identification signal generator ID 201a, modulation such as amplitude modulation, frequency modulation, phase modulation, etc. is received. AC bias signal (in FIG. 12 is an amplitude modulation example).

Similarly, a portion of the AC base signal is also applied to the bias modulator BM 202b, where the same modulation is received by the identification signal (frequency f2) of the identification signal generator ID 202a to become an AC bias signal. Since the identification signal (frequency f1) of the identification signal generator ID 201a and the identification signal (frequency f2) of the identification signal generator ID 202a are different frequencies, the waveforms of the respective AC bias signals are also different.

The outputs from the bias modulators BM201b, BM202b are respectively supplied to the bias signal synthesizers BC201c, BC202c typified by the analog adder, where they are superimposed on the DC bias reference level generator DCB at a certain ratio. DC bias voltage. It is important that the ratio is set as described later in such a manner that the light-emitting component caused by the bias signal on the light-receiving side AC is faithfully set, and the optimum ratio is 0.1 ≦AC bias ≦DC bias ≦0.9. .

An example of the waveform of the output signals of the bias signal synthesizers BC201c, BC202c is shown in FIG.

This signal is adjusted to a specific bias level by the bias level adjustment sections BL201d and BL202d having the functions of the D/A converter. When the measurement conditions of the LEDs are input to the bias level adjustment sections BL201d and BL202d as a program in advance, the corresponding bias level can be set.

When the signal is applied to the applied current output units IP201e and IP202e as the drive command signals, the current proportional to the drive command signal is applied to the LEDs 201 and LEDs 202 to be measured, respectively, as bias currents. As shown in the waveform of FIG. 12, since the waveform of the bias current is superimposed on the reference level of the DC bias current by the identification signal by a certain ratio, the LED 201 and the LED 202 are connected. The illuminating output also becomes the corresponding illuminating output.

Next, the operation of the light amount detecting and measuring portion B of Fig. 11 will be described.

The PD is a light-receiving sensor such as a photodiode or a phototube, and the light amount of the sum of the light-emitting amounts of the LED 201 and the LED 202 is simultaneously received by one light-receiving sensor PD. Therefore, there is no need to shield the light between the LED 201 and the LED 202 at all. Further, even if there is an external incident light that is originally obstructed from measurement other than the light output of the LED 201 and the LED 202, it can be excluded as will be described later.

The light-receiving sensor PD generates a current change substantially proportional to the total amount of incident light, and is converted into a voltage change by a current-to-voltage converter IVC called an I/V conversion amplifier or the like.

If the output component is analyzed, it has the following components (a) and (b):

(a) A voltage (hereinafter referred to as a DC light receiving voltage) which is included in the total of the light emission of each LED and corresponds to the sum of the DC bias components.

(b) A voltage superimposed on the DC light receiving voltage and corresponding to the sum of the components of the AC bias signal (hereinafter referred to as an AC light receiving voltage, including the frequency component fb of the AC base signal).

The above-mentioned output voltage including the above components (a) and (b) is input to the high-pass filter HPF, and the DC received voltage of the above component (a) is first removed.

Even if the DC light receiving voltage (a) is eliminated, the light amount information of each LED is included in proportion to the AC light receiving voltage of (b), so that there is no obstacle to the measurement.

The output of the HPF from the high pass filter is input to a phase detector PSD 203 having a multiplication function. At the same time, the AC base signal (frequency fb) is applied to the phase detector PSD 203 by the AC base signal generator ACB, and the two signals are multiplied. Thus, if the frequency of the AC bias signal is fb and the frequency of the identification signal is f1 and f2, the frequency component of the AC output of the high-pass filter HPF includes the upper sideband components fb+f1, fb+f2, and Sideband components fb-f1, fb-f2. Among them, only the phase of the AC bias signal and the timing sequence are referred to as the fb component. Therefore, the voltage from the phase detector PSD 203 exhibits the following frequency components.

The output of the phase detector PSD 203 is set to a low-pass filter LPF 204 sufficiently lower than fb by the intercept frequency, thereby eliminating the high-pass component, and only the following is shown in the output of the low-pass filter LPF 204 (1) With the voltage of (2):

(1) A voltage of zero Hz exhibited in the output of the high-pass filter HPF only in the presence of a signal in phase with the phase of the AC fundamental signal, that is, in DC, the voltage level thereof and (b) above The AC is proportional to the level of the AC base signal component in the photovoltage.

(2) A voltage whose amplitude is proportional to the amplitude of the identification signal at f1 and f2.

Further, when the low-pass filter LPF204 is replaced with a band-pass filter having a passband frequency of Hz "passband frequency fb", only the voltage component of the above (2) passes. This signal is the signal identifying the sum of the signals.

The signal obtained only by the components of the above (1) and (2) or the signal of only the voltage component of (2) is supplied to the phase detector PSD201f having substantially the same multiplication function as the phase detector PSD203, PSD202f.

On the other hand, the identification signal generators 201a and IDa of the light-emitting bias application portion A supply signals to the phase detectors PSD201f and PSD202f in the same component as the identification signals corresponding to the respective systems.

If the signals from the phase detectors PSD201f, PSD202f are applied to the low pass filters LPF201g, LPF202g which make the cutoff frequency lower than the identification signal frequencies f1, f2, the high-pass components are eliminated, that is, the light emitted by the identification signal can be obtained. The generated DC voltages ED201h, ED202h. The DC voltages ED201h and ED202h are input to an A/D converter ADC having two or more channels and a scanner, and are time-divisionally selected to obtain measured values.

[Previous Technical Literature] [Patent Literature]

[Patent Document] Japanese Patent Laid-Open Publication No. 2004-31460

In the above-described conventional luminescence measuring apparatus 100, since it is impossible to recognize a plurality of LED illuminants and measure the amount of luminescence, it is not possible to simultaneously measure a plurality of LED illuminates. Even if two light-receiving diodes PD are provided and two LEDs are simultaneously measured, the amount of light is converted into a power amount by each of the light-receiving diodes PD, and the system itself needs two, and the LEDs can be simultaneously measured. Glowing, but there is a problem with the system price doubling.

In the above-described conventional luminescence measuring apparatus 200, the measurement time of each illuminating amount can be shortened as compared with the above-described illuminating measuring apparatus 100. However, for each additional LED number to be measured, it is necessary to increase the number of LEDs for identification. The ID circuit, so that the price of the measuring machine increases. In this case, since it is necessary to confirm whether the ID signal is correctly output or the like in both the software/hard body, it is necessary to confirm that the identification ID circuit has no problem, and thus the device price is further increased. Furthermore, since the measurement substrate is not replaced when the ID circuit is in trouble, the device stop time is increased. Further, when the timing of synthesizing the illuminance amount signal and the identification ID signal deviates, the identification signal cannot be accurately captured. When a noise or the like occurs in the identification ID signal, the correct identification ID signal cannot be retrieved.

In any case, in the above-described conventional luminescence measuring devices 100 and 200, the LED and the light-receiving diode PD are arranged in a one-to-one pair, and the amount of light emitted from the LED is converted into a quantity by the photodiode PD. The amount of light emitted by the LED has a problem that it is impossible to measure whether or not the amount of light emitted from the LED has reached the reference value, and it is impossible to check the directivity of the LED light emission or the problem of dust adhesion.

The present invention has been made in view of the above problems, and an object of the present invention is to provide an illuminating device which can easily and accurately measure and inspect a plurality of optical elements without measuring the amount of illuminating light of one optical element without using the prior identification ID circuit. And the illuminating measuring device and the illuminating measuring method for inspecting the directivity of light emission of the optical element or the poor adhesion of the dust, the control program for causing the computer to execute the illuminating measuring method, and the reading of the control program can be easily and accurately measured. Record media.

The luminescence measuring device of the present invention detects an illuminator of an optical element, and includes an imaging element that is provided with a plurality of light receiving units that receive light emitted from the optical element, and performs an inspection control using an imaging signal from the imaging element. The control unit of the light-emitting state of the optical element achieves the above object.

Moreover, it is preferable that the control unit of the luminescence measuring apparatus according to the present invention includes an address specifying means for designating an address for one or a plurality of light receiving units from a plurality of light receiving units that capture light emission states of the optical elements, and A light-emitting state inspection mechanism for inspecting an illumination state of the optical element from an imaging signal of one or a plurality of light-receiving sections designated by the address specifying means.

Furthermore, it is preferable that the address specifying means of the illuminance measuring device of the present invention uses the designated input of the pixel address of which pixel in the inspection of the light-emitting state of the optical element, and the pixel is externally selected or pre-selected. Address.

Furthermore, it is preferable that the address specifying means of the luminescence measuring apparatus of the present invention specifies a plurality of pixel addresses passing through one or both of the illuminating centers of the optical elements and the vicinity thereof, and/or designating the optical elements. One of the pixel addresses of the illuminating center, or a plurality of pixel addresses including the illuminating center of the optical element and the block area in the vicinity thereof.

Furthermore, it is preferable that the light-emitting state inspection means of the luminescence measuring apparatus of the present invention includes a light amount determining means for comparing values of image pickup signals from one or a plurality of light-receiving sections designated by the address specifying means. When the value of the image pickup signal is lower than the reference value, it is determined that the light amount is poor, and when the value of the image pickup signal is equal to or higher than the reference value, it is determined that the light amount is good.

Furthermore, it is preferable that the light-emitting state inspection means of the luminescence measuring apparatus of the present invention includes a directivity judging means for comparing image pickup signals from one or a plurality of light-receiving sections designated by the address specifying means. The value is compared with the reference value, and it is judged whether the directivity of the light emission of the light-emitting element is good or not.

Furthermore, it is preferable that the luminescence measuring apparatus according to the present invention includes a defective registration means when the determination result determined by the light amount determining means and/or the directivity determining means is defective. The judgment content is registered to the wafer number.

Further, in the luminescence measuring device of the present invention, it is preferable that a spacer for preventing light mixing is disposed between the adjacent two of the light-emitting elements.

Further, in the luminescence measuring apparatus of the present invention, it is preferable that a cross-shaped partition plate for preventing light mixing is disposed between the adjacent four of the light-emitting elements.

Furthermore, it is preferable that the luminescence measuring apparatus of the present invention includes an illuminating drive mechanism that simultaneously emits one or more of the illuminating elements.

In the luminescence measuring method of the present invention, the illuminator of the optical element is inspected, and an imaging signal from an imaging element equipped with a light receiving unit that receives light emitted from the optical element is used by the control unit, and the optical element is inspected and controlled. The inspection control step of the illuminating state is achieved by the above-mentioned purpose.

Furthermore, it is preferable that the inspection control step of the luminescence measurement method of the present invention includes: designating, by the address specifying means, one or more of the plurality of light receiving units from a plurality of light receiving units that capture the light emitting state of the optical element And a step of specifying a light-emitting state of the light-emitting state of the optical element based on an image pickup signal from one or a plurality of light-receiving portions specified in the address specifying step.

Furthermore, it is preferable that the light-emitting state inspection step of the luminescence measuring method of the present invention includes a light amount determining step of comparing the image pickup signals from one or a plurality of light-receiving portions designated by the address specifying means by the light amount determining means. The value and the reference value are determined to be poor light quantity when the value of the image pickup signal is lower than the reference value, and judged to be good light quantity when the value of the image pickup signal is greater than the reference value; and the directivity determination step It is determined by the directivity mechanism comparing the value of the image pickup signal from one or a plurality of light receiving units designated by the address specifying unit with the reference value, and determining whether the directivity of the light emitting element is good or not.

The control program of the present invention describes the processing procedure for causing a computer to execute the steps of the above-described luminescence measurement method of the present invention, thereby achieving the above object.

The readable recording medium of the present invention is a computer readable readable recording medium storing the above control program of the present invention, thereby achieving the above object.

Hereinafter, the action of the present invention will be described by the above configuration.

The present invention includes an image pickup device that includes a plurality of light receiving portions that receive light emitted from an optical element, and a control portion that checks an illumination state of the control optical element using an image pickup signal from the image sensor. The control unit includes an address specifying means for designating an address for one or a plurality of light receiving units from a plurality of light receiving units for photographing the light emitting state of the optical element, and based on one or plural numbers specified by the address specifying unit. A light-emitting state inspection mechanism that inspects the light-emitting state of the optical element by the image pickup signal of the light-receiving portion.

In this way, since the light-emitting state of the light-emitting element (for example, LED) is measured as one image by using a light-receiving sensor having a plurality of light-receiving portions, even if the light-receiving portion (one pixel) of the vicinity of the center is extracted, The brightness (or light and dark) of the luminescence can also be measured, and if one of the X-direction or the Y-direction data is extracted, the distribution of the luminescence can also be determined.

Further, by inserting a plate-shaped spacer member between two light-emitting elements (for example, LEDs), interference between light emission from the two light-emitting elements can be suppressed, and light emission from the two light-emitting elements can be simultaneously captured as an image. In the case of four light-emitting elements, each of the light-emitting elements from the four light-emitting elements can be captured as an image as long as the cross-shaped spacer member is placed.

Therefore, since the imaging signal from the imaging element including the plurality of light receiving units that receive the light emitted from the optical element is used, and the signal is extracted by the pixel level to check the light emission state of the control optical element, not only one optical can be measured. The amount of luminescence of the component, and the illuminating amount of the plurality of optical components can be easily and accurately measured and checked without using the ID circuit as before, and the directionality or dust of the illuminating of the optical component can be easily and accurately measured and checked. Poor adhesion.

As described above, according to the present invention, since the image pickup signal from the image pickup element provided with the plurality of light receiving portions that receive the light emitted from the optical element is used, the signal is extracted at the pixel level, thereby checking the light-emitting state of the control optical element. Therefore, not only the amount of luminescence of one optical element can be measured, but also the illuminating amount of a plurality of optical elements can be easily and accurately measured and detected without using the ID circuit as before, and can be easily and accurately measured and Check the directivity of the light emitted by the optical element or the poor adhesion of dust.

Hereinafter, the first embodiment of the luminescence measuring device and the luminescence measuring method of the present invention will be described in detail with reference to the drawings. In addition, from the viewpoint of the production of the drawings, the thickness, length, and the like of the constituent members of the respective drawings are not limited to the configuration of the drawings.

(Embodiment 1)

Fig. 1 is a block diagram showing an example of a configuration of a main part of a luminescence measuring apparatus according to a first embodiment of the present invention.

In the illuminating measurement device 1 of the first embodiment, when the LEDs of the light-emitting elements of the semiconductor wafer 12 to be described later are illuminated, the incident light from the object is photoelectrically converted and photographed in a matrix. The image pickup device 2 of the plurality of light receiving units; the A/D conversion unit 3 that performs A/D conversion after removing noise from the image pickup signal from the image pickup device 2; and the CPU that performs overall control and performs light emission measurement control (central The control unit 4 configured by the arithmetic processing unit receives input through a keyboard, a mouse, a touch panel, a pen type input device, or a communication network (for example, an internet or an intranet) for inputting commands to the CPU. An operation unit 5 such as an input device; a display unit 6 that displays an initial screen, a selection screen, a CPU control result screen, and an operation input screen on the display screen; and is readable by a computer that stores the control program and its data. The ROM 7 that reads the recording medium; and the memory unit that functions as a working memory that reads and memorizes data every time the CPU is controlled by reading the control program and its data at the time of startup. RAM8.

The image pickup device 2 is configured by taking a light-emitting state of an LED of a light-emitting element of a semiconductor wafer 12 to be described later as a CCD image sensor or a CMOS image sensor, and as a plurality of light-receiving portions, for example, It is composed of about 200×400 pixels, but it can be more or less than the number of pixels.

The control unit 4 checks and controls the light-emitting state of the LED by using an image pickup signal from the image pickup device 2 that is provided with a plurality of light-receiving portions that receive light emitted from the LED. The control unit 4 includes an address specifying unit 41 that specifies the X direction in the vicinity of the LED illumination by selecting the input of the pixel address of which pixel is used when the operation unit checks the illumination state, or automatically selecting the setting according to the inspection mode. Or a plurality of pixel addresses in one row of the Y direction, or an address specifying one or a plurality of pixels of a specific region; the light amount determining unit 42 images the light of the LED as an image by one or a plurality of pixels The value or average value of the one pixel is obtained and compared with the reference value; the directivity judging means 43 judges the directivity of the LED as the light emitting element; and the NG wafer registration means 44, which is in the light amount judging means 42 When the determination result determined by the directivity determination unit 43 is NG, the failure registration means is registered as the determination content and the NG wafer number in the RAM 8. By the light amount judging means 42 and the directivity judging means 43, the light-emitting state inspection means for checking the light-emitting state of the LED based on the image pickup signal from one or a plurality of light-receiving sections designated by the address specifying means 41 is formed.

The address specifying unit 41 selects, for example, X in the row direction (vertical and horizontal direction) in a pixel region of a specific range, for example, 200 × 400 pixels, by specifying a specific internal selection setting of an input or an inspection mode according to an external selection. The direction number is based on the top of the first column on the left side, for example, 1 to 200) is 50 to 100, and Y (longitudinal number, 1 to 400) is, for example, a pixel area of 50 to 100. In this case, the address specifying unit 41 is provided with a mechanism for extracting an individual signal of one pixel or more from the imaging element 2 that performs optical measurement, and only specifies the address according to the sequentially input, for example, 200×400 pixel data. The pixel data of the light-emitting state of the pixel region is counted in the row-column direction (vertical and horizontal directions) to the address specifying information of the address specifying unit 41, and the calculated value is uniformly obtained. When the directivity of the LED is described, the directivity of the LED having the peak of one LED is circular or elliptical, or the directivity of the LED having the peak of two LEDs is the directivity of the heart. If a complex pixel address of one of the X direction or the Y direction is specified, the directivity shape (peak value and its peripheral value) of the LED light emission section (circular or heart shape, etc.) can be measured. Even if the light-emitting cross section of the LED is circular or elliptical, when dust is attached to the center of the LED, the light-emitting cross section resembles a heart shape or the like, and it is regarded as defective (NG). In any case, by specifying a plurality of pixel addresses in one of the X direction or the Y direction, it is possible to easily and correctly check for goodness even if the directivity shape or dust adhesion of the optical element is poorly attached.

In the address specifying unit 41, the light receiving area of the image sensor 2 for optical measurement can be arbitrarily set as in X1, Y1, and D1 of FIG. Further, as shown in at least two of X1, Y1, and D1 of FIG. 7, the light receiving region of the image sensor 2 that performs optical measurement may be set to a plurality of regions. Furthermore, when it is judged to be defective (NG), the light-receiving data of the defective portion may be specified in detail one by one for each pixel, and the data specified by the address may be retrieved to verify the defective portion.

The light amount determining means 42 takes the sum of the pixels (X, Y) of the specific pixel region of the set light receiving region, and determines whether the LED light amount is good or not based on whether the total light amount or the average light amount or the peak light amount satisfies a specific reference value.

The directivity determining unit 43 takes the sum of the pixels (X, Y) of the specific pixel region of the set light receiving region, and determines whether the directivity is, for example, a circle or a heart shape, but will be circular but shaped like a heart, or When the peak position is shifted from the center position, it is determined that the directivity (NG) such as dust or dirt adhesion is contained.

When the determination result determined by the light amount determining means 42 and/or the directivity determining means 43 is NG, the NG wafer registration means 44 determines the content (the amount of light NG or / and the directivity NG, or the type of directivity NG). And the NG wafer number is registered to the RAM 8.

The ROM 7 as a readable recording medium can be constituted by a portable optical disk, a magneto-optical disk, a magnetic disk, and an IC memory in addition to a hard disk. The control program and its data are stored in the ROM 7, but the control program and its data can also be downloaded to the ROM 7 from other readable recording media or via wireless, wired or internet.

Fig. 2 is a schematic view showing a state in which the luminescence measuring device 1 of Fig. 1 measures the light emission of the optical elements of the respective wafers before the cutting. Fig. 3 is a plan view showing a state in which a power supply voltage is applied to each of the two semiconductor wafers 12 of Fig. 2 to cause the LED to emit light.

In FIGS. 2 and 3, a plurality of semiconductor wafers 12 provided with light-emitting diodes (LEDs) are arranged in a matrix on the wafer 11. For each of the plurality of semiconductor wafers 12 (here, two), a power supply voltage is applied from the probe pins 14 to the probe pins, that is, the pads 13, to cause the LEDs to emit light. As described above, the control unit 4 includes an illumination drive mechanism that applies a specific power supply voltage by the probe pin 14 to cause one or more LEDs 20 or any of the LEDs 20 to emit light at the same time or individually. At this time, the probe pin 14 must be in contact with the pad 13, and the control unit 4 must identify the semiconductor wafer 12 at which position is measured based on the semiconductor wafer 12 on the upper left side. Thereby, the illuminance measuring device 1 can check whether the amount of light emitted from the LED or the directivity of the LED is good or not. Thus, the spacers (not shown in FIGS. 2 and 3 and illustrated as spacers 19 in FIG. 6) are placed in a specific number (here, two) of semiconductor wafers 12 (wafer A and wafer). Between B), the amount of light emitted from the LED and the state of light emission are checked in sequence.

In this case, the luminescence measuring apparatus 1 is provided with an imaging device 2 that can receive the size of the light emission of a plurality of LEDs, and can extract an imaging device that specifies an imaging signal of a light receiving region of an arbitrary address in the imaging region.

For the light emission of the LED, the imaging area of the imaging element 2 is specified by the pixel address (X, Y), and extracted as an electrical signal, whereby even a plurality of (here, two) LED pairs are required for one imaging element 2 Light, you can also choose the pixel information you need. Further, a spacer (the spacer 19 of FIG. 6) is provided in the image pickup element 2, whereby it is possible to have a configuration that is not affected by light from the lateral direction. In order to finely extract a complex signal at the pixel level, it is necessary to know the illuminance amount distribution with respect to directivity, so that poor directivity and poor dust adhesion can be checked.

4(a) and 4(b) are schematic views showing a state in which the interval between the wafers after the wafer is cut and the optical elements are illuminated.

In FIGS. 4(a) and 4(b), in the state in which the adhesive sheet 16 fixed by the ring 15 as a dicing frame is attached, the above-mentioned wafer 11 is plural by a dicing line or a dicing blade. After the semiconductor wafers 12 are cut into individual semiconductor wafers 12, the adhesive sheets 16 are unrolled (stretched), and a predetermined gap is formed between the respective semiconductor wafers 12, and then the respective semiconductor wafers 12 are fixed. In this case, since a certain gap is formed between the respective semiconductor wafers 12, it is easy to interposer a spacer (not shown) between the semiconductor wafers 12, which makes it easier to inspect.

In this state, for each of the plurality of semiconductor wafers 12 (here, two), the probe pin 14 applies a power supply voltage to the probe pin contact pad 13, that is, the LED emits light. The illuminance measuring device 1 can check whether the amount of light emitted from the LED or the directivity of the LED is good or not. In this manner, a spacer (not shown) is interposed between the semiconductor wafers 12 of a specific number (here, two), and the LEDs are sequentially inspected.

FIGS. 5(a) and 5(b) are schematic diagrams showing a state in which each wafer after the wafer is cut is packaged to emit light.

In FIGS. 5(a) and 5(b), after the semiconductor wafer 12 is cut and sliced, the contact pin 17 is mounted on the semiconductor wafer 12, and the package 18 is packaged from the contact pin. 17 Apply a power supply voltage to cause the LED to illuminate. The illuminance measuring device 1 can check whether the amount of light emitted from the LED or the directivity of the LED is good or not. In this manner, a separator (not shown) is placed between the packages 18 of a specific number (here, two), and the LEDs are sequentially inspected.

6 and FIG. 7 are diagrams showing the light emission of the LEDs to which the power supply voltages are applied to the two semiconductor wafers of FIG. 3, and FIG. 6 is a view showing the light amount determination area of each semiconductor wafer. FIG. 7 is a screen diagram showing an address selection area of each pixel.

As shown in FIG. 6, as the light amount determination region of each semiconductor wafer (each LED), for example, the wafer A is a light quantity determination area A1 of one pixel, and the wafer B is a light quantity determination area B1 of one pixel, but it may be plural The pixel area and the light amount determination area are set in advance, but are not limited thereto, and may be arbitrarily set.

As shown in FIG. 7, as the address selection area of each pixel, for example, the wafer A is the address selection areas X1 and Y1 of each of the X direction and the Y direction, and the wafer B is the address selection area D1 of the pixel block, However, at least one of the address selection areas X1 and Y1 and D1 may be selected, and the address selection area may be arbitrarily set in addition to the above.

Fig. 8(a) shows an address selection area X1 of one line whose cross section has a specific directivity distribution. That is, as a reference curve of the directivity of a circle, the center of the LED is bright and the peripheral portion thereof is dark. In this case, the luminance e1 (center portion) and the luminance e2 (end portion) of the two portions are based on a specific reference value.

Fig. 8(b) shows the address selection area X1 of one line, the cross section of which is a distribution which is aliased from a specific directivity distribution (Fig. 8(a)). That is, although the overall amount of light (brightness) is sufficient, the brightness in the center of the LED is lowered. This is because, in addition to the dust or dirt that is shielded from the center of the LED, there is damage, and there is also a poor directivity of the light, which is a poor centrality (NG). In this case, the difference between the brightness e1 of the central portion of the LED and the brightness e2 of the peripheral portion (end portion) may be reversed or lower than a specific value, and the luminance e1 at the central portion thereof is far below the lower limit of the specific reference value, thereby being judged as Poor centrality (NG).

Fig. 8(c) is a selection of a row selection region X1 whose profile is a distribution which is aliased from a specific directivity distribution (Fig. 8(a)). That is, although the overall amount of luminescence is sufficient, the brightness in the center of the LED is significantly higher than a specific value, and the brightness of the periphery is lower than a specific value. This is because, in addition to the dust or dirt that is shielded from light in the peripheral portion of the LED, there is a risk of damage, and there is also a problem that the directivity of the light is poor, which is a poor visibility (NG). In this case, the difference between the luminance e1 of the central portion of the LED and the luminance e2 of the peripheral portion (end portion) is higher than a specific reference value, and the luminance e2 of the peripheral portion (end portion) is lower than a specific reference value, so that it can be judged as pointing Poor peripheral (NG).

Fig. 8(d) is a selection of a row selection region X1 whose cross section has a specific directivity distribution. That is, although the overall amount of light emission is sufficient, only the brightness of one of the peripheral sides of the LED is brighter to the same extent as the brightness of the central portion, and the brightness of the other side of the LED is dark. This is because, in addition to the dust or dirt that is shielded from light from the side of the LED, there is damage, and it is a poor peripheral (NG) including one of the package defects. In this case, the difference between the luminance e1 at the central portion of the LED and the luminance e2 at the peripheral portion thereof is lower than a specific value, and the luminance e2 of the peripheral portion is significantly higher than a specific value, and it can be determined that the peripheral defect (NG) is one.

When it is judged to be defective (NG) from Figs. 8(b) to 8(d), the address selection region Y1 of one row can be selected, and it is checked in detail whether or not the profile has a specific directivity distribution. In this way, the address selection designation of the plurality of parts can be performed. In summary, the location of the periphery of the portion judged to be defective (NG) and the location of the profile thereof can be further selected, and the directivity distribution can be measured in more detail, and the characteristics of the LED light emission and the characteristics of the defect can be distinguished.

Fig. 8(e) shows the address selection area D1 of the selected block, the cross section of which has a specific directivity distribution (heart shape distribution). That is, as a reference curve of the directivity of the heart shape, the center of the LED is slightly dark, and two portions around it are bright. In this case, the luminances e11, e21, and e12 of the three parts are lighter than the specific values.

The illuminating measurement method according to the first embodiment of the present invention is based on a control program in the ROM 7 and its data, and the inspection control unit uses a plurality of light receiving units that are imaged and received from the light emitted from the LEDs 20. The imaging signal of the imaging element 2 causes the computer (CPU) to perform an inspection control step of checking the illumination state of the LED 20. The inspection control step includes an address designation step of designating an address for one or a plurality of light receiving units from a plurality of light receiving units that capture the light emitting state of the LED 20 by the address specifying unit 41; and an illumination state checking step In this step, the light-emitting state inspection means checks the light-emitting state of the LED 20 based on the image pickup signal from one or a plurality of light-receiving sections specified in the address specifying step. Furthermore, the light-emitting state inspection step includes a light amount determining step of comparing the value of the image pickup signal from the one or more light-receiving portions designated by the address specifying unit 41 with the reference value by the light amount determining unit 42. When the value of the image pickup signal is lower than the reference value, it is determined that the light amount is poor, and when the value of the image pickup signal is equal to or greater than the reference value, it is judged that the light amount is good; and the directivity determination step is compared by the directivity judgment unit 43. The value of the image pickup signal from one or a plurality of light receiving units designated by the address specifying unit 41 and the reference value determine whether the directivity of the light emission of the LED 20 is good or not. In this way, the light-emitting state inspection means is constituted by the light amount determining means 42 and the directivity determining means 43.

As described above, according to the present embodiment, the present invention includes the address specifying unit 41 that specifies an address for one or a plurality of light receiving units from a plurality of light receiving units that capture the light emitting state of the LED 20; the light amount determining unit 42 And comparing the value of the image pickup signal from one or a plurality of light receiving units specified by the address specifying unit 41 with a reference value, and determining that the light amount is poor when the value of the image pickup signal is lower than the reference value, and when the image signal is When the value is equal to or greater than the reference value, it is determined that the amount of light is good; and the directivity determining unit 43 compares the value of the image pickup signal from one or a plurality of light receiving units designated by the address specifying unit 41 with the reference value, and judges the LED 20 The directivity of the light emission is good or not. Further, an image pickup signal from the image pickup device 2 including a plurality of light receiving units that receive the light emitted from the LED 20 is used, and a signal is extracted at the pixel level to check the light emission state of the control LED 20. Therefore, the light emission distribution with respect to directivity can be known, and the wafer having poor directivity can be excluded. Moreover, there is no need to increase or decrease the number of circuits with the same number of measurements, and no software/hard surface modification is required. Furthermore, there is no need for a special confirmation mechanism for the software/hardware of the image pickup device, and the same daily inspection as the previous light sensor can be used to determine whether the mechanism has a problem in detail.

Finally, when the determination result determined by the light amount determining means 42 and/or the directivity determining means 43 is NG, the NG wafer registration means 44 determines the content (light amount NG or/and directivity NG, or even directivity). The NG type) and the NG wafer number are registered in the RAM 8. That is, the content of the determination (the NG type of the light amount NG or/and the directivity NG) is stored at the address corresponding to the wafer number called the mapped address corresponding to the position of the wafer 11. For example, the light amount determining means 42 determines that there is no problem with the amount of light, but the case where the directivity determining means 43 determines that there is a problem is the level B. Further, for example, the light amount determining means 42 determines that there is a problem with the amount of light, and the case where the directivity determining means 43 determines that there is no problem is the level C. Further, for example, the light amount determining unit 42 determines that there is no problem with the amount of light, and the directivity determining unit 43 also determines that there is no problem as the level A. Further differences can be further distinguished in detail. For example, regarding the amount of light determined by the light amount determining means 42, two threshold values can be set in advance, and the light amount defect can be divided into two stages.

Further, in the first embodiment, as shown in FIG. 6 and FIG. 7, the plate-shaped separator 19 is placed between the two light-emitting elements (for example, LEDs) (between the wafers A and B), thereby suppressing A mixture of light from two light-emitting elements (for example, LEDs) captures light from two light-emitting elements as an image, and checks whether the amount of light and directivity are good or not, but is not limited thereto, and can also capture from The light emission of one light-emitting element (for example, LED) is used as an image to check whether the amount of light emission and directivity are good or not. If four light-emitting elements are placed, if they are placed in a cross-shaped partition, four images can be simultaneously captured. Each of the light-emitting elements emits light as an image, and it is checked whether the amount of light emission and the directivity are good or not. Furthermore, it is also possible to use a luminescence measuring device having a plurality of spacers 19 while capturing each illuminating light from a plurality of illuminating elements as an image, and checking whether the illuminating amount and the directivity are good or not, so that the inspection can be performed quickly and easily. . A specific example of the luminescence measuring apparatus in this case is shown in FIG.

Fig. 9 is a longitudinal sectional view showing an essential part of a case where a plurality of specific examples of the luminescence measuring apparatus of Fig. 1 having a plurality of spacers are used.

As shown in FIG. 9, a plurality of illuminating measuring devices 1A (for 4×4 measurement) can be arranged in parallel, and one partition plate 19 is provided for every plurality of LEDs 20 arranged in a matrix in the longitudinal direction and the lateral direction. The LED 20 is illuminated every other number of LEDs 20, and is detected and checked for goodness or not. When a plurality of illuminating measuring devices 1A (4 × 4) are slid in a vertical direction or a lateral direction with respect to a plurality of LEDs 20 arranged in a matrix in the longitudinal direction and the lateral direction, all the LEDs 20 can be patterned. The image is measured and the amount of light and directivity are checked. Further, one illuminating measuring device 1A may measure 4×4 out of 8×8 of the plurality of LEDs 20 for each block. Further, by using a plurality of luminescence measuring devices 1B (for 1×4 measurement), the measurement is performed by sequentially shifting in the longitudinal direction, and the spacer 19 may be used for one of the regions in which the plurality of LEDs 20 are arranged. L represents the light emission from the LED 20. The LEDs 20 that are opposed to the bottom surface of the spacer 19 are not illuminated. Light is emitted every other in the vertical direction (depth direction in FIG. 9) and in the horizontal direction (left-right direction in FIG. 9).

Further, in the first embodiment, although not specifically described, in the case where the wafer which is the base point of the wafer 11 is inspected one by one or every two, the amount of light emitted and the directivity are good or not, as for the current detection inspection. Which of the LEDs of the chip, in addition to the pixel address specified by the address specifying unit 41 provided in the control unit 4, may also identify the number of LEDs of the current number of wafers from the base point of the wafer 11, The NG content is registered in the address position corresponding to the wafer number called the mapped address corresponding to the position of the wafer 11. Further, when a plurality of wafers are simultaneously illuminated to check whether the amount of light emitted and the directivity are good or not, the LEDs of the current number of wafers can be identified as the number of points from the base point of the wafer 11 as described above. .

Further, in the first embodiment, although not particularly described, there is a function of simultaneously emitting light from a light-emitting element (for example, an LED) of one or more electronic components (semiconductor wafers). Further, it has a function of emitting light to any of the light-emitting elements (for example, LEDs) of one or more electronic components (semiconductor wafers). Furthermore, the light-emitting elements of one or more electronic components (semiconductor wafers) can be simultaneously illuminated, and the amount of light emitted by each electronic component can be recognized. Further, the imaging element 2 that performs optical measurement can arbitrarily extract individual signals of one pixel or more. Thereby, in the case where dust adheres to the LED 20 or the like, the individual signal verification signal level can be arbitrarily extracted per pixel, and the position where the dust adheres to the LED 20 can be obtained in detail.

Further, in the first embodiment, although not specifically described, the image pickup device 2 including a plurality of light receiving portions that receive light emitted from the LEDs 20 and is imaged is used, and an image pickup signal from the image pickup device 2 is used. The control unit 4 that controls the light-emitting state of the optical element is inspected. With this configuration, it is possible to achieve the object of the invention: not only the illuminance of one optical element can be measured, but also the illuminating amount of a plurality of optical elements can be easily and accurately measured and checked without using the ID circuit as before. Moreover, the directivity of the light emitted by the optical element or the poor adhesion of the dust can be easily and accurately measured and inspected.

In the first embodiment, the light amount determining unit 42 and the directivity determining unit 43 are configured to check the LEDs based on the imaging signals from one or a plurality of light receiving units designated by the address executing unit 41. In the case of the light-emitting state inspection means in the light-emitting state, the present invention is not limited thereto, and it should be easily understood that the light-emitting state inspection means may be constituted by only one of the light amount determination means 42 and the directivity determination means 43. In this case, when the determination result determined by at least one of the light amount determination unit 42 and the directivity determination unit 43 is defective, the NG wafer registration unit 44, which is the defective registration means, registers the determination content thereof. Wafer number.

As described above, the present invention has been exemplified by the preferred embodiment 1 of the present invention, but the present invention is not limited by the first embodiment. It is to be understood that the present invention should be construed only in accordance with the scope of the claims. It will be apparent to those skilled in the art that the invention can be carried out in accordance with the preferred embodiments of the present invention. The contents of the patents, patent applications and documents cited in the present specification are the same as those specifically described in the specification, and the contents thereof are used as a reference for the present specification.

[Industrial availability]

In the present invention, a luminescence measuring device for detecting the light emission of an optical element such as a light-emitting diode (hereinafter referred to as "LED"), a luminescence measuring method, a control program for causing a computer to execute the illuminating measuring method, and a readable record storing the control program In the field of media, since an image pickup signal from an image pickup device that is provided with a plurality of light receiving portions that receive light emitted from an optical element is used, the signal is detected at the pixel level to check the light-emitting state of the control optical element, so that it is not only measurable. The amount of luminescence of one optical element can be easily and accurately measured and checked for the amount of luminescence of the optical element without using the identification ID circuit as before, and the optical element can be easily and accurately measured and inspected. Poor alignment or dust adhesion.

1. . . Luminescence measuring device

1A. . . Luminescence measuring device

1B. . . Luminescence measuring device

2. . . Camera element

3. . . A/D conversion unit

4. . . Control department

5. . . Operation department

6. . . Display department

7. . . ROM

8. . . RAM

11. . . Wafer

12. . . Semiconductor wafer

13. . . Solder pad

14. . . Probe pin

15. . . ring

16. . . Adhesive plate

17. . . Contact

18. . . Package

19. . . Partition

20. . . led

41. . . Address designation agency

42. . . Light quantity judgment mechanism

43. . . Directional judgment agency

44. . . NG wafer registration mechanism

A. . . Wafer

B. . . Wafer

D1. . . Address selection area

L. . . Illuminate

X. . . Pixel address

X1. . . Address selection area

Y. . . Pixel address

Y1. . . Address selection area

Fig. 1 is a block diagram showing an example of a configuration of a main part of a luminescence measuring apparatus according to a first embodiment of the present invention.

Fig. 2 is a schematic view showing a state in which the light-emitting device of Fig. 1 measures the light emission of the optical elements of the respective wafers before the wafer is cut.

Fig. 3 is a plan view showing a state in which a power supply voltage is applied to each of the two semiconductor wafers of Fig. 2 to cause the LED to emit light.

4(a) and 4(b) are schematic views showing a state in which the interval between the wafers after the wafer is cut and the optical element are illuminated.

5(a) and 5(b) are schematic diagrams showing a state in which each wafer after the wafer is cut is packaged to emit light.

Fig. 6 is a screen diagram showing the light emission of the LED to which the power supply voltages are applied to the two semiconductor wafers of Fig. 3, and is a screen view showing the light amount determination region of each semiconductor wafer.

Fig. 7 is a screen diagram showing the illuminating device of Fig. 1 for measuring the light emission of the LED to which the power supply voltage is applied to the two semiconductor wafers of Fig. 3, and showing a screen image of the address selection area per pixel.

8(a) to (e) are diagrams showing the directivity distribution of the light-emitting state of the LED when the address selection region of Fig. 7 is selected.

Fig. 9 is a longitudinal sectional view showing an essential part of a case where a plurality of specific examples of the luminescence measuring apparatus of Fig. 1 having a plurality of spacers are used.

Fig. 10 is a schematic view for explaining an example of a configuration of a main part of a conventional luminescence measuring apparatus.

FIG. 11 is a block diagram showing an example of the configuration of a main part of a conventional luminescence measuring apparatus shown in Patent Document 1.

Fig. 12 is a waveform diagram for explaining an AC bias signal used in the previous luminescence measuring apparatus of Fig. 11.

1. . . Luminescence measuring device

2. . . Camera element

3. . . A/D conversion unit

4. . . Control department

5. . . Operation department

6. . . Display department

7. . . ROM

8. . . RAM

41. . . Address designation agency

42. . . Light quantity judgment mechanism

43. . . Directional judgment agency

44. . . NG wafer registration mechanism

Claims (17)

A luminescence measuring device that detects an illuminator of an optical element and includes an imaging element that is provided with a plurality of light receiving units that receive light emitted from the optical element, and an image pickup signal from the image sensor a control unit for illuminating the optical element; wherein the control unit includes an address specifying means for designating an address for one or a plurality of light receiving units from a plurality of light receiving units that capture a light emitting state of the optical element, and based on a light-emitting state inspection mechanism for checking an illumination state of the optical component by the image signal of one or a plurality of light-receiving sections designated by the address specifying means; the control section further including a comparison from the one specified by the address specifying means Or determining whether the light-emitting state of the optical element is good or not by the value of the image pickup signal of the plurality of light-receiving portions and the reference value; and when the determination result determined by the determination means is defective, changing the address designation The light receiving unit of the designated address of the mechanism, the judging unit compares the image pickup signal from the changed light receiving unit With a reference value for the light emitting state of the light-emitting element further determination of whether or not good. A luminescence measuring device that detects an illuminator of an optical element and includes an imaging element that is provided with a plurality of light receiving units that receive light emitted from the optical element, and an image pickup signal from the image sensor a control unit for illuminating the optical element; wherein the control portion includes a plurality of illuminating states from the optical element In the light receiving unit, the address specifying means for one or a plurality of light receiving unit designated addresses, and the light emission of the optical element based on an image pickup signal from one or a plurality of light receiving units designated by the address specifying unit a state of light emission state inspection means; and the light state detection means includes a light amount determination means for comparing values and reference values of image pickup signals from one or a plurality of light receiving sections designated by the address specifying means When the value of the image pickup signal is lower than the reference value, it is determined that the light amount is poor, and when the value of the image pickup signal is equal to or higher than the reference value, it is determined that the light amount is good. The luminescence measuring device according to claim 2, comprising a failure registration means for registering the determination content in the wafer number when the determination result by the light amount determination means is a failure. A luminescence measuring device that detects an illuminator of an optical element and includes an imaging element that is provided with a plurality of light receiving units that receive light emitted from the optical element, and an image pickup signal from the image sensor a control unit for illuminating the optical element; wherein the control unit includes an address specifying means for designating an address for one or a plurality of light receiving units from a plurality of light receiving units that capture a light emitting state of the optical element, and based on a light-emitting state inspection mechanism that checks an illumination signal of the optical component by the imaging signal of one or a plurality of light-receiving sections designated by the address specifying means; and the light-emitting state inspection mechanism includes a directivity determination mechanism, and the directivity determination mechanism Comparing the value of the image pickup signal from one or a plurality of light receiving units specified by the address specifying unit with a reference value, and determining the light element The directionality of the luminescence of the piece is good or not. The luminescence measuring device according to claim 4, comprising a failure registration means for registering the determination content in the wafer number when the determination result determined by the directivity determination means is defective. A luminescence measuring device that detects an illuminator of an optical element and includes an imaging element that is provided with a plurality of light receiving units that receive light emitted from the optical element, and an image pickup signal from the image sensor a control unit for illuminating the optical element; wherein the control unit includes an address specifying means for designating an address for one or a plurality of light receiving units from a plurality of light receiving units that capture a light emitting state of the optical element, and based on a light-emitting state inspection mechanism for checking an illumination state of the optical component by the image signal of one or a plurality of light-receiving sections designated by the address specifying means; and the light-emitting state inspection means includes: a light amount determination means for comparing the light quantity determination means The value of the image pickup signal from one or a plurality of light receiving units specified by the address specifying unit and the reference value are determined to be poor light amount when the value of the image capturing signal is lower than the reference value, and when the image capturing signal is When the value is greater than the reference value, it is determined that the amount of light is good; and the directivity judging mechanism, the directivity judging mechanism Comparing the designated address consisting of the above-described mechanism specified by one or a plurality of values of the imaging portion of the signal light and the reference value, and determines the directivity of the emission of the light emitting element is good or not. 2. The luminescence measuring device according to any one of claims 2, 6, wherein The designated input of the pixel address of which pixel is used in the inspection of the light-emitting state of the optical element by the address specifying means is set by the external or pre-selected. The luminescence measuring device of claim 7, wherein the address specifying means specifies a plurality of pixel addresses passing through one or both of the illuminating centers of the optical elements and the vicinity thereof, and/or designating an illuminating center of the optical element. A pixel address, or a complex pixel address containing the illuminating center of the optical element and the block area in the vicinity thereof. The luminescence measuring device according to claim 6, comprising a failure registration means for registering the determination content in the wafer when the determination result determined by the light amount determination means and the directivity determination means is defective Numbering. The luminescence measuring device according to any one of claims 2 to 6, wherein a spacer for preventing light mixing is disposed between the adjacent two of the light-emitting elements. The luminescence measuring apparatus according to any one of the preceding claims, wherein the cross-shaped partition plate for preventing light mixing is disposed between the adjacent four of the light-emitting elements. The luminescence measuring device according to any one of claims 2 to 6, which further comprises an illuminating drive mechanism for causing one or more of the illuminating elements to emit light at the same time. In the luminescence measuring apparatus according to any one of the items 4, wherein the control unit further comprises: comparing the value of the image pickup signal from one or a plurality of light receiving units specified by the address specifying unit with a reference value to determine the optical element. a judging mechanism for the good or not illuminating state; When the determination result determined by the determination means is a failure, the light receiving unit of the designated address of the address specifying unit is changed, and the determining means compares the value of the image pickup signal from the changed light receiving unit with a reference value to perform the light emission. Further judgment of whether the illuminating state of the component is good or not. An illuminating measuring method for inspecting an illuminator of an optical element, comprising: controlling, by the control unit, an imaging signal from an imaging element equipped with a light receiving unit that receives light emitted from the optical element, and inspecting and controlling the optical element An inspection control step of the light-emitting state; wherein the inspection control step includes: specifying, by the address specifying means, an address specifying address of one or a plurality of light-receiving portions from a plurality of light-receiving portions that capture light-emitting states of the optical elements And an illumination state inspection step of the illumination state of the optical component based on an imaging signal from one or a plurality of light-receiving sections specified in the address specifying step; and the illumination state inspection step includes: a judging means for judging whether the light-emitting state of the optical element is good or not based on a value of an image pickup signal of one or a plurality of light-receiving sections designated by the address specifying means and a reference value; and determining the judgment step If the result is a bad situation, the light receiving unit of the designated address of the address specifying institution is changed. Said determining means compares the signal from the imaging of the light receiving section after the change of the value and the reference value Further, a further determination step of further determining whether the light-emitting state of the light-emitting element is good or not is performed. An illuminating measuring method for inspecting an illuminator of an optical element, comprising: controlling, by the control unit, an imaging signal from an imaging element equipped with a light receiving unit that receives light emitted from the optical element, and inspecting and controlling the optical element An inspection control step of the light-emitting state; wherein the inspection control step includes: specifying, by the address specifying means, an address specifying address of one or a plurality of light-receiving portions from a plurality of light-receiving portions that capture light-emitting states of the optical elements And a light-emitting state inspection step of checking an illumination state of the optical element based on an imaging signal from one or a plurality of light-receiving portions specified in the address specifying step; and the illumination state inspection step includes: a light amount a judging step of comparing a value of an image pickup signal from one or a plurality of light receiving units specified by the address specifying unit with a reference value by a light amount determining unit, and determining when the value of the image capturing signal is lower than the reference value It is determined that the light quantity is good when the value of the image pickup signal is greater than the reference value. And a directivity determining step of comparing the value of the image pickup signal from one or a plurality of light receiving portions specified by the address specifying unit with a reference value by the directivity mechanism, and determining that the light emitting element has good directivity of light emission Whether or not. a control program for describing a computer to execute as claimed in item 14 or The procedure of each step of the luminescence measurement method of 15. A readable recording medium storing a readable recording medium readable by a computer such as the control program of claim 16.