JP5021784B2 - Luminescence measurement device, luminescence measurement method, control program, and readable recording medium - Google Patents

Description

  The present invention relates to a light emission measuring apparatus and a light emission measuring method for inspecting light emission of an optical element such as a light emitting diode (hereinafter referred to as LED), a control program for causing a computer to execute the light emission measuring method, and a readable program storing the control program. The present invention relates to a recording medium.

  In recent years, the need for LEDs as energy-saving lighting parts, such as small size, long life, and no harmful substances, has been recognized from the viewpoint of global environmental protection, and the demand for low-priced LEDs has increased greatly. Yes.

  In the conventional LED measurement, the LED and the light receiving sensor (photodiode) are arranged in a one-to-one relationship (opposite), and each light receiving sensor converts the light into an electric quantity to measure the light emission amount of the LED. This is because, when a plurality of LEDs emit light at the same time, each light receiving sensor converts an optical signal into an electric signal in units of light receiving surfaces, and each light receiving sensor side has an individual light emission for simultaneous light emission of a plurality of LEDs. This is because it is impossible to distinguish the light emission amount of the LED.

  As a result, if the same number of light receiving sensors are installed for a plurality of LEDs and face-to-face (facing) one by one, a plurality of LEDs can be measured simultaneously, but the price of the apparatus increases. There is a problem in measurement accuracy due to an increase in the size of the apparatus or a variation in sensitivity of the light receiving sensor, and at present, a single light receiving sensor performs a single measurement without taking such a form.

  FIG. 10 is a schematic diagram for explaining a configuration example of a main part of a conventional luminescence measuring apparatus.

  In FIG. 10, a plurality of semiconductor chips 102 provided with LEDs as light emitting elements are arranged in a matrix on a wafer 101, and the conventional light emission measuring apparatus 100 uses a probe voltage for each semiconductor chip 102. An inspection can be performed by applying light from the probe pin 104 to the pad 103 which is a pin contact to cause the LED to emit light. The light emission amount of the LED can be measured by the on-axis measuring device 105 using the PD method or integrating sphere, and it can be inspected whether or not the measured light emission amount is defective. In this way, the light emission amount of the LED is measured sequentially for each semiconductor chip 102.

  As described above, the conventional light emission measuring device 100 has a problem in that it takes time to measure the light emission amounts of the LEDs of all the chips because the light emission amount of the LEDs is sequentially measured for each semiconductor chip 102. In order to solve this, Patent Document 1 has been proposed in which the amount of light emitted from a plurality of LEDs is simultaneously measured to shorten the measurement time.

  In Patent Document 1, in order to measure the light emission amount of a plurality of LEDs simultaneously, a circuit for generating an ID signal is incorporated in each LED measurement circuit, and an identification signal indicating which LED is included in the LED light emission signal. Are generated as a synthesized signal. This composite signal is a technique for measuring the amount of light emission while judging which LED signal is obtained by using dedicated software for distinguishing between the ID signal and the light emission signal when the light emission signal is converted into an electric quantity on the light receiving sensor side. .

  FIG. 11 is a block diagram showing a configuration example of a main part of a conventional LED simultaneous measurement device disclosed in Patent Document 1. As shown in FIG. Note that FIG. 11 shows the case where two LEDs are measured simultaneously for the sake of explanation, but by adding the same circuit, a plurality of LEDs corresponding to the number can be measured simultaneously.

  As shown in FIG. 11, a conventional LED simultaneous measurement apparatus 200 includes a light emission bias application section A (upper part of the center dotted line in FIG. 11) from a signal source that causes the LEDs 201 and 202 to emit light, and a light amount detection measurement. It can be divided into two sections: section B (lower part of the center dotted line in FIG. 11).

  First, the operation of the light emission bias application section A will be described.

  The ACB is an AC base signal generator that generates a sinusoidal AC base signal having a constant amplitude and a constant frequency (frequency fb). A part of this signal is applied to the bias modulator BM201b, where it is subjected to modulation such as amplitude modulation, frequency modulation or phase modulation by the identification signal (frequency f1) of the identification signal generator ID201a, and an AC bias signal (FIG. 12 is an amplitude modulation example).

  Similarly, a part of the AC base signal is also applied to the bias modulator BM 202b, where it is similarly modulated by the identification signal (frequency f2) of the identification signal generator ID 202a to become an AC bias signal. Since the identification signal (frequency f1) of the identification signal generator ID 201a and the identification signal (frequency f2) of the identification signal generator ID 202a are different frequencies, the waveform of each AC bias signal also differs accordingly.

  The outputs from the bias modulators BM201b and BM202b are respectively applied to bias signal synthesizers BC201c and BC202c typified by an analog adder, where they are superimposed on the DC bias voltage of the DC bias reference level generator DCB at a constant ratio. Is done. As will be described later, it is important to set this ratio so that the light emission component by the AC bias signal appears faithfully on the light receiving side, and the ratio in the range of 0.1 ≦ AC bias / DC bias ≦ 0.9 is optimal. is there.

  An example of waveforms of output signals of the bias signal synthesizers BC201c and BC202c is shown in FIG.

  This signal is adjusted to a predetermined bias level by bias level adjusters BL201d and BL202d having the function of a D / A converter. If each LED measurement condition is previously input as a program to the bias level adjusters BL201d and BL202d, a bias level corresponding to the measurement conditions can be set.

  When this signal is applied as a drive command signal to the applied current output units IP20e1 and IP202e, a current proportional to the drive command signal is applied as a bias current to the LEDs 201 and 202, which are the LEDs to be measured. The waveform of the bias current is a waveform in which the AC bias current amplitude-modulated by the identification signal is superimposed on the reference level of the DC bias current at a certain ratio as shown in the waveform of FIG. The light emission output is specific to this.

  Next, the operation of the light quantity detection measurement section B in FIG. 11 will be described.

  PD is a light receiving sensor such as a photodiode and a phototube, and a single light receiving sensor PD simultaneously receives the light amount of the sum of the light emission amounts of LED 201 and LED 202. Therefore, there is no need to block light between the LED 201 and the LED 202. Moreover, even if there is externally incident light that would otherwise interfere with the measurement other than the light emission outputs of the LED 201 and the LED 202, this can be eliminated as described later.

  The light receiving sensor PD generates a current change substantially proportional to the total amount of incident light, and is converted into a voltage change by a current-voltage converter IVC called an I / V conversion amplifier.

  If this output component is analyzed, it has the following components (a) and (b).

  (A) A voltage corresponding to the sum of the DC bias components included in common to the light emission of each LED (hereinafter referred to as DC received light voltage).

  (B) A voltage corresponding to the sum of AC bias signal components superimposed on the DC light reception voltage (hereinafter referred to as AC light reception voltage, including the frequency component fb of the AC base signal).

  As described above, the output voltage including the components (a) and (b) is input to the high pass filter HPF, and first, the DC light reception voltage of the component (a) is removed.

  Even if the DC light reception voltage (a) is removed, the light quantity information of each LED is proportionally included in the AC light reception voltage of (b), so that there is no problem in measurement.

  The output from the high pass filter HPF is input to the phase detector PSD 203 having a multiplication function. At the same time, an AC base signal (frequency fb) is added to the phase detector PSD 203 from the AC base signal generator ACB, and both signals are multiplied. Then, the frequency components of the AC output of the high-pass filter HPF are the upper sideband components fb + f1, fb + f2, and the lower sideband component fb−f1, where the frequency of the AC bias signal is fb and the identification signal frequencies are f1 and f2. , Fb-f2. Of these, only the fb component has the same phase and timing as the AC bias signal. Therefore, the voltage of the following frequency component appears in the output from the phase detector PSD 203.

By passing the output of the phase detector PSD 203 through a low-pass filter LPF 204 whose cutoff frequency is set to be lower than fb, the high-frequency component is removed, and the output of the low-pass filter LPF 204 includes Only the voltage of (2) appears.
(1) A voltage of 0 Hz that appears only when a signal completely in phase with the phase of the AC base signal is present at the output of the high pass filter HPF, that is, a direct current, the voltage level of which is the amount of AC light received in (b) above. It is proportional to the level of the AC base signal component in the voltage.
(2) A voltage whose amplitude is proportional to the amplitude of the identification signal at f1 and f2.

  Further, if the low-pass filter LPF 204 is replaced with a band filter in which the pass band frequency is zero Hz << pass band frequency << fb, only the voltage component (2) passes. This signal is a sum signal of the identification signals.

  The signals of only the above components (1) and (2) or the voltage component of (2) thus obtained are supplied to phase detectors PSD201f and PSD202f having a multiplication function substantially similar to that of the phase detector PSD203. To do.

  On the other hand, from each identification signal generator ID201a, ID202a of the light emission bias application section A, a signal having the same component as the identification signal corresponding to each system is supplied to the phase detectors PSD201f, PSD202f.

  When the signals from the phase detectors PSD201f and PSD202f are added to the low-pass filters LPF201g and LPF202g whose cutoff frequencies are lower than the identification signal frequencies f1 and f2, the high-frequency components are removed, that is, the DC voltage generated by the light emission by the identification signal. ED201h and ED202h are obtained. The DC voltages ED201h and ED202h are input to an A / D converter ADC with a scanner having two or more channels, and this is time-divisionally selected to obtain a measured value.

  JP 2004-31460 A

  In the conventional light emission measuring device 100, it is impossible to measure the amount of light emission by identifying a plurality of LED light emissions, and therefore it is impossible to measure a plurality of LED light emissions simultaneously. Even if two light-receiving diodes PD are installed and two LEDs are measured at the same time, each light-receiving diode PD converts the amount of light into an electrical quantity, so two systems are required. Although the luminescence can be measured at the same time, the system price has been doubled.

  Although the conventional luminescence measuring apparatus 200 can shorten the entire measurement time of each luminescence amount as compared with the conventional luminescence measuring apparatus 100, each time the number of LEDs to be measured increases, the measurement LED is identified. It is necessary to increase the number of ID circuits, and the price of the measuring machine increases accordingly. In this case, since a check mechanism for confirming that there is no problem in the identification ID circuit, such as whether the ID signal is output correctly, is required on both software and hardware sides, the device price further increases. . Furthermore, when a problem occurs in the identification ID circuit, the apparatus is stopped as a measurement board, not as a part, so that the apparatus stop time increases. Further, when there is a variation in the synthesis timing of the light emission amount signal and the identification ID signal, the identification signal cannot be accurately captured. If noise or the like is included in this identification ID signal, it cannot be captured as an accurate identification ID signal.

  In any case, in the conventional light emission measuring devices 100 and 200, the LED and the light receiving diode PD are arranged to face each other, and the light emission amount of the LED is converted by the photodiode PD into the electric amount. However, there is a problem that it cannot be inspected at all about the directivity of LED light emission and dust adhesion failure. Was.

  The present invention solves the above-described conventional problems. In addition to the light emission amount of one optical element, the light emission amount of a plurality of optical elements can be easily and accurately used without using a conventional identification ID circuit. A light emission measuring device and a light emission measuring method capable of easily and accurately measuring and inspecting the directivity of light emission of an optical element and dust adhesion failure, and a computer to execute the light emission measurement method It is an object of the present invention to provide a control program and a readable recording medium storing the control program.

The light emission measuring device of the present invention is a light emission measuring device for inspecting light emission of an optical element. An image pickup element provided with a plurality of light receiving portions that receive light from the optical element and pick up an image thereof; have a control unit for checking controlling the light emission state of the optical element by using the image signal, the control unit from among the plurality of light receiving portions for imaging the light emission state of the optical element, one or more light receiving portions Addressing means for addressing the light source, and light emission state inspection means for inspecting the light emission state of the optical element based on an imaging signal from one or a plurality of light receiving units designated by the address designation means, and the control The unit further includes a determination unit that compares a value of an imaging signal from one or a plurality of light receiving units specified by the address specifying unit with a reference value, and determines whether the light emission state of the optical element is good. Judgment result judged by means If the light receiving unit is defective, the addressing unit changes the light receiving unit to be addressed, and the determination unit compares the value of the imaging signal from the light receiving unit after the change with the reference value, and emits light from the optical element. Further determination of the quality of the state is made, and thereby the above object is achieved.

  Further preferably, the address specifying means in the light emission measuring device of the present invention is configured such that the pixel address specifying input indicating which pixel is used for the inspection of the light emission state of the optical element is made from the outside, or the pixel address is set in advance. Selected and set.

  Further preferably, the addressing means in the light emission measuring device of the present invention specifies a plurality of pixel addresses in one direction or a plurality of directions passing through the light emission center of the optical element and the vicinity thereof, and / or the light emission of the optical element. One central pixel address or a plurality of pixel addresses of a block area including the light emission center of the optical element and its vicinity are designated.

Further, preferably, Oite the luminometer of the present invention, the determination means compares the value with the reference value of the image signals from one or more light receiving portions specified by said address specifying means, the image pickup signal A light amount determining unit that determines that the light amount is poor when the value of the image signal is lower than the reference value and determines that the light amount is good when the value of the imaging signal is equal to or greater than the reference value.

Further, preferably, Oite the luminometer of the present invention, the determination means compares the value with the reference value of the image signals from one or more light receiving portions specified by said address specifying means, said optical element There is directivity determining means for determining whether the directivity of light emission is good or bad.

  Further preferably, in the light emission measuring device of the present invention, when the determination result determined by the light amount determination means and / or the directivity determination means is defective, a defect registration means for registering the determination content in the chip number is provided. Have.

Further preferably, in the light emission measuring apparatus of the present invention, a partition plate for preventing light mixing is disposed between the two adjacent optical elements.

Further preferably, in the light emission measuring device of the present invention, a partition plate having a cross shape in plan view for preventing light mixing is disposed between the four adjacent optical elements.

Furthermore, it is preferable that the light emission measuring device of the present invention further includes a light emission driving unit that simultaneously emits light from one or more of the optical elements.

The luminescence measurement method of the present invention is an luminescence measurement method for inspecting luminescence of an optical element. In the luminescence measurement method, an image is picked up from an image pickup element provided with a plurality of light receiving portions that receive and radiate light emitted from the optical element. have a test control step of inspecting controlling the light emission state of the optical element by using the signal, the test control step, the addressing means, from a plurality of light receiving portions for imaging the light emission state of the optical element, one Alternatively, the addressing step for addressing a plurality of light receiving units and the light emission state inspection means inspect the light emitting state of the optical element based on the imaging signals from one or a plurality of light receiving units specified in the addressing step. A light emission state inspection step, wherein the light emission state inspection step compares a reference value with a value of an imaging signal from one or a plurality of light receiving units specified by the addressing unit by the determination unit. The determination step for determining whether the light emitting state of the optical element is good or not, and when the determination result in the determination step is bad, the address designation unit changes the light receiving unit to be addressed, and the determination unit And a further determination step of comparing the value of the imaging signal from the subsequent light receiving unit with a reference value to further determine the quality of the light emission state of the optical element , thereby achieving the above object. .

Further preferably, in the light emission state inspection step in the light emission measurement method of the present invention, the light amount determination means compares the value of the imaging signal from one or a plurality of light receiving units designated by the address designation means with a reference value, A light amount determination step for determining a light amount defect when the value of the imaging signal is lower than the reference value, and determining that the light amount is good when the value of the imaging signal is equal to or greater than the reference value; by comparing the value with the reference value of the image signals from one or more light receiving portions specified by designating means, and a directional determination step of determining the directionality of quality of emission of the optical element.

  The control program of the present invention describes a processing procedure for causing a computer to execute each step of the above-described luminescence measurement method of the present invention, thereby achieving the above object.

  The readable recording medium of the present invention is a computer-readable medium in which the control program of the present invention is stored, whereby the above object is achieved.

  With the above configuration, the operation of the present invention will be described below.

  In the present invention, an image sensor provided with a plurality of light receiving units that receive and image light emitted from the optical element, and a control unit that inspects and controls the light emission state of the optical element using an image signal from the image sensor And have. The control unit includes: an address designating unit for addressing one or a plurality of light receiving units out of a plurality of light receiving units for imaging the light emission state of the optical element; and one or a plurality of light receiving units designated by the address designating unit. And a light emission state inspection means for inspecting the light emission state of the optical element based on the imaging signal from the optical element.

  Thus, since the light emitting state of the light emitting element (for example, LED) is measured as a single image using a light receiving sensor having a plurality of light receiving portions, data of one light receiving portion (one pixel) in the vicinity of the center is taken out. The brightness (or luminance) of light emission can be measured, and the distribution of light emission can also be measured by taking out a row of data in the X direction and the Y direction.

  In addition, if a plate-shaped partition member is inserted between two light emitting elements (for example, LEDs), interference of light emission from the two light emitting elements can be suppressed, and light emission from the two light emitting elements can be captured as an image at the same time. It becomes possible. If there are four light-emitting elements, if a cross-shaped partition member is inserted, each light emission from the four light-emitting elements can be simultaneously captured as an image.

  Therefore, the light emission state of the optical element is inspected and controlled by taking out the signal at the pixel level using the image pickup signal from the image pickup element provided with a plurality of light receiving portions that receive and pick up the light emitted from the optical element. In addition to the light emission amount of each optical element, the light emission amount of a plurality of optical elements can be easily and accurately measured and inspected without using a conventional identification ID circuit. It is possible to easily and accurately measure and inspect the dust adhesion failure.

  As described above, according to the present invention, the light emission state of the optical element is obtained by extracting the signal at the pixel level using the image pickup signal from the image pickup element provided with the plurality of light receiving portions that receive the light emission from the optical element and pick up the image. In addition to the light emission amount of one optical element, the light emission amount of a plurality of optical elements can be easily and accurately measured and inspected without using a conventional identification ID circuit. It is possible to easily and accurately measure and inspect the directivity of light emitted from the optical element and dust adhesion failure.

It is a block diagram which shows the principal part structural example of the light emission measuring apparatus in Embodiment 1 of this invention. It is a schematic diagram which shows a mode that the light emission measuring apparatus of FIG. 1 is measuring the optical element light emission of each chip | tip before chip | tip cutting | disconnection. FIG. 3 is a top view when a LED is caused to emit light by applying a power supply voltage to each of the two semiconductor chips of FIG. 2. (A) And (b) is a schematic diagram which shows a mode that the optical element is light-emitted by extending each chip | tip space | interval after chip | tip cutting | disconnection. (A) And (b) is a schematic diagram which shows a mode that each chip | tip after chip | tip cutting is packaged and an optical element is made to light-emit. FIG. 4 is a screen view showing the light emission determination device of FIG. 1 for measuring the light emission of the LED respectively applied with the power supply voltage to the two semiconductor chips of FIG. 3, and showing the light quantity determination area for each semiconductor chip. FIG. 4 is a screen view showing the light emission of the LED to which the power supply voltage is respectively applied to the two semiconductor chips of FIG. 3 measured by the light emission measuring device of FIG. 1 and showing the address selection area of each pixel. (A)-(e) is a directivity distribution map which shows the light emission state of LED at the time of selecting the address selection area of FIG. It is a principal part longitudinal cross-sectional view which shows the case where two or more specific examples of the light emission measuring apparatus of FIG. 1 with a some partition plate are used. It is a schematic diagram for demonstrating the example of a principal part structure of the conventional light emission measuring device. It is a block diagram which shows the principal part structural example of the conventional light emission measuring device currently disclosed by patent document 1. FIG. It is a figure for demonstrating the waveform of the AC bias signal used with the conventional light emission measuring device of FIG.

  Hereinafter, embodiments of a luminescence measuring apparatus and a luminescence measuring method of the present invention will be described in detail with reference to the drawings. In addition, each thickness, length, etc. of the structural member in each figure are not limited to the structure to illustrate from a viewpoint on drawing preparation.

(Embodiment 1)
FIG. 1 is a block diagram illustrating a configuration example of a main part of a luminescence measuring apparatus according to Embodiment 1 of the present invention.

  In FIG. 1, the light emission measuring device 1 according to the first embodiment includes a plurality of light receiving units that photoelectrically convert incident light from a subject when an LED as a light emitting element of a semiconductor chip 12 described later emits light. An image pickup device 2 provided in a matrix, an A / D conversion unit 3 that performs A / D conversion after removing noise from the image pickup signal from the image pickup device 2, and a CPU that performs overall control and performs light emission measurement control ( The control unit 4 is configured by a central processing unit), a keyboard, a mouse, a touch panel and a pen input device for giving an input command to the CPU, and further received via a communication network (for example, the Internet or an intranet). Display that displays an initial screen, a selection screen, a control result screen by the CPU, an operation input screen, and the like on the operation unit 5 such as an input device and the display screen. 6, ROM 7 as a computer-readable readable recording medium in which the control program and its data are stored, and the control program and its data are read at startup, and the data is read and stored for each control by the CPU It has RAM8 as a memory | storage part which works as a work memory.

  The imaging device 2 is configured by a CCD type image sensor or a CMOS type image sensor that captures an image of a light emission state of an LED as a light emitting device of a semiconductor chip 12 to be described later, and has, for example, about 200 × 400 pixels as a plurality of light receiving units. However, it may be more or less than this number of pixels.

  The control unit 4 inspects and controls the light emission state of the LED using an image pickup signal from the image pickup device 2 provided with a plurality of light receiving units that receive and pick up light emitted from the LED. The control unit 4 receives from the operation unit 5 pixel address selection designation input indicating which pixel is used for the inspection of the light emission state, or automatically selects and sets the pixel address according to the inspection mode, and the vicinity of the LED light emission. Addressing means 41 that designates a plurality of pixel addresses in one column in the X direction or Y direction that passes through or addresses of one or more pixels in a predetermined area; A light amount determination means 42 that obtains a value or average value of one pixel and compares it with a reference value, a directivity determination means 43 that determines the directivity of an LED as a light emitting element, a light amount determination means 42, and If the determination result determined by the directivity determining means 43 is NG, the NG chip registering means 4 as defect registering means for registering the determination contents and the NG chip number in the RAM 8. And it has a door. The light quantity determination unit 42 and the directivity determination unit 43 constitute a light emission state inspection unit that inspects the light emission state of the LED based on the imaging signal from one or a plurality of light receiving units designated by the address designation unit 41. Yes.

  The address designating means 41 can select, for example, X (horizontal direction number; left first line top) in a predetermined area of pixel area, for example, 200 × 400 pixels, by external selection designation input or predetermined internal selection setting according to the inspection mode. As a reference, for example, a pixel area in which 1 to 200) is 50 to 100 and Y (vertical direction number; 1 to 400) is 50 to 100, for example, is selected and set in the matrix direction (vertical and horizontal directions). In this case, the address specifying means 41 is provided with means for taking out individual signals of one pixel or more from the image sensor 2 for optical measurement, and the address is specified from, for example, 200 × 400 pixel data that is sequentially input. Only the pixel data of the light emission state of the pixel area is counted in the matrix direction (vertical and horizontal directions) with respect to the addressing information of the address designating means 41, and the count values match and are captured. Explaining the directivity of the LED, there is a directivity in which the light emission cross section of the LED having one peak value is circular or elliptical, and the light emission cross section of the LED having two peak values is in the shape of a heart shape. . When a plurality of pixel addresses in a row in the X direction or the Y direction are designated, the directivity shape (peak value and its peripheral value) of the light emission cross section (such as a circle or a heart shape) of the LED can be measured. Even if the light emission cross section of the LED is circular or elliptical, if dust is attached to the center of the LED, the light emission cross section becomes like a heart shape, which is regarded as defective (NG). In any case, by specifying a plurality of pixel addresses in a row in the X direction or the Y direction, it is possible to easily and accurately measure the directivity shape of the light emitted from the optical element and the dust adhesion failure and to check the quality.

  In the address designation means 41, the light receiving area of the image sensor 2 for optical measurement can be arbitrarily set as X1, Y1, D1 in FIG. Also, a plurality of light receiving areas of the image sensor 2 for optical measurement can be set as at least two of X1, Y1, and D1 in FIG. Furthermore, when it is determined as defective (NG), the received light data of the defective portion can be addressed in detail pixel by pixel, and the defective portion can be verified by fetching the data.

  The light amount determination means 42 determines whether the LED light amount is good or not by taking an AND of each pixel (X, Y) in the predetermined pixel region and whether the total light amount, the average light amount, or the peak light amount satisfies a predetermined reference value.

  The directivity determining means 43 determines whether or not the directivity, for example, a circle or a heart shape, is obtained by taking an AND of each pixel (X, Y) in a predetermined pixel region. If it is, the directivity defect (NG) including dust or dirt is determined.

  When the determination result determined by the light amount determination unit 42 and / or the directivity determination unit 43 is NG, the determination content (the amount of light NG or / and the directivity NG, and the type of directivity NG). The NG chip number is registered in the RAM 8.

  The ROM 7 as a readable recording medium may be composed of a hard disk, a formable optical disk, a magneto-optical disk, a magnetic disk, an IC memory, and the like. The control program and its data are stored in the ROM 7, but the control program and its data may be downloaded to the ROM 7 from another readable recording medium or via wireless, wired or internet.

  FIG. 2 is a schematic diagram showing a state in which the light emission measuring device 1 of FIG. 1 measures the optical element light emission of each chip before cutting. FIG. 3 is a top view when the LED is caused to emit light by applying a power supply voltage to each of the two semiconductor chips 12 of FIG.

  2 and 3, a plurality of semiconductor chips 12 provided with light emitting diodes (LEDs) are arranged in a matrix in a matrix direction on a wafer 11, and a plurality of semiconductor chips 12 (two here) are arranged. A power supply voltage is applied to the pad 13 which is a probe pin contact from the probe pin 14 every time, and LED can be light-emitted. As described above, the control unit 4 includes a light emission driving unit that applies a predetermined power supply voltage from the probe pin 14 and causes one or more LEDs 20 or arbitrary LEDs 20 to emit light simultaneously or individually. At this time, the control unit 4 needs to contact the pad 13 with the probe pin 14 and at the same time recognizes the position of the semiconductor chip 12 measured from the upper left semiconductor chip 12 as a base point. Need to be. Thereby, the light emission measurement device 1 can inspect whether the light emission amount of the LED or the directivity is good or bad. In this way, a predetermined number (here, two) of semiconductor chips 12 (chip A and chip B) are interposed between the partition plates (not shown in FIGS. 2 and 3), and the LEDs emit light sequentially. Measure and inspect quantity and luminescence status.

  In this case, the light emission measuring device 1 is a measuring device that is equipped with an image pickup device 2 having a size capable of receiving a plurality of LEDs, and can take out an image pickup signal having an arbitrary address assigned to the image pickup area.

  With respect to light emission of the LED, a plurality of (two in this case) LEDs are assigned to one image pickup device 2 by designating an image pickup area of the image pickup device 2 with a pixel address (X, Y) and taking it out as an electric signal. Necessary pixel information can be selected by emitting light. Furthermore, by providing a partition plate in the image sensor 2, it is possible to have a structure that eliminates the influence of light from the side. Since a plurality of signals are extracted in detail at the pixel level, the light emission amount distribution related to directivity is known, and it is possible to inspect directivity defects and dust adhesion defects.

  FIG. 4A and FIG. 4B are schematic views showing a state in which the optical element is caused to emit light by increasing the interval between the chips after cutting the chips.

  4 (a) and 4 (b), a dicing wire or a dicing blade in a state where the plurality of semiconductor chips 12 of the wafer 11 described above are attached with an adhesive sheet 16 fixed by a ring 15 which is a dicing frame. After cutting into individual semiconductor chips 12, the adhesive sheet 16 is expanded (stretched) and fixed with a certain gap between the individual semiconductor chips 12. In this case, since a certain gap is left between the individual semiconductor chips 12, a partition plate (not shown) is easily interposed between the semiconductor chips 12, thereby facilitating the inspection.

  In this state, the LED can be caused to emit light by applying a power supply voltage to each of the plurality of semiconductor chips 12 (here, two) from the probe pins 14 to the pads 13 serving as probe pin contacts. The light emission amount and directivity quality determination of the LED can be inspected by the light emission measuring device 1. In this way, the LEDs are sequentially inspected with a partition plate (not shown) interposed between a predetermined number (here, two) of semiconductor chips 12.

  FIG. 5A and FIG. 5B are schematic views showing a state in which each chip after chip cutting is packaged and the optical element emits light.

  5 (a) and 5 (b), after cutting into individual semiconductor chips 12 and dividing them into individual pieces, contact pins 17 are attached to the semiconductor chips 12, and packaged products 18 are packaged. A power supply voltage can be applied from the contact pin 17 to cause the LED to emit light. The light emission amount and directivity quality determination of the LED can be inspected by the light emission measuring device 1. In this way, the LEDs are sequentially inspected with a partition plate (not shown) interposed between a predetermined number (here, two) of package products 18.

  6 and FIG. 7 are screen views obtained by measuring the light emission of the LED to which the power supply voltage is applied to the two semiconductor chips of FIG. 3 by the light emission measuring device 1 of FIG. 1, and FIG. 6 shows the light quantity for each semiconductor chip. FIG. 7 is a screen diagram showing an address selection area for each pixel.

  As shown in FIG. 6, the light amount determination area for each semiconductor chip (for each LED) is, for example, a light amount determination area A1 for one pixel in chip A and a light amount determination area B1 for one pixel in chip B. The light amount determination area may be set in advance, but is not limited to this and can be arbitrarily set.

  As shown in FIG. 7, as the address selection area of each pixel, for example, in the chip A, the address selection areas X1 and Y1 in one column in the X direction and in the Y direction, and in the chip B, the address selection area D1 of the pixel block. It may be at least one of the selection areas X1, Y1, and D1, and is not limited to this, and the address selection area can be arbitrarily set.

  In FIG. 8A, one row of address selection areas X1 is selected, and the cross section has a predetermined directivity distribution. That is, as the circular reference curve for directivity, the center of the LED is bright and the periphery thereof is dark. In this case, the standard is that the brightness e1 (center portion) and the brightness e2 (end portion) at two locations are brighter than a predetermined reference value.

  In FIG. 8B, a row of address selection areas X1 is selected, and the cross section has a distribution that is broken from a predetermined directivity distribution (FIG. 8A). That is, although the amount of light emission (brightness) as a whole is sufficient, the brightness in the middle of the LED is reduced. This is due to a directional central defect (NG) because there is a possibility of scratches in addition to dust and dirt adhering to the middle of the LED, and there is also a possibility of a light directivity defect. In this case, the difference between the brightness e1 of the LED central part and the brightness e2 of the peripheral part (end part) is reversed or lower than a predetermined value, and the brightness e1 of the central part is a predetermined reference value. By far below the lower limit, it can be determined that the central directivity defect (NG).

  In FIG. 8C, a row of address selection areas X1 is selected, and the cross section has a distribution that is broken from a predetermined directivity distribution (FIG. 8A). That is, although the amount of light emission as a whole is sufficient, the brightness in the middle of the LED is significantly brighter than a predetermined value, and the surrounding brightness is lower than the predetermined value. This is a directional peripheral defect (NG) because there is a risk that the LED peripheral part may be scratched in addition to dust and dirt adhering to the LED peripheral part, and there is also a possibility of a light directivity defect. In this case, the difference between the brightness e1 of the LED central portion and the brightness e2 of the peripheral portion (end portion) exceeds the predetermined reference value, and the brightness e2 of the peripheral portion (end portion) falls below the predetermined reference value. Thus, it can be determined that the directivity peripheral defect (NG).

  In FIG. 8D, a row of address selection areas X1 is selected, and the cross section has a predetermined directivity distribution. That is, although the amount of light emission as a whole is sufficient, only the brightness of one side of the LED is as bright as the brightness of the central part, and the brightness of the other side of the LED is dark. This is one-side peripheral failure (NG) including package failure, in addition to dust and dirt adhering to one side of the LED periphery and scratches. In this case, the difference between the brightness e1 of the LED central portion and the brightness e2 of the peripheral portion thereof is lower than a predetermined value, and the peripheral portion brightness e2 is significantly higher than the predetermined value. Can be determined.

  8B to 8D, when it is determined as defective (NG), the address selection area Y1 in a row is selected, and whether or not the cross section has a predetermined directivity distribution is detailed. Can be inspected. In this manner, a plurality of address selection designations can be performed. In short, it is possible to differentiate the characteristics of LED light emission from the characteristics of defects by measuring the directivity distribution in more detail by further selecting and addressing the periphery of the portion determined to be defective (NG) and its cross section.

  In FIG. 8E, the block address selection area D1 is selected, and the cross section has a predetermined directivity distribution (heart-shaped distribution). That is, as a heart-shaped directivity reference curve, the center of the LED is a little darker and brighter in two places around it. In this case, the standard is that the brightness e11, e21, e12 at three locations is brighter than a predetermined value.

  The light emission measurement method of the first embodiment for inspecting the light emission of the LED 20 as an optical element is based on a control program in the ROM 7 and its data, and the inspection control means receives a light emission from the LED 20 and picks up an image. A computer (CPU) is caused to execute an inspection control step for inspecting and controlling the light emission state of the LED 20 using an imaging signal from the imaging device 2 provided with the unit. This inspection control step includes an address specifying step in which the address specifying means 41 addresses one or a plurality of light receiving sections among a plurality of light receiving sections for imaging the light emitting state of the LED 20, and a light emitting state inspecting means in the address specifying step. And a light emission state inspection step of inspecting the light emission state of the LED 20 based on the imaging signals from one or a plurality of light receiving units specified in. Further, in this light emission state inspection step, the light quantity determination means 42 compares the value of the imaging signal from one or a plurality of light receiving units designated by the address designation means 41 with the reference value, and the value of the imaging signal is determined from the reference value. A light amount determination step that determines that the light amount is poor when the value of the imaging signal is equal to or greater than a reference value, and one or a plurality of light receptions that the directivity determination unit 43 designates with the address designation unit 41. A directivity determination step of comparing the value of the imaging signal from the unit with the reference value to determine whether the light emission directivity of the LED 20 is good or bad. As described above, the light emission state inspection unit includes the light amount determination unit 42 and the directivity determination unit 43.

  As described above, according to the first embodiment, out of the plurality of light receiving units that image the light emission state of the LED, the address specifying unit 41 for addressing one or a plurality of light receiving units and the one specified by the address specifying unit 41 are used. Or, compare the values of the imaging signals from multiple light receiving units with the reference value, and determine that the light intensity is poor if the imaging signal value is lower than the reference value, and that the light intensity is good if the imaging signal value is greater than or equal to the reference value Directivity determination that compares the value of the imaging signal from one or a plurality of light receiving units specified by the address specifying unit 41 with a reference value to determine whether the LED light emission directivity is good or bad. Means 43 for detecting the light emission state of the LED 20 by taking out the signal at the pixel level using the image pickup signal from the image pickup device 2 provided with a plurality of light receiving portions for receiving and picking up the light emission from the LED. is doingFor this reason, a light emission amount distribution with respect to directivity can be known, and chips with poor directivity can be eliminated. In addition, there is no increase / decrease in the circuit by the same measurement number, and no software / hardware modification is required. Furthermore, a special check mechanism in software / hardware for the image pickup device is not required, and the presence or absence of a problem in the mechanism can be determined in detail by daily inspection similar to the conventional light receiving sensor.

  Finally, when the determination result determined by the light amount determination unit 42 and / or the directivity determination unit 43 is NG, the determination content (the light amount NG or / and the directivity NG, and further the directivity NG And the NG chip number are registered in the RAM 8. That is, the determination content (a light quantity NG or / and NG type of directivity NG) is stored at an address position corresponding to a chip number called a map address corresponding to the position of the wafer 11. As the type of NG, for example, there is no problem with the amount of light by the light amount determination means 42, but when there is a problem with the directivity determination means 43, the rank is B. Further, for example, when there is a problem with the light amount by the light amount determination unit 42 and there is no problem with the directivity determination unit 43, the rank C is obtained. Further, for example, when there is no problem in the light amount by the light amount determination means 42 and there is no problem in the directivity determination means 43, the rank A is obtained. Further, it is possible to distinguish defects in detail. For example, regarding the light amount by the light amount determination means 42, two threshold values are provided, and the light amount defect can be divided into two stages.

  In the first embodiment, when the plate-shaped partition plate 19 is inserted between two light emitting elements (for example, LEDs) (between chips A and B) as shown in FIGS. 6 and 7, two light emitting elements ( The mixing of light from, for example, LEDs) can be suppressed, and the light emission from the two light emitting elements is simultaneously captured as an image to check the light emission amount and directivity. However, the present invention is not limited to this. It is possible to inspect the light emission (for example, LED) as an image and inspect the light emission amount and directivity, and if there are four light emitting elements, if a cross-shaped partition plate is inserted, four light emitting elements It is also possible to inspect the light emission amount and directivity quality by simultaneously capturing each light emission as an image. Furthermore, using a light emission measuring device having a plurality of partition plates 19, it is possible to inspect each light emission from a plurality of light emitting elements as an image at the same time to inspect the light emission amount and the quality of directivity, thereby making the inspection quick and easy. It can be carried out. A specific example of the luminescence measuring apparatus in this case is shown in FIG.

  FIG. 9 is a longitudinal sectional view of an essential part showing a case where a plurality of specific examples of the luminescence measuring apparatus of FIG. 1 having a plurality of partition plates are used.

  As shown in FIG. 9, a plurality of light emission measuring devices 1A (for 4 × 4 measurement) are arranged, and a partition plate 19 is provided for each of the plurality of LEDs 20 arranged in a matrix in the vertical and horizontal directions. The LED 20 can be caused to emit light every time one of the plurality of LEDs 20 is skipped, and this can be measured to check the quality. If a plurality of light emission measuring devices 1A (4 × 4) are slid in either the vertical direction or the horizontal direction with respect to the plurality of LEDs 20 arranged in a matrix in the vertical and horizontal directions, all the LEDs 20 It is possible to inspect the quality by measuring the light quantity and directivity imagewise. Moreover, one light emission measuring device 1A can measure 4 × 4 of 8 × 8 of the plurality of LEDs 20 one block at a time. Further, the partition plate 19 may be used for one row of the region where the plurality of LEDs 20 are arranged by sequentially shifting in the vertical direction using the plurality of light emission measuring devices 1B (for 1 × 4 measurement). it can. L indicates light emission from the LED 20. The LED 20 facing the bottom surface of the partition plate 19 does not emit light. One light emission is skipped in the vertical direction (depth direction in FIG. 9) and in the horizontal direction (left-right direction in FIG. 9).

  Although not specifically described in the first embodiment, the light emission amount and directivity are inspected one by one or two at a time from the chip serving as the base point of the wafer 11, but the LED of which chip is currently probed. The address designation means 41 provided in the control unit 4 recognizes the number of the LED of the chip currently measured from the base point of the wafer 11 in addition to the designated pixel address. The determination NG content is registered at an address position corresponding to a chip number called a map address corresponding to the position of the wafer 11. In addition, when a plurality of chips emit light at the same time and the light emission amount and directivity are inspected, the LED of the chip currently measured is recognized from the base point of the wafer 11 as described above. can do.

  Although not particularly described in the first embodiment, the light emitting element (for example, LED) of one or more electronic components (semiconductor chips) has a function of simultaneously emitting light. Moreover, it has the function to make arbitrary components light-emit with respect to the light emitting element (for example, LED) of one or more electronic components (semiconductor chip). Furthermore, the light emitting elements of one or more electronic components (semiconductor chips) can emit light simultaneously, and the light emission amount of each electronic component can be identified. Furthermore, the image sensor 2 for optical measurement can arbitrarily take out individual signals of one pixel or more. As a result, in the case where dust is attached on the LED 20, the position where the dust is attached on the LED 20 can be obtained in detail by arbitrarily extracting individual signals pixel by pixel and verifying the signal level. it can.

  Although not particularly described in the first embodiment, the imaging element 2 provided with a plurality of light receiving units that receive and capture the light emitted from the LED 20 and the imaging signal from the imaging element 2 are used. And a control unit 4 for inspecting and controlling the light emission state of the optical element. With this configuration, not only the light emission amount of one optical element but also the light emission amounts of a plurality of optical elements can be easily and accurately measured and inspected without using a conventional identification ID circuit. It is possible to achieve the object of the present invention that the directivity of light emission and dust adhesion failure can be measured and inspected easily and accurately.

  As mentioned above, although this invention has been illustrated using preferable Embodiment 1 of this invention, this invention should not be limited and limited to this Embodiment 1. It is understood that the scope of the present invention should be construed only by the claims. It is understood that those skilled in the art can implement an equivalent range from the description of the specific preferred embodiment 1 of the present invention based on the description of the present invention and the common general technical knowledge. Patents, patent applications, and documents cited herein should be incorporated by reference in their entirety, as if the contents themselves were specifically described herein. Understood.

  The present invention relates to a light emission measuring apparatus and a light emission measuring method for inspecting light emission of an optical element such as a light emitting diode (hereinafter referred to as LED), a control program for causing a computer to execute the light emission measuring method, and a readable program storing the control program. In the field of recording media, the light emission state of the optical element is inspected and controlled by taking out the signal at the pixel level using the image pickup signal from the image pickup element provided with a plurality of light receiving portions that receive the light emission from the optical element and pick up the image. Therefore, not only the light emission amount of one optical element but also the light emission amounts of a plurality of optical elements can be measured and inspected easily and accurately without using a conventional identification ID circuit, and the light emission of the optical element is also performed. It is possible to easily and accurately measure and inspect the directivity and poor adhesion of dust.

DESCRIPTION OF SYMBOLS 1, 1A, 1B Luminescence measuring apparatus 2 Image pick-up element 3 A / D conversion part 4 Control part 41 Address designation means 42 Light quantity determination means 43 Directivity determination means 44 NG chip registration means 5 Operation part 6 Display part 7 ROM
8 RAM
DESCRIPTION OF SYMBOLS 11 Wafer 12 Semiconductor chip 13 Pad 14 Probe pin 15 Ring 16 Adhesive sheet 17 Contact pin 18 Package product 19 Partition plate 20 LED
A, B Chip X, Y Pixel address L Light emission D1, X1, Y1 Address selection area

Claims (13)

In a light emission measuring apparatus for inspecting light emission of an optical element, an image pickup element provided with a plurality of light receiving portions that receive light from the optical element and pick up an image, and the optical element using an image pickup signal from the image pickup element the light emission state have a control unit for checking the control of,
The control unit includes: an address designating unit for addressing one or a plurality of light receiving units out of a plurality of light receiving units for imaging a light emission state of the optical element; and one or a plurality of light receiving units designated by the address designating unit. Light emission state inspection means for inspecting the light emission state of the optical element based on the imaging signal from the unit,
The control unit further includes a determination unit that compares a value of an imaging signal from one or a plurality of light receiving units specified by the address specifying unit and a reference value to determine whether the light emitting state of the optical element is good or bad,
When the determination result determined by the determination unit is defective, the addressing unit changes the light receiving unit to be addressed, and the determination unit compares the value of the imaging signal from the changed light receiving unit with the reference value. Then, a light emission measuring device for further judging whether the light emitting state of the optical element is good or bad . 2. The light emission measuring device according to claim 1 , wherein the address designating means inputs a pixel address designating which pixel is used for the examination of the light emission state of the optical element from the outside, or the pixel address is set in advance. The luminescence measuring device that is selected and set. 3. The light emission measuring device according to claim 2 , wherein the address designating unit designates a plurality of pixel addresses in one direction or a plurality of directions passing through the light emission center of the optical element and the vicinity thereof and / or light emission of the optical element. A light emission measuring device for designating one pixel address of a center or a plurality of pixel addresses of a block area including a light emission center of the optical element and its vicinity. The luminescence measuring apparatus according to claim 1 , wherein the determination unit compares a value of the imaging signal from one or a plurality of light receiving units designated by the address designation unit with a reference value, and the value of the imaging signal is A light emission measuring device including a light amount determination unit that determines that the light amount is defective when the value is lower than a reference value and determines that the light amount is good when the value of the imaging signal is equal to or greater than the reference value. In luminescence measuring device according to claim 1 or 4, wherein the determination means compares the value with the reference value of the image signals from one or more light receiving portions specified by said address specifying means, emission of the optical element The light emission measuring device which has the directivity determination means which determines the quality of directivity. In luminescence measuring device according to claim 4 or 5, wherein when the light amount determining means and / or the determination result of the determination by the directional determination means is defective, the defective registration means for registering the determination content to the chip number Luminescence measuring device having. The luminescence measuring apparatus according to claim 1, wherein a partition plate for preventing light mixing is disposed between the two adjacent optical elements. The luminescence measuring apparatus according to claim 1, wherein a cross-shaped partition plate for preventing light mixing is disposed between the four adjacent optical elements. The luminescence measuring apparatus according to claim 1, further comprising a luminescence driving unit configured to simultaneously emit one or more optical elements. In the light emission measuring method for inspecting the light emission of the optical element, the control means uses the image pickup signal from the image pickup element provided with a plurality of light receiving sections for receiving and picking up the light emission from the optical element. have a test control step of inspecting controlling emission state,
The inspection control step includes:
An address designating unit for addressing one or a plurality of light receiving units from among a plurality of light receiving units for imaging the light emitting state of the optical element, and a light emitting state inspecting unit are designated by the address designating step. A light emission state inspection step for inspecting a light emission state of the optical element based on an imaging signal from one or a plurality of light receiving units,
The light emission state inspection step includes:
A determining step for comparing the value of the imaging signal from one or a plurality of light receiving units specified by the address specifying unit with a reference value to determine whether the optical element is in a light emitting state;
When the determination result in the determination step is bad, the address designation unit changes the light receiving unit to be addressed, and the determination unit compares the value of the imaging signal from the changed light receiving unit with the reference value. A further determination step for further determining the quality of the light emission state of the optical element;
A method for measuring luminescence. The light emission measuring method according to claim 10 , wherein the light emission state inspection step includes:
The light quantity determination means compares the value of the imaging signal from one or a plurality of light receiving units designated by the address designation means with a reference value, and determines that the light quantity is defective when the value of the imaging signal is lower than the reference value. A light amount determination step for determining that the light amount is good when the value of the imaging signal is equal to or greater than the reference value;
Directivity determination means compares the value with the reference value of the image signals from one or more light receiving portions specified by the address specifying means, a directional determination step of determining the directionality of quality of emission of the optical element A luminescence measuring method comprising: A control program in which a processing procedure for causing a computer to execute each step of the luminescence measurement method according to any one of claims 10 to 11 is described. A computer readable storage medium storing the control program according to claim 12 .