JP6156450B2 - Appearance inspection method of light emitting device - Google Patents

Appearance inspection method of light emitting device Download PDF

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JP6156450B2
JP6156450B2 JP2015140978A JP2015140978A JP6156450B2 JP 6156450 B2 JP6156450 B2 JP 6156450B2 JP 2015140978 A JP2015140978 A JP 2015140978A JP 2015140978 A JP2015140978 A JP 2015140978A JP 6156450 B2 JP6156450 B2 JP 6156450B2
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light emitting
emitting device
shielding member
appearance inspection
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賢太 風尾
賢太 風尾
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Nichia Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined

Description

本発明は、発光装置の外観検査方法に関する。   The present invention relates to an appearance inspection method for a light emitting device.

半導体パッケージの外観検査は、観察したい面の画像情報又は目視によって行われている。例えば、半導体パッケージの側面の検査方法として、側面に配置されたカメラによって撮像された画像情報を用いて行う方法が知られている（例えば、特許文献１）。   The appearance inspection of the semiconductor package is performed by image information or visual observation of the surface to be observed. For example, as a method for inspecting a side surface of a semiconductor package, a method is known that uses image information captured by a camera arranged on the side surface (for example, Patent Document 1).

特開平６−１６０２８６号公報JP-A-6-160286

発光装置の側面に、それぞれカメラを配置する外観検査方法では、撮像に時間がかかり、製造効率の低下の原因となり得る。   In the appearance inspection method in which a camera is disposed on each side of the light emitting device, imaging takes time, which may cause a reduction in manufacturing efficiency.

本実施形態は、以下の構成を含む。
発光部と前記発光部を取り囲む遮光部材とを備えた上面と、遮光部材を備えた側面と、を備える発光装置の外観検査方法であって、発光部を発光させた状態で、発光装置の側面の外側の周辺検査領域の明るさを、発光装置の上面側から撮像して検出する。 The present embodiment includes the following configuration.
A method for inspecting the appearance of a light emitting device, comprising: a light emitting unit and an upper surface including a light shielding member surrounding the light emitting unit; and a side surface including a light shielding member. The brightness of the peripheral inspection area outside is detected by imaging from the upper surface side of the light emitting device.

以上により、発光装置の外観検査を、短時間で行うことができ、製造効率の低下を抑制することができる。   As described above, the appearance inspection of the light-emitting device can be performed in a short time, and a reduction in manufacturing efficiency can be suppressed.

図１は、発光装置の一例であり、（ａ）概略斜視図と、（ｂ）Ａ−Ａ断面における概略段面図である。FIG. 1 is an example of a light emitting device, (a) a schematic perspective view and (b) a schematic step view in the AA cross section. 図２は、発光装置の一例であり、（ａ）概略斜視図と、（ｂ）Ｂ−Ｂ断面における概略段面図である。FIG. 2 is an example of a light-emitting device, (a) a schematic perspective view, and (b) a schematic step view in the BB cross section. 図３は、発光装置の製造方法を説明する概略図である。FIG. 3 is a schematic diagram illustrating a method for manufacturing a light emitting device. 図４は、実施形態に係る発光装置の外観検査方法を説明する概略図である。FIG. 4 is a schematic diagram illustrating an appearance inspection method for the light emitting device according to the embodiment. 図５は、実施形態に係る発光装置の外観検査方法を説明する概略図である。FIG. 5 is a schematic diagram illustrating an appearance inspection method for the light emitting device according to the embodiment.

本発明を実施するための形態を、以下に図面を参照しながら説明する。ただし、以下に示す形態は、本発明の技術思想を具体化するための発光装置の外観検査方法を例示するものであって、本発明は、発光装置の外観検査方法を以下に限定するものではない。   A mode for carrying out the present invention will be described below with reference to the drawings. However, the form shown below exemplifies the appearance inspection method of the light emitting device for embodying the technical idea of the present invention, and the present invention does not limit the appearance inspection method of the light emitting device to the following. Absent.

また、本明細書は、特許請求の範囲に示される部材を、実施の形態の部材に特定するものでは決してない。特に、実施の形態に記載されている構成部品の寸法、材質、形状、その相対的配置等は、特定的な記載がない限りは、本発明を実施形態にのみ限定する趣旨ではなく、単なる説明例にすぎない。尚、各図面が示す部材の大きさや位置関係等は、説明を明確にするため誇張していることがある。さらに以下の説明において、同一の名称、符号については同一もしくは同質の部材を示しており、詳細説明を適宜省略する。   Further, the present specification by no means specifies the member shown in the claims as the member of the embodiment. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments are not intended to limit the present invention only to the embodiments unless otherwise specified, and are merely descriptions. It is just an example. It should be noted that the size and positional relationship of the members shown in each drawing may be exaggerated for clarity of explanation. Furthermore, in the following description, the same name and symbol indicate the same or the same members, and detailed description thereof will be omitted as appropriate.

実施形態に係る外観検査を行う発光装置を図１、図２に示す。発光装置１０、２０は、基板１１と、基板上に実装された発光素子１２と、発光素子１２の上に配置された透光部材１３とを備える。さらに、発光素子１２及び透光部材１３の側面を被覆する遮光部材１４を備える。すなわち、発光装置の上面は、透光部材１３の上面である発光部１０ａと、この発光部１０ａを取り囲む遮光部材１４と、を備える。発光装置１０はボイドがなく、発光装置２０はボイドがある。   A light-emitting device that performs an appearance inspection according to the embodiment is shown in FIGS. The light emitting devices 10 and 20 include a substrate 11, a light emitting element 12 mounted on the substrate, and a translucent member 13 disposed on the light emitting element 12. Further, a light shielding member 14 that covers the side surfaces of the light emitting element 12 and the translucent member 13 is provided. In other words, the upper surface of the light emitting device includes a light emitting unit 10a that is the upper surface of the translucent member 13 and a light shielding member 14 that surrounds the light emitting unit 10a. The light emitting device 10 has no voids, and the light emitting device 20 has voids.

このような発光装置１０、２０は、例えば、図３に示すような方法で得ることができる。基板１１の上に複数の発光素子１２を載置し、更にその上に透光部材１３を載置する。その後、発光素子１２と透光部材１３との側面を覆うように遮光部材１４を形成する。最後に、発光素子１２が載置されていない箇所で、遮光部材１４と基板１１とを切断して個片化する。これにより発光装置１０、２０が得られる。   Such light emitting devices 10 and 20 can be obtained by a method as shown in FIG. 3, for example. A plurality of light emitting elements 12 are mounted on the substrate 11, and a light transmitting member 13 is further mounted thereon. Thereafter, the light shielding member 14 is formed so as to cover the side surfaces of the light emitting element 12 and the translucent member 13. Finally, the light shielding member 14 and the substrate 11 are cut into individual pieces at locations where the light emitting elements 12 are not placed. Thereby, the light-emitting devices 10 and 20 are obtained.

基板１１上に載置された複数の発光素子１２の間を埋めるように形成される遮光部材１４は、図２に示すように、その内部にボイド（遮光部材が存在しない部分）１４ａが形成されている場合がある。上面視では、遮光部材１４の内部のボイド１４ａは観察されない。また、ボイドが発生する位置は規則性があるものではなく、その大きさも様々である。例えば、位置については、基板に接するボイド、基板から離間し遮光部材中のみに接するボイド、１つの側面の中央付近に形成されるボイド、２つの側面に亘って形成されるボイド、等がある。また、大きさについては、発光装置の側面の面積の１／４５〜１／４程度のボイドがあり、更に、発光素子まで達しているボイド、発光素子まで達していないボイド、等である。   As shown in FIG. 2, the light shielding member 14 formed so as to fill the space between the plurality of light emitting elements 12 placed on the substrate 11 has a void (a portion where no light shielding member is present) 14a formed therein. There may be. In the top view, the void 14a inside the light shielding member 14 is not observed. Further, the positions where the voids are generated are not regular and the sizes thereof are various. For example, regarding the position, there are a void that contacts the substrate, a void that is separated from the substrate and contacts only in the light shielding member, a void formed near the center of one side surface, a void formed across the two side surfaces, and the like. As for the size, there are voids that are about 1/45 to 1/4 of the area of the side surface of the light emitting device. Further, there are voids reaching the light emitting elements, voids not reaching the light emitting elements, and the like.

遮光部材１４を切断することで発光装置１０の側面が形成されるが、切断位置又はその近傍にボイドがある場合、以下の方法によって容易にボイドの有無を確認できる。   Although the side surface of the light emitting device 10 is formed by cutting the light shielding member 14, when there is a void at or near the cutting position, the presence or absence of the void can be easily confirmed by the following method.

図４、図５に示すように、個片化された発光装置１０、２０を、撮像領域１００内に配置する。撮像領域１００は、その上方にカメラが配置されている。カメラは、その撮像領域１００が、発光装置１０、２０を略中心として、発光装置１０、２０の上面積の約５倍程度の広さとなるように設定する。   As shown in FIGS. 4 and 5, the individual light emitting devices 10 and 20 are arranged in the imaging region 100. In the imaging region 100, a camera is disposed above. The camera is set so that the imaging region 100 is about five times as large as the upper area of the light emitting devices 10 and 20 with the light emitting devices 10 and 20 being substantially at the center.

発光装置１０、２０に通電し、発光素子（発光部）を発光させる。この発光状態を、発光装置１０、２０の上方に配置したカメラで撮像する。その際、発光装置１０、２０の側面の外側である周辺検査領域１２０を撮像する。上述で設定した撮像領域１００は、更に詳細には、この周辺検査領域１２０を含む大きさに設定される。周辺検査領域１２０は、発光装置の側面の外側のうち、１つ又は複数の側面の外側に設けることができ、特に、発光装置の側面のうち、すべての側面の外側に設けることが好ましい。   The light emitting devices 10 and 20 are energized to cause the light emitting element (light emitting unit) to emit light. This light emission state is imaged by a camera disposed above the light emitting devices 10 and 20. At that time, the peripheral inspection region 120 that is outside the side surfaces of the light emitting devices 10 and 20 is imaged. More specifically, the imaging region 100 set as described above is set to a size including the peripheral inspection region 120. The peripheral inspection region 120 can be provided outside one or a plurality of side surfaces out of the side surfaces of the light emitting device, and particularly preferably provided outside all the side surfaces among the side surfaces of the light emitting device.

発光部１０ａを発光させた際、周辺検査領域１２０は、遮光部材１４にボイドがなければ、図４に示すように、暗く観察される。しかしながら、遮光部材１４内にボイド１４ａがあれば、そのボイド１４ａから光が外部に漏れるため、図５に示すように、周辺検査領域１２０の一部が明るい領域１２０ａが観察される。例えば、ボイドが１つの側面に１つ形成されていると、その側面の外側に形成される周辺検査領域に１つの明るい領域が観察される。ボイドが大きいと、明るい領域も大きく観察される。また、ボイドが複数あった場合も、それらが近接している場合は１つの明るい領域が観察される。ボイドが２つの側面に形成されていると、それぞれの側面の外側の周辺検査領域に明るい領域が観察される。   When the light emitting unit 10a emits light, the peripheral inspection region 120 is observed as dark as shown in FIG. 4 if the light shielding member 14 has no voids. However, if there is a void 14a in the light shielding member 14, light leaks from the void 14a to the outside. Therefore, as shown in FIG. 5, a region 120a in which a part of the peripheral inspection region 120 is bright is observed. For example, when one void is formed on one side surface, one bright region is observed in the peripheral inspection region formed outside the side surface. When the void is large, a bright area is also greatly observed. Even when there are a plurality of voids, one bright region is observed when they are close to each other. When the void is formed on the two side surfaces, a bright region is observed in the peripheral inspection region outside each side surface.

このように、発光部１０ａを発光させた状態で、周辺検査領域１２０の明るさを、発光装置１０、２０の上方から撮像することで、発光装置の側面の外観（ボイドの有無）を確認することができる。つまり、実際に発光装置の側面を観察する必要がなく、上方に配置されたカメラによって簡易に確認することができるため、検査（撮像）にかかる時間を抑制することができる。また、発光装置の側面を観察するカメラを配置する必要がないため、例えば、発光装置の周囲にカメラを配置するスペースがない装置であっても、発光装置の外観検査を容易に行うことができる。   As described above, the brightness of the peripheral inspection region 120 is imaged from above the light emitting devices 10 and 20 while the light emitting unit 10a emits light, thereby confirming the appearance of the side surface of the light emitting device (the presence or absence of voids). be able to. That is, it is not necessary to actually observe the side surface of the light-emitting device, and it can be easily confirmed by the camera disposed above, so that the time required for inspection (imaging) can be suppressed. In addition, since it is not necessary to arrange a camera for observing the side surface of the light emitting device, for example, even if there is no space for arranging the camera around the light emitting device, the appearance inspection of the light emitting device can be easily performed. .

また、上記のように周辺検査領域の撮像時に、同時に発光部の発光状態も撮像することができる。つまり、二つの検査を同時に行うことができる。   In addition, as described above, the light emission state of the light emitting unit can be imaged at the same time when imaging the peripheral inspection region. That is, two inspections can be performed simultaneously.

このような外観検査は、上述のような方法で得られる発光装置のほか、遮光部材を側壁とする凹部内に発光素子が実装されている発光装置などにも適用することができる。   Such an appearance inspection can be applied not only to the light emitting device obtained by the method described above but also to a light emitting device in which a light emitting element is mounted in a recess having a light shielding member as a side wall.

本発明に係る発光装置の外観検査方法は、遮光部材を備えた発光装置の検査に適用することができ、照明用光源、各種インジケーター用光源、車載用光源、液晶のバックライト用光源、センサー用光源に用いられる発光装置に適用することができる。   The appearance inspection method of the light emitting device according to the present invention can be applied to the inspection of the light emitting device provided with the light shielding member, and includes an illumination light source, various indicator light sources, an in-vehicle light source, a liquid crystal backlight light source, and a sensor. The present invention can be applied to a light emitting device used for a light source.

１０、２０…発光装置
１０ａ…発光装置の発光部
１０ｂ…発光装置の側面
１１…基板
１２…発光素子
１３…透光部材
１４…遮光部材
１４ａ…ボイド
１００…撮像領域
１１０…発光検査領域
１２０…周辺検査領域
１２０ａ…明るい領域 DESCRIPTION OF SYMBOLS 10, 20 ... Light-emitting device 10a ... Light-emitting part of light-emitting device 10b ... Side surface of light-emitting device 11 ... Substrate 12 ... Light-emitting element 13 ... Translucent member 14 ... Light-shielding member 14a ... Void 100 ... Imaging region 110 ... Light emission inspection region 120 ... Periphery Inspection area 120a ... Bright area

Claims (4)

発光部と前記発光部を取り囲む遮光部材とを備えた上面と、前記遮光部材を備えた側面と、を備える発光装置の外観検査方法であって、
前記発光部を発光させた状態で、前記発光装置の側面の外側の周辺検査領域の明るさを、前記発光装置の上方から撮像することを特徴とする発光装置の外観検査方法。 A method for inspecting the appearance of a light emitting device, comprising: a light emitting unit and an upper surface including a light shielding member surrounding the light emitting unit; and a side surface including the light shielding member,
A method for inspecting the appearance of a light-emitting device, comprising: imaging the brightness of a peripheral inspection region outside the side surface of the light-emitting device from above the light-emitting device in a state where the light-emitting unit is caused to emit light. 前記発光装置の側面は複数あり、前記周辺検査領域は、前記側面の２以上の側面の外側に設けられる請求項１記載の発光装置の外観検査方法。   The light emitting device appearance inspection method according to claim 1, wherein the light emitting device has a plurality of side surfaces, and the peripheral inspection region is provided outside two or more side surfaces of the side surface. 前記遮光部材の側面は、切断された面である請求項１又は請求項２記載の発光装置の外観検査方法。   The light-emitting device appearance inspection method according to claim 1, wherein a side surface of the light shielding member is a cut surface. 前記発光部は、発光素子と、その上に配置された透光性部材を有する請求項１〜請求項３のいずれか一項に記載の発光装置の外観検査方法。   The said light emission part is a visual inspection method of the light-emitting device as described in any one of Claims 1-3 which has a light emitting element and the translucent member arrange | positioned on it.
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