KR20110110730A - Apparatus and method for measuring light emission, and readable recording medium - Google Patents

Abstract

(assignment)
In addition to the light emission amount of one optical element, the light emission amount of a plurality of optical elements can be easily and accurately measured and inspected without using an identification ID circuit as in the related art. Measure and inspect
(Solution)
Among the plurality of light receiving parts for imaging the light emitting state of the LED, addressing means 41 for addressing one or a plurality of light receiving parts, and values of the imaging signals from one or a plurality of light receiving parts designated by the addressing means 41; The light quantity determination means 42 and the address designation means 41 which compare with reference values, determine that light quantity is bad when the value of an imaging signal is lower than a reference value, and determine that light quantity is good when the value of an imaging signal is more than a reference value. It has directivity determination means 43 which compares the value of the image pick-up signal from one or the several light receiving part designated by the reference value, and judges the quality of light emission directivity of LED.

Description

A luminescence measuring device, a luminescence measuring method, and a readable recording medium {APPARATUS AND METHOD FOR MEASURING LIGHT EMISSION, AND READABLE RECORDING MEDIUM}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emission measuring apparatus for inspecting light emission of an optical element such as a light emitting diode (hereinafter referred to as an LED), a light emission measuring method, and a readable recording medium containing a control program for executing the light emission measuring method in a computer. .

In recent years, in view of global environmental protection, the need for LEDs as energy-saving lighting components, such as small size, long life, and no harmful substances, has been recognized, and the demand for low-cost LEDs is also very high.

In conventional LED measurement, the LED and the light receiving sensor (photodiode) were disposed to face each other (opposed), the light was converted into an electric quantity by each light receiving sensor, and the amount of emitted light of the LED was measured. When a plurality of LEDs emit light at the same time, when each light receiving sensor converts an optical signal into an electric signal in units of light receiving surfaces, it is distinguished as the amount of light emitted by the individual LEDs for simultaneous light emission of the plurality of LEDs on each light receiving sensor side. Because it is impossible to do.

In this way, when the same number of light receiving sensors are provided for a plurality of LEDs and are replaced (or opposed to) one to one, simultaneous measurement of the plurality of LEDs is possible. However, there is a problem in measurement accuracy due to an increase in the price of the device, an increase in the size of the device, or a sensitivity variation of the light receiving sensor. Thus, single measurement is performed with one light receiving sensor without taking such a form.

10 is a schematic view for explaining a configuration example of main parts of a conventional light emission measuring apparatus.

In FIG. 10, on the wafer 101, a plurality of semiconductor chips 102 on which LEDs as light emitting elements are formed are arranged in a matrix. The conventional light emission measuring apparatus 100 can apply a power supply voltage for each semiconductor chip 102 to the pad 103, which is a probe pin contact, from the probe pin 104 to emit the LED to inspect the light. The light emission amount of this LED can be measured by the axial measuring device 105 by a PD system or an integrating sphere, and it can be checked whether the measured light emission amount is defective. In this way, the amount of light emitted from the LEDs is sequentially measured one by one semiconductor chip 102.

As described above, in the conventional light emission measuring apparatus 100, since the amount of light emitted by the LEDs is sequentially measured one by one semiconductor chip 102, there is a problem that it takes time to measure the amount of light emitted by the LEDs of all the chips. In order to solve this problem, Patent Literature 1 which measures the light emission amounts of a plurality of LEDs simultaneously and shortens the measurement time has been proposed.

In patent document 1, in order to measure the light emission amount of several LED simultaneously, the circuit which produces | generates an ID signal is attached to each LED measuring circuit, and the ID signal as an identification signal which shows what kind of LED is synthesize | combined with the light emission signal of LED. It is generated as a signal. This synthesized signal is a method of measuring the amount of emitted light while determining which LED signal is used by a dedicated software for distinguishing the ID signal from the emitted light signal when converting the emitted light signal into an electric quantity on the light receiving sensor side.

It is a block diagram which shows the structural example of a principal part of the conventional LED simultaneous measurement apparatus disclosed by patent document 1. As shown in FIG. In addition, although FIG. 11 shows the case where two LEDs are measured simultaneously in description, several LED according to the number can be measured simultaneously by adding the same circuit.

As shown in Fig. 11, the conventional LED simultaneous measuring device 200 is a light emission bias applying section (A: center dotted line in Fig. 11) from a signal source for emitting LEDs 201 and 202 to the LEDs 201 and 202. ), And the light quantity detection measurement section (B: bottom of the center dotted line in FIG. 11).

First, the operation of the light emission bias application section A will be described.

ACB is an AC base signal generator, which generates a sinusoidal AC base signal of constant amplitude and constant frequency (frequency fb). A part of this signal is applied to the bias modulator BM201b, where an AC bias signal is subjected to modulation such as amplitude modulation, frequency modulation or phase modulation by the identification signal (frequency f1) of the identification signal generator ID201a. (Amplitude modulation example in Fig. 12).

Similarly, part of the AC base signal is also applied to the bias modulator BM202b, where the same modulation is received by the identification signal (frequency f2) of the identification signal generator ID202a to become an AC bias signal. Since the identification signal (frequency f1) of these identification signal generator ID201a and the identification signal (frequency f2) of identification signal generator ID202a are different frequencies, the waveform of each AC bias signal also varies accordingly.

AC 바이어스/DC 바이어스

0.9 범위의 비율이 가장 바람직하다.The outputs from the bias modulators BM201b and BM202b are respectively applied to the bias signal synthesizers BC201c and BC202c represented by analog adders, where they overlap at a constant rate with the DC bias voltage of the DC bias reference level generator DCB. . It is important to set this ratio so that the light emission component by an AC bias signal may faithfully appear on the light receiving side, as described later.

AC bias / DC bias

Most preferred is a ratio in the range of 0.9.

An example of the waveform of the output signal of bias signal combiner BC201c, BC202c is shown in FIG.

This signal is adjusted to a predetermined bias level by the bias level adjusting units BL201d and BL202d having the function of the D / A converter. If the measurement conditions of the LEDs are input to the bias level adjusting units BL201d and BL202d in advance by a program, the bias level according to them can be set.

When this signal is applied to the applied current output units IP201e and IP202e as a drive command signal, a current proportional to the drive command signal is applied to the LED 201 and the LED 202 which are the LED under measurement as bias currents, respectively. As shown in the waveform of Fig. 12, the waveform of the bias current is a waveform in which the AC bias current modulated by the identification signal on the reference level of the DC bias current is superimposed at a constant rate, so that the LED 201 and the LED ( The light emission output of 202 also becomes a unique light output according to this.

Next, operation | movement of the light quantity detection measurement section B of FIG. 11 is demonstrated.

The PD is a light receiving sensor such as a photodiode and a photoelectric tube, and is configured to simultaneously receive the light amount of the sum of the emission amounts of the LED 201 and the LED 202 by one light receiving sensor PD. Thus, no light shielding between the LED 201 and the LED 202 is necessary. In addition, even if there is an external incident light other than the light emission output of LED 201 and LED 202 which interferes with a measurement originally, this can be excluded as mentioned later.

The light receiving sensor PD generates a current change almost proportional to the total amount of incident light, and is converted into a change in voltage by a current voltage converter IVC called an I / V converter amplifier or the like.

When analyzing this output component, it has the following components (a) and (b).

(a) A voltage corresponding to the sum of the DC bias components commonly included in the light emission of each LED (hereinafter referred to as DC light receiving voltage).

(b) A voltage corresponding to the sum of the AC bias signal components superimposed on the DC light receiving voltage (hereinafter referred to as AC light receiving voltage and including the frequency component fb of the AC base signal).

As mentioned above, the output voltage containing the said components (a) and (b) is input into the high pass filter HPF, and the DC light receiving voltage of the said component (a) is removed first.

Even if the DC light receiving voltage (a) is removed, since the light quantity information of each LED is included in proportion to the AC light receiving voltage of (b), the measurement does not interfere.

The output from the high pass filter HPF is input to a phase detector PSD203 having a multiplication function. At the same time, the AC base signal (frequency fb) is applied to the phase detector PSD203 from the AC base signal generator ACB, and the two signals are multiplied. Then, the frequency component of the AC output of the high pass filter (HPF), when the frequency of the AC bias signal is set to fb and the identification signal frequencies are set to f1 and f2, the upper band component fb + f1, fb + f2, and the lower band component. It consists of fb-f1 and fb-f2. Among these, only the fb component is said to coincide with the phase and timing of the AC bias signal. Therefore, the voltage of the following frequency component appears in the output from the phase detector PSD203.

By passing the output of the phase detector PSD203 through a low pass filter LPF204 whose cutoff frequency is set sufficiently lower than fb, the high pass component is removed, and the outputs of the low pass filter LPF204 are as follows (1) and (2). Only voltage appears.

(1) A voltage of 0 Hz, i.e., direct current, which appears only at the output of the high pass filter (HPF) when there is a signal that is completely in phase with the phase of the AC base signal, the voltage level of which is the AC of (b) It is proportional to the level of the AC base signal component in the light receiving voltage.

(2) At f1 and f2, the amplitude is a voltage proportional to the amplitude of the identification signal.

When the low pass filter LPF204 is replaced with a band pass filter having a pass band frequency of 0 Hz <pass band frequency <fb, only the voltage component of the above (2) passes. This signal is a sum signal of the identification signal.

The signals obtained only in the components (1) and (2) obtained in this manner or signals composed only of the voltage components in (2) are supplied to the phase detectors PSD201f and PSD202f having the same multiplication functions as those of the phase detector PSD203. .

On the other hand, from each of the identification signal generators ID201a and I2022 in the light emission bias application section A, a signal having the same component as the identification signal corresponding to each system is supplied to the phase detectors PSD201f and PSD202f.

When the signals from the phase detectors PSD201f and PSD202f are applied to the low pass filters LPF201g and LPF202g having the cutoff frequencies lower than the identification signal frequencies f1 and f2, the high pass components are removed, i.e., by light emission according to the identification signal. Generated DC voltages ED201h and ED202h are obtained. The DC voltages ED201h and ED202h are input to an A / D converter (ADC) with a scanner having two or more channels, which are time-divisionally selected to obtain measured values.

Japanese Unexamined Patent Publication No. 2004-31460

In the conventional light emission measuring apparatus 100, since it is impossible to identify the plurality of LED light emission and measure the amount of light emitted, simultaneous measurement of the plurality of LED light emission cannot be performed. Even if two light-emitting diodes PD are installed and two LEDs are measured simultaneously, two light-emitting diodes PD convert the amount of light into electricity, so the system itself requires two LEDs. It was possible to measure at the same time, but the system cost doubled.

In the conventional light emission measuring device 200, compared with the conventional light emission measuring device 100, the entire measurement time of the individual light emission amount can be shortened, but each time the number of LEDs to be measured increases, the measurement LED is identified. In order to do so, the ID circuit needs to be increased, and the price of the measuring instrument becomes expensive. In this case, since the checking mechanism for confirming that there is no problem in the identification ID circuit, such as whether the ID signal is outputted correctly, is also required on both the soft and hard surfaces, the device price is further increased. In addition, when a problem occurs in the identification ID circuit, the device stop time is increased because the replacement is performed as a measurement board instead of a part replacement. In addition, when there is a deviation in the synthesis timing of the light emission amount signal and the identification ID signal, the identification signal cannot be taken accurately. If noise or the like is contained in the identification ID signal, it cannot be taken as an accurate identification ID signal.

Anyway, in the conventional light emission measuring apparatuses 100 and 200, the LEDs and the light-receiving diodes PD are replaced by one-to-one, and the light-emitting amount of the LEDs is converted by converting the light-emitting amount of the LEDs into electricity with the photodiode PD. Although the measurement was carried out, it was only possible to measure whether or not the amount of emitted light of the LED had reached the reference value, and there was a problem in that the directivity of LED light emission, poor adhesion of dust, and the like could not be examined at all.

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems, and it is possible to measure and inspect not only the light emission amount of one optical element but also the light emission amount of a plurality of optical elements easily and accurately without using the conventional identification ID circuit. An object of the present invention is to provide a luminescence measurement apparatus and a luminescence measurement method capable of easily and accurately measuring and inspecting device directivity and dust adhesion defects, and a readable recording medium containing a control program for executing the luminescence measurement method on a computer. It is done.

The light emission measuring device according to the present invention is a light emission measuring device that inspects light emission of an optical element, comprising: an image pickup device in which a plurality of light receiving portions arranged to receive and image light emission from the optical element; and an image pickup signal from the image pickup device It has a control part which inspects and controls the light emission state of the optical element using it, and the said objective is achieved by this.

Preferably, the control unit in the light emission measuring apparatus of the present invention comprises: addressing means for addressing one or a plurality of light receiving sections among a plurality of light receiving sections for imaging the light emitting state of the optical element, and the address designation means; And light emission state inspection means for inspecting the light emission state of the optical element based on the imaging signal from one or the plurality of light receiving portions designated by.

Preferably, the address designation means in the light emission measuring apparatus of the present invention preferably specifies input of a pixel address from which the pixel address is used for light emission state inspection of the optical element, or the pixel address is previously set. Selection is set.

Preferably, the addressing means in the light emission measuring apparatus of the present invention designates a plurality of pixel addresses in one direction or in multiple directions passing through the emission center and the vicinity of the optical element, and / or the optical A plurality of pixel addresses of a block area including one pixel address of the emission center of the element or the emission center of the optical element and its vicinity are specified.

Preferably, the light emission state inspection means in the light emission measuring apparatus of the present invention compares the value of the image pickup signal from one or a plurality of light receiving units designated by the address designation unit with a reference value, and the value of the image pickup signal. It has light quantity determination means which judges that light quantity is bad when it is lower than this reference value, and determines that light quantity is good, when the value of the imaging signal is more than the reference value.

Preferably, the light emission state inspection means in the light emission measuring apparatus of the present invention compares the value of the image pickup signal from one or the plurality of light receiving portions designated by the address designation means with the reference value, and emits light of the light emitting element. It has directivity determination means for determining the quality of directivity.

Further, preferably, in the light emission measuring apparatus of the present invention, when the determination result determined by the light quantity determining means and / or the directivity determination means is defective, a defective registration for registering the determination contents in the chip number is given. Have the means.

Preferably, in the light emission measuring apparatus of the present invention, a partition plate for preventing light mixing is disposed between two adjacent light emitting elements.

Preferably, in the light emission measuring device of the present invention, a partition plate having a cross shape in a planar view for preventing light mixing is disposed between the adjacent four light emitting elements.

Preferably, in the light emission measuring apparatus of the present invention, there is provided light emission driving means for simultaneously emitting one or more light emitting elements.

The light emission measuring method of the present invention is a light emission measurement method for inspecting light emission of an optical element, wherein the control means uses an image pickup signal from an image pickup element in which a plurality of light receiving portions are arranged to receive and capture light emission from the optical element. And an inspection control step of inspecting and controlling the light emitting state of the optical element, thereby achieving the above object.

Further, preferably, in the inspection control step in the light emission measuring method of the present invention, addressing means designates an address for addressing one or a plurality of light receiving sections among a plurality of light receiving sections for imaging the light emitting state of the optical element. And the light emission state inspection means has a light emission state inspection step of inspecting the light emission state of the optical element based on the image pickup signal from the one or the plurality of light receiving portions specified in the addressing step.

Further, preferably, in the light emission state inspection step in the light emission measurement method of the present invention, the light quantity determining means compares the value of the image pickup signal from one or a plurality of light receiving units designated by the address designation means with a reference value, When the value of the image pickup signal is lower than the reference value, it is determined that the light quantity is bad, and when the value of the image pickup signal is equal to or more than the reference value, the light quantity determination step and the directivity determination means are designated by the address designation means. And a directivity determination step of comparing the value of the image pickup signal from one or the plurality of light receiving sections with the reference value to determine whether the light emitting element has the light emitting directivity.

The control program of the present invention describes a processing procedure for executing each step of the above-described luminescence measurement method of the present invention on a computer, whereby the above object is achieved.

The readable recording medium of the present invention is a computer readable medium in which the control program of the present invention is stored, thereby achieving the above object.

According to the above configuration, the operation of the present invention will be described below.

In this invention, it has the imaging element in which the some light receiving part which receives and image | emitted light emission from an optical element is arrange | positioned, and the control part which inspects and controls the light emission state of an optical element using the imaging signal from this imaging element. The control unit comprises addressing means for addressing one or a plurality of light receiving sections among a plurality of light receiving sections for imaging the light emitting state of the optical element, and based on the imaging signals from the one or the plurality of light receiving sections designated by this addressing means. It has a light emission state inspection means for inspecting the light emission state of an optical element.

Thereby, since the light emission state of a light emitting element (for example, LED) is measured as one image using the light receiving sensor which has a several light receiving part, even if data of one light receiving part (1 pixel) near the center is taken out, the brightness of light emission (Or luminance) can be measured, and the distribution of light emission can be measured by taking out data of one column in the X direction or the Y direction.

In addition, if a plate-shaped partition member is placed between two light emitting elements (for example, LEDs), the light emission interference from the two light emitting elements can be suppressed, and the light emission from the two light emitting elements can be grasped as an image at the same time. do. In the case of four light emitting elements, when a cross-shaped partition member is inserted, each light emission from the four light emitting elements can be grasped simultaneously as an image.

Therefore, since the light emission state of the optical element is inspected and controlled by extracting the signal at the pixel level using the image pickup signal from the image pickup element in which the plurality of light receiving portions arranged to receive and image the light emission from the optical element are formed, the amount of light emitted by one optical element In addition, it is possible to easily and accurately measure and inspect the light emission amount of a plurality of optical elements without using an identification ID circuit as in the related art, and to easily and accurately measure and inspect the directivity of light emission and poor adhesion of dust. do.

As described above, according to the present invention, the light emitting state of the optical element is inspected and controlled by extracting the signal at the pixel level by using the imaging signal from the imaging element in which the plurality of light receiving portions arranged to receive and image the light emission from the optical element are formed. In addition to the light emission amount of one optical element, the light emission amount of a plurality of optical elements can be easily and accurately measured and inspected without using the conventional identification ID circuit. Accurately measure and inspect

BRIEF DESCRIPTION OF THE DRAWINGS It is a block diagram which shows the structural example of a principal part of the luminescence measurement apparatus in Embodiment 1 of this invention.
It is a schematic diagram which shows the mode that the light emission measuring device of FIG. 1 measures the optical element light emission of each chip | tip before chip cutting.
3 is a top view when the LEDs emit light by applying a power supply voltage to each of the two semiconductor chips of FIG. 2.
4 (a) and 4 (b) are schematic diagrams showing a state in which the optical elements are made to emit light by widening the respective chip intervals after chip cutting.
5 (a) and 5 (b) are schematic diagrams showing a state in which each chip after chip cutting is packaged to emit an optical element.
FIG. 6 is a screen diagram in which the light emission measuring apparatus of FIG. 1 measures light emission of LEDs to which the power supply voltages are respectively applied to the two semiconductor chips of FIG. 3, and is a screen diagram showing a light quantity determination area for each semiconductor chip. FIG.
FIG. 7 is a screen diagram in which the light emission measuring apparatus of FIG. 1 measures light emission of LEDs to which the power supply voltages are respectively applied to the two semiconductor chips of FIG. 3, and is a screen diagram showing an address selection area of each pixel. FIG.
8A to 8E are directional distribution diagrams showing light emitting states of LEDs when the address selection area of FIG. 7 is selected.
FIG. 9 is a longitudinal sectional view of an essential part showing a case where a plurality of specific examples of the light emission measuring apparatus of FIG. 1 having a plurality of partition plates are used. FIG.
It is a schematic diagram for demonstrating the structural example of a principal part of the conventional luminescence measurement apparatus.
It is a block diagram which shows the structural example of a principal part of the conventional luminescence measurement apparatus disclosed by patent document 1.
12 is a view for explaining the waveform of the AC bias signal used in the conventional light emission measuring apparatus of FIG.

EMBODIMENT OF THE INVENTION Below, Embodiment 1 of the light emission measuring device and light emission measuring method of this invention is described in detail, referring drawings. In addition, each thickness, length, etc. of a structural member in each figure are not limited to the structure shown from a viewpoint on drawing creation.

(Embodiment 1)

1 is a block diagram showing a configuration example of main parts of a light emission measuring device according to Embodiment 1 of the present invention.

In FIG. 1, when the LED as a light emitting element of the semiconductor chip 12 mentioned later emits light, the light emission measuring apparatus 1 of this Embodiment 1 has the several light-receiving part which photoelectrically converts the incident light from a subject, and image | photographs it. The image pickup device 2 formed in a matrix shape, the A / D converter 3 for A / D conversion after noise is removed from the image pickup signal from the image pickup device 2, and the overall control and emission measurement control A control unit 4 composed of a CPU (Central Processing Unit) for executing the system, a keyboard, a mouse, a touch panel, and a pen input device for giving input commands to the CPU, and a communication network (for example, the Internet or an intranet). An operation unit 5 such as an input device to receive and input through the display unit, a display unit 6 for displaying an initial screen, a selection screen, a control result screen and an operation input screen by the CPU, and a control program on a display screen. ROM 7 as a computer-readable readable recording medium storing grams and the data thereof, and a control program and its data, etc., are read at startup, and function as a work memory for reading and storing data for each control by the CPU. It has a RAM 8 as a storage unit.

The imaging device 2 is constituted by a CCD-type image sensor or a CMOS-type image sensor which captures, as an image, a light emission state of an LED as a light-emitting element of the semiconductor chip 12 described later. Although it may be comprised about 400 pixels, it may be more than this pixel number or it may be at least.

The control part 4 inspects and controls the light emission state of LED using the imaging signal from the imaging element 2 in which the some light receiving part which receives and image | photographed the light emission from LED is arrange | positioned. The control part 4 is made from the operation part 5, X which selects and inputs the pixel address of which pixel is used for the light emission state test | inspection, or automatically selects and sets it according to an inspection mode, and passes X vicinity of LED light emission. Addressing means 41 for designating a plurality of pixel addresses in one column in the direction or the Y direction, or for designating addresses of one or a plurality of pixels in a predetermined area, and image emission of the LEDs by one or a plurality of pixels. A light amount determining means 42 for obtaining a value or an average value of the one pixel and comparing it with a reference value, a directivity determining means 43 for determining the directivity of the LED as a light emitting element, a light amount determining means 42 and / or In the case where the determination result determined by the directivity determination means 43 is NG, the number of NG chip registrations as the defective registration means for registering the determination content and the NG chip number in the RAM 8 It has a sweet 44. By these light quantity determination means 42 and the directivity determination means 43, the light emission state inspection means which examines the light emission state of LED based on the imaging signal from the 1 or some light receiving part designated by the address designation means 41 is provided. Consists of.

The addressing means 41 is configured to, for example, X in the pixel area of a predetermined range, for example, 200 x 400 pixels, in accordance with a predetermined internal selection setting according to the external selection designation input or inspection mode; Based on the first row of the left column, for example, 1 to 200 is 50 to 100 and Y (vertical number; 1 to 400) is selected to be the matrix area (vertical direction), for example, 50 to 100. Is set. In this case, the addressing means 41 is provided with means for extracting an individual signal of 1 pixel or more from the image sensing element 2 that performs optical measurement, and for example, addresses are sequentially input from 200x400 pixel data. Only pixel data in the light-emitting state of the designated pixel area is counted in the matrix direction (vertical and horizontal directions) with respect to the addressing information of the addressing means 41, and the count value is taken to match. When the directivity of LED is demonstrated, the light emission cross section of the LED which has one peak value is directional, circular or elliptical, and the light emission cross section of the LED which has two peak values is heart-shaped, etc. are mentioned. By specifying a plurality of pixel addresses in one column in the X direction or the Y direction, the directional shape (peak value and its peripheral value) of the light emitting end surface (circular or heart shaped, etc.) of the LED can be measured. Even if the light emitting cross section of the LED is circular or elliptical, when dust adheres to the center of the LED, the light emitting cross section becomes like a heart shape, and this is referred to as defect (NG). In any case, by specifying a plurality of pixel addresses in one column in the X direction or the Y direction, the directional shape and the dust adhesion defect of the optical element light emission can be easily and accurately measured and inspected.

In the address designation means 41, the light receiving area of the image pickup element 2 which performs optical measurement can be arbitrarily set as X1, Y1, D1 of FIG. In addition, the light receiving area of the imaging element 2 which performs optical measurement can also be set in multiple areas like at least two of X1, Y1, D1 of FIG. Further, when it is determined that the defect NG is determined, the defective portion can be verified by addressing the received data of the defective portion in detail by one pixel and taking the addressed data.

The light quantity determining means 42 takes an end of each pixel (X, Y) in the predetermined pixel region in which the light receiving area is set, and determines whether the total amount of light or its average amount of light or peak amount of light satisfies a predetermined reference value. Judging whether or not.

The directivity determining means 43 takes the end of each pixel (X, Y) in the predetermined pixel region where the light receiving area is set and determines whether it is directivity, for example, circular or heart-shaped, and when it is circular, a heart-shaped or peak position Is misaligned at the central position, and the like is determined as a bad directivity NG including dust or dirt.

The NG chip registration means 44, when the determination result determined by the light quantity determination means 42 and / or the directivity determination means 43 is NG, the content of the determination (light quantity NG or / and the directionality NG, and the directivity NG). Type) and the NG chip number are registered in the RAM 8.

The ROM 7 as a readable recording medium may be constituted of an optical disk, a magneto-optical disk, a magnetic disk, an IC memory, and the like, which can be freely carried, in addition to a hard disk. Although this control program and its data and the like are stored in the ROM 7, the control program and its data may be downloaded to the ROM 7 from another read-only recording medium or via wireless, wired or the Internet.

FIG. 2: is a schematic diagram which shows the mode in which the light emission measuring device 1 of FIG. 1 measures the optical element light emission of each chip | tip before cutting | disconnection. FIG. 3 is a top view when the LEDs are made to emit light by applying a power supply voltage to each of the two semiconductor chips 12 of FIG. 2.

2 and 3, on the wafer 11, a plurality of semiconductor chips 12 on which light emitting diodes (LEDs) are formed are arranged in a matrix in the matrix direction. A power supply voltage is applied to each of the plurality of semiconductor chips 12 (here, two) from the probe pin 14 to the pad 13 serving as the probe pin contact to emit LEDs. Thus, the control part 4 has light emission drive means which applies predetermined | prescribed power supply voltage from the probe pin 14, and light | emits one or more LED 20 or arbitrary LEDs 20 simultaneously or individually. . At this time, the probe pin 14 needs to be in contact with the pad 13, and the control unit 4 selects the semiconductor chip 12 at a certain position from the upper left semiconductor chip 12 as a starting point. You need to be aware that you are measuring. Thereby, the light emission measuring device 1 can inspect the light emission amount and directivity determination of the LED. In this manner, partition plates (not shown in FIGS. 2 and 3, but not shown in FIGS. 2 and 3) between the predetermined numbers (here two) of the semiconductor chips 12 (chips A and B). The amount of light emitted and the state of light emitted from the LEDs are measured and inspected in order.

In this case, the light emission measuring device 1 is equipped with an imaging element 2 having a size capable of receiving a plurality of LEDs, and can measure an imaging signal of an arbitrary addressed light receiving area with respect to the imaging area. to be.

Regarding the light emission of the LED, the imaging area of the imaging device 2 is designated as the pixel address (X, Y) and taken out as an electric signal, whereby a plurality of LEDs (here, two) for one imaging device 2 are obtained. It is possible to select the necessary pixel information even by emitting light. Moreover, by forming the partition plate (partition plate 19 of FIG. 6) in the imaging element 2, it can be made to have a structure which removes the influence of the light from the side. Since a plurality of signals are taken out finely at the pixel level, the light emission amount distribution regarding the directivity can be known, and the directivity defect and the dust adhesion defect can also be inspected.

4 (a) and 4 (b) are schematic diagrams showing a state in which the optical elements are made to emit light by widening the respective chip intervals after chip cutting.

In FIG.4 (a) and FIG.4 (b), the adhesive sheet 16 fixed to the some semiconductor chip 12 of the wafer 11 mentioned above by the ring 15 which is a dicing frame was affixed on it. After cutting into individual semiconductor chips 12 by a dicing wire or a dicing blade in a state, the adhesive sheet 16 is expanded (pulled) to provide a predetermined gap between the individual semiconductor chips 12, The semiconductor chip 12 is fixed. In this case, since a certain gap is formed between the individual semiconductor chips 12, partition plates (not shown) are easily interposed between the semiconductor chips 12, and inspection becomes easier.

In this state, a power supply voltage is applied to each of the plurality of semiconductor chips 12 (here, two) from the probe pin 14 to the pad 13 which is the probe pin contact to emit the LEDs. The light emission measuring device 1 can inspect the light emission amount and the directivity determination of the LED. In this way, the LEDs are sequentially inspected through partition plates (not shown) between predetermined numbers (here, two) of semiconductor chips 12.

5 (a) and 5 (b) are schematic diagrams showing a state in which each chip after chip cutting is packaged to emit an optical element.

5 (a) and 5 (b), after cutting into individual semiconductor chips 12 and separating them, the contact pins 17 are mounted on the semiconductor chips 12 and packaged. For one package product 18, a power supply voltage can be applied from the contact pin 17 to cause the LED to emit light. The light emission measuring device 1 can inspect the light emission amount and the directivity determination of the LED. In this way, the LEDs are inspected in order through a partition plate (not shown) between each of a predetermined number (here two) of the packaged products 18.

6 and 7 are screen diagrams in which the light emission measuring apparatus 1 of FIG. 1 measures the light emission of the LEDs to which the power supply voltages are respectively applied to the two semiconductor chips of FIG. 3, and FIG. 6 is the amount of light for each semiconductor chip. Fig. 7 is a screen diagram showing an address selection area of each pixel.

As shown in FIG. 6, as the light quantity determination area for each semiconductor chip (per LED), for example, in the chip A, the light amount determination area A1 of one pixel, and in the chip B, the light amount determination area B1. ), A plurality of pixel areas may be used, and the light quantity determination area is set in advance, but the present invention is not limited to this and can be set arbitrarily.

As shown in Fig. 7, as the address selection area of each pixel, for example, in the chip A, the address selection areas X1 and Y1 of each column in the X direction and the Y direction, and the address selection of the pixel block in the chip B are shown. Although it is the area D1, at least any one of the address selection areas X1, Y1, and D1 may be used, but it is not limited to this, An address selection area can be arbitrarily set elsewhere.

8 (a), the address selection area X1 of one column is selected, and the cross section has a predetermined directivity distribution. That is, as a reference curve of circular directivity, the center of the LED is bright and the periphery thereof is dark. In this case, it becomes a reference | standard that two brightness e1 (center part) and brightness e2 (end part) are brighter than a predetermined reference value.

In Fig. 8 (b), one address selection area X1 is selected, and its cross section is a distribution collapsed from a predetermined directivity distribution (Fig. 8 (a)). That is, although the overall light emission amount (brightness) is sufficient, the brightness of the center of the LED falls. This is because in addition to the adhesion of dust or contamination to the center of the LED, there is a risk of scratching, and the directivity of the light may be deteriorated, which is because of the directional center defect (NG). In this case, the difference between the brightness e1 of the LED center portion and the brightness e2 of the peripheral portion (end) thereof is reversed or lower than the predetermined value, and the brightness e1 of the center portion is much lower than the lower limit of the predetermined reference value. By this, it can be determined as directional central defect NG.

In Fig. 8C, one column of address selection area X1 is selected, and its cross section is a distribution collapsed from a predetermined directivity distribution (Fig. 8 (A)). That is, although the total amount of light emitted is sufficient, the brightness of the center of the LED is significantly brighter than the predetermined value, and the surrounding brightness is lower than the predetermined value. This is a directional peripheral defect (NG) in addition to the adhesion of dust and dirt to the LED periphery, which may cause scratches, and there is also a fear of poor directivity of light. In this case, the difference between the brightness e1 of the LED central portion and the brightness e2 of the peripheral portion (end) thereof exceeds the predetermined reference value, and the brightness e2 of the peripheral portion (end) thereof falls below the predetermined reference value, thereby providing directivity. It can be determined as the peripheral defect NG.

In Fig. 8 (d), one column of address selection area X1 is selected and its cross section has a predetermined directivity distribution. That is, although the total amount of light emission is sufficient, only the brightness of one side around the LED is bright enough to be the same as the brightness of the center portion, and the brightness of the other side around the LED becomes dark. This is a one-side peripheral defect (NG) including a package defect, in addition to the case of scratches, in addition to the adhesion of dust or dirt that is shielded on one side of the LED periphery. In this case, the difference between the brightness e1 of the LED central portion and the brightness e2 of the peripheral portion thereof is less than the predetermined value, and the brightness e2 of the peripheral portion greatly exceeds the predetermined value, whereby one side peripheral defect NG Can be determined.

8 (b) to 8 (d), when it is determined that the defect is NG, one address selection area Y1 is selected, and the cross section is examined in detail whether or not the cross section has a predetermined directivity distribution. can do. In this way, the address selection designation of a plurality of points can be performed. In short, the periphery of the portion determined as defective NG and its cross section can be further addressed and designated to measure the directional distribution in more detail, and can differentiate the characteristic of the LED light emission from the characteristic of the defective.

In Fig. 8E, the address selection area D1 of the block is selected, and its cross section is a predetermined directivity distribution (heart-shaped distribution). In other words, as a reference curve of the heart-shaped directivity, the center of the LED is slightly dark and brightens in two places around it. In this case, it is a reference that three brightness e11, e21, e12 is brighter than predetermined value.

In the light emission measurement method of the first embodiment that checks the light emission of the LED 20 as an optical element, the inspection control means receives light emission from the LED 20 based on a control program in the ROM 7 and its data. The computer (CPU) executes an inspection control step of inspecting and controlling the light emitting state of the LED 20 by using the imaging signal from the imaging element 2 in which the plurality of light receiving portions to be imaged are arranged. The inspection control step includes an address specifying step of addressing one or a plurality of light receiving parts, among the plurality of light receiving parts for which the addressing means 41 picks up the light emitting state of the LED 20, and the light emitting state checking means is an address. It has a light emission state test | inspection step which test | indicates the light emission state of the LED 20 based on the imaging signal from the 1 or some light receiving part designated in the designation step. In this light emission state inspection step, the light quantity determining means 42 compares the value of the image pickup signal from one or a plurality of light receiving units designated by the address designation means 41 with the reference value, and the value of the image pickup signal is higher than the reference value. A light quantity determination step of determining that the quantity of light is poor when it is low and determining that the quantity of light is good when the value of the image pickup signal is equal to or greater than the reference value, and the one or more light receiving units designated by the address designation means 41 by the directivity determining means 43; It has a directivity determination step of comparing the value of the imaging signal from a reference value with a reference value, and determining the emission directivity of the LED 20. In this way, the light emission state inspection means is constituted by the light quantity determination means 42 and the directivity determination means 43.

As described above, according to the first embodiment, among the plurality of light receiving parts for imaging the light emitting state of the LED 20, by the address designation means 41 for addressing one or the plurality of light receivers, and the address designation means 41. The amount of light is determined by comparing the value of the image pickup signal from the designated one or a plurality of light receiving sections with the reference value, and determining that the quantity of light is poor when the value of the image pickup signal is lower than the reference value, and determining that the quantity of light is good when the value of the image pickup signal is equal to or greater than the reference value. Directivity determining means 43 for comparing the value of the image pickup signal from one or the plurality of light receiving sections designated by the address designation means 41 with the reference value, and determining whether or not the light emission directivity of the LED 20 is determined. Using the imaging signal from the imaging element 2 in which a plurality of light receiving portions arranged to receive and image the light emission from the LED 20 are used. The light emission state of the LED 20 is taken out and controlled by inspection. Therefore, it is possible to know the distribution of light emission with respect to the directivity, so that chips with poor directivity can also be excluded. In addition, there is no increase or decrease as a circuit by the same number of measurements, and no modification of the soft / hard surface is necessary. In addition, a special check mechanism in soft / hard for the image pickup device is also unnecessary, and it is possible to determine in detail whether there is a problem with the mechanism in the same daily inspection as the conventional light receiving sensor.

Finally, when the determination result determined by the light quantity determining means 42 and / or the directivity determination means 43 is NG, the content of the determination (light quantity NG or / or directivity) is determined by the NG chip registration means 44. NG, and the type of directional NG) and the NG chip number are registered in the RAM 8. That is, the judgment content (type of light amount NG or / and NG of directivity NG) is stored in the address position corresponding to the chip number called the map address corresponding to the position of the wafer 11. As a kind of NG, although the quantity of light by the light quantity determination means 42 does not have a problem, when there is a problem in the directivity determination means 43, it becomes rank B. As shown to FIG. For example, when there is a problem in the amount of light by the light amount determining means 42 and there is no problem in the directivity determining means 43, the rank C is obtained. In addition, when there is no problem in the light quantity by the light quantity determination means 42, and there is no problem also in the directionality determination means 43, it becomes rank A. FIG. The failure may be distinguished in more detail. For example, with respect to the light quantity by the light quantity determining means 42, two threshold values are formed and light quantity defect can be divided into two stages.

In addition, in the said Embodiment 1, when the plate-shaped partition plate 19 is put between two light emitting elements (for example, LED) (between chips A and B), as shown to FIG. 6 and FIG. Light mixing from two light emitting elements (e.g. LEDs) can be suppressed, and the light emission from the two light emitting elements is simultaneously captured as an image, and the quantity of emitted light and the directivity are examined, but not limited thereto. The light emission from the light emitting element (for example, LED) can be grasped as an image, and the quantity of light emitted and the directivity can be inspected. Can be simultaneously viewed as an image, and the quantity of emitted light and directivity can be inspected. In addition, by using a light emission measuring device having a plurality of partition plates 19, each light emission from a plurality of light emitting elements can be grasped simultaneously as an image, and the quantity of emitted light and directivity can be inspected, so that inspection can be carried out quickly and easily. Can be. 9 shows a specific example of the light emission measuring apparatus in this case.

FIG. 9: is a principal part longitudinal cross-sectional view which shows the case where more than one specific example of the light emission measuring device of FIG. 1 which has a some partition plate is used.

As shown in FIG. 9, the partition plate (1) of the plurality of LEDs 20 arranged in a matrix form in a longitudinal direction and in a transverse direction with a plurality of light emission measuring devices 1A (for 4 × 4 measurement) lined up ( 19) can be formed, and the LEDs 20 can emit light every other one of the plurality of LEDs 20, and this can be measured and checked. With respect to the plurality of LEDs 20 arranged in a matrix shape in the longitudinal direction and the transverse direction, the plurality of light emission measuring apparatuses 1A (4 × 4) are slid in either the longitudinal direction or the transverse direction, thereby all the LEDs. The amount of light and directivity can be measured on the image with respect to the image of 20 so as to confirm the inspection. In addition, one light emission measuring device 1A may measure 4 × 4 of 8 × 8 of the plurality of LEDs 20 by one block. In addition, by using the plurality of light emission measuring apparatuses 1B (for 1 × 4 measurement), the partition plate 19 is moved to one row of the region where the plurality of LEDs 20 are arranged by shifting them in the longitudinal direction. Can also be used. L represents light emission from the LED 20. The LED 20 to which the bottom face of the partition plate 19 opposes does not emit light. Light emission is carried out every other in the longitudinal direction (the longitudinal direction in FIG. 9) and the transverse direction (the left and right direction in FIG. 9).

In the first embodiment, although not specifically described, the light emission amount and directivity are inspected one by one or two sequentially from the chip serving as the starting point of the wafer 11. In addition to the designated pixel address, the address designation means 41 formed in the controller 4 can recognize the number of LEDs of the chip being counted from the starting point of the wafer 11, and the position of the wafer 11 can be determined. The determination NG content is registered at an address position corresponding to the chip number called the corresponding map address. In addition, even when a plurality of chips are simultaneously emitted and the light emission amount and directivity are checked, it is possible to recognize how many LEDs are currently counted from the starting point of the wafer 11 as in the above.

In addition, although it did not describe in particular in the said Embodiment 1, it also has a function which simultaneously light-emits the light emitting element (for example, LED) of one or more electronic components (semiconductor chip). Moreover, it has a function which light | emits arbitrary components with respect to the light emitting element (for example, LED) of one or more electronic components (semiconductor chip). In addition, the light emitting elements of one or more electronic components (semiconductor chips) can be simultaneously emitted to identify the amount of light emitted from each electronic component. Moreover, the imaging element 2 which performs optical measurement can take out the individual signal of 1 pixel or more arbitrarily. Thereby, in the case where dust adheres to the LED 20 or the like, by arbitrarily taking out individual signals one pixel at a time and verifying the signal level, the position at which dust adheres to the LED 20 can be obtained in detail.

In addition, although not mentioned in particular in the said Embodiment 1, the image pick-up element 2 in which the some light-receiving part which receives the light emission from the LED 20 and imaged was arrange | positioned, and the imaging signal from this imaging element 2 are used. To control the light emitting state of the optical element. According to this configuration, not only the light emission amount of one optical element but also the light emission amount of a plurality of optical elements can be easily and accurately measured and inspected without using the conventional identification ID circuit. The object of the present invention can be easily and accurately measured and inspected.

In addition, in the first embodiment, the light emission state of the LED is determined by the light amount determining means 42 and the directivity determining means 43 on the basis of the imaging signals from the one or the plurality of light receiving portions designated by the address designation means 41. Although the case where the light emission state inspection means to examine was comprised was demonstrated, it is not limited to this, It is easy for the light emission state inspection means to have either one of the light quantity determination means 42 and the directivity determination means 43 easily. I can understand it. In this case, when the determination result determined by at least one of the light quantity determination means 42 and the directivity determination means 43 is defective, the NG chip registration means 44 as the failure registration means determines the determination contents of the chip. The number will be registered.

As mentioned above, although this invention was illustrated using the preferable Embodiment 1 of this invention, this invention is not limited to this Embodiment 1, and should not be interpreted. It is understood that the scope of the present invention should be interpreted only by the claims. It is understood that those skilled in the art can implement equivalent ranges based on the description of the present invention and common technical knowledge from the description of the specific preferred embodiment 1 of the present invention. It is to be understood that the patents, patent applications, and documents cited in the present specification are to be incorporated by reference as if the contents themselves are specifically described herein.

BACKGROUND OF THE INVENTION Field of the Invention [0001] The present invention relates to a field of a readable recording medium in which a light emission measuring device for inspecting light emission of an optical element such as a light emitting diode (hereinafter referred to as LED), a light emission measuring method, and a control program for executing the light emission measuring method in a computer are stored. In the optical element, since the light emission state of the optical element is inspected and controlled by extracting the signal at the pixel level using the image pickup signal from the image pickup element in which the plurality of light receiving portions arranged to receive and image the light emission from the optical element are arranged. Not only the amount of light emitted but also the amount of light emitted by a plurality of optical elements can be easily and accurately measured and inspected without using an identification ID circuit as in the related art. have.

1, 1A, 1B Luminescence Measuring Device
2 imaging device
3 A / D converter
4 control unit
41 Address designation means
42 light quantity determination means
43 directivity determination means
44 NG chip registration means
5 Control Panel
6 display
7 ROM
8 RAM
11 wafer
12 semiconductor chip
13 pads
14 probe pins
15 ring
16 adhesive sheets
17 contact pins
18 package
19 compartments
20 LED
A, B chip
X, Y pixel address
L luminous
D1, X1, Y1 address selection area

Claims (15)

A light emission measuring device for inspecting light emission of an optical element,
An imaging element in which a plurality of light receiving portions arranged to receive and image light emission from the optical element are formed;
And a control unit which inspects and controls the light emission state of the optical element by using the image pickup signal from the image pickup element. The method of claim 1,
The control unit,
Addressing means for addressing one or a plurality of light receiving sections, among a plurality of light receiving sections for imaging the light emitting state of the optical element;
And a light emission state inspection means for inspecting a light emission state of the optical element on the basis of an image pickup signal from one or a plurality of light receiving portions designated by the addressing means. The method of claim 2,
The addressing means is a light emission measuring apparatus in which a designation input of a pixel address of which pixel is used for light emission state inspection of the optical element is made from the outside, or the pixel address is selected and set in advance. The method of claim 3, wherein
The addressing means specifies a plurality of pixel addresses in one direction or a plurality of directions passing through and around the emission center of the optical element, and / or one pixel address of the emission center of the optical element or emission of the optical element. A light emission measuring device for specifying a plurality of pixel addresses of a block area including a center and its vicinity. The method of claim 2,
The light emission state inspection means compares the values of the imaging signals from one or the plurality of light receiving sections designated by the addressing means with a reference value, and determines that the quantity of light is poor when the value of the imaging signal is lower than the reference value. A light emission measuring device having light quantity determining means for determining that light quantity is good when the value of the image pickup signal is equal to or greater than the reference value. 6. The method according to claim 2 or 5,
The light emission state inspection means includes light emission measurement means having directivity determination means for comparing the value of the image pickup signal from one or the plurality of light receiving portions designated by the address designation means with a reference value to determine whether the light emission directivity of the light emitting element is satisfactory. Device. The method of claim 5, wherein
And a failure registration means for registering the determination content in the chip number when the determination result determined by the light amount determination means is defective. The method according to claim 6,
And a failure registration means for registering the determination content in the chip number when the determination result determined by at least the directivity determination means is at least one of the light quantity determination means and the directivity determination means. The method of claim 1,
A light emission measuring device, wherein a partition plate for preventing light mixing is disposed between two adjacent light emitting elements. The method of claim 1,
A luminescence measurement device in which a partition plate having a cross shape when viewed in a plane for preventing light mixing is disposed between four adjacent light emitting elements. The method of claim 1,
An emission measuring apparatus having light emission driving means for simultaneously emitting one or more of the above light emitting elements. As a light emission measuring method for inspecting light emission of an optical element,
And a control means for inspecting and controlling the light emitting state of the optical element by using an image pickup signal from an imaging element in which a plurality of light receiving portions arranged to receive and image light emission from the optical element are arranged. The method of claim 12,
The inspection control step,
An addressing step of addressing means for addressing one or a plurality of light receiving sections among a plurality of light receiving sections for imaging the light emitting state of the optical element;
And a light emitting state inspecting means having a light emitting state inspecting means for inspecting a light emitting state of the optical element based on an image pickup signal from one or a plurality of light receiving portions designated in the addressing step. The method of claim 13,
The emission state inspection step,
The light quantity judging means compares the values of the imaging signals from one or the plurality of light receiving sections designated by the addressing means with the reference values, and determines that the quantity of the imaging signals is poor when the value of the imaging signal is lower than the reference value, and the imaging signals A light quantity determining step of determining that the light quantity is good when the value of is equal to or greater than the reference value;
And a directivity determination step, wherein the directivity determination means compares the values of the image pickup signals from one or the plurality of light receiving sections designated by the addressing means with a reference value, and determines whether or not the light emission directivity of the light emitting element is determined. A computer-readable readable storage medium in which a control program describing a processing procedure for executing each step of the light emission measuring method according to any one of claims 12 to 14 is described.

Images