TWI442508B - The body of the object and the manufacturing method of the base body - Google Patents

The body of the object and the manufacturing method of the base body Download PDF

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Publication number
TWI442508B
TWI442508B TW93137876A TW93137876A TWI442508B TW I442508 B TWI442508 B TW I442508B TW 93137876 A TW93137876 A TW 93137876A TW 93137876 A TW93137876 A TW 93137876A TW I442508 B TWI442508 B TW I442508B
Authority
TW
Taiwan
Prior art keywords
fibers
carbon
seat
layer
tissue
Prior art date
Application number
TW93137876A
Other languages
English (en)
Chinese (zh)
Other versions
TW200525686A (en
Inventor
施尼威斯 史蒂芬
Original Assignee
雄克煤碳科技公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 雄克煤碳科技公司 filed Critical 雄克煤碳科技公司
Publication of TW200525686A publication Critical patent/TW200525686A/zh
Application granted granted Critical
Publication of TWI442508B publication Critical patent/TWI442508B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity

Landscapes

  • Chemical Vapour Deposition (AREA)
  • Ceramic Products (AREA)
TW93137876A 2003-12-09 2004-12-08 The body of the object and the manufacturing method of the base body TWI442508B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2003157698 DE10357698A1 (de) 2003-12-09 2003-12-09 Träger für zu behandelnde Gegenstände sowie Verfahren zur Herstellung eines solchen

Publications (2)

Publication Number Publication Date
TW200525686A TW200525686A (en) 2005-08-01
TWI442508B true TWI442508B (zh) 2014-06-21

Family

ID=34672544

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93137876A TWI442508B (zh) 2003-12-09 2004-12-08 The body of the object and the manufacturing method of the base body

Country Status (8)

Country Link
US (1) US7919143B2 (https=)
EP (1) EP1692718B1 (https=)
JP (1) JP5052137B2 (https=)
KR (1) KR101148897B1 (https=)
CN (1) CN100446213C (https=)
DE (2) DE10357698A1 (https=)
TW (1) TWI442508B (https=)
WO (1) WO2005059992A1 (https=)

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DE102006055038B4 (de) * 2006-11-22 2012-12-27 Siltronic Ag Epitaxierte Halbleiterscheibe sowie Vorrichtung und Verfahren zur Herstellung einer epitaxierten Halbleiterscheibe
DE102007054526A1 (de) * 2007-11-07 2009-05-14 Deutsches Zentrum für Luft- und Raumfahrt e.V. Wärmetransferelement und Anlage zur thermischen Behandlung von Substraten
US9012766B2 (en) 2009-11-12 2015-04-21 Silevo, Inc. Aluminum grid as backside conductor on epitaxial silicon thin film solar cells
US9214576B2 (en) 2010-06-09 2015-12-15 Solarcity Corporation Transparent conducting oxide for photovoltaic devices
US9773928B2 (en) 2010-09-10 2017-09-26 Tesla, Inc. Solar cell with electroplated metal grid
US9800053B2 (en) 2010-10-08 2017-10-24 Tesla, Inc. Solar panels with integrated cell-level MPPT devices
US9054256B2 (en) 2011-06-02 2015-06-09 Solarcity Corporation Tunneling-junction solar cell with copper grid for concentrated photovoltaic application
MX351564B (es) 2012-10-04 2017-10-18 Solarcity Corp Dispositivos fotovoltaicos con rejillas metálicas galvanizadas.
US9865754B2 (en) 2012-10-10 2018-01-09 Tesla, Inc. Hole collectors for silicon photovoltaic cells
US9281436B2 (en) 2012-12-28 2016-03-08 Solarcity Corporation Radio-frequency sputtering system with rotary target for fabricating solar cells
US9412884B2 (en) 2013-01-11 2016-08-09 Solarcity Corporation Module fabrication of solar cells with low resistivity electrodes
US9219174B2 (en) 2013-01-11 2015-12-22 Solarcity Corporation Module fabrication of solar cells with low resistivity electrodes
US9624595B2 (en) 2013-05-24 2017-04-18 Solarcity Corporation Electroplating apparatus with improved throughput
DE102013218883B4 (de) * 2013-09-19 2018-12-06 Siltronic Ag Vorrichtung und Verfahren zum Abscheiden von Halbleitermaterial aus einer Gasphase auf eine Substratscheibe
US20150083046A1 (en) * 2013-09-26 2015-03-26 Applied Materials, Inc. Carbon fiber ring susceptor
US10309012B2 (en) 2014-07-03 2019-06-04 Tesla, Inc. Wafer carrier for reducing contamination from carbon particles and outgassing
US9899546B2 (en) 2014-12-05 2018-02-20 Tesla, Inc. Photovoltaic cells with electrodes adapted to house conductive paste
US9947822B2 (en) 2015-02-02 2018-04-17 Tesla, Inc. Bifacial photovoltaic module using heterojunction solar cells
KR20170126899A (ko) 2015-03-11 2017-11-20 엔브이 베카에르트 에스에이 임시 결합된 웨이퍼용 캐리어
WO2016142240A1 (en) * 2015-03-11 2016-09-15 Nv Bekaert Sa Carrier for temporary bonded wafers
WO2016142239A1 (en) * 2015-03-11 2016-09-15 Nv Bekaert Sa Carrier for temporary bonded wafers
US9761744B2 (en) 2015-10-22 2017-09-12 Tesla, Inc. System and method for manufacturing photovoltaic structures with a metal seed layer
US9842956B2 (en) 2015-12-21 2017-12-12 Tesla, Inc. System and method for mass-production of high-efficiency photovoltaic structures
US9496429B1 (en) 2015-12-30 2016-11-15 Solarcity Corporation System and method for tin plating metal electrodes
US10115838B2 (en) 2016-04-19 2018-10-30 Tesla, Inc. Photovoltaic structures with interlocking busbars
US10672919B2 (en) 2017-09-19 2020-06-02 Tesla, Inc. Moisture-resistant solar cells for solar roof tiles
US11190128B2 (en) 2018-02-27 2021-11-30 Tesla, Inc. Parallel-connected solar roof tile modules
US12351915B2 (en) 2019-06-06 2025-07-08 Picosun Oy Porous inlet

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Also Published As

Publication number Publication date
EP1692718A1 (de) 2006-08-23
DE10357698A1 (de) 2005-07-14
CN100446213C (zh) 2008-12-24
EP1692718B1 (de) 2007-05-02
JP5052137B2 (ja) 2012-10-17
TW200525686A (en) 2005-08-01
DE502004003727D1 (de) 2007-06-14
KR101148897B1 (ko) 2012-05-29
US7919143B2 (en) 2011-04-05
CN1890792A (zh) 2007-01-03
JP2007514306A (ja) 2007-05-31
KR20060126536A (ko) 2006-12-07
WO2005059992A1 (de) 2005-06-30
US20070110975A1 (en) 2007-05-17

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