TWI441868B - 高耐熱性環氧樹脂組成物、預浸體、貼金屬箔疊層板以及印刷電路板 - Google Patents

高耐熱性環氧樹脂組成物、預浸體、貼金屬箔疊層板以及印刷電路板 Download PDF

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Publication number
TWI441868B
TWI441868B TW100142050A TW100142050A TWI441868B TW I441868 B TWI441868 B TW I441868B TW 100142050 A TW100142050 A TW 100142050A TW 100142050 A TW100142050 A TW 100142050A TW I441868 B TWI441868 B TW I441868B
Authority
TW
Taiwan
Prior art keywords
epoxy resin
resin composition
phosphorus
compound
prepreg
Prior art date
Application number
TW100142050A
Other languages
English (en)
Chinese (zh)
Other versions
TW201235401A (en
Inventor
Hiroharu Inoue
Koji Kishino
Takatosi Abe
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of TW201235401A publication Critical patent/TW201235401A/zh
Application granted granted Critical
Publication of TWI441868B publication Critical patent/TWI441868B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
TW100142050A 2010-11-24 2011-11-17 高耐熱性環氧樹脂組成物、預浸體、貼金屬箔疊層板以及印刷電路板 TWI441868B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010261146A JP5909693B2 (ja) 2010-11-24 2010-11-24 高耐熱性エポキシ樹脂組成物、プリプレグ、金属張積層板およびプリント配線板

Publications (2)

Publication Number Publication Date
TW201235401A TW201235401A (en) 2012-09-01
TWI441868B true TWI441868B (zh) 2014-06-21

Family

ID=46145573

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100142050A TWI441868B (zh) 2010-11-24 2011-11-17 高耐熱性環氧樹脂組成物、預浸體、貼金屬箔疊層板以及印刷電路板

Country Status (4)

Country Link
JP (1) JP5909693B2 (ja)
CN (1) CN103228697B (ja)
TW (1) TWI441868B (ja)
WO (1) WO2012070202A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6770793B2 (ja) * 2015-08-19 2020-10-21 日鉄ケミカル＆マテリアル株式会社 難燃性エポキシ樹脂組成物及びその硬化物
WO2018060247A1 (en) * 2016-09-27 2018-04-05 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Flame retardant structure for component carrier

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3721950B2 (ja) * 2000-06-06 2005-11-30 松下電工株式会社 エポキシ樹脂組成物、プリプレグ、多層プリント配線板
JP2002138096A (ja) * 2000-10-27 2002-05-14 Dainippon Ink & Chem Inc リン含有フェノール化合物とその製造方法、及び、それを用いたエポキシ樹脂組成物
JP4830748B2 (ja) * 2006-09-20 2011-12-07 パナソニック電工株式会社 難燃性エポキシ樹脂組成物、樹脂フィルム、プリプレグ及び多層プリント配線板
WO2008102853A1 (ja) * 2007-02-23 2008-08-28 Panasonic Electric Works Co., Ltd. エポキシ樹脂組成物、プリプレグ、積層板、及びプリント配線板
US20100261837A1 (en) * 2007-11-29 2010-10-14 Dow Global Technologies Inc. Dimethylformamide-free formulations using dicyanadiamide as curing agent for thermosetting epoxy resins
JP4548547B1 (ja) * 2009-03-18 2010-09-22 Ｄｉｃ株式会社 リン原子含有フェノール類の製造方法、新規リン原子含有フェノール類、硬化性樹脂組成物、その硬化物、プリント配線基板、及び半導体封止材料
WO2011102211A1 (ja) * 2010-02-18 2011-08-25 Dic株式会社 リン原子含有オリゴマー、その製造方法、硬化性樹脂組成物、その硬化物、及びプリント配線基板
CN102472894B (zh) * 2010-04-20 2015-01-28 松下电器产业株式会社 透视显示器以及平视显示器
TWI449749B (zh) * 2010-04-23 2014-08-21 Panasonic Corp 環氧樹脂組成物、預浸體、金屬被覆疊層板及印刷電路板
JP5866806B2 (ja) * 2010-05-31 2016-02-24 日立化成株式会社 エポキシ樹脂組成物、このエポキシ樹脂組成物を用いたプリプレグ、支持体付き樹脂フィルム、金属箔張り積層板及び多層プリント配線板

Also Published As

Publication number Publication date
WO2012070202A1 (ja) 2012-05-31
CN103228697B (zh) 2015-04-29
JP2012111828A (ja) 2012-06-14
TW201235401A (en) 2012-09-01
JP5909693B2 (ja) 2016-04-27
CN103228697A (zh) 2013-07-31

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